System monitor based on hardware collaborative optimization

Abstract

The utility model relates to the technical field of servo motor control, and provides a system monitor based on hardware collaborative optimization, which comprises a monitor body. Wherein the monitor body is fixed in an accommodating cavity of the circular base; the monitor body comprises a monitoring head part and a transmission neck part, and the bottom of the monitoring head part is in axial transmission fit with the transmission neck part; wherein the monitoring head is fixedly provided with a processing module and an optical sensing assembly connected with the processing module; the transmission neck part comprises a driving module, and the driving module is fixed to the bottom of the containing cavity of the circular base and electrically connected with the power module.

Description

Technical Field

[0001] This utility model relates to the field of motor control technology, and in particular to a system monitoring instrument based on hardware collaborative optimization. Background Technology

[0002] With the increasing demands for target detection in modern military and civilian fields, target monitoring in low-altitude and ultra-low-altitude domains (such as drones and small aircraft) has become a critical scenario. Although traditional radar detection technology can cover a wide area, it is susceptible to electronic interference across the entire airspace and frequency domain in complex electromagnetic environments, limiting its detection performance. In contrast, optoelectronic detection technology, with its advantages of high precision, strong anti-interference capability at low altitudes, and intuitive image visualization, is gradually becoming an important supplementary means of low-altitude target detection.

[0003] However, existing photoelectric detection equipment generally suffers from large size, heavy weight, and low integration: traditional equipment typically consists of separate indoor control devices and outdoor sensors, requiring multiple cables for connection, resulting in a complex system composition that is difficult to deploy quickly; some integrated devices have a dispersed layout of core components such as sensors (visible light, infrared, laser, etc.), servo turntables, and image processing modules, leading to an overall weight far exceeding 20kg, which cannot meet the needs of single-person carrying and field mobility. In addition, the electrical design of traditional equipment (such as control boards, power boards, and communication boards) often adopts an independent and dispersed layout, occupying a large space and resulting in low coordination efficiency; in terms of structural design, load-bearing components often use a single metal material (such as ordinary steel), and non-load-bearing components are not optimized for weight reduction, further increasing the size and weight of the equipment; the image processing module, due to insufficient hardware performance, is unable to achieve real-time monitoring, tracking, and encoding transmission of targets across the entire field of view, limiting the actual application effectiveness of the equipment.

[0004] With the miniaturization and low-power development of integrated circuits (such as the maturity of system-on-a-chip (SoC)) and the rapid advancement of optical sensor technology (such as lightweight infrared thermal imagers and highly integrated laser rangefinders), a technological foundation has been laid for the miniaturization and lightweight design of photoelectric detection equipment. Based on this, there is an urgent need for a system monitoring instrument that achieves portability with a total weight of ≤20kg by integrating multiple sensors (visible light, infrared, laser), a servo turntable, and a high-performance processing module, while simultaneously improving the real-time performance and accuracy of target detection, tracking, and positioning, to adapt to monitoring tasks in rapid field deployment and complex environments. Utility Model Content

[0005] This application proposes a system monitoring instrument based on hardware co-optimization to address the problem of large equipment footprint and inconvenience in carrying out target detection in the field.

[0006] Firstly, a system monitoring instrument based on hardware co-optimization includes:

[0007] The monitoring instrument body is fixed in the receiving cavity of the circular base;

[0008] The monitoring device body includes a monitoring head and a transmission neck, with the bottom of the monitoring head axially driven by the transmission neck; wherein, the monitoring head is fixedly mounted with a processing module and an optical sensing component connected to the processing module.

[0009] The transmission neck includes a drive module, which is fixed to the bottom of the receiving cavity of the circular base and electrically connected to the power module.

[0010] In conjunction with the first aspect, the optical sensing components include a visible light sensor, an infrared thermal imager, and a laser rangefinder;

[0011] Visible light sensors and infrared thermal imagers are used to acquire video image information of the target;

[0012] Laser rangefinders are used for measuring target distances;

[0013] The optical sensing component is connected to the input interface of the processing module via a data interface.

