Conveying mechanism and Mini LED die bonding production line

Abstract

The utility model discloses a conveying mechanism and a Mini LED die bonding production line, and belongs to the technical field of die bonding equipment. The conveying mechanism comprises at least two fixed type linear feeding assemblies arranged at intervals and a rotary type linear feeding assembly located between every two adjacent fixed type linear feeding assemblies. The rotary lifting driving mechanism is used for driving the rotary linear feeding assembly to rotate and lift relative to the fixed linear feeding assembly; wherein the fixed type linear feeding assembly comprises at least three layers of fixed conveying devices, and the rotary type linear feeding assembly comprises at least two layers of dispatching conveying devices which are arranged from top to bottom. The transmission mechanism and the Mini LED die bond production line provided by the utility model can effectively solve the problems of poor expansion flexibility and low production efficiency of the existing Mini LED die bond production line.

Description

Technical Field

[0001] This utility model relates to the field of die bonding equipment technology, and in particular to a conveying mechanism and a Miniled die bonding production line. Background Technology

[0002] When performing RGB die bonding, the R chip must be bonded first, then the G chip, and finally the B chip.

[0003] Existing minimized die bonding production lines typically include:

[0004] A conveying mechanism for conveying a support frame;

[0005] A plurality of R die bonding devices are arranged sequentially along the conveying mechanism, and each R die bonding device is used to perform R chip die bonding operations on a portion of the die bonding holes of the support.

[0006] A plurality of G die bonding devices are provided, each of which is located downstream of all the R die bonding devices and is arranged sequentially along the conveying mechanism. Each of the R die bonding devices is used to perform die bonding operations on the R chip of the support portion.

[0007] A plurality of B-die bonding devices are provided, each of which is located downstream of all the G-die bonding devices and is arranged sequentially along the conveying mechanism. Each B-die bonding device is used to perform B-chip bonding operations on a portion of the G-chip of the support.

[0008] See Figure 1 Taking two R-type die bonders, two G-type die bonders, and two B-type die bonders as an example, the existing Miniled die bond process flow is as follows:

[0009] ①The conveying mechanism 1 transports the empty support without any chip bonding to the first R bonding device 2. After the first R bonding device 2 performs R chip bonding operation on half of the bonding holes of the support, it sends the support back to the conveying mechanism 1.

[0010] ②The conveying mechanism 1 transports the bracket with half of the die bonding holes R chip already bonded to the second R die bonding device 3. After the second R die bonding device 3 performs the R chip bonding operation for the other half of the die bonding holes of the bracket, it sends the bracket back to the conveying mechanism 1.

[0011] ③ The conveying mechanism 1 transports the bracket with the R chip die bonded to the first G die bonder 4. After the first G die bonder 4 performs the G chip die bonding operation on half of the R chip on the bracket, it sends the bracket back to the conveying mechanism 1.

[0012] ④ The conveying mechanism 1 transports the bracket on which half of the R chip has been die bonded to the second G die bonder 5. After the second G die bonder 5 performs the die bonding operation on the other half of the R chip on the bracket, it sends the bracket back to the conveying mechanism 1.

[0013] ⑤ The conveying mechanism 1 transports the bracket with the completed G chip die bonding to the first B die bonding device 6. After the first B die bonding device 6 performs the B chip die bonding operation on half of the G chip on the bracket, it sends the bracket back to the conveying mechanism 1.

[0014] ⑥ The conveying mechanism 1 transports the bracket on which half of the G chip has been die bonded to the second B die bonder 7. After the second B die bonder 7 performs the die bonding operation on the other half of the G chip on the bracket, it sends the bracket back to the conveying mechanism 1.

[0015] ⑦ At this point, the RGB die bonding operation on all die bonding holes on the support has been completed. The conveying mechanism 1 transports the support that has completed the RGB die bonding operation to the downstream process.

[0016] The above process has the following problems:

[0017] ①The die bonding order of R-GB is not adjustable. Therefore, after the B die bonding equipment, no R die bonding equipment or G die bonding equipment can be set up. For example, if the existing Miniled die bonding production line has two R die bonding equipment, two G die bonding equipment and two B die bonding equipment, then the specific die bonding equipment layout is RRGGBB.

[0018] If you want to expand production capacity in the future, and increase the number of R-type die bonding equipment, G-type die bonding equipment, and B-type die bonding equipment to three each, that is, when the desired die bonding equipment layout is RRRGGGBBB, you cannot simply add a set of R-type die bonding equipment, G-type die bonding equipment, and B-type die bonding equipment after the original RRGGBB type die bonding production line; instead, you can only dismantle the original RRGGBB type die bonding production line and re-insert a set of R-type die bonding equipment, G-type die bonding equipment, and B-type die bonding equipment.

[0019] This results in poor flexibility of the entire production line and high costs for subsequent upgrades and expansions;

[0020] ② In theory, if the time it takes for all die bonding equipment to remove the bracket from the conveyor 1 and the time it takes to put the bracket back into the conveyor 1 after die bonding are the same, then each forward transport operation of the conveyor 1 can simultaneously meet the bracket transport needs of all die bonding equipment.

[0021] However, in reality, the processing time of different die bonding equipment varies, which results in some die bonding equipment having a fast die bonding speed and others having a slow die bonding speed.

[0022] The existing conveyor mechanism 1 is a single-layer conveyor belt structure. Each support can only be transported forward in sequence. Even if some die-bonding equipment has completed the die-bonding operation of its own station, the conveyor mechanism 1 must wait for other die-bonding equipment to complete the die-bonding work of the corresponding station before it can uniformly transport the support forward. The waiting time of the die-bonding equipment will lead to idle production resources and greatly reduce production efficiency.

[0023] Therefore, existing Miniled die bonding production lines need to be improved to address their poor scalability and low production efficiency.

[0024] The information disclosed in this background section is included only to enhance the understanding of the context of this disclosure, and therefore may contain information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0025] One objective of this invention is to provide a conveying mechanism and a Miniled die bonding production line that can effectively solve the problems of poor expansion flexibility and low production efficiency of existing Miniled die bonding production lines.

[0026] To achieve the above objectives, on the one hand, this utility model provides a conveying mechanism, including at least two fixed linear feeding assemblies spaced apart, a rotary linear feeding assembly located between two adjacent fixed linear feeding assemblies, and a rotary lifting drive mechanism for driving the rotary linear feeding assembly to rotate and lift relative to the fixed linear feeding assembly.

