Chip welding conveying track

Abstract

The chip welding conveying track comprises a track body and a cover plate, the front side and the rear side of a bearing track are inserted into two side tracks respectively, the two side tracks are close to one side of the bearing track and can slide in the front-back direction, and the two side tracks get close to each other or get away from each other in the width direction of the bearing track. The rear side of the second cover plate is inserted into the front side of the first cover plate and can slide in the front-back direction, the width of the cover plate is adjusted, the cover plate covers the track, and the cooling fin and the lead frame are pushed to slide in the length direction of the bearing channel; the width of the bearing channel is adjusted through sliding fit between the side channel and the bearing channel and sliding fit between the first cover plate and the second cover plate, the utilization rate of equipment is increased, and the application range of the equipment is widened.

Description

Technical Field

[0001] This utility model relates to the field of chip welding technology, and in particular to a chip welding conveyor track. Background Technology

[0002] Existing chip welding transport tracks consist of a lower track and an upper cover plate. The lower track is a heated track on which the chip's heat sink and lead frame are placed. The cover plate is placed on the lower track, and the heat sink and lead frame are transported along the length of the lower track to the various through-holes of the upper cover plate for spot soldering and chip welding. The width of the lower track is fixed. If chips with heat sinks of other sizes need to be welded, it is still necessary to replace the track and cover plate with other sizes. The chip welding transport track has low utilization and a limited range of applications.

[0003] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model discloses a chip welding transport track, which solves the problems that if chips with heat sinks of other sizes need to be welded, it is still necessary to replace the track and cover plate with other sizes, resulting in low utilization and limited applicability of the chip welding transport track.

[0005] The technical solution adopted in this utility model is as follows:

[0006] A chip bonding transport track includes:

[0007] The track includes a support track and two side tracks. The heat sink and lead frame can slide on the top of the support track. The two side tracks are inserted into the front and rear sides of the support track respectively, close to the support track, and can slide in the front and rear direction.

[0008] A cover plate, detachably mounted on the track, includes a first cover plate and a second cover plate. The rear side of the second cover plate is inserted into the front side of the first cover plate and can slide in the front-back direction. A first groove and a second groove are sequentially formed at the top of the front side of the first cover plate, and a third groove and a fourth groove are sequentially formed at the top of the rear side of the second cover plate. The positions of the first groove and the third groove correspond to the second groove and the fourth groove, respectively. The first groove and the third groove form a solder through hole, and the second groove and the fourth groove form a chip placement through hole.

[0009] A further technical solution is that the thickness of the first cover plate is greater than the thickness of the second cover plate, a fifth groove is formed on the front side of the first cover plate along the length direction of the first cover plate, and the rear side of the second cover plate is slidably disposed in the fifth groove; the thickness of the side channel is greater than the thickness of the bearing channel, a sixth groove is formed on the side of the side channel close to the bearing channel along the length direction of the first cover plate, and the front and rear sides of the bearing channel are respectively slidably disposed in the two sixth grooves.

[0010] A further technical solution is that the track further includes a first drive assembly, which includes a first lead screw, two first nuts, two first sliders, and a first bearing seat. The first bearing seat is located on the left side of the bearing track. The first lead screw is fixedly inserted into the first bearing seat. The left sides of the two first sliders are respectively connected to the right sides of the two first nuts, and the right sides of the two first sliders are respectively connected to the left sides of the two side tracks. The two first nuts are respectively threaded to the front and rear sides of the first lead screw and located on the front and rear sides of the first bearing seat. The internal threads of the two first nuts are in opposite directions. Rotating the first lead screw causes the two first nuts to drive the two first sliders to move closer together or... The two first sliders respectively drive the two side channels to move closer or further apart along the width direction of the bearing channel; the cover plate also includes a second driving assembly, which includes a second lead screw, a second nut, a second slider and a second bearing seat. The second bearing seat is located on the right side of the first cover plate, the second lead screw is fixedly inserted into the second bearing seat, the right side of the second slider is connected to the left side of the second nut, the left side of the second slider is connected to the right side of the second cover plate, and the second nut is threadedly connected to the second lead screw; rotating the second lead screw causes the second nut to drive the second slider to slide back and forth, and the second slider causes the front side of the second cover plate to slide back and forth in the fifth groove.