[0014] In conjunction with the first aspect, the drive module includes a two-axis servo turntable composed of an azimuth component and a pitch component, and a servo control unit; wherein, the azimuth component is connected to the pitch component via a first integrated drive shaft; the azimuth component includes an azimuth base and a position measuring device, the first position measuring device is fixed on the right side of the azimuth base, and the bottom of the first integrated drive shaft is driven by a deep groove ball bearing connected to a bearing seat fixed on the azimuth base; wherein, the first position measuring device is a horizontal azimuth sensor, and the first position measuring device is electrically connected to the processing module;

[0015] The pitch assembly includes a pitch frame, a second integrated drive shaft, a second position measuring device, and a load mounting position; wherein, the second integrated drive shaft is hinged to the monitoring head through the load mounting position of the pitch frame, the second position measuring device is circumferentially fixed on the second integrated drive shaft through a coupling, and the second position measuring device is electrically connected to the processing module.

[0016] The servo control unit includes a servo controller, and a first servo motor and a second servo motor connected to the servo controller; wherein the first servo motor is driven and synchronously rotated with a first integrated drive shaft, and the second servo motor is driven and synchronously rotated around a horizontal axis.

[0017] In conjunction with the first aspect, the servo controller includes a servo drive board, a servo control board, and a gyroscope acquisition board, and the processing module is connected to the servo drive board, the servo control board, and the gyroscope acquisition board for signal transmission.

[0018] The gyroscope acquisition board is installed in the mounting slot of the monitoring instrument body 1 and communicates with the servo control board via a serial port and slip ring. The servo control board and the servo drive board are tightly fixed by custom upper and lower ribbon cables, which are used to exchange power, current and control signals.

[0019] In conjunction with the first aspect, the processing module includes a PCB board, on which a CPU processor and a memory are embedded. The memory is electrically connected to the CPU processor, and the CPU processor is embedded in an aluminum heat sink on the PCB board. A beryllium copper thermal pad is filled between the aluminum heat sink and the CPU processor.

[0020] In conjunction with the first aspect, it includes a power conversion board, a first interface board, and a second interface board;

[0021] The power conversion board, the first interface board, and the second interface board are stacked vertically. Adjacent boards are electrically connected by a single row of pins / sockets. Pins 1-8 of the pins / sockets are power supply lines, and pins 9-16 are data transmission lines. Multiple transformers are deployed on the power conversion board.

[0022] The power conversion board is fixed to the bottom of the receiving cavity of the circular base by screws and nylon posts, and the power conversion board is fixed to the first interface board and the first interface board by nylon screws.

[0023] An optocoupler is installed on the first interface board, and the optocoupler is electrically connected to the drive module.

[0024] The second interface board is equipped with a series-connected isolated power supply module and an EMI filter. The output of the filter is connected to the processing module and the optical sensing component, respectively.

[0025] In conjunction with the first aspect, the azimuth base and pitch frame of the monitoring instrument body are made of aluminum alloy;

[0026] The first and second integrated drive shafts are made of stainless steel.

[0027] In conjunction with the first aspect, the bottom of the receiving cavity of the circular base is provided with an external power supply hole, and the inner wall of the receiving cavity is provided with a fixing thread.

[0028] In conjunction with the first aspect, the drive module of the transmission neck is provided with a foldable neck sleeve.

[0029] In conjunction with the first aspect, the system monitor also includes a positioning and orientation module connected to the processing module. The positioning and orientation module is integrated with the monitor body and is located at the bottom of the monitor body. It includes a Beidou receiver, an antenna, and a data receiving and processing module, and is used to realize the positioning and orientation function of the device.

[0030] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of this invention may be realized and obtained by means of the structures particularly pointed out in the written description and the accompanying drawings.

[0031] The technical solution of this utility model will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0032] The accompanying drawings are provided to further understand the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation thereof.