[0027] in,

[0028] The fixed linear feeding assembly includes at least three layers of fixed conveying devices arranged from top to bottom, and the rotary linear feeding assembly includes at least two layers of dispatching conveying devices arranged from top to bottom.

[0029] The rotary lifting drive mechanism

[0030] This is used to drive the rotary linear feed assembly to rotate parallel to the feeding direction of each of the fixed linear feed assemblies, so as to perform material transfer operations between the fixed linear feed assemblies and the rotary linear feed assembly.

[0031] And for driving the rotary linear feed assembly to rotate to be perpendicular to the feeding direction of each of the fixed linear feed assemblies, so as to perform material transfer operations between the rotary linear feed assembly and the die bonding platform.

[0032] Optionally, the number of fixed transmission devices is three layers, and the number of scheduled transmission devices is two layers.

[0033] Optional,

[0034] When the uppermost fixed conveyor is aligned with the uppermost dispatch conveyor, the lowermost fixed conveyor is aligned with the lowermost dispatch conveyor.

[0035] Optionally, the interval between two adjacent fixed conveying devices is equal.

[0036] Optionally, each of the conveying devices is a conveyor belt or a set of feeding rollers.

[0037] Optionally, both the fixed linear feeding assembly and the rotary linear feeding assembly include a conveying device mounting frame for mounting and fixing each of the conveying devices, and a mounting frame transverse direct drive mechanism located at the bottom of the conveying device mounting frame.

[0038] The driving direction of the fixed frame transverse direct drive mechanism is perpendicular to the feeding direction of the fixed linear feeding assembly.

[0039] Optional,

[0040] The rotary lifting drive mechanism includes:

[0041] A rotary drive mechanism, wherein the drive end of the rotary drive mechanism is connected to the rotary linear feed assembly, and is used to drive the rotary linear feed assembly to rotate around a vertical axis;

[0042] A lifting direct drive mechanism is provided, the drive end of which is connected to the rotary drive mechanism. The rotary drive mechanism drives the rotary linear feeding assembly to move up and down in the vertical direction, so that each of the scheduling conveying devices moves to be flush with the corresponding fixed conveying device under different working conditions.

[0043] On the other hand, a minimized die bonding production line is provided, including:

[0044] Any of the aforementioned conveying mechanisms, wherein the conveying mechanism is used to transport the support;

[0045] A plurality of R die bonding devices, each of the R die bonding devices being provided with a corresponding rotary linear feeding assembly, each of the R die bonding devices being used to perform R chip die bonding operations on some die bonding holes of the support;

[0046] A plurality of G die bonding devices, each of the G die bonding devices being provided with a corresponding rotary linear feeding assembly, and each of the R die bonding devices being used to perform die bonding operations on the R chip on the support portion.

[0047] A plurality of B-die bonding devices, each of the B-die bonding devices being provided with a corresponding rotary linear feeding assembly, and each of the B-die bonding devices being used to perform B-chip bonding operations on a portion of the G-chip of the support.

[0048] Optional,

[0049] Each of the G die bonding devices has an R die bonding device upstream and a B die bonding device downstream to form a continuous RGB arrangement structure.

[0050] The beneficial effects of this utility model are as follows: It provides a conveying mechanism and a minimized die bonding production line, which have the following advantages:

[0051] 1. Modular and scalable architecture

[0052] By connecting modular equipment groups in series with independent transmission units, seamless expansion of the production line end is achieved, solving the problem of dismantling and reassembling traditional production lines and reducing the difficulty of production line expansion.

[0053] 2. Three-dimensional transport system

[0054] By employing the coordinated scheduling of multi-layer fixed conveyor belts and rotary lifting mechanisms, a three-dimensional material channel is established, enabling parallel transmission and space reuse of supports for different processes.

[0055] 3. Dynamic priority scheduling mechanism

[0056] Intelligent allocation of conveyor paths based on process status prioritizes the flow of semi-finished support brackets, synchronously schedules raw material replenishment, eliminates equipment waiting periods, and improves production efficiency.

[0057] 4. Multi-channel redundant transmission design

[0058] Construct upper / middle / lower layered conveyor channels to achieve physical isolation between finished product output, semi-finished product processing and raw material input, and ensure system degradation operation in the event of a single channel failure. Attached Figure Description

[0059] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0060] Figure 1 A top view of an existing Miniled die bonding production line provided for the background art;

[0061] Figure 2 A side view of the conveying mechanism provided in the embodiment;

[0062] Figure 3 A schematic diagram of the inner side of the conveying mechanism provided in the embodiment;

[0063] Figure 4 A top view of the four-module Miniled die-bonding production line provided in this embodiment;

[0064] Figure 5 A flowchart of the die-bonding scaffold scheduling method provided in the embodiment.

[0065] In the picture:

[0066] 100, First RGB module; 200, Second RGB module; 300, Third RGB module; 400, Fourth RGB module;

[0067] 1. Conveying mechanism; 101. First fixed linear feeding assembly; 1011. First upper conveyor; 1012. First middle conveyor; 1013. First lower conveyor; 102. Second fixed linear feeding assembly; 1021. Second upper conveyor; 1022. Second middle conveyor; 1023. Second lower conveyor; 103. Rotary linear feeding assembly; 1031. Scheduling upper conveyor; 1032. Scheduling lower conveyor; 104. Rotary lifting drive mechanism; 1041. Rotary drive mechanism; 1042. Lifting direct drive mechanism; 105. Conveying device fixing frame; 106. Fixing frame transverse direct drive mechanism;

[0068] 2. First R die bonding equipment;

[0069] 3. Second R-type die bonding equipment;

[0070] 4. First G die bonding equipment;

[0071] 5. Second G die bonding equipment;

[0072] 6. First B die bonding equipment;

[0073] 7. Second B die bonding equipment;

[0074] 801. First R fixed feeding assembly of module one; 802. R rotary feeding assembly of module one; 803. Second R fixed feeding assembly of module one;

[0075] 901. Module 1, First G Fixed Feeding Assembly; 902. Module 1, G Rotary Feeding Assembly; 903. Module 1, Second G Fixed Feeding Assembly;

[0076] 1001. Module 1 First B Fixed Feeding Assembly; 1002. Module 1 B Rotary Feeding Assembly; 1003. Module 1 Second B Fixed Feeding Assembly;

[0077] 1101. Module 2, First R-fixed feeding assembly; 1102. Module 2, R-rotary feeding assembly; 1103. Module 2, Second R-fixed feeding assembly;

[0078] 1201. Module 2, First G Fixed Feeding Assembly; 1202. Module 2, G Rotary Feeding Assembly; 1203. Module 2, Second G Fixed Feeding Assembly;

[0079] 1301. Module 2, First B, Fixed Feeding Assembly; 1302. Module 2, B, Rotary Feeding Assembly; 1303. Module 2, Second B, Fixed Feeding Assembly. Detailed Implementation

[0080] In this utility model, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this utility model. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this utility model, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0081] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit the invention.