[0011] A further technical solution is that the first drive assembly further includes a first motor, which is located on the left side of the bearing channel, and the rear side of the first lead screw is connected to the output end of the first motor; the second drive assembly further includes a second motor, which is located on the right side of the first cover plate, and the rear side of the second lead screw is connected to the output end of the second motor.

[0012] A further technical solution is that a seventh groove is provided at the top of the front side of the first cover plate, and the seventh groove is located between the first groove and the second groove; an eighth groove is provided at the top of the rear side of the second cover plate, and the eighth groove is located between the third groove and the fourth groove. The position of the seventh groove corresponds to the eighth groove, and the seventh groove and the eighth groove form a pressure welding through hole.

[0013] A further technical solution is that the carrier channel includes a heat sink carrier channel and a lead frame carrier channel. The heat sink carrier channel is located at the front end of the lead frame carrier channel. The thickness of the heat sink carrier channel is less than the thickness of the lead frame carrier channel. The positions of the spot solder through-hole, the chip placement through-hole, and the solder pressure through-hole are all located at the top end of the heat sink carrier channel.

[0014] A further technical solution is that the bearing channel is provided with a number of air inlet holes for introducing a hydrogen-nitrogen mixed gas.

[0015] A further technical solution is that an air distribution groove is opened at the bottom end of the bearing channel, and the air inlet hole is opened in the air distribution groove.

[0016] The beneficial effects of this utility model embodiment are as follows:

[0017] (I) A chip bonding transport track includes a track and a cover plate. Two side tracks are inserted into the front and rear sides of the carrier track, respectively, and can slide in the front-back direction. Depending on the width of the heat sink and lead frame, the two side tracks are moved closer or further apart along the width of the carrier track, reducing or increasing the width of the carrier track where the heat sink and lead frame can be placed. Several heat sinks and lead frames are placed on the carrier track. The rear side of a second cover plate is inserted into the front side of a first cover plate and can slide in the front-back direction. Depending on the width of the track, the second cover plate is slid in the front-back direction inside the front side of the first cover plate to adjust the width of the cover plate. The heat sink and lead frame are pushed along the length of the bearing channel by the cover plate and the track. When the heat sink slides to the bottom of the soldering through hole, solder is applied to the heat sink through the soldering through hole. When the heat sink with solder applied slides to the bottom of the chip placement through hole, the chip is placed on the heat sink through the chip placement through hole, so that the chip is soldered to the heat sink to complete the soldering work. The heat sink and lead frame are pushed to complete the material discharge. The sliding cooperation between the side channel and the bearing channel and the sliding cooperation between the first cover plate and the second cover plate realizes the adjustment of the width of the bearing channel, improves the utilization rate of the equipment, and expands the application range of the equipment.

[0018] (ii) Furthermore, the track also includes a first drive assembly, which includes a first lead screw, two first nuts, two first sliders, and a first bearing seat. The first bearing seat is located on the left side of the bearing track. The first lead screw is fixedly inserted into the first bearing seat. The left sides of the two first sliders are respectively connected to the right sides of the two first nuts. The right sides of the two first sliders are respectively connected to the left sides of the two side tracks. The two first nuts are threadedly connected to the front and rear sides of the first lead screw and located on the front and rear sides of the first bearing seat. The internal threads of the two first nuts are in opposite directions. Rotating the first lead screw causes the two first nuts to move the two first sliders closer together or further apart. The first and second drive components work together to move the two side tracks closer together or further apart along the width of the bearing track. The cover plate also includes a second drive assembly, which consists of a second lead screw, a second nut, a second slider, and a second bearing seat. The second bearing seat is located on the right side of the first cover plate, and the second lead screw is fixedly inserted into the second bearing seat. The right side of the second slider is connected to the left side of the second nut, and the left side of the second slider is connected to the right side of the second cover plate. The second nut is threaded onto the second lead screw. Rotating the second lead screw causes the second nut to slide the second slider back and forth, which in turn causes the front side of the second cover plate to slide back and forth within the fifth groove. The coordinated operation of the first and second drive components, through the cooperation of the lead screw and nut, eliminates the need for manual adjustment of the bearing track and cover plate, improving the accuracy of the width adjustment of the bearing track and cover plate, and increasing work efficiency.

