Chip positioning device for lead bonding machine

Abstract

The utility model relates to the technical field of chip production, in particular to a chip positioning device for a lead bonding machine, which is mounted on a processing table, an upper mounting seat is mounted on the rear side of the top end of the outer wall of the processing table, and a lead processor is mounted on the upper mounting seat. A placing part for positioning and placing a chip is arranged at the top end of the outer wall of the processing table and located below the lead processor, the placing part comprises a chip positioning frame, and the two sides of the inner wall of the chip positioning frame are each provided with a movable clamping seat and a chip positioning seat which are used for clamping the chip. The chip positioning seat and the movable clamping seat are detachably fixed, so that a worker only needs to select the corresponding chip positioning seat according to the circuit board, and then the device can clamp and position different circuit boards within a certain size range, so that the applicability of the device can be improved, and the worker can conveniently use the device.

Description

Technical Field

[0001] This utility model relates to the field of chip manufacturing technology, specifically to a chip positioning device for a wire bonding machine. Background Technology

[0002] A wire bonding machine is a device used in semiconductor manufacturing to electrically connect integrated circuit chips (ICs) to a packaging substrate. This machine plays a crucial role in microelectronic packaging technology.

[0003] When performing wire bonding on chips, the chip needs to be placed on the corresponding circuit board first, and then the circuit board is clamped to ensure that the chip can be fixed on the bonding machine, so that personnel can perform subsequent processing operations on the chip. However, when producing chips continuously, personnel need to ensure that the chip is in a consistent position so that they can process the chips continuously. However, the shape and size of each circuit board will be different according to its use and design. Therefore, existing clamping and positioning devices often cannot accurately clamp and position different circuit boards, thus having certain shortcomings.

[0004] In conclusion, it is necessary to invent a chip positioning device for wire bonding machines. Utility Model Content

[0005] To address this issue, this invention provides a chip positioning device for wire bonding machines, which solves the problem that existing clamping and positioning devices often cannot accurately clamp and position different circuit boards due to the fact that the shape and size of each circuit board may vary depending on its use and design.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a chip positioning device for a wire bonding machine, which is installed on a processing table. An upper mounting base is installed on the rear side of the top of the outer wall of the processing table, and a wire processor is installed on the upper mounting base. A placement component for positioning and placing the chip is provided at the top of the outer wall of the processing table and below the wire processor.

[0007] The placement component includes a chip positioning frame, which is installed on the top of the outer wall of the processing table. The inner walls of the chip positioning frame are provided with movable clamping seats and chip positioning seats for clamping the chip on both sides.

[0008] Preferably, the movable clamping seat and the chip positioning seat are two-section structures, with two chip positioning seats disposed on opposite sides of the two movable clamping seats, and each of the opposite sides of the two chip positioning seats having a chip clamping groove for clamping the outer end of the chip.

[0009] Preferably, the inner wall of each chip clamping slot is fixed with a protective pad to protect the chip clamping, and the end of each chip positioning seat near the movable clamping seat is fixed with a connecting plug.

[0010] Preferably, the plurality of connecting blocks are evenly arranged in a strip array, and the movable clamping seat is provided with a connecting slot at the end near the chip positioning seat and at the position corresponding to the connecting block.

[0011] Preferably, the outer walls of the connecting blocks are slidably connected to the inner walls of the corresponding connecting slots, and the outer walls of the chip positioning base, located on the front and rear sides of the connecting blocks, are fixed with magnetic insertion shafts.

[0012] Preferably, the outer wall side of the movable clamping seat is provided with magnetic insertion holes at positions corresponding to the magnetic insertion shaft, and the outer wall of the magnetic insertion shaft is magnetically inserted into the inner wall of the magnetic insertion hole.

[0013] Preferably, the top of the outer wall of the movable clamping seat is provided with a positioning slot at the position corresponding to the connecting slot, the bottom of the positioning slot is connected to the top of the inner wall of the connecting slot, the top of the outer wall of the connecting plug is provided with a fixing groove at the position corresponding to the positioning slot, and the top of the inner wall of the positioning slot is fixedly connected with an anti-detachment plug to fix the connecting plug to the connecting slot.

[0014] Preferably, the front and rear ends of the outer wall of the movable clamping seat are fixed with guide sliders, the front and rear ends of the inner wall of the chip positioning frame are slidably connected to the outer wall of the guide sliders by opening strip grooves, and guide rods are fixed on both sides of the inner wall of the chip positioning frame at positions corresponding to the front guide sliders. The outer wall of the front guide slider is slidably connected to the outer wall of the guide rods by opening through holes.

