Visual inspection image acquisition device of wafer laminator

Abstract

The utility model discloses a visual inspection image acquisition device for a wafer laminator, and relates to the technical field of laminators. The visual inspection image acquisition device of the wafer laminator comprises a bottom plate and an acquisition assembly, a box body is fixedly mounted at the top of the bottom plate, the acquisition assembly is arranged on the bottom plate, the acquisition assembly comprises a linear array camera, a proximity sensor, a controller and a displacement pulse conversion device, and the linear array camera and the proximity sensor are both connected with the controller. Through the arrangement of the acquisition assembly, a displacement pulse device outputs a pulse to trigger an image line to start acquisition when a linear array camera operates by using a vacuum chuck carrying table, surface image information after wafer film pasting is automatically acquired, and the operation direction and the initial film pasting position of the vacuum chuck carrying table are detected through two sensors in a proximity sensor; the controller is matched to trigger frames of the line-scan digital camera to start collection, high-efficiency information collection is achieved through synchronous work of the line-scan digital camera and the vacuum suction cup carrying table, and operation of the film pasting machine and the film pasting technology are not affected.

Description

Technical Field

[0001] This utility model relates to the field of wafer laminating machine technology, and in particular to a visual inspection image acquisition device for a wafer laminating machine. Background Technology

[0002] After automatic wafer lamination, surface information is collected using laser beam scanning (e.g., CN119495587A), which is performed synchronously with the lamination process. This method is highly efficient, but the collected information is limited. It can only detect bubbles and flatness, and cannot identify information such as film type, surface characters, defects, or scorching. Currently, area array cameras are used to collect wafer surface images, which provide rich information. However, this requires dividing the wafer into a matrix of squares, taking photos and stitching them together sequentially. This method cannot be performed synchronously with the lamination process, resulting in low production efficiency and affecting the normal operation of the original lamination machine.

[0003] In summary, this application proposes a visual inspection image acquisition device for a wafer laminating machine to solve the aforementioned problems. Utility Model Content

[0004] The purpose of this invention is to provide a visual inspection image acquisition device for a wafer laminating machine, which can solve the problem that the wafer needs to be divided into a matrix grid, and the images need to be taken and stitched together in sequence. This cannot be done simultaneously with the lamination process, resulting in low production efficiency and affecting the normal operation of the original laminating machine.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a visual inspection image acquisition device for a wafer laminating machine, comprising:

[0006] The base plate has a housing fixedly installed on top of it.

[0007] The acquisition component is mounted on the base plate and includes a linear array camera, a proximity sensor, a controller, and a displacement pulse conversion device. The linear array camera and the proximity sensor are both connected to the controller, and the displacement pulse conversion device is connected to the vacuum suction cup stage and the linear array camera, respectively.

[0008] Preferably, an electric slide rail is fixedly installed on the top of the base plate, a sliding block is slidably installed on the electric slide rail, and a vacuum suction cup platform is fixedly installed on the top of the sliding block.

[0009] Preferably, the acquisition component further includes a bracket and a light source. The bracket is fixedly installed on the top of the base plate, a line scan camera is set on one side of the bracket, a light source is set on one side of the housing, two sets of proximity sensors are fixedly installed on the top of the base plate, and the controller and displacement pulse conversion device are located on one side of the bracket. When the line scan camera is running on the vacuum chuck stage, the displacement pulse device outputs pulses to trigger the image line to start acquisition, realizing automatic acquisition of surface image information after wafer lamination. The two sensors in the proximity sensors detect the running direction of the vacuum chuck stage and the starting lamination position, and cooperate with the controller to trigger the frame of the line scan camera to start acquisition. The line scan camera and the vacuum chuck stage work synchronously to achieve high-efficiency information acquisition without affecting the operation of the laminator and the lamination process. The line scan camera and the light source can adjust the matching acquisition and lighting angles according to the position of the vacuum chuck stage to achieve high-quality acquisition of image information.

[0010] Preferably, a through hole is provided on one side of the housing, and the height of the through hole is higher than that of the vacuum suction cup stage, so that the vacuum suction cup stage can move left and right.

[0011] Preferably, the vacuum suction cup stage is a microporous negative pressure suction cup.

[0012] Preferably, the electric slide rail is a linear sliding guide rail.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] This wafer laminator visual inspection image acquisition device works in conjunction with a support, a line scan camera, a light source, a proximity sensor, a controller, and a displacement pulse conversion device. The line scan camera uses the displacement pulse device to trigger image acquisition when the vacuum chuck stage is running, automatically acquiring surface image information of the wafer after lamination. Two sensors in the proximity sensor detect the running direction of the vacuum chuck stage and the starting lamination position, which, in conjunction with the controller, triggers the line scan camera to start acquiring frames. The line scan camera and vacuum chuck stage work synchronously to achieve high-efficiency information acquisition without affecting the laminator's operation or lamination process. The line scan camera and light source can adjust the matching acquisition and lighting angles according to the position of the vacuum chuck stage, achieving high-quality image acquisition. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0016] Figure 1 The three-dimensional representation of this utility model Figure 1 ;

[0017] Figure 2 This is a three-dimensional sectional view of the present invention;

[0018] Figure 3This is the front view of the present invention;

[0019] Figure 4 The three-dimensional representation of this utility model Figure 2 .

