Stamping die and stamping equipment

Abstract

The utility model relates to a stamping die and stamping equipment, the stamping die comprises a first die body and a second die body, the first die body and the second die body are stacked along a preset direction, and an accommodating groove for accommodating a battery pole piece is formed between the first die body and the second die body; wherein at least one of the first mold body and the second mold body comprises a base material layer, a first film layer and a second film layer, the periphery of the base material layer is coated with the first film layer, the periphery of the first film layer is coated with the second film layer, and the hardness of the second film layer is smaller than that of the first film layer. The first die body and the second die body can conduct punch forming on the battery pole piece in the containing groove, and through mutual cooperation of the first film layer and the second film layer, the first die body and / or the second die body can give consideration to the high hardness and the good punching effect on the battery pole piece at the same time, and the punching quality is effectively improved.

Description

Technical Field

[0001] This application relates to the field of stamping die technology, and in particular to a stamping die and stamping equipment. Background Technology

[0002] A fuel cell is a device that directly converts the chemical energy of fuel into electrical energy. It boasts advantages such as high energy conversion efficiency, environmental friendliness, and low operating temperature, making it a highly promising clean energy technology. A fuel cell consists of multiple stacked cells, each typically including a cathode and an anode. During production, the cathode and anode cells require stamping, and this stamping process demands a high degree of surface finish, thus requiring high stamping quality.

[0003] Therefore, ordinary stamping forming equipment can easily scratch the surface of the electrode sheet during stamping forming, affecting the final forming quality of the electrode sheet. Utility Model Content

[0004] Therefore, it is necessary to provide a stamping die and its manufacturing method, as well as stamping equipment, to address the problem that the surface of the electrode is easily scratched during stamping, which affects the final forming quality of the electrode.

[0005] In a first aspect, this application provides a stamping die for stamping and forming battery electrode sheets. The stamping die includes a first die body and a second die body, which are stacked together along a preset direction to accommodate the battery electrode sheets.

[0006] Wherein, at least one of the first mold body and the second mold body includes a substrate layer, a first film layer and a second film layer, the first film layer covers the outer periphery of the substrate layer, the second film layer covers the outer periphery of the first film layer, and the hardness of the second film layer is less than the hardness of the first film layer.

[0007] Therefore, through the above structure, during the stamping process of the battery electrode sheet, the first film layer and the second film layer on the first mold body and / or the second mold body cooperate with each other. While taking into account the surface hardness of the first mold body and / or the second mold body, the lubrication and friction reduction effect of the first mold body and / or the second mold body can be improved, the service life of the stamping die can be increased, and the stamping quality can be improved.

[0008] According to one or more embodiments, the first film layer comprises a titanium nitride film layer.

[0009] With the above structure, the titanium nitride film layer can effectively reduce the probability of oxidation on the surface of the first mold body and / or the second mold body, and can effectively improve the surface hardness of the first mold body and / or the second mold body, thereby increasing the service life of the stamping die.

[0010] According to one or more embodiments, the second film layer comprises a soft metal film layer.

[0011] With the above structure, the soft metal film layer has good lubrication and friction reduction effects. When combined with the titanium nitride film layer, it can form a composite metal film layer, which can effectively improve the forming quality of battery electrode sheets and reduce costs while significantly improving hardness and service life.

[0012] According to one or more embodiments, the thickness of the first film layer ranges from 4 μm to 20 μm.

[0013] Therefore, by ensuring that the thickness of the first film layer is within the aforementioned range during the formation of the first film layer, the probability of oxidation of the surface of the first mold body and / or the second mold body can be effectively reduced, and the surface hardness of the first mold body and / or the second mold body can be effectively improved, thereby extending the service life of the stamping die.

[0014] According to one or more embodiments, the thickness of the second film layer ranges from 4 μm to 20 μm.

[0015] Therefore, by ensuring that the thickness of the second film layer is within the aforementioned range during the formation of the second film layer, the lubrication and friction reduction effects of the first mold and / or the second mold can be effectively improved, thereby enhancing the forming quality of the battery electrode sheet.

[0016] According to one or more embodiments, the material of the substrate layer includes one or more of the following: 45# steel, Cr12MoV mold steel, SKD11 mold steel, DC53 mold steel, SKH-9 mold steel, Q235 mold steel, SKH51 mold steel, P20 mold steel, YXM1 mold steel, SLD mold steel, and V4 mold steel.

