Double-chip cascade acquisition circuit

Abstract

The utility model discloses a double-chip cascade acquisition circuit, which comprises a mounting base and a chip bearing mechanism for bearing and positioning two groups of chips, the top of the mounting base is provided with radiating fins contacted with the bottoms of the chips, and the top of the mounting base is provided with a radiating fin plugging and fixing mechanism. And chip fixing mechanisms are arranged on the two sides of the chip bearing mechanism. According to the utility model, the chip bearing mechanism can carry out bearing and preliminary positioning on two groups of chips which need to be installed, and then the chip fixing mechanism is arranged outside the chip bearing mechanism, so that the chips can be prevented from being separated from the interior of the chip bearing mechanism when working; according to the chip fixing mode, the chip does not need to be directly installed through screws, the damage possibility of the chip is prevented to a certain extent, heat generated by the chip can be conveniently and rapidly dissipated through the arranged cooling fins, heat is prevented from being concentrated and accumulated, and the cooling fins can be fixed through the arranged cooling fin blocking and fixing mechanism.

Description

Technical Field

[0001] This utility model relates to a data acquisition circuit, specifically a dual-chip cascaded data acquisition circuit. Background Technology

[0002] Dual-chip cascaded acquisition circuits are a design strategy that combines the functions of two or more chips to achieve more efficient and accurate data acquisition. This architecture is typically used in applications requiring high-performance data processing and signal conditioning.

[0003] When using a dual-chip cascaded acquisition circuit, the two sets of chips need to be fixedly installed. In most cases, multiple sets of locking screws are used for chip installation. However, this direct installation method can easily damage the chips during use. Furthermore, the chips generate a lot of heat when they are working. If the heat continues to accumulate, the chips may become unusable due to high temperature. Therefore, we propose a dual-chip cascaded acquisition circuit. Utility Model Content

[0004] The purpose of this invention is to provide a dual-chip cascaded acquisition circuit to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a dual-chip cascaded acquisition circuit, including a mounting base, two sets of first locking frames fixedly mounted on both sides of the mounting base, multiple sets of support rods fixedly mounted on the top of the mounting base, a chip carrying mechanism for positioning the two sets of chips fixedly mounted on the top of the support rods, a heat sink contacting the bottom of the chip provided on the top of the mounting base, a heat sink sealing and fixing mechanism for positioning the heat sink provided on the top of the mounting base, and chip fixing mechanisms for mounting the chip inside the chip carrying mechanism provided on both sides of the chip carrying mechanism.

[0006] Furthermore, the chip carrier mechanism includes a connecting frame, a mounting groove, a carrier frame, a carrier groove, and a first locking threaded hole. The connecting frame has a mounting groove, the top of the connecting frame is fixedly connected to the carrier frame, the carrier frame has a carrier groove for carrying the chip, and the top of the carrier frame has two sets of first locking threaded holes.

[0007] Furthermore, the heat sink sealing and fixing mechanism includes a positioning frame, a second locking frame, a connecting plate, a sealing block, and a third locking frame. The positioning frame is fixedly installed on the top of the mounting base, and the heat sink is slidably installed inside the positioning frame. The second locking frame is fixedly installed on the top of one side of the positioning frame. A sealing block inserted into the positioning frame is fixedly connected to one side of the connecting plate. The third locking frame is fixedly connected to the top of the connecting plate at the position corresponding to the second locking frame.

[0008] Furthermore, the chip fixing mechanism includes a fixing frame, a second locking threaded hole, a pick-up plate, and a first clearance chamfer. The fixing frame is inserted into the outside of the support frame. The fixing frame has a second locking threaded hole at the position corresponding to the first locking threaded hole. The pick-up plate is fixedly connected to one side of the fixing frame. The inner wall of the fixing frame has a first clearance chamfer.

[0009] Furthermore, the cross-section of the sealing block is set as an isosceles trapezoid, and the sealing block is made of rubber.