[0033] In the attached diagram:

[0034] Figure 1 This is a three-dimensional structural diagram of a system monitoring instrument based on hardware co-optimization in an embodiment of this utility model;

[0035] Figure 2 This is an internal planar cross-sectional view based on hardware co-optimization in an embodiment of this utility model;

[0036] Figure 3 This is a schematic diagram of the drive module in an embodiment of the present invention;

[0037] Figure 4 This is a schematic diagram of the connection structure of the optical sensing component in an embodiment of this utility model;

[0038] Figure 5 This is a circuit board connection diagram of the servo controller in an embodiment of this utility model;

[0039] Figure 6 This is a three-dimensional structural diagram of the power module in an embodiment of the present utility model;

[0040] Figure 7 This is a structural diagram of the positioning and orientation module in an embodiment of this utility model. Detailed Implementation

[0041] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0042] Example 1:

[0043] See Figure 1 and Figure 2 This application proposes a system monitoring instrument based on hardware co-optimization, comprising:

[0044] The monitoring instrument body 1 is fixed in the receiving cavity of the circular base 6.

[0045] The main body of the monitoring device 1 includes a monitoring head 2 and a transmission neck 3. The bottom of the monitoring head 2 is axially driven to the transmission neck 3. The monitoring head 2 is fixedly equipped with a processing module 4 and an optical sensing component connected to the processing module 4.

[0046] The transmission neck 3 includes a drive module 31, which is fixed to the bottom of the receiving cavity of the circular base 6 and electrically connected to the power module 5.

[0047] In practice, the monitoring device body 1 of this application is injection molded from ABS engineering plastic and coated with an anti-static coating. It is fixed to the circular base 6 via threads inside the receiving cavity of the circular base 6, which is made of iron. However, in practice, a waterproof sealing cloth can also be used, with internal clips used to fix the monitoring device body 1. When using a waterproof sealing cloth, water can be filled between the outer surface of the circular base 6 and the receiving cavity. After filling with water, the monitoring device body 1 is fixed by the clips. This method is mainly used in portable scenarios.

[0048] The monitoring head 2 adopts a hemispherical structure with multiple slots inside for installing the processing module 4 and optical sensing components. When the processing module 4 and optical sensing components are installed in the slots, thermally conductive silicone with adhesive properties can also be placed inside the slots. The processing module 4 is mainly a PCB board with a CPU processor and programmable memory. The CPU processor connects to the driver module 31, power module 5, and optical sensing components via a serial port on the PCB board to achieve data acquisition, thereby enabling the monitoring of drones or small aircraft in the air.

[0049] The transmission neck 3 is equipped with a servo control system for horizontal and pitch angle adjustment to achieve angle adjustment, thereby enabling large-angle adjustment of the drone in the air. The specific monitoring angle needs to be determined according to the scenario requirements and the maximum adjustment angle of the transmission neck. In actual implementation, two Hall sensors can be set on both sides of the transmission neck 3 to determine the rotation angle.

[0050] Power module 5 can be an external power source or a rechargeable energy storage device, depending on actual needs.

[0051] In monitoring drones and small aircraft, traditional monitoring devices may not differ much in appearance from those in this application. However, existing solutions often use gear meshing or belt drives for head rotation, which results in excessive backlash, easily causing wear on transmission components. Under high-frequency vibration, this can easily lead to jamming and step loss. Furthermore, in industrial settings, existing devices occupy a large space and are a single, non-modular design, limiting their use in small industrial settings or in situations where portability and deployment are inconvenient.

[0052] Regarding angle adjustment, this application can adapt to high-frequency vibration environments. When monitoring drones and small aircraft, the measurement range covers the omnidirectional area except for the bottom edge, with a measured blind spot radius of no more than 1 meter. In actual testing, the blind spot only extends to the bottom of the circular base 6, with an outer circumference of no more than 1 meter. The circular base 6 and the monitoring device body 1 can be separated for easier portability, and the base is replaceable to adapt to different power supply scenarios.

