Wafer taking and placing mechanism

Abstract

The utility model discloses a wafer taking and placing mechanism, which comprises a shell, a large arm rotating mechanism and a small arm rotating mechanism, and is characterized in that the upper end of the shell is provided with a servo driving mechanism, and the outer side of the servo driving mechanism is provided with the large arm rotating mechanism; the big arm rotating mechanism comprises a big arm body, a big arm shaft ring, a first rotating shaft and a transmission assembly, and the big arm body is installed on the outer side of the upper end of the shell. The utility model belongs to the technical field of wafer taking and placing, and aims to solve the problems that in the prior art, the functions that a mechanical arm stretches out and draws back and fingers always move at the same included angle relative to a large arm body cannot be achieved, and therefore the conveying precision cannot be ensured. And meanwhile, the stable transmission effect of a transmission mechanism is poor. The mechanical arm has the technical effects that the problems that the functions of stretching and retracting of the mechanical arm and the same-included-angle movement of fingers relative to the large arm body cannot be achieved, and consequently the conveying precision cannot be ensured are solved. And meanwhile, the stable transmission effect of a transmission mechanism is poor.

Description

Technical Field

[0001] This application relates to the field of wafer pick-and-place technology, specifically to a wafer pick-and-place mechanism. Background Technology

[0002] With the development of China's semiconductor industry, higher requirements have been placed on wafer processing technology. Wafer loading and unloading is an indispensable part of the fully automated wafer grinding and chamfering process. It is responsible for retrieving wafers transported from the customer's site by overhead crane to the next processing stage, and simultaneously for placing the chamfered wafers back into the chucks, and then transporting them to the designated location by overhead crane. Therefore, the accuracy and stability of the wafer loading and unloading mechanism play a crucial role in the operation of the equipment.

[0003] However, most current wafer pick-and-place mechanisms cannot achieve the extension and retraction of the robotic arm and the ability for the fingers to maintain a constant angle relative to the main arm, thus compromising transfer accuracy. Furthermore, the transmission mechanism exhibits poor stable transmission performance. Utility Model Content

[0004] To address this issue, this application provides a wafer pick-and-place mechanism to solve the problems of existing mechanisms that cannot achieve the extension and retraction of the robotic arm and the consistent angle between the fingers and the upper arm body, thus failing to ensure transfer accuracy. Additionally, the transmission mechanism suffers from poor stable transmission performance.

[0005] To achieve the above objectives, this application provides the following technical solution:

[0006] A wafer pick-and-place mechanism includes a housing, a large arm rotation mechanism, and a small arm rotation mechanism. A servo drive mechanism is provided at the upper end of the housing, and the large arm rotation mechanism is provided on the outside of the servo drive mechanism.

[0007] The boom rotation mechanism includes a boom body, a boom collar, a first rotating shaft, and a transmission assembly. The boom body is installed on the upper outer side of the housing. The boom collar is installed inside the boom body. The first rotating shaft is provided through the upper interior of the boom body.

[0008] The upper outer side of the upper arm rotation mechanism is provided with a forearm rotation mechanism, and the upper outer side of the forearm rotation mechanism is provided with a wafer finger mechanism.

[0009] Furthermore, the servo drive mechanism includes a servo motor, a reducer, a transmission assembly, and a transmission shaft. The servo motor is installed inside the housing, and a reducer is provided on the upper outer side of the servo motor. The output end of the reducer is connected to the transmission assembly, and a transmission shaft is installed on the upper rear side of the transmission assembly.

[0010] Furthermore, the transmission assembly includes a synchronous pulley and a synchronous transmission belt. The synchronous pulley is installed at the output end of the reducer, and a synchronous transmission belt is provided on the outer side of the synchronous pulley.

[0011] Furthermore, the forearm rotation mechanism includes a forearm body and a transmission assembly. The forearm body is located on the upper outer side of the upper arm body, and the transmission assembly is installed inside the forearm body. The upper end of the first rotation shaft extends into the interior of the forearm body.