[0019] (III) Furthermore, a seventh groove is formed on the front side of the first cover plate along its height direction, located between the first and second grooves. An eighth groove is formed on the top rear side of the second cover plate along its height direction, located between the third and fourth grooves. The position of the seventh groove corresponds to the eighth groove, and the seventh and eighth grooves together form a solder pressure through-hole. The solder spotting through-hole, chip placement through-hole, and solder pressure through-hole are all located at the top of the heat sink support channel. After solder is applied to the heat sink through the solder spotting through-hole, the solder melts into a teardrop shape. When the heat sink with applied solder slides below the solder pressure through-hole, a mold is used to press the teardrop-shaped solder into a square shape through the solder pressure through-hole, making the solder distribution on the heat sink more uniform and ensuring a more secure subsequent chip soldering. Attached Figure Description

[0020] Figure 1 This is an isometric view of the track in the chip welding and conveying track of this utility model.

[0021] Figure 2 This is a side view of the track structure in the chip welding and conveying track of this utility model.

[0022] Figure 3 This is an isometric view of the cover plate in the chip welding and conveying track of this utility model.

[0023] Figure 4 This is a side view of the cover plate in the chip welding and conveying track of this utility model.

[0024] Figure 5 for Figure 3 Enlarged view at point A.

[0025] Figure 6 This is a top view of the chip welding and conveying track of this utility model.

[0026] Figure 7 This is a bottom view of the chip welding and conveying track of this utility model.

[0027] Figure 8 for Figure 6 Enlarged view at point B.

[0028] Figure 9 for Figure 7 Enlarged view at point C.

[0029] In the picture:

[0030] 100. Track; 110. Support channel; 111. Heat sink support channel; 112. Lead wire frame support channel; 113. Air inlet hole; 114. Air distribution groove; 120. Side channel; 121. Sixth groove; 130. First drive assembly; 131. First lead screw; 132. First nut; 133. First slider; 134. First bearing seat; 200. Cover plate; 210. First cover plate; 211. Fifth groove 212. First groove; 213. Second groove; 214. Seventh groove; 220. Second cover plate; 221. Third groove; 222. Fourth groove; 223. Eighth groove; 230. Spot solder through hole; 240. Chip placement through hole; 250. Solder pressure through hole; 260. Second drive assembly; 261. Second lead screw; 262. Second nut; 263. Second slider; 264. Second bearing seat. Detailed Implementation

[0031] The specific embodiments of this utility model are described below with reference to the accompanying drawings.

[0032] To make the objectives, technical solutions, and advantages of this utility model clearer, the device proposed by this utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of this utility model will become clearer according to the following description. It should be noted that the accompanying drawings are in a very simplified form and use non-precise proportions, only used to conveniently and clearly assist in illustrating the purpose of the embodiments of this utility model. Please refer to the accompanying drawings to make the objectives, features, and advantages of this utility model more apparent and understandable. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only used to complement the content disclosed in the specification, for those skilled in the art to understand and read, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and objectives that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0033] Example:

[0034] A chip welding transport track includes a track 100 and a cover plate 200.

[0035] Figure 1 This is an isometric view of the track in the chip welding and conveying track of this utility model. Figure 2 This is a side view of the track structure in the chip welding and conveying track of this utility model. (See attached diagram.) Figures 1-2 As shown, track 100 includes a carrier channel 110 and two side channels 120. Specifically, track 100 is a heated track 100. When solder is placed on a heat sink, heating track 100 melts the solder onto the heat sink, facilitating subsequent chip soldering. The heat sink and lead frame are slidable at the top of carrier channel 110. For example, carrier channel 110 includes a heat sink carrier channel 111 and a lead frame carrier channel 112. The heat sink carrier channel 111 is located at the front end of the lead frame carrier channel 112. The thickness of the heat sink carrier channel 111 is less than the thickness of the lead frame carrier channel 112. Two side channels 120 are inserted into the front and rear sides of carrier channel 110, respectively, near the side of carrier channel 110, and can slide in the front-rear direction. For example, the thickness of the side channel 120 is greater than the thickness of the bearing channel 110. A sixth groove 121 is provided on the side of the side channel 120 near the bearing channel 110 along the length direction of the first cover plate 210. The front and rear sides of the bearing channel 110 are respectively slidably disposed in the two sixth grooves 121.