[0082] In the description of this utility model, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " generally indicates that the preceding and following objects have an "or" logical relationship.

[0083] In this invention, terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy, or order between these entities or operations.

[0084] Without further limitations, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this invention is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a series of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0085] Similar to the understanding in the Examination Guidelines, in this utility model, expressions such as "greater than," "less than," and "exceeding" are understood to exclude the stated number; expressions such as "above," "below," and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this utility model, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times," unless otherwise explicitly specified.

[0086] In the description of the embodiments of this utility model, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the convenience of describing the specific embodiments of this utility model or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.

[0087] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this utility model, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this utility model pertains, the specific meaning of the above terms in the embodiments of this utility model can be understood according to the specific circumstances.

[0088] This invention provides a conveying mechanism, a Miniled die bonding production line, and a die bonding support scheduling method, which is applicable to application scenarios where various supports are continuously conveyed to different die bonding equipment for die bonding. It can effectively solve the problems of poor expansion flexibility and low production efficiency of existing Miniled die bonding production lines.

[0089] As in Examples 1 and 2, the following describes various embodiments of the conveying mechanism, the Miniled die bonding production line, and the die bonding support scheduling method of this utility model with reference to the accompanying drawings.

[0090] Example 1

[0091] This embodiment provides a conveying mechanism and a Miniled die bonding production line. Through the coordinated scheduling of a multi-layered fixed linear feeding assembly and a rotary linear feeding assembly, and the modular layout of die bonding equipment, the Miniled production line can be flexibly expanded and efficiently paralleled by utilizing a rotary lifting multi-directional transmission mechanism, thus solving the problems of poor production line scalability and low production efficiency in the prior art.

[0092] The Miniled die bonding production line provided in this embodiment includes a conveyor mechanism, several R die bonding devices, several G die bonding devices, and several B die bonding devices.

[0093] See Figure 2 and Figure 3 The conveying mechanism 1 is used to convey the support. Specifically, the conveying mechanism 1 includes at least two fixed linear feeding assemblies spaced apart, a rotary linear feeding assembly 103 located between two adjacent fixed linear feeding assemblies, and a rotary lifting drive mechanism 104 for driving the rotary linear feeding assembly 103 to rotate and lift relative to the fixed linear feeding assembly.

[0094] in,

[0095] The fixed linear feeding assembly includes at least three layers of fixed conveying devices arranged from top to bottom, and the rotary linear feeding assembly 103 includes at least two layers of dispatching conveying devices arranged from top to bottom.

[0096] The rotary lifting drive mechanism 104 is used for:

[0097] ① Drive the rotary linear feeding assembly 103 to rotate parallel to the feeding direction of each of the fixed linear feeding assemblies, so as to perform material transfer operations between the fixed linear feeding assembly and the rotary linear feeding assembly 103.

[0098] ② Drive the rotary linear feed assembly 103 to rotate to be perpendicular to the feeding direction of each of the fixed linear feed assemblies, so as to perform material transfer operation between the rotary linear feed assembly 103 and the die bonding platform.

[0099] In this embodiment:

[0100] Each of the R die bonding devices is provided with a corresponding rotary linear feeding assembly 103, and each of the R die bonding devices is used to perform R chip die bonding operations on some die bonding holes of the support.

[0101] Each of the G die bonding devices is provided with a corresponding rotary linear feeding assembly 103, and each of the R die bonding devices is used to perform die bonding operations on the G chip on the R chip of the support portion.

[0102] Each of the B-die bonding devices is provided with a corresponding rotary linear feed assembly 103, and each of the B-die bonding devices is used to perform B-chip die bonding operations on the G-chip of the bracket portion.

[0103] Generally, during the die bonding process, the chip is provided by the die bonding equipment, and the transfer mechanism 1 is mainly used for the transfer of the substrate. Therefore, in this embodiment, the transfer mechanism 1 is mainly used for the transfer of the substrate.

[0104] Of course, in some other embodiments, depending on actual production needs, the conveying mechanism 1 can also be used for the conveying of crystal rings, and this utility model does not limit this.

[0105] The following mainly uses the conveyor mechanism 1 for conveying the support as an example to explain the working principle of the conveyor mechanism 1 and the Miniled die bonding production line.

[0106] In this embodiment, the fixed conveying device has three layers (in some other embodiments, four, five, or even more layers may be provided to improve the transmission speed of the fixed conveying device's support); further:

[0107] Each of the fixed linear feeding assemblies includes a first fixed linear feeding assembly 101 located upstream of the rotary linear feeding assembly 103, and a second fixed linear feeding assembly 102 located downstream of the rotary linear feeding assembly 103.

[0108] The fixed conveying devices of the first fixed linear feeding assembly 101, from top to bottom, include a first upper conveying device 1011, a first middle conveying device 1012, and a first lower conveying device 1013.

[0109] The fixed conveying devices of the second fixed linear feeding assembly 102, from top to bottom, include a second upper conveying device 1021, a second middle conveying device 1022, and a second lower conveying device 1023.

[0110] In this embodiment, the scheduling and conveying device has two layers (in some other embodiments, three, four, or even more layers may be provided to improve the scheduling speed of the rotary linear feeding assembly 103); further:

[0111] Each of the aforementioned scheduling and transmission devices, from top to bottom, includes a scheduling upper transmission device 1031 and a scheduling lower transmission device 1032.

[0112] Optionally, the interval between two adjacent fixed conveying devices is equal, and when the uppermost fixed conveying device is aligned with the uppermost scheduling conveying device, the lowermost fixed conveying device is aligned with the lowermost scheduling conveying device.