[0017] Through the above structure, the substrate layer can provide a supporting foundation for the subsequent adhesion of the first and second film layers, and together with the first and second film layers, form a multi-layered first mold and / or second mold, so that the first mold and / or second mold can take into account both greater surface hardness and good lubrication and friction reduction effects.

[0018] According to one or more embodiments, the stamping die further includes a first die assembly and a second die assembly. The first die assembly is disposed along the preset direction on the side of the first die body away from the second die body, and the second die assembly is disposed along the preset direction on the side of the second die body away from the first die body. The first die assembly and the second die assembly are used to provide a resisting force that brings the first die body and the second die body closer to each other along the preset direction.

[0019] In this way, the first and second mold components can provide external force to the first and second molds in a preset direction, so that the first and second molds can more stably limit and fix the battery electrode located between them, and the battery electrode can be formed smoothly.

[0020] According to one or more embodiments, the first module assembly includes a first mold base and a first template connected to each other, and a first limiting groove for accommodating the first mold body is formed on the side surface of the first template opposite to the first mold base.

[0021] Therefore, through the above structure, on the one hand, the first mold base and the first template can be more easily disassembled and assembled, and the relative positions between the various structures can be better adjusted; on the other hand, the first limiting groove can limit the first mold body, making the position of the first mold body more stable, thereby making the force on the first mold body more uniform and stable.

[0022] According to one or more embodiments, the second module assembly includes a second module base and a second template connected to each other, and a second limiting groove for accommodating the second module body is formed on the side surface of the second template opposite to the second module base.

[0023] Therefore, through the above structure, on the one hand, the second mold base and the second template can be more easily disassembled and assembled, and the relative positions between the various structures can be better adjusted; on the other hand, the second limiting groove can limit the second mold body, making the position of the second mold body more stable, thereby making the force on the second mold body more uniform and stable.

[0024] Secondly, this application also provides a stamping apparatus, including the stamping die as described above.

[0025] The aforementioned stamping die and stamping equipment allow the battery electrode to be placed between a first die and a second die. The first and second dies can stamp and form the battery electrode. Simultaneously, the first and / or second dies are configured as a multi-layered structure consisting of a substrate layer, a first film layer, and a second film layer, with each layer overlapping the others. The second film layer is the outermost layer, and its hardness is less than that of the first film layer. Thus, the first film layer ensures the overall hardness of the first and / or second dies, effectively improving their service life. Furthermore, the outermost second film layer provides good lubrication and friction reduction, reducing the probability of scratches on the battery electrode surface and effectively protecting it. In this way, through the cooperation of the first and second film layers, the first and / or second dies can simultaneously achieve high hardness and good stamping performance on the battery electrode, effectively improving stamping quality. Attached Figure Description

[0026] Figure 1This is a schematic diagram of the structure of a stamping die according to one or more embodiments.

[0027] Figure 2 This is a schematic diagram of the structure of a first mold body and a second mold body in a stamping die according to one or more embodiments.

[0028] Figure 3 This is a schematic diagram of the structure of the first die body in a stamping die according to one or more embodiments.

[0029] Figure 4 This is a schematic diagram of the structure of the second die body in a stamping die according to one or more embodiments.

[0030] Figure 5 This is a schematic diagram of the structure of a stamping die according to one or more embodiments.

[0031] Figure 6 for Figure 1 A magnified view of a portion of point A in the middle.

[0032] Figure 7 for Figure 2 A magnified view of a section at point B in the middle.

[0033] Explanation of reference numerals in the attached drawings: 100, stamping die; 200, battery electrode; 10, first mold body; 20, second mold body; 30, receiving groove; 40, first mold assembly; 50, second mold assembly; 11, substrate layer; 12, first film layer; 13, second film layer; 41, first mold base; 42, first template; 43, first limiting groove; 51, second mold base; 52, second template; 53, second limiting groove; a, preset direction. Detailed Implementation

[0034] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0035] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0036] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0037] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0038] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0039] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0040] Please refer to the following: Figure 1 , Figure 2 , Figure 3 as well as Figure 4 One embodiment of this application provides a stamping die 100 for stamping and forming a battery electrode 200. The stamping die 100 includes a first die 10 and a second die 20, which are stacked along a predetermined direction a, and a receiving groove 30 for accommodating the battery electrode 200 is formed between them. At least one of the first die 10 and the second die 20 includes a substrate layer 11, a first film layer 12, and a second film layer 13. The first film layer 12 covers the outer periphery of the substrate layer 11, and the second film layer 13 covers the outer periphery of the first film layer 12. The hardness of the second film layer 13 is less than that of the first film layer 12.