[0053] Example 2:

[0054] See Figure 1 , Figure 2 and Figure 4 The optical sensing components include a visible light sensor 41, an infrared thermal imager 42, and a laser rangefinder 43;

[0055] Visible light sensor 41 and infrared thermal imager 42 are used to acquire target video image information. In actual implementation, visible light sensor 41 mainly adopts a CMOS image sensor, which is connected to the CPU processor of processing module 4 through a MIPICSI-2 interface, and the lens is soldered to the head PCB board through an FPC cable. Infrared thermal imager 42 preferably has a 32×24 pixel array, a temperature measurement range of -40℃ to 300℃, and is connected to the I2C pin of the CPU processor of processing module 4 through an I2C interface, and is fixed below the visible light sensor.

[0056] The laser rangefinder 43 is used for target distance measurement; the laser rangefinder 43 is connected to the CPU processor I2C pin of the processing module 4 via an I2C interface.

[0057] The optical sensing components are connected to the input interface of the processing module 4 via a data interface, and the three sensors are isolated and synchronized in time. The processing module 4 is used to control the zoom / focus control of the visible light lens and the infrared lens, and to control the laser rangefinder 43 to perform real-time ranging of the UAV or small aircraft.

[0058] Existing monitoring instruments mostly use a single visible light sensor, which is prone to image distortion in low light conditions (such as at night) or high temperature environments, and cannot obtain target temperature and distance information, resulting in a single monitoring dimension. Furthermore, the parallel use of multiple sensors with different interfaces in existing monitoring instruments may lead to complex PCB layout, increased electromagnetic interference, and higher data transmission error rate in strong electromagnetic environments in industrial settings.

[0059] This application combines three sensors to achieve synchronous acquisition of image, temperature and distance data, enabling multi-dimensional monitoring. Moreover, the visible light sensor 41, infrared thermal imager 42 and laser rangefinder 43 are independently connected to the processing module 4, which can adapt to strong electromagnetic environments.

[0060] Example 3:

[0061] See Figure 3 and Figure 2 The drive module 31 includes a two-axis servo turntable consisting of an azimuth component 321 and a pitch component 322, and a servo control unit.

[0062] The orientation component 321 is used to control the rotation of the entire monitoring head to achieve 360° omnidirectional monitoring;

[0063] The pitch component 322 is used for pitch adjustment, with an angle adjustment of no less than 90°. The pitch angle is customized according to the actual needs of the scenario.

[0064] The azimuth component 321 is connected to the pitch component 322 via a first integrated drive shaft 412. The azimuth component 321 includes an azimuth base 411 and a position measuring device 413. The first position measuring device 413 is fixed on the right side of the azimuth base 411. The bottom of the first integrated drive shaft 412 is in transmission engagement with a bearing seat fixed on the azimuth base 411 via a deep groove ball bearing. The first position measuring device 413 is a horizontal azimuth sensor and is electrically connected to the processing module 4.

[0065] During the rotation of the orientation component 321 controlled by the servo motor, the first integrated drive shaft 412 is installed in the bearing seat hole of the orientation base 411, with a built-in deep groove ball bearing. Rotation is achieved through an interference fit between the bearing inner ring and the stepped shaft at the bottom of the first integrated drive shaft 412, while the outer ring of the bearing is also interference-fitted with the bearing seat hole. The first position measuring device 413 is an orientation monitoring sensor. In actual implementation, a 360° horizontal orientation sensor is primarily used. Alternatively, a conductive plastic potentiometer can be used, fixed to an L-shaped bracket on the right side of the orientation base 411. The rotating shaft of the conductive plastic potentiometer is welded to the extension shaft at the bottom of the first integrated drive shaft 412 via a flexible coupling. The output signal of the first position measuring device 413 is connected to the ADC interface of the processing module 4 via a shielded wire.

