Attached high-sensitivity film fluorescence sensor

Abstract

The utility model discloses a fitting type high-sensitivity film fluorescence sensor, which belongs to the technical field of film fluorescence sensors and comprises a sensor outer shell, a sensor rear cover, a detection component, a top mounting plate, an adjusting component, a fitting component and wiping paper. The wiping paper in the attaching assembly carries the detection object and is attached to the upper portion of the film fixing piece, the detection assembly detects the detection object on the wiping paper, then the distance from the detection object to the sensitive film can be shortened in an attaching type detection mode, losses such as path physical adsorption and leakage are reduced, and the detection efficiency is improved. By rotating an adjusting nut in an adjusting assembly, a threaded rod and a sliding rod can move, the distance between an assembling plate and a film fixing piece can be adjusted, a sensitive film is made to be close to wiping paper, and therefore it can be guaranteed that an analyte can volatilize and effectively interact with the sensitive film when the device conducts measurement, and the sensitivity of the device is improved. And adjusting the distance from the wiping paper to the sensitive film according to the scale value.

Description

Technical Field

[0001] This utility model belongs to the field of thin-film fluorescence sensor technology, specifically, it relates to a bonding-type high-sensitivity thin-film fluorescence sensor. Background Technology

[0002] Thin-film fluorescence sensors are a new type of sensor that achieves high-sensitivity detection based on the fluorescence properties of thin-film materials. The core of the sensor is to identify target molecules through changes in fluorescence signals. It utilizes the specific binding of fluorescent sensing molecules to the analyte and has the 3S+1R detection characteristics of high sensitivity, high selectivity, fast response, and reversibility. It is used in industries such as environmental monitoring, medical diagnosis, and food safety.

[0003] Thin-film fluorescence sensors are an advanced sensing technology for detecting substances based on the fluorescence effect. The core principle is to achieve specific identification and quantitative analysis of trace substances by causing changes in fluorescence signals (intensity, wavelength, or lifetime) through the interaction between fluorescent materials and target substances. The working process involves key steps such as electronic transition (photoexcitation to generate fluorescence), molecular recognition (target substance binding with sensitive material), and signal conversion (converting changes in fluorescence parameters into readable data).

[0004] Current technologies face significant challenges in detecting low-saturated vapor pressure and non-volatile explosives (such as nitro aromatic compounds). These compounds exhibit extremely low gaseous molecular concentrations at room temperature, and the gas transport path design of traditional thin-film sensors has inherent flaws: analyte molecules are pumped from the collection port to the sensitive thin-film surface, resulting in long-distance transport paths prone to physical adsorption and leakage losses, leading to an effective transport efficiency of less than 30%. This makes the detection of these compounds even more difficult, resulting in low sensitivity. Utility Model Content

[0005] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the present invention.

[0006] To address the significant challenges in detecting low-saturated vapor pressure and non-volatile explosives (such as nitro aromatic compounds) mentioned in the background section, where the concentration of these compounds in the gas phase is extremely low at room temperature, the gas transmission path design of traditional thin-film sensors has inherent flaws: analyte molecules are pumped to the sensitive film surface through the collection port, and the long transmission path is prone to losses such as physical adsorption and leakage, resulting in an effective transmission efficiency of less than 30%. This makes the detection of these compounds even more difficult and results in low sensitivity. Therefore, this invention adopts the following technical solution.

[0007] A bonding-type high-sensitivity thin-film fluorescence sensor includes a sensor housing, a sensor back cover detachably connected to the bottom of the sensor housing, a detection component mounted on the upper end of a mounting bracket, the detection component detecting the analyte, an opening provided on the top of the sensor housing, a top mounting plate inserted into the opening, an adjustment component mounted on the top mounting plate, a bonding component mounted on the adjustment component, and a wiping paper detachably connected to the bonding component, the wiping paper bonding with the detection component.

[0008] Preferably, the detection component includes a detection circuit component, an excitation optical path component, a sensitive film, and a film fixing plate. The detection circuit component is detachably connected to the upper end of the mounting bracket, the excitation optical path component is provided on one side of the mounting bracket, the film fixing plate is provided on the path of the excitation light emitted by the excitation optical path component, the sensitive film is detachably connected to the bottom of the film fixing plate, the excitation optical path irradiates the sensitive film, and the detection circuit transmits detection data.