[0010] Furthermore, each of the four corners of the bearing groove is provided with an arc-shaped second chamfer.

[0011] Compared with the prior art, the present invention has the following advantages: the mounting base and the first locking frame of the present invention cooperate with each other to fix the entire device, and the chip carrying mechanism can carry and initially position the two sets of chips to be installed. The chip fixing mechanism is set outside the chip carrying mechanism, which can prevent the chip from detaching from the chip carrying mechanism when working. This chip fixing method does not require direct installation with screws, which can prevent the possibility of chip damage to a certain extent. The heat sink can facilitate the rapid dissipation of heat generated by the chip and prevent heat accumulation. The heat sink sealing and fixing mechanism can fix the heat sink.

[0012] Furthermore, when the entire device is in use, the heat sink, heat sink sealing and fixing mechanism, chip carrier mechanism, and chip fixing mechanism are mostly detachable, which makes it convenient to replace and maintain a single component after it is damaged. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural schematic diagram of the present utility model;

[0014] Figure 2 This is a three-dimensional structural diagram of the chip carrier mechanism of this utility model;

[0015] Figure 3 This is a three-dimensional view of the sealing block installation structure of this utility model;

[0016] Figure 4 This is a three-dimensional structural diagram of the chip fixing mechanism of this utility model.

[0017] In the diagram: 1. Mounting base; 2. First locking frame; 3. Support rod; 4. Heat sink; 5. Heat sink sealing and fixing mechanism; 6. Chip carrier mechanism; 7. Chip fixing mechanism; 8. Connecting frame; 9. Mounting slot; 10. Carrier frame; 11. Carrier slot; 12. First locking threaded hole; 13. Positioning frame; 14. Second locking frame; 15. Connecting plate; 16. Sealing block; 17. Third locking frame; 18. Fixing frame; 19. Second locking threaded hole; 20. Removal plate; 21. First clearance chamfer; 22. Second clearance chamfer. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Please see Figures 1-4 This utility model provides a technical solution: a dual-chip cascaded acquisition circuit, including a mounting base 1. Two sets of first locking frames 2 are fixedly installed on both sides of the mounting base 1. Multiple sets of support rods 3 are fixedly installed on the top of the mounting base 1. A chip carrying mechanism 6 for supporting and positioning the two sets of chips is fixedly installed on the top of the support rods 3. A heat sink 4 that contacts the bottom of the chip is provided on the top of the mounting base 1. The top of the heat sink 4 is located on the same horizontal plane as the bottom of the connecting frame 8. A heat sink sealing and fixing mechanism 5 for positioning the heat sink 4 is provided on the top of the mounting base 1. Chip fixing mechanisms 7 for installing the chip inside the chip carrying mechanism 6 are provided on both sides of the chip carrying mechanism 6.

[0020] The mounting base 1 and the first locking frame 2 work together to secure the entire device. The chip carrier mechanism 6 provides initial support and positioning for the two sets of chips to be installed. The chip fixing mechanism 7 is located outside the chip carrier mechanism 6 to prevent the chips from detaching from the chip carrier mechanism 6 during operation. This chip fixing method eliminates the need for direct screw installation, thus reducing the possibility of chip damage. The heat sink 4 facilitates the rapid dissipation of heat generated by the chips, preventing heat accumulation. The heat sink sealing and fixing mechanism 5 secures the heat sink 4. Furthermore, most of the components—heat sink 4, heat sink sealing and fixing mechanism 5, chip carrier mechanism 6, and chip fixing mechanism 7—are detachable, allowing for individual replacement and maintenance if any component is damaged.

[0021] Please see Figure 1 and Figure 2 The chip carrier mechanism 6 includes a connecting frame 8, a mounting groove 9, a carrier frame 10, a carrier groove 11, and a first locking threaded hole 12. The connecting frame 8 has a mounting groove 9, and the carrier frame 10 is fixedly connected to the top of the connecting frame 8. The carrier frame 10 has a carrier groove 11 for carrying the chip, and the top of the carrier frame 10 has two sets of first locking threaded holes 12. The four corners of the carrier groove 11 are all provided with arc-shaped second clearance chamfers 22.

