Wafer detection device and wafer detection system

Abstract

The utility model provides a wafer detection device and a wafer detection system, and the device comprises a fixing mechanism which comprises a retainer and a clamping jaw, one side of the retainer in the horizontal direction is provided with a connecting surface, the connecting surface is perpendicular to the horizontal plane, the connecting surface is provided with a connecting area, and the clamping jaw is arranged around the connecting area and can move along the thickness direction of the retainer. At least part of the clamping claws can press the edge of the wafer to be detected; and the detection mechanism comprises a probe, and the probe can be close to / away from the wafer to be detected. According to the utility model, the to-be-detected wafer can be fixed in the vertical direction, observation is facilitated, the detection accuracy is ensured, and meanwhile, chippings and impurities are not easy to accumulate on the surface of the vertically arranged wafer, so that the detection quality is improved. Compared with an existing wafer detection device, the wafer detection device has the advantages of being high in controllability, compatibility and detection quality, capable of avoiding wafer damage and the like, and has wide application prospects in the industry.

Description

Technical Field

[0001] This utility model relates to the field of wafer probing technology, specifically to a wafer probing device and a wafer probing system. Background Technology

[0002] In semiconductor wafer manufacturing processes, wafer probers are core equipment for electrical performance testing, and their structural design directly affects testing accuracy, production efficiency, and equipment maintenance costs.

[0003] Traditional wafer probing machines typically place the wafer in the loading port, remove it from the wafer cassette via a transfer mechanism, and after calibration, place it horizontally on a chuck. The chuck moves upward to the appropriate position so that the probe device can perform electrical testing. The probe head is manually locked on the inner ring and contacts the stationary device (such as POGOTower) that connects the tester interface board and the probe card. It moves closer to the wafer to be probed by lifting and lowering.

[0004] However, during this lifting and lowering detection process, the operator cannot observe the downward-facing probe in real time. The debris generated by friction may accumulate on the wafer, leading to the risk of probe impact. This not only affects the accuracy of the test, but in severe cases, it may even cause the wafer to be scrapped. At the same time, because the wafer is set horizontally, its surface is prone to the accumulation of debris and impurities, which is also one of the main reasons affecting the wafer detection results. Summary of the Invention

[0005] Therefore, the technical problem to be solved by this utility model is to overcome the problems of difficulty in monitoring and easy impact on detection quality when horizontally probing wafers in the prior art, and to provide a wafer probing device and wafer probing system.

[0006] To address the aforementioned technical problems, this utility model provides a wafer probing device, comprising: a fixing mechanism including a holder and at least three claws; a connecting surface on one side of the holder in the horizontal direction, the connecting surface being perpendicular to the horizontal plane and having a connecting area thereon; at least three claws connected to the holder and arranged around the connecting area; any one of the claws being movable along the thickness direction of the holder; at least a portion of the claws extending toward the connecting area to press against the edge of the wafer to be probed; and a probing mechanism including multiple probes, the multiple probes being able to move closer to / away from the wafer to be probed in the horizontal direction.

[0007] In one embodiment of the present invention, the body of the retainer is provided with at least three guide grooves, any one of the guide grooves extends along the thickness direction of the body, the guide grooves are correspondingly arranged with the claws, at least part of the claws are inserted into the guide grooves and can move along the guide grooves.

[0008] In one embodiment of the present invention, the claw includes an insertion portion and a limiting portion. The insertion portion extends along the thickness direction of the holder, with one end passing through and connected to the holder, and the other end connected to the limiting portion. The limiting portion and the insertion portion are inclined toward the connection area to abut against the probed wafer.

[0009] In one embodiment of the present invention, the body of the retainer is provided with a connection channel, and the connection area is provided with at least one adsorption port. One end of the connection channel is connected to the adsorption port, and the other end is connected to a vacuum generator.