[0012] Furthermore, the wafer finger mechanism includes a second rotating shaft, a finger mounting component, a pipe connector, and a finger pick-and-place clip. The second rotating shaft is installed through the upper end of the forearm body and is connected to a transmission component inside the forearm body.

[0013] Furthermore, a finger mounting component is installed on the upper outer side of the forearm body, and a pipe connector is provided on the upper outer side of the finger mounting component. A finger pick-and-place clip located above the forearm body is provided on the front outer side of the finger mounting component.

[0014] Compared with the prior art, this application has at least the following beneficial effects:

[0015] 1. A servo drive mechanism is set at the upper end of the housing, and a large arm rotation mechanism is set on the outside of the servo drive mechanism. A small arm rotation mechanism is set on the outer side of the upper end of the large arm rotation mechanism, and a wafer finger mechanism is set on the outer side of the upper end of the small arm rotation mechanism. This makes the overall structure compact, meets the customer's minimum space constraints, and better realizes the handling of wafers.

[0016] 2. The transmission assembly includes a synchronous pulley and a synchronous transmission belt. The synchronous pulley is installed at the output end of the reducer, and a synchronous transmission belt is provided on the outer side of the synchronous pulley. The synchronous transmission belt is a GT toothed synchronous belt structure, which can mesh with the arc of the synchronous pulley, ensuring the transmission accuracy of the synchronous belt. This ensures the angle of arm swing and the extension size of the finger picking and placing clamp, thus ensuring the stability of the transmission mechanism.

[0017] 3. By using a 2:1 tooth ratio between the master and slave pulleys of the synchronous belt in the transmission assembly of the upper arm body and a 2:1 tooth ratio between the master and slave pulleys of the synchronous belt in the transmission assembly of the lower arm body, the upper arm body and the lower arm body rotate in opposite directions with a swing angle of 1:2. The lower arm body rotates in the opposite direction relative to the second rotation axis with a swing angle of 2:1. This enables the extension and retraction of the robotic arm and the fingers to maintain the same angle relative to the upper arm body. By changing the tooth ratio between the master and slave pulleys of the robotic arm and the lower arm, the upper arm body and the lower arm body can achieve the same swing angle but opposite swing direction, thereby realizing the linear extension and retraction motion of the fingers when picking up and placing the gripper. Attached Figure Description

[0018] To more intuitively illustrate the prior art and this application, exemplary drawings are provided below. It should be understood that the specific shapes and structures shown in the drawings should not generally be regarded as limiting conditions for implementing this application; for example, based on the technical concept disclosed in this application and the exemplary drawings, those skilled in the art are capable of making conventional adjustments or further optimizations to the addition / reduction / classification of certain units, their specific shapes, positional relationships, connection methods, size ratios, etc.

[0019] Figure 1 This is an exploded view of the overall structure of a wafer pick-and-place mechanism provided in one embodiment of this application;

[0020] Figure 2 This is a schematic diagram of the overall structure of a wafer pick-and-place mechanism provided in one embodiment of this application;

[0021] Figure 3 This is a schematic cross-sectional view of a wafer pick-and-place mechanism provided in one embodiment of this application.

[0022] Explanation of reference numerals in the attached figures:

[0023] 1. Housing; 2. Servo motor; 3. Reducer; 4. Synchronous pulley; 5. Synchronous transmission belt; 6. Drive shaft; 7. Boom body; 8. Boom collar; 9. First rotating shaft; 10. Forearm body; 11. Second rotating shaft; 12. Finger mounting piece; 13. Pipe connector; 14. Finger pick-and-place clamp. Detailed Implementation

[0024] The present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0025] like Figures 1 to 3 As shown, a wafer pick-and-place mechanism of this application includes a housing 1, a large arm rotation mechanism, and a small arm rotation mechanism. A servo drive mechanism is provided at the upper end of the housing 1, and the large arm rotation mechanism is provided on the outer side of the servo drive mechanism. The servo drive mechanism adopts a servo closed-loop drive system, which can achieve high-precision position, speed, and torque control. The built-in encoder can provide real-time feedback of position information to ensure precise control of the motion trajectory.