[0036] Figure 3 This is an isometric view of the cover plate in the chip welding and conveying track of this utility model. Figure 4 This is a side view of the cover plate in the chip welding and conveying track of this utility model. Figure 5 for Figure 3 A magnified view at point A. (See image below.) Figures 3-5 As shown, the cover plate 200 is detachably mounted on the track 100. The cover plate 200 includes a first cover plate 210 and a second cover plate 220. The rear side of the second cover plate 220 is inserted into the front side of the first cover plate 210 and can slide in the front-back direction. For example, the thickness of the first cover plate 210 is greater than the thickness of the second cover plate 220. A fifth groove 211 is formed on the front side of the first cover plate 210 along the length direction of the first cover plate 210, and the rear side of the second cover plate 220 is slidably disposed in the fifth groove 211. The first cover plate 210 has a first groove 212 and a second groove 213 formed from left to right along the height direction of the first cover plate 210 on the front side. The second cover plate 220 has a third groove 221 and a fourth groove 222 formed from left to right along the height direction of the first cover plate 210 at the top rear side. The positions of the first groove 212 and the third groove 221 correspond to the second groove 213 and the fourth groove 222, respectively. The first groove 212 and the third groove 221 form a solder through hole 230, and the second groove 213 and the fourth groove 222 form a chip placement through hole 240.

[0037] Figure 6 This is a top view of the chip welding and conveying track of this utility model. Figure 7 This is a bottom view of the chip welding and conveying track of this utility model. Figure 8 for Figure 6 Enlarged view at point B. Figure 9 for Figure 7 A magnified view at point C. (See image below.) Figures 6-9As shown, the track 100 further includes a first drive assembly 130, which includes a first lead screw 131, two first nuts 132, two first sliders 133, and a first bearing seat 134. The first bearing seat 134 is located on the left side of the bearing channel 110. The first lead screw 131 is fixedly inserted into the first bearing seat 134. The left sides of the two first sliders 133 are respectively connected to the right sides of the two first nuts 132, and the right sides of the two first sliders 133 are respectively connected to the left sides of the two side channels 120. The two first nuts 132 are respectively threaded to the front and rear sides of the first lead screw 131 and located on the front and rear sides of the first bearing seat 134. The internal threads of the two first nuts 132 are in opposite directions. Rotating the first lead screw 131 causes the two first nuts 132 to move the two first sliders 133 closer together or further apart. The slider 133 drives the two side channels 120 to move closer to each other or further away from each other along the width direction of the bearing channel 110. The cover plate 200 also includes a second drive assembly 260, which includes a second lead screw 261, a second nut 262, a second slider 263 and a second bearing seat 264. The second bearing seat 264 is located on the right side of the first cover plate 210. The second lead screw 261 is fixedly inserted into the second bearing seat 264. The right side of the second slider 263 is connected to the left side of the second nut 262. The left side of the second slider 263 is connected to the right side of the second cover plate 220. The second nut 262 is threadedly connected to the second lead screw 261. When the second lead screw 261 is rotated, the second nut 262 drives the second slider 263 to slide back and forth. The second slider 263 drives the front side of the second cover plate 220 to slide back and forth in the fifth groove 211. The coordinated operation of the first drive assembly 130 and the second drive assembly 260, through the cooperation of the lead screw and nut, eliminates the need for manual sliding adjustment of the bearing channel 110 and the cover plate 200 by the operator, thereby improving the accuracy of the adjustment of the width of the bearing channel 110 and the cover plate 200 and increasing work efficiency.

[0038] Furthermore, the first drive assembly 130 also includes a first motor, which is located on the left side of the bearing channel 110, and the rear side of the first lead screw 131 is connected to the output end of the first motor. The second drive assembly 260 also includes a second motor, which is located on the right side of the first cover plate 210, and the rear side of the second lead screw 261 is connected to the output end of the second motor. The first and second motors provide a stable power source, driving the lead screw to rotate, thereby adjusting the width of the bearing channel 110 and the width of the cover plate 200. This automates the adjustment system, reduces manual operation, improves operational efficiency, and ensures the efficient and high-quality operation of the production line.