[0010] In one embodiment of the present invention, the fixing mechanism further includes an adsorption wire connected to the holder and disposed in the connection area, and is connected to an external power source to adsorb the wafer to be tested.

[0011] In one embodiment of the present invention, the detection mechanism further includes a chuck, and a plurality of probes are spaced apart on one side of the chuck and oriented toward the connection area.

[0012] This utility model also provides a wafer probing system, which includes the wafer probing device described above.

[0013] In one embodiment of the present invention, the wafer probing system includes a transmission mechanism disposed on one side of the wafer probing device, which includes a robotic arm that carries the wafer to be probed and moves it into the wafer probing device.

[0014] In one embodiment of the present invention, the wafer probing system further includes a signal transmission module, which is connected to the holder and disposed toward the connection area.

[0015] In one embodiment of the present invention, the wafer probing system further includes a control mechanism, and the transmission mechanism and the signal transmission module are respectively connected to the control mechanism.

[0016] The above-mentioned technical solution of this utility model has the following advantages compared with the prior art:

[0017] The wafer probing device and system described in this utility model fix the wafer to be probed in a vertical direction using a fixing mechanism, and then probes the wafer using a horizontally movable probe mechanism. During this process, the operator can observe the relative position and distance between the probe and the wafer in real time, thereby ensuring the accuracy of the probe. Simultaneously, the vertically positioned wafer surface is less prone to the accumulation of debris and impurities, thus improving the probe quality. Furthermore, it can reduce the impact of high temperatures during the probe process on the probe's lifespan by increasing the heat dissipation area. Compared with existing wafer probing equipment, this application has advantages such as strong controllability, strong compatibility, high probe quality, and avoidance of wafer damage, and has broad application prospects in the industry. Attached Figure Description

[0018] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0019] Figure 1 This is an exploded structural diagram of the wafer detection device in a preferred embodiment of this utility model;

[0020] Figure 2 yes Figure 1 A schematic diagram of the wafer probing device when the jaws are in the extended state;

[0021] Figure 3 yes Figure 1 A schematic diagram of the chuck in the wafer probing device during the retraction process;

[0022] Figure 4 yes Figure 1 A schematic diagram of the wafer probing device when the jaws are in the retracted state;

[0023] Figure 5 This is a three-dimensional structural diagram of the signal transmission module of the wafer probing system in another embodiment of the present invention.

[0024] Explanation of reference numerals in the accompanying drawings: 100, detection mechanism; 110, chuck; 120, probe; 200, fixing mechanism; 210, retainer; 211, body; 212, guide groove; 213, connection channel; 214, suction port; 220, claw; 221, insertion part; 222, limiting part; 300, wafer; 400, signal transmission module. Detailed Implementation

[0025] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.

[0026] Example 1:

[0027] See Figure 1 As shown, this embodiment provides a wafer probing device, which includes a fixing mechanism 200, the fixing mechanism 200 including a holder 210 and at least three claws 220. The holder 210 has a connecting surface on one side in the horizontal direction, the connecting surface is perpendicular to the horizontal plane, and has a connecting area thereon. At least three claws 220 are connected to the holder 210 and arranged around the connecting area. Any claw 220 can move along the thickness direction of the holder 210. At least a portion of the claws 220 extend toward the connecting area to press against the edge of the wafer 300 to be probed. The wafer 300 to be probed is fixed in the connecting area by the claws 220. A probing mechanism 100 includes a plurality of probes 120, the plurality of probes 120 can move closer to / away from the wafer 300 to be probed in the horizontal direction.

[0028] The wafer probing device described in this embodiment uses a fixing mechanism 200 to fix the wafer 300 to be probed in a vertical direction. Then, a horizontally movable probe mechanism 100 probes the wafer 300. During this process, the operator can observe the relative position and distance between the probe 120 and the wafer 300 in real time, thereby ensuring the accuracy of the probe. Simultaneously, the vertically positioned wafer 300 is less prone to accumulating debris and impurities, thus improving the probe quality. Furthermore, it can reduce the impact of high temperatures during the probe process on the lifespan of the probe 120 by increasing the heat dissipation area. Compared to existing wafer probing equipment, this application has advantages such as strong controllability, strong compatibility, high probe quality, and avoidance of wafer damage, and has broad application prospects in the industry.