[0009] Preferably, the adjustment assembly includes a sliding rod, an adjusting nut, and a threaded rod. The sliding rod is slidably connected to one side of the top mounting plate, and the adjusting nut is rotatably connected to the other side of the top of the top mounting plate. The threaded rod is detachably connected inside the adjusting nut. The ends of the threaded rod and the sliding rod that are inserted into the sensor housing are rotatably connected to an assembly plate. The sliding rod is provided with a scale.

[0010] Preferably, the bonding component includes an assembly plate, a snap-fit ​​plate, and a wiping paper slot. The bottom of the assembly plate is provided with a wiping paper slot, and a snap-fit ​​plate is snapped onto one side of the assembly plate. Wiping paper is inserted into the wiping paper slot, and the snap-fit ​​plate fixes the wiping paper. The bottom of the assembly plate is detachably connected to the film fixing piece.

[0011] Preferably, the assembly plate is provided with a through groove, and a heating component is installed at the upper end of the assembly plate to heat the wiping paper.

[0012] Preferably, paper replacement pins are provided on both sides of the outer wall of the sensor housing, and the paper replacement pins pass through the sensor housing and are inserted into the interior of the top mounting plate.

[0013] Preferably, the mounting bracket is equipped with an air extraction port that extends out of the sensor housing.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0015] 1. The wiping paper in the bonding component carries the detection object and is bonded to the top of the film fixing sheet. The detection component detects the detection object on the wiping paper. This bonding detection method reduces the distance the detection object has to travel to the sensitive film, thus reducing physical adsorption, leakage and other losses along the path.

[0016] 2. By rotating the adjusting nut in the adjusting assembly, the threaded rod and sliding rod can be moved, thereby adjusting the distance between the mounting plate and the film fixing plate, bringing the sensitive film closer to the wiping paper. This ensures that the analyte can volatilize and interact effectively with the sensitive film during measurement. The sliding rod has a scale, and the distance between the wiping paper and the sensitive film can be adjusted according to the scale value.

[0017] 3. The heating element can be used to heat the wiping paper, causing the analytes on the wiping paper to volatilize and interact with the film.

[0018] 4. The top mounting plate can be removed by pulling out the paper replacement pin, making it easy to replace the wiping paper.

[0019] 5. The sensitive unit on the sensitive film is excited by the excitation optical path component and the detection circuit component in the set detection component. When the sensitive unit encounters the analyte, the fluorescence intensity will change, which is used to calibrate the concentration of the analyte. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of a bonding-type high-sensitivity thin-film fluorescence sensor structure according to the present invention;

[0021] Figure 2 This is a schematic diagram of the detection component structure in this utility model;

[0022] Figure 3 This is a schematic diagram of the adjustment component structure in this utility model;

[0023] Figure 4 This is a schematic diagram of the bonding component structure in this utility model;

[0024] The correspondence between the labels and component names in the attached figures is as follows:

[0025] 100. Sensor housing; 101. Sensor rear cover; 102. Mounting bracket;

[0026] 200. Air extraction port; 201. Detection circuit assembly; 202. Excitation optical path assembly; 203. Sensitive thin film; 204. Thin film fixing plate;

[0027] 300. Adjusting nut; 301. Threaded rod; 302. Top mounting plate; 303. Sliding rod; 304. Assembly plate; 305. Heating assembly; 306. Snap-fit ​​plate; 307. Paper changing pin; 308. Wiping paper slot. Detailed Implementation

[0028] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0029] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0030] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments. The present invention provides the following embodiments.

[0031] like Figure 1 The diagram shown is a schematic of a preferred embodiment of the present invention: a bonding-type high-sensitivity thin-film fluorescence sensor. This embodiment includes a sensor housing 100, with a sensor back cover 101 detachably connected to the bottom of the housing 100. The back cover 101 has a through-hole 200. In this embodiment, the through-hole 200 allows the detection gas inside the sensor housing 100 to be extracted, and also allows fresh air to enter the housing 100, which helps clean and restore the sensor and maintain the system's proper operation. Alternatively, the gas to be detected can be drawn into the housing 100 for detection.