[0066] The pitch assembly 322 includes a pitch frame 421, a second integrated drive shaft 422, a second position measuring device 424, and a load mounting position 423; wherein, the second integrated drive shaft 422 is hinged to the monitoring head 2 through the load mounting position 423 of the pitch frame 421, the second position measuring device 424 is circumferentially fixed on the second integrated drive shaft 422 through a coupling, and the second position measuring device 424 is electrically connected to the processing module 4;

[0067] The pitch frame 421 is internally connected to a second integrated drive shaft 422, which is fixed to the lower part of the second position measuring device 424. Its main function is to fix the second integrated drive shaft 422. Both ends of the second integrated drive shaft 422 are supported by bearings within the bearing holes of the pitch frame 421. A load mounting position 423 is machined in the middle section of the shaft, and it is hinged to the bottom connecting shaft of the monitoring head 2 via a clamping coupling. The bottom of the second integrated drive shaft 422 has a stepped journal, which forms an interference fit with the bearing holes on both sides of the pitch frame 421 to achieve pitch operation.

[0068] The servo control unit includes a servo controller, and a first servo motor and a second servo motor connected to the servo controller; wherein the first servo motor is drivenly connected to the first integrated drive shaft 412 and rotates synchronously, and the second servo motor is drivenly connected to the second integrated drive shaft 422 and rotates synchronously around the horizontal axis.

[0069] The servo controller has a main chip that integrates the motor drive chips for the first and second servo motors. The servo control board is equipped with switching power supplies for the first and second servo motors, connected to their phase lines and encoders. Both the first and second servo motors are brushless motors. The first servo motor is fixed to the left side of the azimuth base 411 and is connected to the bottom of the first integrated drive shaft 412 via a planetary gear reducer and an azimuth gear transmission. The planetary gear reducer and the azimuth gear mesh with each other, allowing only 0-350° rotation of the first integrated drive shaft 412 during actual operation. However, by combining the two opposite directions, a 360° rotation can be achieved. The second servo motor drives the second integrated drive shaft 422 to pitch and rotate via a synchronous belt pulley. The second servo motor is fixed to the top of the first integrated drive shaft 412 or to the left or right side of the fixing piece between the second integrated drive shaft 422.

[0070] The pitch assembly 322 and azimuth assembly 321 are primarily designed to address the issues of existing two-axis drive turntables, which often employ separate drive shafts, leading to assembly gaps, shaft slippage during rotation, and errors due to their primary connection with gears on the drive shaft during measurement. Furthermore, the pitch assembly 322 and azimuth assembly 321 of this application are independently designed for ease of disassembly and portable transport. Both azimuth and pitch angle measurements are directly connected to the drive shaft via flexible couplings, improving monitoring accuracy.

[0071] Example 4:

[0072] See Figure 5 The present application adopts a three-layer stacked structure, which conforms to the board structure. The layers can also cooperate with each other. In actual implementation, the same stacking method as the power module 5 is adopted.

[0073] The servo controller includes a servo drive board, a servo control board, and a gyroscope acquisition board. The processing module 4 is connected to the servo drive board, the servo control board, and the gyroscope acquisition board for signal transmission.

[0074] The servo drive board primarily uses a three-phase gate driver as its core, which can form a three-phase full-bridge circuit. It employs an aluminum heat sink substrate, with connection pins for the servo motor phase lines and encoder pins for differential signal output on its edges. The servo control board uses a microprocessor as its core, but integrates FPU and DSP instructions to achieve collaborative communication between multiple boards. This includes multiple PWM control signals, current sampling feedback, and ground signals; and it connects to the servo drive board via horn-shaped connectors (upper and lower ribbon cables).

[0075] The gyroscope acquisition board inherits the inertial measurement function, integrates a three-axis gyroscope and a three-axis accelerometer, and communicates with the SPI interface of the servo control board. It is connected to the SPI interface through a through-hole conductive slip ring.

[0076] The gyroscope acquisition board is installed in the mounting slot of the monitoring head 2 and communicates with the servo control board through a slip ring. The servo control board and the servo drive board are tightly fixed by upper and lower ribbon cables, which are used to exchange power, current and control signals.

[0077] The servo drive board is a high-power circuit board, and the servo control board is the control board for the sensitive circuit. In traditional technology, they are integrated. This application has adopted a separate design, shortening the signal path through upper and lower cabling. The gyroscope acquisition board is an independent circuit board, far away from the noise source of the drive circuit, making the gyroscope communication more reliable.