[0029] In this embodiment, the fixing mechanism 200 is used to fix the wafer 300 to be probed, so that the wafer 300 can be stably kept in a vertical state. The holder 210 provides a mounting platform for the wafer 300 to be probed, and the jaws 220 are used to limit the wafer 300 in the horizontal and vertical directions, thereby ensuring the stability of the wafer 300 during the probe process. The holder 210 can be connected to an external mounting bracket to adapt to different probe scenarios. Figures 2 to 4 The wafer probing device shown is a reference object, and the right side wall of the holder 210 in this embodiment is the connecting surface.

[0030] Furthermore, to improve the adsorption effect of the holder 210 on the wafer 300, the holder body 211 in this embodiment is provided with a connection channel 213, and the connection area is provided with at least one adsorption port 214. One end of the connection channel 213 is connected to the adsorption port 214, and the other end is connected to a vacuum generator. Based on this, it can adsorb and fix the wafer 300 through the adsorption port 214. Specifically, in this embodiment, the adsorption port 214 is disposed at the center of the connection surface. In different embodiments, the specific number, size, and setting position of the adsorption ports 214 can be adaptively adjusted according to actual usage requirements, and this utility model does not impose specific limitations in this regard.

[0031] Furthermore, in different embodiments, the fixing mechanism 200 further includes an adsorption wire (not shown in the figure), which is connected to the holder 210 and disposed in the connection area. The wire is connected to an external power source to generate an adsorption force through a voltage electric field to adsorb the wafer 300 to be tested. In this embodiment, the fixing mechanism 200 has four claws 220, which are arranged at uniform circumferential intervals to form a circular connection area, thereby enabling precise fixing of the wafer 300 to be tested from four directions. Further, in this embodiment, the holder 210 has four guide grooves 212 on its body 211. Each guide groove 212 extends along the thickness direction of the body 211. The guide grooves 212 correspond one-to-one with the claws 220, and at least a portion of the claws 220 are inserted into the guide grooves 212 and can move along the guide grooves 212.

[0032] Furthermore, in this embodiment, the jaw 220 includes an insertion portion 221 and a limiting portion 222. The insertion portion 221 extends along the thickness direction of the holder 210, with one end passing through and connected to the holder 210, and the other end connected to the limiting portion 222. The limiting portion 222 and the insertion portion 221 are inclined toward the connection area to abut against the wafer 300 to be probed. Specifically, in this embodiment, the insertion portion 221 and the limiting portion 222 are vertically connected to form an "L"-shaped structure. Based on this structure, the insertion portion 221 can limit and fix the wafer 300 to be probed in the vertical direction, and the limiting portion 222 can limit and fix the wafer 300 to be probed in the horizontal direction, thereby ensuring that the wafer 300 in the vertical state remains stable during the probed process.

[0033] In this embodiment, the detection mechanism 100 further includes a chuck 110, and a plurality of probes 120 are spaced apart on one side of the chuck 110 and facing the connection area. The probes 120 are connected to a wafer analysis device to realize the detection process of the wafer 300. This utility model does not impose specific limitations on the specific number and arrangement of the probes 120.

[0034] The following describes the usage process and principle of the wafer probing device in this embodiment:

[0035] See Figures 2 to 4 Before mounting the wafer 300 to be probed, the jaws 220 need to be removed to expose the connection surface. Then, the wafer 300 is placed in the connection area, and the jaws 220 are pushed closer to the wafer 300 until the limiting portion 222 on the jaws contacts the surface of the wafer 300. Next, the probe mechanism 100 approaches the wafer 300 until the probe 120 contacts the surface of the wafer 300, at which point the wafer probed process can begin.