[0113] Furthermore, the conveying device is a conveyor belt or a set of conveyor rollers.

[0114] The conveyor mechanism 1 and the minimized die bonding line provided in this embodiment can execute the following die bonding support scheduling method to complete continuous die bonding operations:

[0115] S10: The first upper conveying device 1011 delivers a bracket that has not completed RGB die bonding, and / or the first lower conveying device 1013 delivers a bracket that has not undergone die bonding at all.

[0116] In this embodiment, the bracket with incomplete RGB die bonding delivered by the first upper conveying device 1011 has two possibilities:

[0117] The first type is where some chip bonding operations have already been performed, for example, R chip bonding has already been performed, or R chip and G chip bonding has already been performed. This type of partially bonded support is generally delivered by the second upper conveyor 1021 of the previous second fixed linear feed assembly 102 through the scheduling conveyor. The remaining chip bonding operations need to be completed on the basis of the previous bonding operations to obtain a support that completes the RGB bonding operation.

[0118] The second type is a support that has not undergone any die bonding operation, that is, all the die bonding holes on the entire die bonding support are empty; this type of support that has not undergone any die bonding operation is generally sent by the second lower conveyor 1023 of the previous second fixed linear feed assembly 102 through the scheduling conveyor. The first die bonding operation needs to be performed on this support (that is, the most basic R chip die bonding operation needs to be performed) so that the support with the R chip die bonding operation completed can be transported to the first upper conveyor 1011 of the downstream through the downstream scheduling conveyor so that the remaining G chip and B chip die bonding operations can be completed in the downstream die bonding equipment in sequence, so as to obtain a support with the RGB die bonding operation completed.

[0119] The first conveyor 1013 delivers a bracket that has not yet undergone die bonding. This bracket is mainly intended to be transported to the downstream idle R die bonding equipment. Therefore, if no idle R die bonding equipment is encountered, the bracket that has not yet undergone die bonding will continue to be conveyed forward at the bottom layer until an idle R die bonding equipment appears. Only then will it be transported upward to the corresponding R die bonding equipment by the corresponding scheduling conveyor to perform the most basic R chip die bonding operation.

[0120] S20: If the first upper conveying device 1011 continues to deliver the bracket, the rotary linear feeding assembly 103 and the rotary lifting drive mechanism 104 cooperate to prioritize dispatch the bracket delivered by the first upper conveying device 1011 to the corresponding die bonding equipment for die bonding operation.

[0121] It should be noted that if the first upper conveying device 1011 continues to send the bracket, it means that the upstream second lower conveying device 1023 is continuously sending the bracket that has already undergone R chip die bonding or RG chip die bonding. In this case, the remaining chip die bonding operation should be performed on the bracket sent by the first upper conveying device 1011 first.

[0122] Specifically, S20 includes:

[0123] S201: The rotary lifting drive mechanism 104 drives the rotary linear feeding assembly 103 to move to the position where the scheduling upper conveying device 1031 is directly opposite and level with the first upper conveying device 1011, and the scheduling lower conveying device 1032 is directly opposite and level with the first lower conveying device 1013.

[0124] S202: The first upper conveying device 1011 transmits the bracket that has not completed RGB die bonding to the scheduling upper conveying device 1031, and the scheduling lower conveying device 1032 transmits the bracket that has not undergone die bonding to the second lower conveying device 1023.

[0125] S203: The rotary lifting drive mechanism 104 drives the scheduling upper conveyor 1031 to rotate so that it is directly opposite and aligned with the corresponding die bonding equipment; the corresponding die bonding equipment removes the support from the first upper conveyor 1011 for die bonding, and transfers the support that has completed the die bonding operation of the die bonding equipment to the scheduling upper conveyor 1031.

[0126] If the bracket delivered by the die bonding device has not yet completed RGB die bonding, the rotary lifting drive mechanism 104 drives the scheduling upper conveying device 1031 to rotate so that it is directly opposite and aligned with the second upper conveying device 1021; then, the scheduling upper conveying device 1031 conveys the bracket that has not completed RGB die bonding to the second upper conveying device 1021.

[0127] If the bracket delivered by the die bonding device has completed RGB die bonding, the rotation and lifting drive mechanism 104 drives the scheduling upper conveying device 1031 to rotate and descend to be directly opposite and level with the second middle conveying device 1022; then, the scheduling upper conveying device 1031 transports the bracket that has completed RGB die bonding to the second middle conveying device 1022.

[0128] S30: If the first upper conveying device 1011 stops delivering the bracket, the rotary linear feeding assembly 103 schedules the corresponding die bonding equipment to perform die bonding on the bracket delivered by the first lower conveying device 1013.

[0129] If the first upper conveying device 1011 stops sending the bracket, it means that the bracket on the first upper conveying device 1011 has completed the RGB die bonding operation, and all the brackets sent out by the first upper conveying device 1011 have been transferred by the upstream scheduling upper conveying device 1031 to the first middle conveying device 1012 and the second middle conveying device 1022.

[0130] At this point, a new support needs to be obtained from the second lower conveyor device 1023 at the bottom layer to carry out the first round of R chip die bonding operation.

[0131] Specifically, S30 includes:

[0132] S301: The rotary lifting drive mechanism 104 drives the rotary linear feeding assembly 103 to move to the scheduling upper conveying device 1031 and the first lower conveying device 1013 facing each other and level; the first lower conveying device 1013 conveys the completely unbonded support to the scheduling upper conveying device 1031.

[0133] S302: The rotary lifting drive mechanism 104 drives the scheduling upper conveyor 1031 to rotate and rise to be directly opposite and level with the corresponding die bonding device; the corresponding die bonding device takes out the bracket from the first lower conveyor 1013 that has not undergone die bonding operation, performs the first R chip die bonding, and sends the bracket that has completed the die bonding operation of the die bonding device back to the scheduling upper conveyor 1031;

[0134] S303: The rotary lifting drive mechanism 104 drives the scheduling upper conveying device 1031 to rotate to be directly opposite and flush with the second upper conveying device 1021, and transfers the bracket with the R chip die bonded to the second upper conveying device 1021.

[0135] S304: The other fixed linear feeding components, rotary linear feeding components 103, and rotary lifting drive mechanism 104 cooperate to complete the remaining G chip and B chip die bonding operations in sequence according to step S20.