[0041] It should be noted that a fuel cell is a device that directly converts the chemical energy of fuel into electrical energy. It boasts advantages such as high energy conversion efficiency, environmental friendliness, and low operating temperature, making it a highly promising clean energy technology. A fuel cell typically consists of multiple stacked cells, each usually including a cathode and an anode. Hydrogen gas is introduced to the anode as fuel, and air is introduced to the cathode as an oxidant. Under load conditions, hydrogen and oxygen react to generate electricity. Metal bipolar plates are the core component of proton exchange membrane fuel cells. Compared to graphite and composite bipolar plates, metal bipolar plates have significant advantages, such as superior thermal and electrical conductivity, good gas barrier properties, and high mechanical strength, and are gradually becoming a technological trend and research hotspot in high-power-density fuel cell design.

[0042] During the stamping process of the battery electrode 200, the tangential friction caused by stamping scratches on the surface of the formed battery electrode 200. Since the surface finish of the battery electrode 200 for fuel cells is extremely high, ordinary stamping quality cannot meet the requirements of the finished product. As a result, the formed battery electrode 200 needs to undergo secondary electroplating. This process involves stamping the battery electrode 200 first and then electroplating the coating. That is, electroplating after forming. The coating is uneven and affected by the process. Some recessed areas are not successfully electroplated or are very easy to fall off.

[0043] In addition, the industry standard for processing battery electrode sheets 200 requires a secondary treatment of the electrode substrate, including electroplating a coating layer before stamping. While this process is simple and low-cost, and produces a uniform surface coating, it suffers from severe surface scratches due to friction, resulting in a high defect rate.

[0044] Under such circumstances, when stamping the battery electrode 200, the current stamping die 100 is prone to scratching the surface of the battery electrode 200, which affects the quality of the final formed battery electrode 200.

[0045] In this application, the stamping die 100 can be used to stamp the battery electrode 200. Of course, it can also be used to stamp other products according to actual needs. The preset direction a can be set to a vertical or horizontal direction. The first die 10 and the second die 20 are stacked along the preset direction a, and a receiving groove 30 is formed between them. The battery electrode 200 can be placed in the receiving groove 30. When the first die 10 and the second die 20 move toward each other, pressure can be applied to the battery electrode 200 in the receiving groove 30, so that it can be smoothly formed in the receiving groove 30.

[0046] For current stamping dies 100, 45#, Cr12MoV, SKD11, DC53, SKH-9, Q235, SKH51, P20, YXM1, SLD, V4 and other die steels are usually used as die materials. The hardness of these materials is usually HRC45 to 50. After conventional heat treatment, the surface hardness reaches HRC58 to 60.

[0047] Therefore, the material of the current stamping die 100 is relatively hard, and when it is used to stamp the battery electrode 200, it is easy to scratch the surface of the battery electrode 200.

[0048] Based on this, the stamping die 100 provided in this application has at least one of the first die body 10 and the second die body 20 configured as a multi-layer covering structure, that is, at least one of the first die body 10 and the second die body 20 includes a substrate layer 11, a first film layer 12 and a second film layer 13 sequentially covering from the inside to the outside. Among them, the substrate layer 11 is located on the innermost side, then the first film layer 12 covers the outer periphery of the substrate layer 11, and then the second film layer 13 covers the outer periphery of the first film layer 12.

[0049] Understandably, the first mold 10 can be configured as a multi-layer structure in which the substrate layer 11, the first film layer 12, and the second film layer 13 are sequentially covered, and the second mold 20 can also be configured as a multi-layer structure in which the substrate layer 11, the first film layer 12, and the second film layer 13 are sequentially covered. Of course, the first mold 10 and the second mold 20 can also be configured as a multi-layer structure in which the substrate layer 11, the first film layer 12, and the second film layer 13 are sequentially covered.