[0015] Preferably, a bidirectional screw is rotatably connected to the inner wall of the chip positioning frame and at the position corresponding to the rear guide slider via a bearing seat. The rear guide slider is threaded to both sides of the outer wall of the bidirectional screw through threaded holes. A drive motor for driving the bidirectional screw to rotate in both directions is fixed on one side of the outer wall of the chip positioning frame.

[0016] The beneficial effects of this utility model are:

[0017] In this utility model, by detachably fixing the chip positioning seat and the movable clamping seat, the personnel only need to select the corresponding chip positioning seat according to the circuit board so that the device can clamp and position different circuit boards within a certain size range, thereby improving the applicability of the device and making it convenient for personnel to use.

[0018] In this invention, a drive motor drives a bidirectional screw to rotate, allowing the bidirectional screw to simultaneously drive the movable clamping seat to move in opposite directions. Since the two bidirectional screws move the same distance, the circuit board is clamped and positioned at the center. This ensures that subsequent circuit boards are positioned in the same location, facilitating continuous processing and production of the circuit boards. Attached Figure Description

[0019] Figure 1 This is a frontal view of the square overall structure of the bonding machine of this utility model;

[0020] Figure 2 This is a partial structural schematic diagram of the chip positioning frame of this utility model from a top view.

[0021] Figure 3 This is a three-dimensional structural diagram of the movable clamping seat and chip positioning seat in this utility model, viewed from above.

[0022] Figure 4 In this utility model Figure 3 A schematic diagram of the specific structure of the chip positioning base.

[0023] In the diagram: 100, processing table; 110, upper mounting base; 120, wire feeder; 200, chip positioning frame; 210, drive motor; 220, moving clamping base; 221, guide slider; 222, bidirectional screw; 223, guide slide bar; 230, chip positioning base; 231, chip clamping slot; 232, connecting plug; 233, magnetic insertion shaft; 240, connecting slot; 241, magnetic insertion hole; 242, positioning slot; 243, anti-detachment plug. Detailed Implementation

[0024] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0025] See attached document Figures 1-4This utility model provides a chip positioning device for a wire bonding machine, which is installed on a processing table 100. An upper mounting base 110 is installed on the rear side of the top of the outer wall of the processing table 100, and a wire processor 120 is installed on the upper mounting base 110. A chip positioning component is provided on the top of the outer wall of the processing table 100, below the wire processor 120, for positioning and placing the chip. The positioning component includes a chip positioning frame 200, which is installed on the top of the outer wall of the processing table 100. Movable clamping seats 220 and chip positioning seats 230 are provided on both sides of the inner wall of the chip positioning frame 200 for clamping the chip. The movable clamping seats 220 and chip positioning seats 230 have a two-section structure, with the two chip positioning seats 230 located on opposite sides of the two movable clamping seats 220. The chip positioning seats 230 can be positioned according to the circuit board... The shape and size have been changed. Both chip positioning seats 230 have chip clamping slots 231 on opposite sides to hold the outer end of the chip. The inner wall of each chip clamping slot 231 is fixed with a protective pad to protect the chip clamping. A connecting plug 232 is fixed at the end of each chip positioning seat 230 near the movable clamping seat 220. The chip clamping slots 231 can clamp and fix the outer sides of the circuit board through the protective pads. The protective pads can be made of rubber or silicone, so that the chip clamping slots 231 can prevent the circuit board from being damaged during the clamping process. At the same time, the number of rotations of the drive motor 210 can be controlled in advance by testing, so that the chip positioning seats 230 can fix and clamp the two ends of the circuit board while avoiding damage to the circuit board, thus making it more convenient for personnel to use.

[0026] Multiple connecting blocks 232 are evenly arranged in a strip array. A connecting slot 240 is provided at one end of the movable clamping base 220 near the chip positioning base 230 and at a position corresponding to the connecting blocks 232. The outer wall of each connecting block 232 is slidably connected to the inner wall of the corresponding connecting slot 240. The connecting blocks 232 and the connecting slots 240 can be inserted into each other, allowing personnel to install the chip positioning base 230 on the clamping end of the movable clamping base 220. Magnetic suction shafts 233 are fixed to the outer wall of the chip positioning base 230 and on the front and rear sides of the connecting blocks 232. The outer wall of the movable clamping base 220 is... Furthermore, magnetic insertion holes 241 are provided at positions corresponding to magnetic insertion shaft 233. The outer wall of magnetic insertion shaft 233 is magnetically inserted into the inner wall of magnetic insertion hole 241. The magnetic insertion shaft 233 and magnetic insertion hole 241 can be fixed by magnetic connection. The magnetic insertion shaft 233 and magnetic insertion hole 241 can play a positioning and installation role. By changing the shape of chip positioning seat 230, the device can clamp and fix circuit boards of different shapes within a certain range. The operator only needs to ensure that the connecting plug 232 and magnetic insertion shaft 233 are compatible with the connecting slot 240 and magnetic insertion hole 241.