[0136] S40: If the first intermediate conveying device 1012 delivers a bracket that has completed RGB die bonding, the rotary linear feeding assembly 103 and the rotary lifting drive mechanism 104 cooperate to transfer the bracket delivered by the first intermediate conveying device 1012 to the second intermediate conveying device 1022.

[0137] In this embodiment, each of the G die bonding devices has an R die bonding device upstream and a B die bonding device downstream, forming a continuous RGB arrangement (RGB-RGB-...). Three adjacent R die bonding devices, G die bonding devices, and B die bonding devices constitute an RGB die bonding module.

[0138] Next, see Figure 4 To illustrate, we will take four RGB die-bonding modules as an example (referred to as "first RGB module 100", "second RGB module 200", "third RGB module 300" and "fourth RGB module 400" respectively).

[0139] Accordingly,

[0140] The die bonding devices of the first RGB module 100 are sequentially referred to as the first R die bonding device 2, the first G die bonding device 4, and the first B die bonding device 6.

[0141] The die bonding devices of the second RGB module 200 are referred to as the second R die bonding device 3, the second G die bonding device 5, and the second B die bonding device 7, respectively.

[0142] The fixed linear feeding assembly and the rotary linear feeding assembly 103 are respectively referred to as:

[0143] Module 1 First R Fixed Feeding Assembly 801, Module 1 R Rotary Feeding Assembly 802, Module 1 Second R Fixed Feeding Assembly 803

[0144] Module 1 First G Fixed Feeding Assembly 901, Module 1 G Rotary Feeding Assembly 902, Module 1 Second G Fixed Feeding Assembly 903

[0145] Module 1 First B Fixed Feeding Assembly 1001, Module 1 B Rotary Feeding Assembly 1002, Module 1 Second B Fixed Feeding Assembly 1003

[0146] Module 2 First R Fixed Feeding Assembly 1101, Module 2 R Rotary Feeding Assembly 1102, Module 2 Second R Fixed Feeding Assembly 1103

[0147] Module 2 First G Fixed Feeding Assembly 1201, Module 2 G Rotary Feeding Assembly 1202, Module 2 Second G Fixed Feeding Assembly 1203

[0148] Module 2 First B Fixed Feeding Assembly 1301, Module 2 B Rotary Feeding Assembly 1302, Module 2 Second B Fixed Feeding Assembly 1303.

[0149] Assuming the bonding bracket needs to undergo complete processing through two RGB die-bonding modules (R→G→B→R→G→B), and each module only completes 50% of the die-bonding work for its corresponding chip, the specific die-bonding bracket scheduling method is as follows:

[0150] Step 1: Initialize the bracket and insert it into the first RGB module 100.

[0151] (1) Bracket input:

[0152] ①The first lower conveyor 1013 of the first R fixed feeding assembly 801 of module one continuously feeds a bracket that has not undergone die bonding:

[0153] ②The first conveying device 1012 of the first R fixed feeding assembly 801 of module one continuously feeds the bracket that has completed RGB die bonding;

[0154] First, the first lower conveying device 1013 of the first R fixed feeding assembly 801 of module 1 transmits the bracket to the scheduling upper conveying device 1031 of the rotating feeding assembly 802 of module 1R, and the scheduling upper conveying device 1031 of the rotating feeding assembly 802 of module 1R conveys it upward to the first R die bonding device 2.

[0155] Then, the first lower conveyor 1013 of the first R fixed feeding assembly 801 of module one will transfer the remaining supports to the scheduling lower conveyor 1032 of the rotating feeding assembly 802 of module one. From the scheduling lower conveyor 1032 of the rotating feeding assembly 802 of module one, the supports will sequentially pass through the second R fixed feeding assembly 803 of module one, the first G fixed feeding assembly 901 of module one, the rotating feeding assembly 902 of module one, the second G fixed feeding assembly 903 of module one, the first B fixed feeding assembly 1001 of module one, the rotating feeding assembly 1002 of module one, the second B fixed feeding assembly 1003 of module one, the first R fixed feeding assembly 1101 of module two, and the rotating feeding assembly 103 of module two. The material is directly fed to the third RGB module 300 from the lower layer of numerous linear feeding components, including material component 1102, module two second R fixed feeding component 1103, module two first G fixed feeding component 1201, module two G rotary feeding component 1202, module two second G fixed feeding component 1203, module two first B fixed feeding component 1301, module two B rotary feeding component 1302, and module two second B fixed feeding component 1303. This allows the third RGB module 300 and the fourth RGB module 400 to simultaneously perform die bonding operations while the first RGB module 100 and the second RGB module 200 are performing die bonding operations, without waiting, thus improving production efficiency.

[0156] Furthermore, if more RGB die bonding modules are needed in the future, it is only necessary to add an RGB die bonding module and a corresponding extension conveyor mechanism 1 directly after the fourth RGB module 400, without disassembling the entire production line, which greatly improves the flexibility of die bonding production line expansion.

[0157] (2) R-type die bonding equipment processing:

[0158] Rotation docking: The module 1R rotary feeding assembly 802 rotates 90° and is raised, so that its upper conveying device 1031 is aligned with the first R die bonding device 2.

[0159] Board processing: The first R die bonding device 2 removes the bracket that has not been die bonded at all, and puts the other bracket, whose R chip has been die bonded in 50% of the area, into the scheduling upper conveyor 1031 of the module-1 R rotary feeding assembly 802.

[0160] Return transmission: The R chip die bonding bracket, which has completed 50% of the region, is conveyed downward through the scheduling upper conveyor 1031 of the module one R rotary feed assembly 802 to the second upper conveyor 1021 of the module one second R fixed assembly, and marked as "R part completed".

[0161] The RGB die bonding operation has been completed. The Module 1 R rotary feeding assembly 802 and the corresponding rotary lifting drive mechanism 104 cooperate to transfer the bracket sent by the first middle conveying device 1012 of the Module 1 first R fixed feeding assembly 801 to the second middle conveying device 1022 of the Module 1 second R fixed feeding assembly 803 through the scheduling upper conveying device 1031 and / or scheduling lower conveying device 1032.

[0162] Step 2: The bracket is inserted into the G-die bonding device of the first RGB module 100.

[0163] (1) Transmission to G device:

[0164] The second upper conveying device 1021 of the second R fixed component of module one delivers the bracket with the R part completed to the first upper conveying device 1011 of the first G fixed component of module one.