[0050] Furthermore, the hardness of the second film layer 13 is less than that of the first film layer 12. That is, the first film layer 12 has greater hardness, and the first film layer 12 is located between the substrate layer 11 and the second film layer 13. In this way, on the one hand, the first film layer 12 can provide a certain supporting strength for the overall structure of the first mold 10 or the second mold 20; on the other hand, the first film layer 12 can effectively reduce the probability of oxidation of the surface of the first mold 10 or the second mold 20, and can effectively improve the surface hardness of the first mold 10 or the second mold 20.

[0051] Furthermore, the second film layer 13 is located on the outermost layer and has lower hardness. In this way, during the stamping process, the second film layer 13 actually comes into contact with the battery electrode 200. The second film layer 13 has good lubrication and friction reduction effects, and can better protect the surface of the battery electrode 200 from scratches.

[0052] Therefore, through the above structure, during the stamping process of the battery electrode 200, the first film layer 12 and the second film layer 13 on the first mold 10 and / or the second mold 20 cooperate with each other. While taking into account the surface hardness of the first mold 10 and / or the second mold 20, the lubrication and friction reduction effect of the first mold 10 and / or the second mold 20 can be improved, the service life of the stamping die 100 can be increased, and the stamping quality can be improved.

[0053] In some embodiments, the first film layer 12 includes a titanium nitride film layer.

[0054] Specifically, the first film layer 12 may be, but is not limited to, a titanium nitride (TiN) film layer. The titanium nitride film layer can effectively reduce the probability of oxidation of the surface of the first mold 10 and / or the second mold 20, and increase the surface hardness of the first mold 10 and / or the second mold 20 by three times compared with conventional heat treatment, which can effectively improve the service life of the stamping die 100.

[0055] Furthermore, the first film layer 12 can be deposited using vapor deposition technology, under vacuum conditions, by utilizing physical processes such as thermal evaporation, glow discharge, or arc discharge to deposit a solid thin film or coating on the surface of the substrate layer 11.

[0056] With the above structure, the titanium nitride film layer can effectively reduce the probability of oxidation on the surface of the first mold 10 and / or the second mold 20, and can effectively improve the surface hardness of the first mold 10 and / or the second mold 20, thereby increasing the service life of the stamping die 100.

[0057] In some embodiments, the second film layer 13 comprises a soft metal film layer.

[0058] Specifically, the second film layer 13 can be, but is not limited to, a soft metal film layer, wherein the soft metal can be one of silver (Ag), copper (Cu), lead (Pb), and gold (Au). The soft metal film layer has good lubrication and friction reduction effects, and when combined with the titanium nitride film layer, it can form a composite metal film layer, which can effectively improve the forming quality of the battery electrode 200 and reduce costs while significantly improving hardness and service life.

[0059] In some embodiments, the thickness of the first film layer 12 ranges from 4 μm to 20 μm.

[0060] Specifically, the thickness of the first film layer 12, i.e. the thickness of the titanium nitride film layer, will affect the probability of oxidation of the surface of the first mold 10 and / or the second mold 20, as well as the surface hardness of the first mold 10 and / or the second mold 20, thereby affecting the service life of the stamping die 100.

[0061] Therefore, by making the thickness of the first film layer 12 within the above-mentioned range during the formation of the first film layer 12, the probability of oxidation of the surface of the first mold body 10 and / or the second mold body 20 can be effectively reduced, and the surface hardness of the first mold body 10 and / or the second mold body 20 can be effectively improved, thereby increasing the service life of the stamping die 100.

[0062] In some embodiments, the thickness of the second film layer 13 ranges from 4 μm to 20 μm.

[0063] Specifically, the thickness of the second film layer 13, i.e. the thickness of the soft metal film layer, will affect the lubrication and friction reduction effect of the first mold 10 and / or the second mold 20, thereby affecting the quality of the finally formed battery electrode 200.

[0064] Therefore, by ensuring that the thickness of the second film layer 13 is within the aforementioned range during the formation of the second film layer 13, the lubrication and friction reduction effects of the first mold 10 and / or the second mold 20 can be effectively improved, thereby enhancing the forming quality of the battery electrode 200.