[0039] like Figure 5As shown, further, a seventh groove 214 is formed on the front side of the first cover plate 210 along the height direction of the first cover plate 210, and the seventh groove 214 is located between the first groove 212 and the second groove 213. An eighth groove 223 is formed on the top of the rear side of the second cover plate 220 along the height direction of the first cover plate 210, and the eighth groove 223 is located between the third groove 221 and the fourth groove 222. The position of the seventh groove 214 corresponds to the eighth groove 223, and the seventh groove 214 and the eighth groove 223 form a solder pressure through hole 250. The positions of the spot solder through hole 230, the chip placement through hole 240, and the solder pressure through hole 250 are all located at the top of the heat sink support channel 111. Solder is applied to the heat sink through the soldering through-hole 230. The solder melts and forms droplets. When the heat sink with solder applied slides to the bottom of the soldering through-hole 250, the droplets of solder are pressed into square shapes by a mold through the soldering through-hole 250, so that the solder is distributed more evenly on the heat sink and the subsequent chip soldering is more reliable.

[0040] like Figure 6 and Figure 8 As shown, furthermore, the carrier channel 110 has several air inlet holes 113 for introducing hydrogen-nitrogen mixed gas. For example, a gas distribution groove 114 is formed at the bottom of the carrier channel 110, and the air inlet holes 113 are formed within the gas distribution groove 114. The bottom end of the track 100 is connected to a hydrogen-nitrogen mixed gas supply mechanism, which delivers the hydrogen-nitrogen mixed gas to the gas distribution groove 114, allowing the hydrogen-nitrogen mixed gas to pass more evenly through the air inlet holes 113 into the welding area, preventing the copper material from oxidizing during transport.

[0041] In operation, this embodiment is as follows:

[0042] Based on the width of the heat sink and the lead frame, the first motor is started, driving the first lead screw 131 to rotate. Two first nuts 132 on the lead screw cause two first sliders 133 to move closer or further apart. The front side of the heat sink support channel 111 slides forward or backward within a sixth groove 121, while the rear side of the lead frame support channel 112 slides backward or forward within another sixth groove 121, decreasing or increasing the width of the heat sink support channel 111 and the lead frame support channel 112. Several heat sinks and lead frames are placed on the heat sink support channel 111 and the lead frame support channel 112 respectively. Based on the width adjusted by the track 100, the second motor is started, driving the second lead screw 261 to rotate. The second nut 262 on the lead screw causes the sliders to move forward or backward. The second cover plate 220 is in the fifth groove. The body 211 slides backward or forward to reduce or increase the width of the heat sink carrier channel 111 and the lead frame carrier channel 112. The width of the cover plate 200 is adjusted and placed on the track 100. The track 100 starts to heat up, pushing the heat sink and lead frame to slide along the length of the carrier channel 110. When the heat sink slides below the spot solder through hole 230, solder is applied to the heat sink through the spot solder through hole 230. The solder melts and is in the shape of water droplets. When the heat sink with solder is applied slides below the pressure solder through hole 250, the melted water droplet-shaped solder is pressed into a square shape using a mold. When the heat sink with solder is pressed slides below the chip placement through hole 240, the chip is placed on the heat sink through the chip placement through hole 240 so that the chip is soldered onto the heat sink to complete the soldering work. The heat sink and lead frame are pushed to complete the material discharge.

[0043] During the welding process, the bottom end of the track 100 is connected to a hydrogen-nitrogen mixed gas supply mechanism to deliver the hydrogen-nitrogen mixed gas. After the hydrogen-nitrogen mixed gas is evenly distributed through the gas distribution groove 114, it is sent into the space between the track 100 and the cover plate 200 through the gas inlet hole 113.

[0044] In this embodiment, the sliding fit between the side channel 120 and the bearing channel 110 and the sliding fit between the first cover plate 210 and the second cover plate 220 enable the adjustment of the width of the bearing channel 110, improve the utilization rate of the equipment, and expand the applicability of the equipment.

[0045] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0046] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A chip welding conveyor track, characterized in that, include: The track (100) includes a support channel (110) and two side channels (120). The heat sink and lead frame can slide on the top of the support channel (110). The two side channels (120) are inserted into the front and rear sides of the support channel (110) respectively, close to the side of the support channel (110), and can slide in or out of the side channels (120) in the front and rear direction. A cover plate (200) is detachably mounted on the track (100), comprising a first cover plate (210) and a second cover plate (220). The rear side of the second cover plate (220) is inserted into the front side of the first cover plate (210) and can slide in or out of the first cover plate (210) in the front-rear direction. A first groove (212) and a second groove (213) are sequentially formed at the top of the front side of the first cover plate (210). The second cover plate (220)... 20) A third groove (221) and a fourth groove (222) are sequentially opened at the top of the rear side. The positions of the first groove (212) and the third groove (221) correspond to the second groove (213) and the fourth groove (222) respectively. The first groove (212) and the third groove (221) form a solder through hole (230), and the second groove (213) and the fourth groove (222) form a chip through hole (240).