[0078] Example 5:

[0079] The processing module 4 of this application includes a PCB board, on which a CPU processor and a memory are embedded. The memory is electrically connected to the CPU processor, and the CPU processor is embedded in an aluminum heat sink on the PCB board. A beryllium copper thermal pad is filled between the aluminum heat sink and the CPU processor.

[0080] The circuit design adopts a layout in which the CPU processor is located in the center of the PCB and the memory chips are symmetrically distributed on both sides of the CPU. However, this application deploys an aluminum heat sink base. In actual implementation, the bottom of the aluminum heat sink base is machined with a groove that matches the CPU package, and the top is milled with heat sink fins. The heat dissipation efficiency is more efficient and more suitable for vibrations generated during portable transportation, preventing the CPU processor from loosening due to vibration.

[0081] Example 6:

[0082] See Figure 6 The power module 5 of this application includes a power conversion board, a first interface board, and a second interface board;

[0083] The power conversion board, the first interface board, and the second interface board are stacked vertically, with adjacent boards electrically connected via a single row of pins / sockets. Pins 1-8 of the pins / sockets are power supply lines, and pins 9-16 are data transmission lines. Multiple transformers are deployed on the power conversion board. Traditional power conversion boards, especially power modules for monitoring instruments, primarily use a flat layout because monitoring instruments are mainly used in industrial or construction site environments, allowing for large equipment that occupies significant space. However, with the increasing use of drones and small aircraft, the selection of monitoring locations has become more restrictive than before. Monitoring instruments may need to be deployed in space-constrained locations such as rooftops or rocky outcrops in mountains, necessitating a compact layout and miniaturization. Therefore, the stacked layout of the power module 5 in this application meets the miniaturization design requirements of the monitoring instrument body 1. In actual implementation, the multi-channel transformer adopts a DC-DC isolation transformer, which is soldered to the PCB board through THT package. Pins 1-4 are +5V output, pins 5-8 are GND, pins 9-12 are I2C communication bus, and pins 13-16 are fault alarm signals, realizing overvoltage, overcurrent, overtemperature and OC gate output.

[0084] The power conversion board is fixed to the bottom of the receiving cavity of the circular base 6 by screws and nylon posts, and the power conversion board is fixed to the first interface board and the first interface board is fixed to the second interface board by nylon screws.

[0085] Optocouplers are installed on the first interface board and are electrically connected to the driver module 31. In actual implementation, four high-speed optocouplers are used, connected to the control terminal of the driver module 31 through a 1KΩ current-limiting resistor. Their signals are transmitted to the power conversion board through pins 9-12. The top of the optocoupler is tightly fitted with the pins of the power conversion board through a single row of sockets, and the bottom has pins of the same specification for connecting to the second interface board. Pins 1-8 of the socket / pin connector are used for power supply, and pins 9-16 are used for data signal transmission. The two are strictly separated, thus the optocouplers on the first interface board achieve electrical isolation between the driver module 31 and the power system.

[0086] The second interface board features a series-connected isolated power supply module and an EMI filter. The filter outputs are connected to the processing module 4 and the optical sensing component, respectively. The second interface board integrates two RS485 interfaces, one CAN bus interface, and four GPIOs to power the sensors. The interface circuit uses a π-type filter to suppress EMI interference. The PCB board size is consistent with the power conversion board. The top socket matches the pins of the first interface board, and the bottom has pre-drilled mounting holes for connecting external devices.

[0087] Example 7:

[0088] See Figure 3 The azimuth base 411 and pitch frame 421 are made of aluminum alloy. In actual implementation, because the monitoring instrument is mainly used in outdoor scenarios, the aluminum alloy frames of the azimuth base 411 and pitch frame 421 also adopt a hard anodizing process to improve wear resistance and corrosion resistance. The first integrated drive shaft 412 and the second integrated drive shaft 422 are made of stainless steel. Since the drive shafts are mainly internal, they need to be protected from rust, so stainless steel is used. At the same time, the aluminum alloy frame and stainless steel drive shafts achieve weight reduction, enhance environmental adaptability, and improve rust resistance, comprehensively improving equipment performance and reducing errors.