[0027] Positioning slots 242 are provided at the top of the outer wall of the movable clamping base 220, corresponding to the positions of the connecting slots 240. The bottom ends of the positioning slots 242 communicate with the top of the inner wall of the connecting slots 240. Fixing slots are provided at the top of the outer wall of the connecting plug 232, corresponding to the positions of the positioning slots 242. Anti-detachment plugs 243 are fixedly connected to the top of the inner wall of the positioning slots 242 to fix the connecting plugs 232 and the connecting slots 240. The anti-detachment plugs 243 can be inserted from the top into the positioning slots 242 and fixed. Within the fixed slot, the chip positioning seat 230 and the movable clamping seat 220 are fixed, allowing the device to clamp the workpiece by controlling the movement of the movable clamping seat 220. A certain amount of friction can be provided between the anti-detachment block 243, the positioning slot 242, and the fixed slot to improve the insertion effect. A lifting ring can be fixed to the top of the anti-detachment block 243 to facilitate removal by personnel (existing technology, not shown in the figure). Guide sliders 221 are fixed to the front and rear ends of the outer wall of the movable clamping seat 220. The inner wall of the positioning frame 200 is slidably connected to the outer wall of the guide slider 221 at both the front and rear ends by forming strip grooves. Guide rods 223 are fixed on both sides of the inner wall of the chip positioning frame 200 at positions corresponding to the front guide slider 221. The outer wall of the front guide slider 221 is slidably connected to the outer wall of the guide rods 223 through through holes. A bidirectional screw 222 is rotatably connected to the inner wall of the chip positioning frame 200 at positions corresponding to the rear guide slider 221 via bearing seats. The rear guide slider 221 is connected to the bidirectional screw 222 through screw holes. The screw 222 has threaded connections on both sides of its outer wall. A drive motor 210 is fixed on one side of the outer wall of the chip positioning frame 200 to drive the bidirectional screw 222 to rotate in both directions. Specifically, the device can drive the movable clamping seat 220 to rotate in both directions through the drive motor 210, so that the movable clamping seat 220 can control the two movable clamping seats 220 to slide in opposite or relative directions at the same time through the drive guide slider 221, so that the movable clamping seat 220 can clamp or release the workpiece through the chip positioning seat 230.

[0028] The usage process of this utility model is as follows: Those skilled in the art can first assemble the device according to the above instructions, then connect all electrical equipment to an external power supply, and control the operation of the device through an external controller. After completion, first select a chip positioning seat 230 with the corresponding shape and size according to the shape of the circuit board to be clamped, and then insert it into the connecting slot 240 through the connecting plug 232. Then, insert the magnetic insertion shaft 233 into the magnetic insertion hole 241. After completion, the operator can remove the anti-detachment plug 243 and insert its bottom end into the positioning slot 242 and the fixing slot to fix the chip positioning seat 230 and the movable clamping seat 220. After completion, the operator can take out a test piece with the same shape as the circuit board to be processed, and place it in the chip positioning frame 200 between the chip positioning seats 230. Then, power on the movable clamping seat 220 to drive the bidirectional screw 222 to rotate, so that the two movable clamping seats 220 can drive the chip positioning seat 230 to move and clamp the outer wall of the test piece. Once the clamping is confirmed to be fixed, the controller can be used to... At this point, the drive motor 210 is set to a certain number of revolutions. Then, the drive motor 210 can be controlled to rotate in the opposite direction. The chip and circuit board to be bonded are then placed between the movable clamping seats 220. The drive motor 210 is then started to drive the bidirectional screw 222 to rotate. This causes the two movable clamping seats 220 to move the chip positioning seat 230 to clamp and fix both ends of the circuit board. The moving distances of the two movable clamping seats 220 and the chip positioning seat 230 are consistent, ensuring precise positioning of the circuit board at the center. The drive motor 210 automatically stops after the set number of revolutions. This allows the movable clamping seats 220 and the chip positioning seat 230 to clamp and fix both ends of the circuit board without damaging it. Then, the personnel can use the wire bonding machine 120 to perform the chip bonding operation. After completion, the personnel can start the drive motor 210 to control the bidirectional screw 222 to rotate in the opposite direction, causing the movable clamping seats 220 and the chip positioning seat 230 to rotate in the opposite direction and reset. The personnel can then remove the circuit board for replacement.