[0032] like Figure 2As shown, this is a schematic diagram of the detection component structure in this embodiment. A mounting bracket 102 is installed inside the sensor back cover 101. The air extraction port 200 is detachably connected to the mounting bracket 102 and extends out of the sensor back cover 101. A detection circuit assembly 201 is detachably connected to the upper end of the mounting bracket 102. An excitation light path assembly 202 is provided on one side of the mounting bracket 102. A thin film fixing plate 204 is provided on the excitation light path emitted by the excitation light path assembly 202. A sensitive film 203 is detachably connected to the bottom of the thin film fixing plate 204. The excitation light path irradiates the sensitive film 203. In this embodiment, when the sensitive unit encounters the analyte, the fluorescence intensity changes to calibrate the concentration of the analyte. The detection circuit transmits detection data.

[0033] It is worth noting that the detection circuit assembly 201, the excitation optical path assembly 202, the sensitive film 203, and the film fixing sheet 204 mentioned above are the detection components in this embodiment. The detection components include, but are not limited to, the detection circuit assembly 201, the excitation optical path assembly 202, the sensitive film 203, and the film fixing sheet 204. Any component that can detect the concentration of the analyte can be used in this embodiment.

[0034] like Figure 4 As shown, this is a schematic diagram of the bonding component structure in this embodiment. The bottom of the assembly plate 304 is provided with a wiping paper slot 308, and a snap-fit ​​plate 306 is snapped onto one side of the assembly plate 304. Wiping paper is inserted into the wiping paper slot 308, and the snap-fit ​​plate 306 fixes the wiping paper. The bottom of the assembly plate 304 is detachably connected to the film fixing piece 204. In this embodiment, the wiping paper carries the detection object and is bonded to the top of the film fixing piece 204. The detection component detects the detection object on the wiping paper, thereby reducing the path of the detection object to the sensitive film 203 by using a bonding detection method, and reducing physical adsorption, leakage and other losses along the path.

[0035] It is worth noting that the aforementioned snap-fit ​​plate 306 and wiping paper slot 308 are bonding components in this embodiment. The bonding components include, but are not limited to, the assembly plate 304, the snap-fit ​​plate 306, and the wiping paper slot 308. Any component that can enable the object to be tested to bond with the testing component can be applied in this embodiment.

[0036] like Figure 3As shown, this is a schematic diagram of the adjustment component structure in this embodiment. The top of the sensor housing 100 has an opening, and a top mounting plate 302 is inserted into the opening. A sliding rod 303 is slidably connected to one side of the top mounting plate 302, and an adjustment nut 300 is rotatably connected to the other side of the top of the top mounting plate 302. A threaded rod 301 is detachably connected inside the adjustment nut 300. The ends of the threaded rod 301 and the sliding rod 303 inserted into the sensor housing 100 are rotatably connected to an assembly plate 304. A thin film fixing piece 204 is located at the bottom of the assembly plate 304. The outer wall of the sliding rod 303 is provided with a scale. In this embodiment, by rotating the adjustment nut 300, the threaded rod 301 and the sliding rod 303 can be moved, thereby adjusting the distance between the assembly plate 304 and the thin film fixing piece 204, so that the sensitive thin film 203 is close to the wiping paper. This ensures that the analyte can volatilize and interact effectively with the sensitive thin film 203 during measurement. The distance between the wiping paper and the sensitive thin film 203 is adjusted according to the scale value.

[0037] It is worth noting that the sliding rod 303, adjusting nut 300 and threaded rod 301 mentioned above are the adjustment components in this embodiment. The adjustment components include, but are not limited to, the sliding rod 303, adjusting nut 300 and threaded rod 301. Any component that can adjust the position of the mounting plate 304 inside the sensor housing 100 can be applied to this embodiment.

[0038] like Figure 3 As shown, a through groove is provided on the assembly plate 304, and a heating component 305 is installed on the upper end of the assembly plate 304. The heating component 305 heats the wiping paper. The temperature of the heating component 305 can be preset and adjusted. The temperature range of the heating component 305 is 40~120℃. In this embodiment, the heating component 305 can be used to heat the wiping paper, causing the analytes on the wiping paper to volatilize and interact with the film.