[0026] The servo drive mechanism includes a servo motor 2, a reducer 3, a transmission assembly, and a transmission shaft 6. The servo motor 2 is installed inside the housing 1, and the reducer 3 is provided on the upper outer side of the servo motor 2. The output end of the reducer 3 is connected to the transmission assembly, and the transmission shaft 6 is installed on the upper rear side of the transmission assembly. The transmission shaft 6 is fixedly installed on the lower rear end of the boom body 7.

[0027] The transmission assembly includes a synchronous pulley 4 and a synchronous transmission belt 5. The synchronous pulley 4 is mounted on the output end of the reducer 3, and the synchronous transmission belt 5 is located on the outer side of the synchronous pulley 4. The servo motor 2 and the reducer 3 provide power to the transmission assembly, allowing the synchronous pulley 4 to rotate via the rotation of the servo motor 2. The synchronous transmission belt 5 then drives the transmission shaft 6, which is mounted on the lower rear end of the boom body 7, to rotate. The synchronous transmission belt 5 is a GT toothed synchronous belt structure, which engages with the arc of the synchronous pulley 4, ensuring the transmission accuracy of the synchronous belt. This ensures the arm swing angle and the extension size of the finger pick-and-place clamp 14, thus ensuring the stability of the transmission mechanism. Compared to the SM type synchronous belt, the GT toothed synchronous belt structure has higher transmission accuracy and greater transmission torque.

[0028] The boom rotation mechanism includes a boom body 7, a boom collar 8, a first rotating shaft 9, and a transmission assembly. The boom body 7 is installed on the upper outer side of the housing 1, and a transmission shaft 6 is provided through the lower interior of the boom body 7. The upper outer side of the transmission shaft 6 is connected to the boom collar 8, and the upper interior of the boom body 7 is provided through the first rotating shaft 9.

[0029] The boom body 7 also has a transmission assembly installed inside, and the upper end of the transmission shaft 6 is connected to the synchronous transmission belt 5 in the transmission assembly of the boom body 7, so that the boom body 7 can be rotated through the transmission shaft 6. The rotation of the boom body 7 causes the synchronous transmission belt 5 to rotate in the opposite direction relative to the boom body 7, which drives another synchronous pulley 4 and the first rotating shaft 9 to rotate, thus facilitating the subsequent rotation of the forearm body 10.

[0030] A forearm rotation mechanism is provided on the outer side of the upper end of the boom rotation mechanism. The forearm rotation mechanism includes a forearm body 10 and a transmission assembly. The forearm body 10 is located on the outer side of the upper end of the boom body 7, and the transmission assembly is installed inside the forearm body 10. The upper end of the first rotation shaft 9 extends into the interior of the forearm body 10.

[0031] The transmission assembly is connected to the upper end of the first rotating shaft 9 and is used to drive the forearm body 10 to rotate. When the forearm body 10 rotates, the synchronous transmission belt 5 rotates in the opposite direction to the forearm body 10, driving another synchronous pulley 4 to rotate, thereby driving the rotation of the second rotating shaft 11.

[0032] A wafer finger mechanism is provided on the outer side of the upper end of the forearm rotation mechanism. The wafer finger mechanism includes a second rotating shaft 11, a finger mounting component 12, a pipe connector 13, and a finger pick-and-place clip 14. The second rotating shaft 11 is installed through the upper end of the forearm body 10 and is connected to the transmission component inside the forearm body 10. The finger mounting component 12 is installed on the outer side of the upper end of the forearm body 10, and a pipe connector 13 is provided on the outer side of the upper end of the finger mounting component 12. A finger pick-and-place clip 14 located above the forearm body 10 is provided on the outer side of the front end of the finger mounting component 12.