[0029] The above description is merely a preferred embodiment of this utility model. Any person skilled in the art may modify this utility model or modify it into an equivalent technical solution using the technical solutions described above. Therefore, any simple modifications or equivalent substitutions made based on the technical solutions of this utility model are within the scope of protection claimed by this utility model.

Claims

1. A chip positioning device for a wire bonding machine, characterized in that: It is installed on a processing table (100), and an upper mounting base (110) is installed on the rear side of the top of the outer wall of the processing table (100). A wire feeder (120) is installed on the upper mounting base (110). A placement component for positioning and placing the chip is provided on the top of the outer wall of the processing table (100) and below the wire feeder (120). The placement component includes a chip positioning frame (200), which is installed on the top of the outer wall of the processing table (100). The inner walls of the chip positioning frame (200) are provided with movable clamping seats (220) and chip positioning seats (230) for clamping the chip.

2. The chip positioning device for a wire bonding machine according to claim 1, characterized in that: The movable clamping seat (220) and the chip positioning seat (230) are two-section structures. The two chip positioning seats (230) are located on opposite sides of the two movable clamping seats (220). Each of the two chip positioning seats (230) has a chip clamping groove (231) on opposite sides to clamp the outer end of the chip.

3. The chip positioning device for a wire bonding machine according to claim 2, characterized in that: The inner wall of each chip clamping slot (231) is fixed with a protective pad to protect the chip clamping, and the chip positioning seat (230) is fixed with a connecting plug (232) at one end near the movable clamping seat (220).

4. The chip positioning device for a wire bonding machine according to claim 3, characterized in that: The multiple connecting blocks (232) are evenly arranged in a strip array. The movable clamp (220) is provided with a connecting slot (240) at one end near the chip positioning base (230) and at the position corresponding to the connecting block (232).

5. A chip positioning device for a wire bonding machine according to claim 4, characterized in that: The outer walls of the connecting plug (232) are slidably connected to the inner walls of the corresponding connecting slots (240), and the outer walls of the chip positioning base (230) and the front and rear sides of the connecting plug (232) are fixed with magnetic insertion shafts (233).

6. A chip positioning device for a wire bonding machine according to claim 5, characterized in that: The outer wall of the movable clamping seat (220) and the corresponding position of the magnetic insertion shaft (233) are provided with magnetic insertion holes (241), and the outer wall of the magnetic insertion shaft (233) is magnetically inserted into the inner wall of the magnetic insertion hole (241).

7. A chip positioning device for a wire bonding machine according to claim 5, characterized in that: The top of the outer wall of the movable clamping seat (220) and the corresponding position of the connecting slot (240) are provided with positioning slots (242). The bottom of the positioning slots (242) are connected to the top of the inner wall of the connecting slot (240). The top of the outer wall of the connecting plug (232) and the corresponding position of the positioning slot (242) are provided with fixing grooves. The top of the inner wall of the positioning slot (242) is fixedly connected with an anti-detachment plug (243) to fix the connecting plug (232) and the connecting slot (240).

8. A chip positioning device for a wire bonding machine according to claim 1, characterized in that: The front and rear ends of the outer wall of the movable clamping seat (220) are fixed with guide sliders (221). The front and rear ends of the inner wall of the chip positioning frame (200) are slidably connected to the outer wall of the guide slider (221) by opening strip grooves. The inner walls of the chip positioning frame (200) are fixed with guide rods (223) on both sides and at positions corresponding to the front guide slider (221). The outer wall of the front guide slider (221) is slidably connected to the outer wall of the guide rod (223) by opening through holes.

9. A chip positioning device for a wire bonding machine according to claim 8, characterized in that: The inner wall of the chip positioning frame (200) and the corresponding position of the rear guide slider (221) are rotatably connected to a bidirectional screw (222) via a bearing seat. The rear guide slider (221) is threaded to both sides of the outer wall of the bidirectional screw (222) through threaded holes. A drive motor (210) for driving the bidirectional screw (222) to rotate in both directions is fixed on one side of the outer wall of the chip positioning frame (200).

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