[0022] The mounting slot 9 on the connecting frame 8 facilitates the heat sink 4 to approach the chip for heat dissipation. The chip to be installed is then placed inside the carrier slot 11 for positioning. The arc-shaped second chamfer 22 facilitates the chip to be placed inside the carrier slot 11. The first locking threaded hole 12 can cooperate with the chip fixing mechanism 7 to install the chip inside the carrier slot 11.

[0023] Please see Figure 1 , Figure 2 and Figure 4 The chip fixing mechanism 7 includes a fixing frame 18, a second locking threaded hole 19, a pick-up plate 20, and a first clearance chamfer 21. The fixing frame 18 is inserted into the outside of the support frame 10. The fixing frame 18 has a second locking threaded hole 19 at a position corresponding to the first locking threaded hole 12. The pick-up plate 20 is fixedly connected to one side of the fixing frame 18. The inner wall of the fixing frame 18 has a first clearance chamfer 21.

[0024] After the chip is placed, the mounting bracket 18 is picked up using the pick-up plate 20. Then, the first chamfer 21 on one side of the mounting bracket 18 allows the mounting bracket 18 to be easily inserted into the outside of the support frame 10. Then, the first locking thread hole 12 and the second locking thread hole 19 are in a corresponding state, and then the mounting bracket 18 can be fixed to the outside of the support frame 10 using external locking bolts.

[0025] Please see Figure 1 , Figure 2 and Figure 4 The heat sink sealing and fixing mechanism 5 includes a positioning frame 13, a second locking frame 14, a connecting plate 15, a sealing block 16, and a third locking frame 17. The positioning frame 13 is fixedly installed on the top of the mounting base 1. The heat sink 4 is slidably installed inside the positioning frame 13. The second locking frame 14 is fixedly installed on the top of one side of the positioning frame 13. The sealing block 16, which is inserted into the positioning frame 13, is fixedly connected to one side of the connecting plate 15. The third locking frame 17 is fixedly connected to the top of the connecting plate 15 at the position corresponding to the second locking frame 14. The cross-section of the sealing block 16 is set as an isosceles trapezoid, and the sealing block 16 is made of rubber.

[0026] During the installation of the heat sink 4, it is inserted into the interior of the positioning frame 13. Then, the sealing block 16 on one side of the connecting plate 15 is inserted into the interior of the positioning frame 13. The sealing block 16, with an isosceles trapezoidal cross-section, is easy to insert into the interior of the positioning frame 13. Then, the second locking frame 14 and the third locking frame 17 correspond to each other. In this way, the second locking frame 14 and the third locking frame 17 can be locked and installed using locking bolts to prevent the heat sink 4 from moving away from the bottom of the chip and to prevent the sealing block 16, made of rubber material, from damaging the heat sink 4.