2. The chip welding conveyor track according to claim 1, characterized in that: The thickness of the first cover plate (210) is greater than the thickness of the second cover plate (220). A fifth groove (211) is formed on the front side of the first cover plate (210) along the length direction of the first cover plate (210). The rear side of the second cover plate (220) is slidably disposed in the fifth groove (211). The thickness of the side channel (120) is greater than the thickness of the bearing channel (110). A sixth groove (121) is formed on the side of the side channel (120) near the bearing channel (110) along the length direction of the first cover plate (210). The front and rear sides of the bearing channel (110) are respectively slidably disposed in the two sixth grooves (121).

3. The chip welding conveyor track according to claim 2, characterized in that: The track (100) further includes a first drive assembly (130), which includes a first lead screw (131), two first nuts (132), two first sliders (133), and a first bearing seat (134). The first bearing seat (134) is located on the left side of the bearing track (110), the first lead screw (131) is fixedly inserted into the first bearing seat (134), and the left sides of the two first sliders (133) are respectively connected to the two first nuts (132). On the right side, the right sides of the two first sliders (133) are respectively connected to the left sides of the two side rails (120). The two first nuts (132) are respectively threaded to the front and rear sides of the first lead screw (131) and located on the front and rear sides of the first bearing seat (134). The internal threads of the two first nuts (132) are opposite in direction. When the first lead screw (131) is rotated, the two first nuts (132) drive the two first sliders (133) to move closer to each other or further apart. The two side channels (120) are respectively driven to move closer to each other or further apart along the width direction of the bearing channel (110); the cover plate (200) also includes a second drive assembly (260), which includes a second lead screw (261), a second nut (262), a second slider (263), and a second bearing seat (264). The second bearing seat (264) is located on the right side of the first cover plate (210), and the second lead screw (261) is fixedly inserted into the second bearing seat. Inside 264), the right side of the second slider (263) is connected to the left side of the second nut (262), and the left side of the second slider (263) is connected to the right side of the second cover plate (220). The second nut (262) is threadedly connected to the second lead screw (261). When the second lead screw (261) is rotated, the second nut (262) drives the second slider (263) to slide back and forth, and the second slider (263) drives the front side of the second cover plate (220) to slide back and forth in the fifth groove (211).

4. The chip welding conveyor track according to claim 3, characterized in that: The first drive assembly (130) further includes a first motor, which is located on the left side of the bearing channel (110), and the rear side of the first lead screw (131) is connected to the output end of the first motor; the second drive assembly (260) further includes a second motor, which is located on the right side of the first cover plate (210), and the rear side of the second lead screw (261) is connected to the output end of the second motor.

5. The chip welding conveyor track according to claim 1, characterized in that: The top of the front side of the first cover plate (210) is provided with a seventh groove (214), which is located between the first groove (212) and the second groove (213); the top of the rear side of the second cover plate (220) is provided with an eighth groove (223), which is located between the third groove (221) and the fourth groove (222). The position of the seventh groove (214) corresponds to the eighth groove (223), and the seventh groove (214) and the eighth groove (223) together form a pressure welding through hole (250).

6. The chip welding conveyor track according to claim 5, characterized in that: The carrier channel (110) includes a heat sink carrier channel (111) and a lead frame carrier channel (112). The heat sink carrier channel (111) is located at the front end of the lead frame carrier channel (112). The thickness of the heat sink carrier channel (111) is less than the thickness of the lead frame carrier channel (112). The positions of the spot solder through hole (230), the chip placement through hole (240), and the pressure solder through hole (250) are all located at the top end of the heat sink carrier channel (111).

7. The chip welding conveyor track according to claim 1, characterized in that: The bearing channel (110) has several air inlet holes (113) for introducing hydrogen-nitrogen mixed gas.

8. The chip welding conveyor track according to claim 7, characterized in that: An air distribution groove (114) is provided at the bottom of the bearing channel (110), and an air inlet hole (113) is provided in the air distribution groove (114).

Images