[0039] like Figure 3 as well as Figure 4 As shown, paper replacement pins 307 are provided on both sides of the outer wall of the sensor housing 100. The paper replacement pins 307 pass through the sensor housing 100 and are inserted into the interior of the top mounting plate 302. In this embodiment, the top mounting plate 302 can be removed by pulling out the paper replacement pins 307, which makes it easy to replace the wiping paper.

[0040] The above description, in conjunction with specific embodiments, provides a further detailed explanation of the present utility model. It should not be construed that the specific implementation of the present utility model is limited to these descriptions. For those skilled in the art, several simple deductions or substitutions can be made without departing from the concept of the present utility model, and all such deductions or substitutions should be considered to fall within the scope of protection defined by the claims submitted by the present utility model.

Claims

1. A bonding-type high-sensitivity thin-film fluorescence sensor, comprising a sensor housing (100), wherein a sensor back cover (101) is detachably connected to the bottom of the sensor housing (100), characterized in that, The upper end of the mounting bracket (102) is equipped with a detection component, which detects the object to be detected. The top of the sensor housing (100) is provided with an opening, and a top mounting plate (302) is inserted into the opening. An adjustment component is installed on the top mounting plate (302), and a bonding component is installed on the adjustment component. A wiping paper is detachably connected to the bonding component, and the wiping paper is bonded to the detection component.

2. The laminated high-sensitivity thin-film fluorescence sensor according to claim 1, characterized in that, The detection assembly includes a detection circuit assembly (201), an excitation optical path assembly (202), a sensitive film (203), and a film fixing plate (204). The detection circuit assembly (201) is detachably connected to the upper end of the mounting bracket (102). The excitation optical path assembly (202) is provided on one side of the mounting bracket (102). The film fixing plate (204) is provided on the path of the excitation light emitted by the excitation optical path assembly (202). The sensitive film (203) is detachably connected to the bottom of the film fixing plate (204). The excitation optical path irradiates the sensitive film (203), and the detection circuit transmits detection data.

3. The bonding-type high-sensitivity thin-film fluorescence sensor according to claim 2, characterized in that, The adjustment assembly includes a sliding rod (303), an adjusting nut (300), and a threaded rod (301). The sliding rod (303) is slidably connected to one side of the top mounting plate (302), and the adjusting nut (300) is rotatably connected to the other side of the top of the top mounting plate (302). The threaded rod (301) is detachably connected inside the adjusting nut (300). The ends of the threaded rod (301) and the sliding rod (303) inserted into the sensor housing (100) are rotatably connected to an assembly plate (304). The sliding rod (303) is provided with a scale.

4. The bonding-type high-sensitivity thin-film fluorescence sensor according to claim 3, characterized in that, The bonding assembly includes a snap-fit ​​plate (306) and a wiping paper slot (308). The bottom of the assembly plate (304) is provided with a wiping paper slot (308). The snap-fit ​​plate (306) is snapped onto one side of the assembly plate (304). Wiping paper is inserted into the wiping paper slot (308). The snap-fit ​​plate (306) fixes the wiping paper. The bottom of the assembly plate (304) is detachably connected to the film fixing piece (204).

5. The bonding-type high-sensitivity thin-film fluorescence sensor according to claim 4, characterized in that, The assembly plate (304) is provided with a through groove, and a heating component (305) is installed on the upper end of the assembly plate (304). The heating component (305) heats the wiping paper. The temperature adjustment range of the heating component is 40~120℃.

6. The bonding-type high-sensitivity thin-film fluorescence sensor according to claim 5, characterized in that, Paper replacement pins (307) are provided on both sides of the outer wall of the sensor housing (100). The paper replacement pins (307) pass through the sensor housing (100) and are inserted into the interior of the top mounting plate (302).

7. A laminated high-sensitivity thin-film fluorescence sensor according to claim 6, characterized in that, An air extraction port (200) is installed on the mounting bracket (102) that extends through the sensor housing (100).

Images