[0065] In some embodiments, the material of the substrate layer 11 includes one or more of the following: 45# steel, Cr12MoV mold steel, SKD11 mold steel, DC53 mold steel, SKH-9 mold steel, Q235 mold steel, SKH51 mold steel, P20 mold steel, YXM1 mold steel, SLD mold steel, and V4 mold steel.

[0066] Specifically, the material of the base layer 11 can be selected from the material of the conventional stamping die 100. For example, the material of the base layer 11 can be, but is not limited to, 45# steel, Cr12MoV die steel, SKD11 die steel, DC53 die steel, SKH-9 die steel, Q235 die steel, SKH51 die steel, P20 die steel, YXM1 die steel, SLD die steel, and V4 die steel.

[0067] Furthermore, the substrate layer 11 can provide a supporting foundation for the subsequent adhesion of the first film layer 12 and the second film layer 13, and together with the first film layer 12 and the second film layer 13, form a multi-layer structure of the first mold 10 and / or the second mold 20, so that the first mold 10 and / or the second mold 20 can take into account both greater surface hardness and good lubrication and friction reduction effects.

[0068] like Figure 1 , Figure 5 , Figure 6 as well as Figure 7 As shown, in some embodiments, the stamping die 100 further includes a first die assembly 40 and a second die assembly 50. The first die assembly 40 is disposed along a preset direction a on the side of the first die body 10 away from the second die body 20, and the second die assembly 50 is disposed along a preset direction a on the side of the second die body 20 away from the first die body 10. The first die assembly 40 and the second die assembly 50 are used to provide a resistance force along the preset direction a to bring the first die body 10 and the second die body 20 closer to each other.

[0069] Specifically, the first mold assembly 40, the second mold assembly 50, the first mold body 10, and the second mold body 20 are assembled together to form a stamping die 100. The first mold assembly 40, the first mold body 10, the second mold body 20, and the second mold assembly 50 can be arranged sequentially from top to bottom, that is, the first mold body 10 and the second mold body 20 are sandwiched between the first mold assembly 40 and the second mold assembly 50, and the battery electrode 200 is disposed between the first mold body 10 and the second mold body 20.

[0070] Thus, the first mold assembly 40 and the second mold assembly 50 can provide external force to the first mold 10 and the second mold 20 along the preset direction a, so that the first mold 10 and the second mold 20 can more stably limit and fix the battery electrode 200 located between them, so that the battery electrode 200 can be formed smoothly.

[0071] In some embodiments, the first mold assembly 40 includes a first mold base 41 and a first template 42 connected to each other. The first template 42 has a first limiting groove 43 for accommodating the first mold body 10 on its side surface opposite to the first mold base 41.

[0072] Specifically, the first mold assembly 40 can be further divided into a first mold base 41 and a first template 42, wherein the first mold base 41 and the first template 42 can be detachably connected by bolts or other means.

[0073] The first template 42 is connected to the first mold body 10, and the first mold base 41 is connected to the end of the first template 42 that is away from the first mold body 10. Furthermore, a first limiting groove 43 is formed on the surface of the first template 42 that is away from the first mold base 41. In this way, the first mold body 10 can be confined within the first limiting groove 43, making the relative position between the first mold body 10 and the first template 42 more stable.

[0074] Therefore, through the above structure, on the one hand, the first mold base 41 and the first template 42 can be more easily disassembled and assembled, and the relative positions between the various structures can be better adjusted; on the other hand, the first limiting groove 43 can limit the first mold body 10, making the position of the first mold body 10 more stable, thereby making the force on the first mold body 10 more uniform and stable.

[0075] In some embodiments, the second mold assembly 50 includes a second mold base 51 and a second template 52 connected to each other, and a second limiting groove 53 for accommodating the second mold body 20 is formed on the side surface of the second template 52 facing away from the second mold base 51.

[0076] Specifically, the second module assembly 50 can be further divided into a second module base 51 and a second template 52, wherein the second module base 51 and the second template 52 can be detachably connected by bolts or other means.

[0077] The second template 52 is connected to the second mold body 20, and the second mold base 51 is connected to the end of the second template 52 that is away from the second mold body 20. Furthermore, a second limiting groove 53 is formed on the surface of the second template 52 that is away from the second mold base 51. In this way, the second mold body 20 can be confined within the second limiting groove 53, making the relative position between the second mold body 20 and the second template 52 more stable.