[0036] Example 2:

[0037] This embodiment provides a wafer probing system, which includes the aforementioned wafer probing device. Further, the wafer probing system includes a transfer mechanism disposed on one side of the wafer probing device, and includes a robotic arm. The robotic arm carries the wafer 300 to be probing and moves it into the wafer probing device. Further, see... Figure 5 As shown, the wafer probing system also includes a signal transmission module 400, which is connected to the holder 210 and is positioned toward the connection area, thereby enabling the system to perform wafer 300 positioning, calibration, and pre-calibration functions.

[0038] In summary, the wafer probing device and system described in this utility model fix the wafer 300 to be probed in a vertical direction through the fixing mechanism 200, and then probe the wafer 300 through the horizontally movable probe mechanism 100. During this process, the operator can observe the relative position and distance between the probe 120 and the wafer 300 in real time, thereby ensuring the accuracy of the probe. At the same time, the vertically positioned wafer 300 is less prone to the accumulation of debris and impurities, thus improving the probe quality. In addition, it can also reduce the impact of high temperature during the probe process on the service life of the probe 120 by increasing the heat dissipation area. Compared with existing wafer probing equipment, this application has the advantages of strong controllability, strong compatibility, high probe quality, and avoidance of wafer damage, and has broad application prospects in this industry.

[0039] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A wafer probing device, characterized in that: include: A fixing mechanism includes a retainer and at least three claws. The retainer has a connecting surface on one side in the horizontal direction, which is perpendicular to the horizontal plane and has a connecting area. At least three claws are connected to the retainer and arranged around the connecting area. Any one of the claws can move along the thickness direction of the retainer. At least a portion of the claws extend toward the connecting area to press against the edge of the wafer to be tested. The wafer to be tested is fixed in the connecting area by the claws. The detection mechanism includes multiple probes that can move closer to or further away from the wafer to be detected in a horizontal direction.

2. The wafer probing device according to claim 1, characterized in that: The retainer body is provided with at least three guide grooves, each of which extends along the thickness direction of the body. The guide grooves are provided in a one-to-one correspondence with the claws, and at least a portion of the claws are inserted into the guide grooves and can move along the guide grooves.

3. The wafer probing device according to claim 1, characterized in that: The claw includes an insertion portion and a limiting portion. The insertion portion extends along the thickness direction of the holder, with one end passing through and connected to the holder, and the other end connected to the limiting portion. The limiting portion and the insertion portion are inclined toward the connection area to abut against the probed wafer.

4. The wafer probing device according to claim 1, characterized in that: The main body of the retainer is provided with a connection channel, and the connection area is provided with at least one adsorption port. One end of the connection channel is connected to the adsorption port, and the other end is connected to a vacuum generator.

5. The wafer probing device according to claim 1, characterized in that: The fixing mechanism also includes an adsorption wire connected to the holder and disposed in the connection area, which is externally powered to adsorb the wafer to be tested.

6. The wafer probing device according to claim 1, characterized in that: The detection mechanism also includes a chuck, and multiple probes are spaced apart on one side of the chuck and oriented toward the connection area.

7. A wafer probing system, characterized in that: Includes the wafer probing device according to any one of claims 1 to 6.

8. The wafer probing system according to claim 7, characterized in that: The wafer probing system includes a transmission mechanism located on one side of the wafer probing device. The transmission mechanism includes a robotic arm that carries the wafer to be probed and moves it into the wafer probing device.

9. The wafer probing system according to claim 8, characterized in that: The wafer probing system further includes a signal transmission module connected to the holder and positioned toward the connection area.

10. The wafer probing system according to claim 9, characterized in that: The wafer probing system also includes a control mechanism, and the transmission mechanism and the signal transmission module are respectively connected to the control mechanism.

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