[0033] The finger mounting component 12 serves to mount the finger pick-and-place clip 14. When the second rotating shaft 11 rotates, it can drive the finger mounting component 12 to rotate synchronously with it.

[0034] The master-slave pulley ratio of the synchronous pulley 4 in the transmission assembly of the upper arm body 7 is 2:1, and the master-slave pulley ratio of the synchronous pulley 4 in the transmission assembly of the lower arm body 10 is also 2:1. This causes the upper arm body 7 and the lower arm body 10 to rotate in opposite directions with a swing angle of 1:2. The lower arm body 10 rotates in the opposite direction relative to the second rotating axis 11 with a swing angle of 2:1. This enables the extension and retraction of the robotic arm and the fingers to maintain the same angle relative to the upper arm body 7. By changing the master-slave pulley ratio of the upper and lower arms of the robotic arm, the upper arm body 7 and the lower arm body 10 can achieve the same swing angle but opposite swing direction, thereby realizing the linear extension and retraction of the finger pick-and-place clamp 14. This facilitates the handling of wafers through the finger mounting piece 12 and the finger pick-and-place clamp 14.

[0035] Furthermore, this structure can be modified to allow two fingers to handle loading and unloading separately, saving the time required for handling with a single finger.

[0036] The technical features of the above embodiments can be combined in any way (as long as there is no contradiction in the combination of these technical features). For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described; these embodiments not explicitly written should also be considered to be within the scope of this specification.

Claims

1. A wafer pick-and-place mechanism, comprising a housing (1), a large arm rotation mechanism, and a small arm rotation mechanism, characterized in that, The upper end of the outer shell (1) is provided with a servo drive mechanism, and the outer side of the servo drive mechanism is provided with a large arm rotation mechanism. The boom rotation mechanism includes a boom body (7), a boom collar (8), a first rotating shaft (9) and a transmission assembly. The boom body (7) is installed on the upper outer side of the outer shell (1). The boom collar (8) is installed inside the boom body (7). The first rotating shaft (9) is provided through the upper inner part of the boom body (7). The upper outer side of the upper arm rotation mechanism is provided with a forearm rotation mechanism, and the upper outer side of the forearm rotation mechanism is provided with a wafer finger mechanism.

2. The wafer pick-and-place mechanism according to claim 1, characterized in that, The servo drive mechanism includes a servo motor (2), a reducer (3), a transmission assembly, and a transmission shaft (6). The servo motor (2) is installed inside the housing (1), and a reducer (3) is provided on the outer side of the upper end of the servo motor (2). The output end of the reducer (3) is connected to the transmission assembly, and the transmission shaft (6) is installed on the upper rear side of the transmission assembly.

3. The wafer pick-and-place mechanism according to claim 2, characterized in that, The transmission assembly includes a synchronous pulley (4) and a synchronous transmission belt (5). The synchronous pulley (4) is installed at the output end of the reducer (3), and the synchronous transmission belt (5) is provided on the outer side of the synchronous pulley (4).

4. A wafer pick-and-place mechanism according to claim 1, characterized in that, The forearm rotation mechanism includes a forearm body (10) and a transmission assembly. The forearm body (10) is located on the upper outer side of the upper arm body (7), and the transmission assembly is installed inside the forearm body (10). The upper end of the first rotation shaft (9) extends into the interior of the forearm body (10).

5. A wafer pick-and-place mechanism according to claim 1, characterized in that, The wafer finger mechanism includes a second rotating shaft (11), a finger mounting component (12), a pipe connector (13), and a finger pick-and-place clip (14). The second rotating shaft (11) is installed through the upper end of the forearm body (10) and is connected to the transmission component inside the forearm body (10).

6. A wafer pick-and-place mechanism according to claim 5, characterized in that, A finger mounting component (12) is installed on the outer side of the upper end of the forearm body (10), and a pipe connector (13) is provided on the outer side of the upper end of the finger mounting component (12). A finger pick-and-place clip (14) located above the forearm body (10) is provided on the outer side of the front end of the finger mounting component (12).

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