[0089] Example 8:

[0090] The circular base 6 has an external power supply hole at the bottom of its receiving cavity, and the inner wall of the cavity has a fixing thread. The purpose of the external power supply hole is to lead a power cord from the base for charging or direct power supply. Traditional bases are attached using a snap-fit ​​structure or glue, which are prone to deformation under stress and glue failure due to high temperatures, resulting in a short lifespan. Since the monitoring instrument is mainly used outdoors, this application primarily uses this replaceable circular base 6, which is replaced via threads.

[0091] Example 9:

[0092] See Figure 1The transmission neck 3 includes a foldable neck sleeve externally mounted on the drive module 31. In existing monitoring instruments, the drive module 31 of the transmission neck mostly uses a fixed metal shell or a non-foldable rubber sleeve, which is inconvenient to store and not easy to protect. After being contaminated by dust and oil, the exposed drive parts may experience abnormal gear meshing noise or motor jamming. Moreover, the fixed structure makes pitch operation difficult. In the actual implementation of the transmission neck 3 of this application, a silicone-chloroprene rubber composite layer and a Teflon-coated oil-resistant neck sleeve are used, along with a bellows-type power supply and control circuit wiring channel, which can achieve protection in all scenarios.

[0093] Example 10:

[0094] See Figure 7 The system monitor also includes a positioning and orientation module 7, which is integrated with the monitor body 1 and located at the lower part of the monitor body 1. The positioning and orientation module 7 includes a Beidou receiver 71, an antenna 72 and a data receiving and processing module 73, which are used to realize the positioning and orientation function of the device.

[0095] The Beidou receiver 71 is integrated into the lower inner wall of the monitoring instrument body 1 and is the core signal processing unit of the positioning and orientation module 7. Its function is to receive satellite signals transmitted by the antenna 72, calculate the pseudorange and carrier phase of the raw observation data, and send the data to the data receiving and processing module 73. The antenna 72 is installed on the lower outer surface of the monitoring instrument body 1 and is the satellite signal receiving component. Its function is to capture the radio signals transmitted by the Beidou satellite and transmit the signals to the Beidou receiver 71 via an RF cable. The data receiving and processing module 73 is fixed adjacent to the Beidou receiver 71 at the lower part of the monitoring instrument body 1 and is the unit for calculating the positioning results. Its function is to receive the raw data from the Beidou receiver 71, run the positioning algorithm to calculate the latitude, longitude, altitude, and heading angle of the device, and finally send the results to the processing module 4. In actual implementation, the positioning and orientation module 7 is also connected to the first position measuring device 413 and the second position measuring device 424 to acquire rotation angle data and pitch angle data.

[0096] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

Claims

1. A system monitoring instrument based on hardware co-optimization, characterized in that, include: The monitoring instrument body (1) is fixed in the receiving cavity of the circular base (6); The main body (1) of the monitoring instrument includes a monitoring head (2) and a transmission neck (3). The bottom of the monitoring head (2) is axially driven to the transmission neck (3). The monitoring head (2) is fixedly equipped with a processing module (4) and an optical sensing component connected to the processing module (4). The transmission neck (3) includes a drive module (31), which is fixed to the bottom of the receiving cavity of the circular base (6) and electrically connected to the power module (5).

2. A system monitoring instrument based on hardware co-optimization as described in claim 1, characterized in that, The optical sensing components include a visible light sensor (41), an infrared thermal imager (42), and a laser rangefinder (43); A visible light sensor (41) and an infrared thermal imager (42) are used to acquire target video image information; A laser rangefinder (43) is used for target distance measurement; The optical sensing component is connected to the input interface of the processing module (4) via a data interface.