[0078] Thus, through the above structure, on the one hand, the second mold base 51 and the second template 52 can be more easily disassembled and assembled, and the relative positions between the various structures can be better adjusted; on the other hand, the second limiting groove 53 can limit the second mold body 20, making the position of the second mold body 20 more stable, thereby making the force on the second mold body 20 more uniform and stable.

[0079] Based on the same concept as the stamping die 100 described above, this application also provides a stamping apparatus, including the stamping die 100 as described above.

[0080] Based on the same concept as the stamping die 100 described above, this application can also provide a method for manufacturing a stamping die 100, applicable to the stamping die 100 described above, the method comprising the following steps:

[0081] S10: Place the substrate layer 11, the first target material, and the second target material into a vacuum plating furnace.

[0082] S20: Evacuate the vacuum plating furnace to the basic vacuum level.

[0083] S30: The target medium is introduced into the vacuum plating furnace, and the target medium reacts with the first target material to form a first film layer 12 on the outer surface of the substrate layer 11.

[0084] S40: A second film layer 13 is formed on the outer surface of the first film layer 12 by ion deposition of the second target material, and the hardness of the second film layer 13 is less than that of the first film layer 12.

[0085] S50: Cool the substrate layer 11, the first film layer 12 covering the outer periphery of the substrate layer 11, and the second film layer 13 covering the outer periphery of the first film layer 12, and restore the pressure inside the vacuum plating furnace to atmospheric pressure to form the first mold 10 and / or the second mold 20.

[0086] Specifically, in the process of manufacturing the stamping die 100, a material is first selected from conventional die materials to form the base material layer 11 of the first die body 10 and / or the second die body 20, and the base material layer 11 is processed into the required stamping shape.

[0087] Furthermore, the substrate layer 11, together with the first target and the second target, is placed in a PVD vacuum plating furnace, and the interior of the vacuum plating furnace is evacuated to maintain the vacuum level inside the furnace at the basic vacuum level.

[0088] It should be noted that the basic vacuum level can be a range, and the vacuum level inside the vacuum plating furnace should be maintained within this range.

[0089] Once the vacuum level inside the vacuum plating furnace stabilizes, the target medium is introduced into the furnace. The target medium can be adjusted according to the specific material of the first target to ensure that the target medium and the first target can react smoothly to produce a specific compound, which ultimately forms the first film layer 12 on the outer surface of the substrate layer 11.

[0090] After the first film layer 12 is formed and stabilized, a second film layer 13 can be formed on the outer surface of the first film layer 12 by ion deposition.

[0091] After the first film layer 12 and the second film layer 13 are both formed and stabilized, the first mold 10 and / or the second mold 20 of the multilayer structure formed by the substrate layer 11, the first film layer 12 and the second film layer 13 are cooled. In a vacuum environment, the first mold 10 and / or the second mold 20 are cooled to below 40°C, and then the pressure is gradually restored to atmospheric pressure to complete the surface treatment.

[0092] In some embodiments, the first target material comprises a titanium target; and / or, the second target material comprises a soft metal target material.

[0093] Specifically, if the first target is a titanium target, then nitrogen can be used as the target medium. A protective gas, such as argon, is introduced into the vacuum plating furnace to maintain a vacuum level. The substrate layer 11 is baked and heated to nearly 200°C, and then bombarded with argon ions. After argon ion bombardment sputtering cleaning, nitrogen is introduced into the vacuum plating furnace. The titanium atoms and nitrogen interact after plasma activation to generate titanium nitride, which is deposited on the outer surface of the substrate layer 11 to form a titanium nitride film, namely the first film layer 12.

[0094] Furthermore, the second target can be a soft metal target. After the first film layer 12 has been formed and stabilized, the nitrogen gas supply is stopped and the titanium electron gun is cut off to perform soft metal ion deposition, so as to form a soft metal film layer, namely the second film layer 13, on the outer surface of the first film layer 12.

[0095] Therefore, a titanium nitride film can be successfully formed on the outer surface of the substrate layer 11 using a titanium target, and a soft metal film can be formed on the outer surface of the titanium nitride film using a soft metal target. In this way, the titanium nitride film can effectively reduce the probability of oxidation of the surface of the first mold 10 and / or the second mold 20, while increasing the surface hardness of the first mold 10 and / or the second mold 20 and improving its service life. At the same time, the soft metal film can provide good lubrication and friction reduction effects.