[0165] The second intermediate conveying device 1022 of the second R fixed component of module one delivers the bracket that has completed the RGB die bonding operation to the first intermediate conveying device 1012 of the first G fixed component of module one.

[0166] (2) G-type die bonding equipment processing:

[0167] Rotation docking: The scheduling upper conveyor 1031 of the module 1 G rotary feeding assembly 902 first receives the bracket sent by the second upper conveyor 1021 of the module 1 second R fixed assembly, then rotates 90° and lifts it, so that the scheduling upper conveyor 1031 is aligned with the platform of the first G die bonding equipment 4.

[0168] Board processing: The first G die bonding device 4 takes away the bracket and sends the bracket with 50% of the G chip die bonding completed (covering the completed R area) back to the scheduling upper conveyor device 1031.

[0169] Return transmission: After processing, the bracket is sent back to the second upper transmission device 1021 of the second G fixed component of module one via the scheduling upper transmission device 1031 of the module one G rotary feeding assembly 902, and marked as "G part completed".

[0170] The RGB die bonding operation has been completed. The Module 1 G rotary feeding component 902 and the corresponding rotary lifting drive mechanism 104 cooperate to transfer the bracket sent by the first middle conveying device 1012 of the Module 1 first G fixed feeding component 901 to the second middle conveying device 1022 of the Module 1 second G fixed feeding component 903 through the scheduling upper conveying device 1031 and / or scheduling lower conveying device 1032.

[0171] Step 3: The bracket is inserted into the die bonding device of the first RGB module 100.

[0172] (1) Transmission to device B:

[0173] The second upper conveying device 1021 of the second G fixed component of module one sends the bracket to the first upper conveying device 1011 of the first B fixed component of module one, and then transfers it to the rotary feeding component 1002 of module one B.

[0174] The second middle conveying device 1022 of the second G fixed component of module one delivers the bracket that has completed the RGB die bonding operation to the first middle conveying device 1012 of the first B fixed component of module one.

[0175] (2) Processing with B-type die bonding equipment:

[0176] Rotation docking: The scheduling upper conveyor 1031 of the rotating feeding assembly 1002 of module 1 first receives the bracket sent by the second upper conveyor 1021 of the second fixed assembly of module 1, and then rotates 90° to align the scheduling upper conveyor 1031 with the platform of the first die bonding equipment 6.

[0177] Board removal processing: The first B die bonding device 6 removes the bracket and puts the bracket with 50% of the B chip die bonded (covering the completed G area) back into the scheduling upper conveyor 1031 of the module-B rotary feeding assembly 1002.

[0178] Return transmission: The processed bracket is sent back to the second upper transmission device 1021 of the second fixed component of module one B through the scheduling upper transmission device 1031 of the module one B rotary feeding assembly 1002, and marked as "Part B completed".

[0179] The RGB die bonding operation has been completed. The rotating feeding assembly 1002 of module one B and the corresponding rotating lifting drive mechanism 104 cooperate to transfer the bracket sent by the first middle conveying device 1012 of module one first B fixed feeding assembly 1001 to the second middle conveying device 1022 of module one second B fixed feeding assembly 1003 through the scheduling upper conveying device 1031 and / or scheduling lower conveying device 1032.

[0180] Step 4: The bracket transmits data across modules to the second RGB module 200.

[0181] (1) Inter-module connection:

[0182] The second upper conveying device 1021 of the second B fixed component of module one transmits the bracket to the first upper conveying device 1011 of the first R fixed component of module two;

[0183] The second middle conveying device 1022 of the second B fixed component of module one transmits the bracket to the first middle conveying device 1012 of the first R fixed component of module two;

[0184] The second lower conveying device 1023 of the second B fixed component of module one transmits the bracket to the first lower conveying device 1013 of the first R fixed component of module two.

[0185] (2) Entering the second R die bonding device 3 of the second RGB module 200:

[0186] The subsequent process is exactly the same as steps 1-3, but the remaining 50% of the R→G→B chip bonding is completed by the second R die bonding equipment 3, the second G die bonding equipment 5, and the second B die bonding equipment 7.

[0187] (3) Final state: After the bracket is completed by the second B die bonding device 7 of the second RGB module 200, the bracket is marked as "complete die bonding completed" and is conveyed by the scheduling upper conveying device 1031 of the module 2B rotary feeding assembly 1302 to the second middle conveying device 1022 of the module 2B fixed feeding assembly 1303, and then sent downstream via the second middle conveying device 1022.

[0188] During the above process, while the first RGB module 100 and the second RGB module 200 are performing die bonding operations, the third RGB module 300 can also perform die bonding operations simultaneously without waiting, thus improving production efficiency.

[0189] Furthermore, if more RGB die bonding modules are needed in the future, it is only necessary to add a new RGB die bonding module and a corresponding extension conveyor 1 directly after the last RGB die bonding module (fourth RGB module 400), without disassembling the entire production line, which greatly improves the flexibility of die bonding production line expansion.

[0190] Therefore, the conveying mechanism 1 and the Miniled die bonding production line provided in this embodiment can effectively solve the problems of poor expansion flexibility and low production efficiency of existing Miniled die bonding production lines.

[0191] In this embodiment, both the fixed linear feeding assembly and the rotary linear feeding assembly 103 include a conveying device mounting frame 105 for mounting and fixing each of the conveying devices, and a mounting frame transverse direct drive mechanism 106 located at the bottom of the conveying device mounting frame 105.

[0192] The driving direction of the fixed frame transverse direct drive mechanism 106 is perpendicular to the feeding direction of the fixed linear feeding assembly.

[0193] The fixed frame transverse direct drive mechanism 106 of the fixed linear feeding assembly is used to adjust the transverse position of the fixed linear feeding assembly so that the fixed linear feeding assembly is aligned with the upstream equipment, thereby smoothly receiving materials from the upstream equipment.

[0194] The fixed frame transverse direct drive mechanism 106 of the rotary linear feed assembly 103 is used to adjust the transverse position of the rotary linear feed assembly 103 so that the rotary linear feed assembly 103 is aligned with the fixed linear feed assembly, so that after the material is conveyed to the downstream equipment, it can smoothly receive the material from the upstream fixed linear feed assembly.

[0195] Optionally, the rotary lifting drive mechanism 104 includes a rotary drive mechanism 1041 and a lifting direct drive mechanism 1042.