[0027] In use, the mounting base 1 and the first locking bracket 2 work together to secure the entire device. The chip carrier mechanism 6 initially positions the two sets of chips to be installed. The chip fixing mechanism 7 is located outside the chip carrier mechanism 6 to prevent the chips from detaching during operation. This chip fixing method eliminates the need for direct screw installation, reducing the possibility of chip damage. The heat sink 4 quickly dissipates heat generated by the chips, preventing heat accumulation. The heat sink sealing and fixing mechanism 5 secures the heat sink 4. Furthermore, most of the components—heat sink 4, heat sink sealing and fixing mechanism 5, chip carrier mechanism 6, and chip fixing mechanism 7—are detachable for easy replacement and maintenance if any component is damaged. The mounting slot 9 on the connecting frame 8 facilitates heat dissipation between the heat sink 4 and the chip. The chip to be installed is then placed inside the carrier slot 11 for positioning. The arc-shaped second clearance... Angle 22 facilitates the placement of the chip into the carrier groove 11, while the first locking threaded hole 12 cooperates with the chip fixing mechanism 7 to install the chip inside the carrier groove 11. After the chip is placed, the fixing bracket 18 is lifted using the pick-up plate 20. Then, the first clearance chamfer 21 on one side of the fixing bracket 18 facilitates the insertion of the fixing bracket 18 into the outside of the carrier frame 10. Subsequently, the first locking threaded hole 12 and the second locking threaded hole 19 are aligned, and the fixing bracket 18 can then be fixed using external locking bolts. The heat sink 4 is positioned outside the support frame 10 and inserted into the positioning frame 13 during installation. Then, the sealing block 16 on one side of the connecting plate 15 is inserted into the positioning frame 13. The sealing block 16, which has an isosceles trapezoidal cross-section, is easy to insert into the positioning frame 13. Then, the second locking frame 14 and the third locking frame 17 correspond to each other. In this way, the second locking frame 14 and the third locking frame 17 can be locked and installed using locking bolts to prevent the heat sink 4 from moving away from the bottom of the chip and to prevent the sealing block 16 made of rubber material from damaging the heat sink 4.

[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A dual-chip cascaded acquisition circuit, comprising a mounting base (1), wherein two sets of first locking frames (2) are fixedly mounted on both sides of the mounting base (1), and multiple sets of support rods (3) are fixedly mounted on the top of the mounting base (1), characterized in that: The top of the support rod (3) is fixedly installed with a chip carrying mechanism (6) for positioning two sets of chips. The top of the mounting base (1) is provided with a heat sink (4) that contacts the bottom of the chip. The top of the mounting base (1) is provided with a heat sink sealing and fixing mechanism (5) for positioning the heat sink (4). The two sides of the chip carrying mechanism (6) are provided with chip fixing mechanisms (7) for installing the chip inside the chip carrying mechanism (6).

2. The dual-chip cascaded acquisition circuit according to claim 1, characterized in that: The chip carrier mechanism (6) includes a connecting frame (8), a mounting groove (9), a carrier frame (10), a carrier groove (11), and a first locking threaded hole (12). The connecting frame (8) has a mounting groove (9), and the top of the connecting frame (8) is fixedly connected to the carrier frame (10). The carrier frame (10) has a carrier groove (11) for carrying the chip, and the top of the carrier frame (10) has two sets of first locking threaded holes (12).

3. The dual-chip cascaded acquisition circuit according to claim 2, characterized in that: The heat sink sealing and fixing mechanism (5) includes a positioning frame (13), a second locking frame (14), a connecting plate (15), a sealing block (16), and a third locking frame (17). The positioning frame (13) is fixedly installed on the top of the mounting base (1). The heat sink (4) is slidably installed inside the positioning frame (13). The second locking frame (14) is fixedly installed on the top of one side of the positioning frame (13). The sealing block (16) inserted into the positioning frame (13) is fixedly connected to one side of the connecting plate (15). The third locking frame (17) is fixedly connected to the top of the connecting plate (15) at the position corresponding to the second locking frame (14).

4. The dual-chip cascaded acquisition circuit according to claim 3, characterized in that: The chip fixing mechanism (7) includes a fixing frame (18), a second locking threaded hole (19), a pick-up plate (20), and a first clearance chamfer (21). The fixing frame (18) is inserted into the outside of the support frame (10). The fixing frame (18) has a second locking threaded hole (19) at a position corresponding to the first locking threaded hole (12). The pick-up plate (20) is fixedly connected to one side of the fixing frame (18). The inner wall of the fixing frame (18) has a first clearance chamfer (21).

5. The dual-chip cascaded acquisition circuit according to claim 4, characterized in that: The cross-section of the sealing block (16) is set as an isosceles trapezoid, and the sealing block (16) is made of rubber material.

6. The dual-chip cascaded acquisition circuit according to claim 4, characterized in that: The four corners of the bearing groove (11) are provided with arc-shaped second chamfers (22).

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