[0096] In some embodiments, the basic vacuum level is less than or equal to 3 × 10⁻⁶. -3 Pa.

[0097] Specifically, after placing the dried substrate layer 11, the first target material, and the second target material into the vacuum plating furnace, the vacuum plating furnace is evacuated to a vacuum level of less than or equal to 3 × 10⁻⁶. -3 Pa, and then a protective gas, such as argon, is introduced into the vacuum plating furnace to maintain the vacuum level inside the furnace.

[0098] In some embodiments, after step S20, the following step is further included:

[0099] S21: Introduce an inert gas into the vacuum plating furnace. The inert gas can be, but is not limited to, argon. Introducing argon into the vacuum plating furnace can better maintain the vacuum level inside the furnace and make the reaction environment more stable.

[0100] In some embodiments, after step S21, the following step is further included:

[0101] S22: Baking and heating the substrate layer 11 and bombarding it with argon ions.

[0102] S23: Introduce nitrogen gas to maintain a vacuum of 10. -1 Pa.

[0103] Specifically, a titanium target is used as the first target material. The substrate layer 11 is baked and heated to fully evaporate the moisture inside the substrate layer 11. Then, the substrate layer 11 is bombarded with argon ions. After the argon ion bombardment sputtering cleaning is completed, nitrogen gas is introduced into the vacuum plating furnace. After the titanium atoms and nitrogen gas are activated by plasma, they interact to generate the compound titanium nitride, which is deposited on the outer surface of the substrate layer 11, thereby successfully forming a titanium nitride film layer.

[0104] In some embodiments, before step S10, the following step is further included:

[0105] S08: The substrate layer 11 is cleaned using ultrasonic cleaning with water, ultrasonic cleaning with alkaline solution, ultrasonic cleaning with acetone, and ultrasonic cleaning with ethanol.

[0106] S09: Dry the cleaned substrate layer 11.

[0107] Specifically, ultrasonic cleaning with clean water can remove dust from the substrate layer 11. Ultrasonic cleaning with alkaline solution can remove animal oil from the surface of the substrate layer 11. Ultrasonic cleaning with acetone can remove vegetable oil from the surface of the substrate layer 11. Ultrasonic cleaning with ethanol can dehydrate the substrate layer 11.

[0108] Furthermore, after cleaning, the substrate layer 11 is dried to enable it to better facilitate subsequent reactions.

[0109] In some embodiments, the thickness of the first film layer 12 ranges from 4 μm to 20 μm; and / or, the thickness of the second film layer 13 ranges from 4 μm to 20 μm.

[0110] Specifically, the thickness of the first film layer 12, i.e. the thickness of the titanium nitride film layer, will affect the probability of oxidation of the surface of the first mold 10 and / or the second mold 20, as well as the surface hardness of the first mold 10 and / or the second mold 20, thereby affecting the service life of the stamping die 100.

[0111] Therefore, by making the thickness of the first film layer 12 within the above-mentioned range during the formation of the first film layer 12, the probability of oxidation of the surface of the first mold body 10 and / or the second mold body 20 can be effectively reduced, and the surface hardness of the first mold body 10 and / or the second mold body 20 can be effectively improved, thereby increasing the service life of the stamping die 100.

[0112] Similarly, the thickness of the second film layer 13, i.e. the thickness of the soft metal film layer, will affect the lubrication and friction reduction effect of the first mold 10 and / or the second mold 20, thereby affecting the quality of the finally formed battery electrode 200.

[0113] Therefore, by ensuring that the thickness of the second film layer 13 is within the aforementioned range during the formation of the second film layer 13, the lubrication and friction reduction effects of the first mold 10 and / or the second mold 20 can be effectively improved, thereby enhancing the forming quality of the battery electrode 200.

[0114] In some embodiments, after step S50, the following step is further included:

[0115] S51: The first mold 10 and the second mold 20 are stacked along a preset direction a, and a receiving groove 30 for accommodating the battery electrode 200 is formed between them.

[0116] S52: Place the battery electrode 200 into the receiving slot 30.

[0117] S53: The first template 42 is abutted against the end of the first mold 10 away from the second mold 20, and the first mold 10 is confined within the first limiting groove 43 of the first template 42.