[0196] The drive end of the rotary drive mechanism 1041 is connected to the rotary linear feed assembly 103 and is used to drive the rotary linear feed assembly 103 to rotate around the vertical axis.

[0197] The driving end of the lifting direct drive mechanism 1042 is connected to the rotary drive mechanism 1041, which drives the rotary linear feeding assembly 103 to move up and down in the vertical direction, so that each of the scheduling conveying devices moves to be flush with the corresponding fixed conveying device under different working conditions.

[0198] It should be noted that each of the G die bonding devices has an R die bonding device upstream and a B die bonding device downstream to form an RGB-RGB-... arrangement. With this die bonding device arrangement, when more RGB die bonding modules need to be added later, it is only necessary to add an RGB die bonding module and a corresponding extension conveyor 1 directly after the last RGB module, without disassembling the entire production line, which greatly improves the flexibility of die bonding production line expansion. Therefore, this die bonding device arrangement is preferred.

[0199] Of course, in some other embodiments, due to process requirements or design factors, each of the G die bonding devices may be located downstream of all the R die bonding devices, and each of the B die bonding devices may be located downstream of all the G die bonding devices, so as to form an arrangement structure of RR……-GG……-BB……. The conveying structure provided in this embodiment can also meet the support conveying requirements of the arrangement structure of the die bonding devices, and this utility model does not limit it in this regard.

[0200] It should be noted that the direct drive mechanism mentioned in this utility model can be a cylinder, hydraulic cylinder, electric cylinder, or motor lead screw linear module, etc., and the rotary drive mechanism 1041 mentioned can be a brushed motor, brushless motor, or rotary cylinder, etc. This utility model does not limit the specific structural form of the direct drive mechanism and the rotary drive mechanism 1041.

[0201] In summary, the conveying mechanism 1 and the Miniled die bonding line provided in this embodiment have the following advantages:

[0202] 1. Modular and scalable architecture

[0203] By connecting modular equipment groups in series with independent transmission units, seamless expansion of the production line end is achieved, solving the problem of dismantling and reassembling traditional production lines and reducing the difficulty of production line expansion.

[0204] 2. Three-dimensional transport system

[0205] By employing the coordinated scheduling of multi-layer fixed conveyor belts and rotary lifting mechanisms, a three-dimensional material channel is established, enabling parallel transmission and space reuse of supports for different processes.

[0206] 3. Dynamic priority scheduling mechanism

[0207] Intelligent allocation of conveyor paths based on process status prioritizes the flow of semi-finished support brackets, synchronously schedules raw material replenishment, eliminates equipment waiting periods, and improves production efficiency.

[0208] 4. Multi-channel redundant transmission design

[0209] Construct upper / middle / lower layered conveyor channels to achieve physical isolation between finished product output, semi-finished product processing and raw material input, and ensure system degradation operation in the event of a single channel failure.

[0210] Example 2

[0211] See Figure 5 This embodiment provides a die bonder scheduling method, which is executed by the transfer mechanism 1 and / or the Miniled die bonder production line provided in Embodiment 1, and has the same function and beneficial effects.

[0212] The die-attachment scaffold scheduling method provided in this embodiment includes:

[0213] S10: The first upper conveying device 1011 delivers a bracket that has not completed RGB die bonding, and / or the first lower conveying device 1013 delivers a bracket that has not undergone die bonding at all.

[0214] S20: If the first upper conveying device 1011 continues to deliver the bracket, the rotary linear feeding assembly 103 and the rotary lifting drive mechanism 104 cooperate to prioritize dispatch the bracket delivered by the first upper conveying device 1011 to the corresponding die bonding equipment for die bonding operation.

[0215] S30: If the first upper conveying device 1011 stops delivering the bracket, the rotary linear feeding assembly 103 schedules the corresponding die bonding equipment to perform die bonding on the bracket delivered by the first lower conveying device 1013.

[0216] Optionally, S20 includes:

[0217] S201: The rotary lifting drive mechanism 104 drives the rotary linear feeding assembly 103 to move to the position where the scheduling upper conveying device 1031 is directly opposite and level with the first upper conveying device 1011, and the scheduling lower conveying device 1032 is directly opposite and level with the first lower conveying device 1013.

[0218] S202: The first upper conveying device 1011 transmits the bracket that has not completed RGB die bonding to the scheduling upper conveying device 1031, and the scheduling lower conveying device 1032 transmits the bracket that has not undergone die bonding to the second lower conveying device 1023.

[0219] S203: The rotary lifting drive mechanism 104 drives the scheduling upper conveyor 1031 to rotate so that it is directly opposite and aligned with the corresponding die bonding equipment; the corresponding die bonding equipment removes the support from the first upper conveyor 1011 for die bonding, and transfers the support that has completed the die bonding operation of the die bonding equipment to the scheduling upper conveyor 1031.

[0220] If the bracket delivered by the die bonding device has not yet completed RGB die bonding, the rotary lifting drive mechanism 104 drives the scheduling upper conveying device 1031 to rotate so that it is directly opposite and aligned with the second upper conveying device 1021; then, the scheduling upper conveying device 1031 conveys the bracket that has not completed RGB die bonding to the second upper conveying device 1021.

[0221] If the bracket delivered by the die bonding device has completed RGB die bonding, the rotation and lifting drive mechanism 104 drives the scheduling upper conveying device 1031 to rotate and descend to be directly opposite and level with the second middle conveying device 1022; then, the scheduling upper conveying device 1031 transports the bracket that has completed RGB die bonding to the second middle conveying device 1022.

[0222] Further, S30 includes:

[0223] S301: The rotary lifting drive mechanism 104 drives the rotary linear feeding assembly 103 to move to the scheduling upper conveying device 1031 and the first lower conveying device 1013 facing each other and level; the first lower conveying device 1013 conveys the completely unbonded support to the scheduling upper conveying device 1031.

[0224] S302: The rotary lifting drive mechanism 104 drives the scheduling upper conveyor 1031 to rotate and rise to be directly opposite and level with the corresponding die bonding device; the corresponding die bonding device takes out the bracket from the first lower conveyor 1013 that has not undergone die bonding operation, performs the first R chip die bonding, and sends the bracket that has completed the die bonding operation of the die bonding device back to the scheduling upper conveyor 1031;

[0225] S303: The rotary lifting drive mechanism 104 drives the scheduling upper conveying device 1031 to rotate to be directly opposite and flush with the second upper conveying device 1021, and transfers the bracket with the R chip die bonded to the second upper conveying device 1021.