3. A system monitoring instrument based on hardware co-optimization as described in claim 1, characterized in that, The drive module (31) includes a two-axis servo turntable and a servo control unit consisting of an azimuth component (321) and a pitch component (322); wherein, the azimuth component (321) is connected to the pitch component (322) via a first integrated drive shaft (412); the azimuth component (321) includes an azimuth base (411) and a position measuring device (413), the first position measuring device (413) is fixed on the right side of the azimuth base (411), and the bottom of the first integrated drive shaft (412) is connected to the bearing seat fixed on the azimuth base (411) via a deep groove ball bearing; wherein, the first position measuring device (413) is a horizontal azimuth sensor, and the first position measuring device (413) is electrically connected to the processing module (4); The pitch assembly (322) includes a pitch frame (421), a second integrated drive shaft (422), a second position measuring device (424), and a load mounting position (423); wherein, the second integrated drive shaft (422) is hinged to the monitoring head (2) through the load mounting position (423) of the pitch frame (421), the second position measuring device (424) is circumferentially fixed on the second integrated drive shaft (422) through a coupling, and the second position measuring device (424) is electrically connected to the processing module (4); The servo control unit includes a servo controller, and a first servo motor and a second servo motor connected to the servo controller; wherein the first servo motor is drivenly connected to the first integrated drive shaft (412) and rotates synchronously, and the second servo motor is drivenly connected to the second integrated drive shaft (422) and rotates synchronously around the horizontal axis.

4. A system monitoring instrument based on hardware co-optimization as described in claim 3, characterized in that, The servo controller includes a servo drive board, a servo control board and a gyroscope acquisition board, and the processing module (4) is connected to the servo drive board, the servo control board and the gyroscope acquisition board respectively. The gyroscope acquisition board is installed in the mounting slot of the monitoring head (2) and communicates with the servo control board through a slip ring; the servo control board and the servo drive board are tightly fixed by upper and lower ribbon cables, which are used to exchange power, current and control signals.

5. A system monitoring instrument based on hardware co-optimization as described in claim 1, characterized in that, The processing module (4) includes a PCB board, on which a CPU processor and a memory are embedded. The memory is electrically connected to the CPU processor. The CPU processor is embedded in an aluminum heat sink on the PCB board. A beryllium copper thermal pad is filled between the aluminum heat sink and the CPU processor.

6. A system monitoring instrument based on hardware co-optimization as described in claim 1, characterized in that, The power module (5) includes a power conversion board (51), a first interface board (52), and a second interface board (53); The power conversion board (51), the first interface board (52), and the second interface board (53) are stacked vertically in sequence. Adjacent boards are electrically connected by a single row of pins / sockets. Pins 1-8 of the pins / sockets are power supply lines, and pins 9-16 are data transmission lines. Multiple transformers are deployed on the power conversion board (51). The power conversion board (51) is fixed to the bottom of the receiving cavity of the circular base (6) by screws and nylon posts, and the power conversion board (51) is fixed to the first interface board (52) and the first interface board (52) is fixed to the second interface board (53) by nylon screws. An optocoupler is provided on the first interface board (52), and the optocoupler is electrically connected to the drive module (31); The second interface board (53) is equipped with a series isolation power supply module and an EMI filter, and the output of the filter is connected to the processing module (4) and the optical sensing component respectively.

7. A system monitoring instrument based on hardware co-optimization as described in claim 3, characterized in that, The azimuth base (411) and pitch frame (421) are made of aluminum alloy. The first integrated drive shaft (412) and the second integrated drive shaft (422) are made of stainless steel.

8. A system monitoring instrument based on hardware co-optimization as described in claim 1, characterized in that, The bottom of the cavity of the circular base (6) is provided with an external power supply hole, and the inner wall of the cavity is provided with a fixing thread.

9. A system monitoring instrument based on hardware co-optimization as described in claim 1, characterized in that, The transmission neck (3) includes a foldable neck sleeve disposed outside the drive module (31).

10. A system monitoring instrument based on hardware co-optimization as described in claim 1, characterized in that, The system monitor also includes a positioning and orientation module (7) connected to the processing module (4). The positioning and orientation module (7) is integrated with the monitor body (1) and is located at the lower part of the monitor body (1). The positioning and orientation module (7) includes a Beidou receiver (71), an antenna (72) and a data receiving and processing module (73). The positioning and orientation module (7) is used to realize the positioning and orientation function of the equipment.

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