[0118] S54: The second template 52 is abutted against the end of the second mold 20 away from the first mold 10, and the second mold 20 is confined within the second limiting groove 53 of the second template 52.

[0119] S55: The first mold base 41 is abutted against the end of the first template 42 away from the first mold body 10, and the second mold base 51 is abutted against the end of the second template 52 away from the second mold body 20.

[0120] Specifically, the battery electrode 200 is disposed within the receiving groove 30 formed between the first mold 10 and the second mold 20. This not only allows the battery electrode 200 to be stamped and formed more stably between the first mold 10 and the second mold 20, but also limits the battery electrode 200 so that the force is more uniform.

[0121] The first template 42 is connected to the first mold body 10, and the first mold base 41 is connected to the end of the first template 42 that is away from the first mold body 10. Furthermore, a first limiting groove 43 is formed on the surface of the first template 42 that is away from the first mold base 41. In this way, the first mold body 10 can be confined within the first limiting groove 43, making the relative position between the first mold body 10 and the first template 42 more stable.

[0122] Therefore, through the above structure, on the one hand, the first mold base 41 and the first template 42 can be more easily disassembled and assembled, and the relative positions between the various structures can be better adjusted; on the other hand, the first limiting groove 43 can limit the first mold body 10, making the position of the first mold body 10 more stable, thereby making the force on the first mold body 10 more uniform and stable.

[0123] Similarly, the second template 52 is connected to the second mold body 20, and the second mold base 51 is connected to the end of the second template 52 that is away from the second mold body 20. Furthermore, a second limiting groove 53 is formed on the surface of the second template 52 that is away from the second mold base 51. In this way, the second mold body 20 can be confined within the second limiting groove 53, making the relative position between the second mold body 20 and the second template 52 more stable.

[0124] Thus, through the above structure, on the one hand, the second mold base 51 and the second template 52 can be more easily disassembled and assembled, and the relative positions between the various structures can be better adjusted; on the other hand, the second limiting groove 53 can limit the second mold body 20, making the position of the second mold body 20 more stable, thereby making the force on the second mold body 20 more uniform and stable.

[0125] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0126] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A stamping die, characterized in that, The stamping die is used for stamping and forming battery electrode sheets. The stamping die includes a first die body and a second die body, which are stacked together along a preset direction to accommodate the battery electrode sheets. Wherein, at least one of the first mold body and the second mold body includes a substrate layer, a first film layer and a second film layer, the first film layer covers the outer periphery of the substrate layer, the second film layer covers the outer periphery of the first film layer, and the hardness of the second film layer is less than the hardness of the first film layer.

2. The stamping die according to claim 1, characterized in that, The first film layer includes a titanium nitride film layer.

3. The stamping die according to claim 1, characterized in that, The second film layer includes a soft metal film layer.

4. The stamping die according to any one of claims 1-3, characterized in that, The thickness of the first film layer ranges from 4 μm to 20 μm.

5. The stamping die according to any one of claims 1-3, characterized in that, The thickness of the second film layer ranges from 4 μm to 20 μm.

6. The stamping die according to claim 1, characterized in that, The material of the substrate layer includes one or more of the following: 45# steel, Cr12MoV mold steel, SKD11 mold steel, DC53 mold steel, SKH-9 mold steel, Q235 mold steel, SKH51 mold steel, P20 mold steel, YXM1 mold steel, SLD mold steel, and V4 mold steel.

7. The stamping die according to claim 1, characterized in that, The stamping die further includes a first die assembly and a second die assembly. The first die assembly is disposed along the preset direction on the side of the first die body away from the second die body. The second die assembly is disposed along the preset direction on the side of the second die body away from the first die body. The first die assembly and the second die assembly are used to provide a resistance force along the preset direction to bring the first die body and the second die body closer to each other.

8. The stamping die according to claim 7, characterized in that, The first mold assembly includes a first mold base and a first template connected to each other. A first limiting groove for accommodating the first mold body is formed on the side surface of the first template opposite to the first mold base.

9. The stamping die according to claim 7 or 8, characterized in that, The second mold assembly includes a second mold base and a second template connected to each other. A second limiting groove for accommodating the second mold body is formed on the side surface of the second template opposite to the second mold base.

10. A stamping device, characterized in that, Including the stamping die as described in any one of claims 1-9.

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