[0020] Reference numerals: 1. Base plate; 2. Housing; 3. Electric slide rail; 4. Sliding block; 5. Vacuum suction cup stage; 6. Bracket; 7. Linear scan camera; 8. Light source; 9. Proximity sensor; 10. Controller; 11. Displacement pulse conversion device. Detailed Implementation

[0021] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0022] Please see Figure 1-4 This utility model provides a technical solution: a visual inspection image acquisition device for a wafer laminating machine, including a base plate 1 and an acquisition component. A housing 2 is fixedly installed on the top of the base plate 1. The acquisition component is set on the base plate 1 and includes a linear array camera 7, a proximity sensor 9, a controller 10 and a displacement pulse conversion device 11. The linear array camera 7 and the proximity sensor 9 are both connected to the controller 10. The displacement pulse conversion device 11 is connected to the vacuum suction cup stage 5 and the linear array camera 7 respectively.

[0023] Furthermore, an electric slide rail 3 is fixedly installed on the top of the base plate 1, a sliding block 4 is slidably installed on the electric slide rail 3, and a vacuum suction cup platform 5 is fixedly installed on the top of the sliding block 4.

[0024] Furthermore, the acquisition components also include a bracket 6 and a light source 8. The bracket 6 is fixedly installed on the top of the base plate 1, and a line scan camera 7 is installed on one side of the bracket 6. The light source 8 is installed on one side of the housing 2. Two sets of proximity sensors 9 are fixedly installed on the top of the base plate 1. The controller 10 and the displacement pulse conversion device 11 are located on one side of the bracket 6. Before applying the film, the vacuum suction cup stage 5 first moves to the starting film-applying position under the rightmost film applicator, and then moves from right to left to apply the film. When the left edge of the wafer on the vacuum suction cup stage contacts the film-applying floating pressure roller, the film application begins. At the same time, the two proximity sensors 9 determine the direction of the vacuum suction cup stage's movement by triggering the sequence, and then the line scan camera 7 and the light source 8 are activated to synchronously acquire image information. The line scan camera 7 emits pulses based on the position detected by the displacement pulse conversion device 11 when the vacuum chuck stage 5 moves. The line scan camera 7 uses the displacement pulse device output pulses during the operation of the vacuum chuck stage to trigger the start of image acquisition, realizing the automatic acquisition of surface image information after wafer lamination. The two sensors in the proximity sensor 9 detect the running direction of the vacuum chuck stage and the starting lamination position, and the controller 10 triggers the frame acquisition of the line scan camera 7. The line scan camera 7 and the vacuum chuck stage 5 work synchronously to achieve high-efficiency information acquisition without affecting the operation of the laminator and the lamination process. The line scan camera 7 and the light source 8 can adjust the matching acquisition and lighting angles according to the position of the vacuum chuck stage to achieve high-quality image acquisition.

[0025] Furthermore, a through hole is provided on one side of the housing 2, and the height of the through hole is higher than that of the vacuum suction cup stage 5, so that the vacuum suction cup stage 5 can move left and right.

[0026] Furthermore, the vacuum suction cup stage 5 is a microporous negative pressure suction cup, and the electric slide rail 3 is a linear sliding guide rail.

[0027] Secondly, the front and rear sides of the housing 2 are rotatably equipped with unwinding rollers, rewinding rollers, film-applying floating pressure rollers, and auxiliary rollers for conveying the film.

[0028] Working principle: During use, the vacuum suction cup stage 5 first moves to the starting film application position under the rightmost film application machine before film application. Then, it moves from right to left to apply the film. When the left edge of the wafer on the vacuum suction cup stage 5 contacts the floating pressure roller for film application, the film application begins. At the same time, the two proximity sensors 9 determine the direction of the vacuum suction cup stage 5 for film application by triggering the sequence. Then, the line scan camera 7 and the light source 8 are activated to synchronously collect image information. The line scan camera 7 emits pulses based on the position detected by the displacement pulse conversion device 11 when the vacuum suction cup stage 5 moves, controlling the frame rate of the picture. When the proximity sensor 9 signal is disconnected and there is a settable delay, the light source 8 is stopped, and the image information acquisition process is completed.

[0029] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A visual inspection image acquisition device for a wafer laminating machine, characterized in that, include: A base plate (1) is provided, and a box body (2) is fixedly installed on the top of the base plate (1); The acquisition component is set on the base plate (1). The acquisition component includes a line array camera (7), a proximity sensor (9), a controller (10), and a displacement pulse conversion device (11). The line array camera (7) and the proximity sensor (9) are both connected to the controller (10). The displacement pulse conversion device (11) is connected to the vacuum suction cup stage (5) and the line array camera (7) respectively.

2. The visual inspection image acquisition device for a wafer laminating machine according to claim 1, characterized in that: An electric slide rail (3) is fixedly installed on the top of the base plate (1), and a sliding block (4) is slidably installed on the electric slide rail (3). A vacuum suction cup platform (5) is fixedly installed on the top of the sliding block (4).

3. The visual inspection image acquisition device for a wafer laminating machine according to claim 2, characterized in that: The acquisition component also includes a bracket (6) and a light source (8). The bracket (6) is fixedly installed on the top of the base plate (1). A line array camera (7) is set on one side of the bracket (6). A light source (8) is set on one side of the housing (2). Two sets of proximity sensors (9) are fixedly installed on the top of the base plate (1). The controller (10) and the displacement pulse conversion device (11) are located on one side of the bracket (6).

4. The visual inspection image acquisition device for a wafer laminating machine according to claim 3, characterized in that: A through hole is provided on one side of the box (2), and the height of the through hole is higher than that of the vacuum suction cup stage (5).

5. The visual inspection image acquisition device for a wafer laminating machine according to claim 4, characterized in that: The vacuum suction cup stage (5) is a microporous negative pressure suction cup.

6. The visual inspection image acquisition device for a wafer laminating machine according to claim 5, characterized in that: The electric slide rail (3) is a linear sliding guide rail.

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