[0226] S304: The other fixed linear feeding components, rotary linear feeding components 103, and rotary lifting drive mechanism 104 cooperate to complete the remaining G chip and B chip die bonding operations in sequence according to step S20.

[0227] S40: If the first intermediate conveying device 1012 delivers a bracket that has completed RGB die bonding, the rotary linear feeding assembly 103 and the rotary lifting drive mechanism 104 cooperate to transfer the bracket delivered by the first intermediate conveying device 1012 to the second intermediate conveying device 1022.

[0228] In this embodiment, each of the die bonding devices includes an R die bonding device for performing R chip die bonding, a G die bonding device for performing G chip die bonding, and a B die bonding device for performing B chip die bonding.

[0229] In this configuration, each of the G-type die-bonding devices has an R-type die-bonding device upstream and a B-type die-bonding device downstream, forming a continuous RGB-style arrangement. The die-bonding support scheduling method may further include:

[0230] S50: After the downstream B die bonding equipment, several RGB die bonding modules are added and the conveying mechanism 1 is extended accordingly to expand the capacity of the Miniled die bonding production line; wherein, the RGB die bonding module includes R die bonding equipment, G die bonding equipment and B die bonding equipment in sequence.

[0231] In summary, the die-bonding scaffold scheduling method provided in this embodiment also has the following advantages:

[0232] 1. Modular and scalable architecture

[0233] By connecting modular equipment groups in series with independent transmission units, seamless expansion of the production line end is achieved, solving the problem of dismantling and reassembling traditional production lines and reducing the difficulty of production line expansion.

[0234] 2. Three-dimensional transport system

[0235] By employing the coordinated scheduling of multi-layer fixed conveyor belts and rotary lifting mechanisms, a three-dimensional material channel is established, enabling parallel transmission and space reuse of supports for different processes.

[0236] 3. Dynamic priority scheduling mechanism

[0237] Intelligent allocation of conveyor paths based on process status prioritizes the flow of semi-finished support brackets, synchronously schedules raw material replenishment, eliminates equipment waiting periods, and improves production efficiency.

[0238] 4. Multi-channel redundant transmission design

[0239] Construct upper / middle / lower layered conveyor channels to achieve physical isolation between finished product output, semi-finished product processing and raw material input, and ensure system degradation operation in the event of a single channel failure.

[0240] Based on Example 1, features not explained in this example will have the same function and beneficial effects as those explained in Example 1, and will not be described again here.

[0241] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.

Claims

1. A conveying mechanism, characterized in that, It includes at least two fixed linear feeding assemblies spaced apart, a rotary linear feeding assembly (103) located between two adjacent fixed linear feeding assemblies, and a rotary lifting drive mechanism (104) for driving the rotary linear feeding assembly (103) to rotate and lift relative to the fixed linear feeding assembly. in, The fixed linear feeding assembly includes at least three layers of fixed conveying devices arranged from top to bottom, and the rotary linear feeding assembly (103) includes at least two layers of dispatching conveying devices arranged from top to bottom. The rotary lifting drive mechanism (104) Used to drive the rotary linear feed assembly (103) to rotate parallel to the feeding direction of each of the fixed linear feed assemblies, so as to perform material transfer operations between the fixed linear feed assemblies and the rotary linear feed assembly (103). And for driving the rotary linear feed assembly (103) to rotate perpendicular to the feeding direction of each of the fixed linear feed assemblies, so as to perform material transfer operations between the rotary linear feed assembly (103) and the die bonding platform.

2. The conveying mechanism according to claim 1, characterized in that, The number of fixed transmission devices is three layers, and the number of dispatch transmission devices is two layers.

3. The conveying mechanism according to claim 2, characterized in that, When the uppermost fixed conveyor is aligned with the uppermost dispatch conveyor, the lowermost fixed conveyor is aligned with the lowermost dispatch conveyor.

4. The conveying mechanism according to claim 2, characterized in that, The interval between any two adjacent fixed conveying devices is equal.

5. The conveying mechanism according to claim 1, characterized in that, Each of the conveying devices is a conveyor belt or a set of feeding rollers.

6. The conveying mechanism according to claim 1, characterized in that, Both the fixed linear feeding assembly and the rotary linear feeding assembly (103) include a conveyor mounting bracket (105) for mounting and fixing each of the conveying devices, and a mounting bracket transverse direct drive mechanism (106) located at the bottom of the conveyor mounting bracket (105). The driving direction of the fixed frame transverse direct drive mechanism (106) is perpendicular to the feeding direction of the fixed linear feeding assembly.

7. The conveying mechanism according to claim 1, characterized in that, The rotary lifting drive mechanism (104) includes: A rotary drive mechanism (1041) is provided, the drive end of which is connected to the rotary linear feed assembly (103) for driving the rotary linear feed assembly (103) to rotate around a vertical axis. The lifting direct drive mechanism (1042) is connected to the rotary drive mechanism (1041) at its drive end. The rotary drive mechanism (1041) drives the rotary linear feeding assembly (103) to move up and down in the vertical direction, so that each of the scheduling and conveying devices moves to be flush with the corresponding fixed conveying device under different working conditions.

8. A minimized die bonding production line, characterized in that, include: The conveying mechanism (1) according to any one of claims 1-7, the conveying mechanism (1) being used to convey the support; A plurality of R die bonding devices, each of the R die bonding devices being provided with a corresponding rotary linear feeding assembly (103), each of the R die bonding devices being used to perform R chip die bonding operations on some die bonding holes of the support; A plurality of G die bonding devices, each of the G die bonding devices being provided with a corresponding rotary linear feeding assembly (103), and each of the R die bonding devices being used to perform die bonding operations on the R chips on the support portion of the G chips; A plurality of B-die bonding devices are provided, each of the B-die bonding devices being provided with a corresponding rotary linear feeding assembly (103), and each of the B-die bonding devices is used to perform B-chip die bonding operations on a portion of the G-chip of the support.

9. The Miniled die bonding line according to claim 8, characterized in that, Each of the G die bonding devices has an R die bonding device upstream and a B die bonding device downstream to form a continuous RGB arrangement structure.

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