Chip testing device

Abstract

The utility model discloses a chip testing device, and belongs to the technical field of chip testing. The chip testing device comprises a testing seat, a gland and a pressing block, the top of the testing seat is provided with a clamping groove in an inward concave mode, and the clamping groove is used for installing a to-be-tested chip; the gland is arranged at the top of the testing seat, one end of the gland is rotatably connected with the testing seat, the other end of the gland is provided with a clamping hook, the testing seat is provided with a first fixing shaft at the clamping hook of the gland, and the clamping hook can be hooked on the first fixing shaft to buckle the gland on the testing seat; a reset structure is arranged at the rotational joint of the gland and the test seat; the pressing cover is provided with a through heat dissipation hole above the clamping groove, the pressing block is arranged in the heat dissipation hole, the bottom of the pressing block is provided with a protrusion protruding downwards out of the bottom of the pressing cover, the protrusion abuts against the to-be-tested chip to limit the to-be-tested chip when the pressing cover is buckled on the test seat, and a gap is reserved between the pressing block and the inner wall of the heat dissipation hole for ventilation.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a chip testing device. Background Technology

[0002] In today's era of rapid technological advancement, chips, as core components of various electronic devices, directly impact the overall performance of these devices. After packaging at the manufacturing plant, chips must undergo final testing to ensure they meet quality standards and can operate stably in various complex environments. Currently, chip testing covers several key aspects, including measuring DDR4 timings, frequency, voltage, and current.

[0003] However, a pressing problem exists in existing chip testing processes—heat dissipation. During testing, the high-speed operation of internal electronic components generates a significant amount of heat. If this heat cannot be dissipated effectively and promptly, the chip's temperature will rise rapidly. Excessive temperature can negatively impact chip performance in numerous ways. For example, it can exacerbate electron migration, gradually damaging internal metal wires and affecting the chip's electrical performance. High temperatures can also alter the properties of the semiconductor materials within the chip, causing threshold voltage drift and affecting the accuracy of the chip's logic decisions.

[0004] When chips are exposed to high temperatures, they cannot operate stably and continuously. During testing, this not only leads to inaccurate test results that fail to accurately reflect the chip's actual performance, but can also cause irreversible damage due to the high temperatures, increasing testing costs. Therefore, providing effective heat dissipation for chips during testing has become a critical challenge for those skilled in the art. Solving this problem is crucial for improving the accuracy and reliability of chip testing, as well as reducing testing costs. Utility Model Content

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a chip testing device. The chip testing device contacts the chip under test with a pressure block and conducts heat to the outside of the test socket, thereby achieving heat dissipation of the chip under test and ensuring the accuracy of chip testing.

[0006] According to an embodiment of the present invention, the chip testing device includes a test base, a pressure cover, and a pressure block. The top of the test base is recessed with a retaining groove for mounting the chip to be tested. The pressure cover is disposed on the top of the test base, with one end rotatably connected to the test base and the other end provided with a hook. The test base is provided with a first fixing shaft at the hook of the pressure cover, and the hook and the first fixing shaft are hooked together, so that the pressure cover is fastened to the test base. The pressure cover has a through heat dissipation hole above the retaining groove, and the pressure block is disposed in the heat dissipation hole. The bottom of the pressure block is provided with a protrusion protruding downward from the bottom of the pressure cover. When the pressure cover is fastened to the test base, the protrusion abuts against the chip to be tested to limit the chip to be tested, and a gap is left between the pressure block and the inner wall of the heat dissipation hole for ventilation.

[0007] According to the chip testing device of the present utility model embodiment, the following beneficial effects can be achieved by setting it up as follows: the top of the test base is provided with a retaining groove that is recessed inward. The retaining groove is designed specifically for installing the chip to be tested. Its size and shape are adapted to common chips, which can accurately fix the chip and prevent the chip from shifting during the test and affecting the test results.

[0008] The pressure cap is located on top of the test socket, with one end rotatably connected to the test socket and the other end equipped with a latch. The test socket has a first fixing shaft at the latch of the pressure cap. When the pressure cap needs to be fastened onto the test socket, the latch engages with the first fixing shaft, achieving a tight connection between the pressure cap and the test socket. A reset structure is provided at the rotatable connection between the pressure cap and the test socket. This structure makes the opening and closing of the pressure cap smoother and allows it to automatically reset after opening, facilitating chip loading and unloading for operators.

[0009] After the chip under test is installed inside the Ancas mounting slot, the pressure block can contact the chip through its protrusions, which not only limits the chip's position and prevents it from shaking during testing, but also leaves a gap between the heat dissipation hole and the pressure block for ventilation. When the airflow passes through the gap, it creates a Venturi effect, increasing the flow rate and further enhancing the heat dissipation efficiency.

[0010] Furthermore, the inner wall of the mounting slot is coated with an anti-static coating to prevent electrostatic damage. An array of flexible conductive pins is located at the bottom of the slot, making direct contact with the chip pins.

[0011] Furthermore, the pressure block is made of thermally conductive material, which can dissipate heat. This allows the pressure block to quickly dissipate the heat generated by the chip under test during the testing process to the outside of the test socket, avoiding the impact of poor heat dissipation of the chip under test on the component test parameters and improving the stability of the entire test system.

[0012] According to some embodiments of this utility model, a reset structure is provided at the rotatable connection between the pressure cap and the test seat. When the hook is disengaged from the first fixed shaft, the reset structure will pop the pressure cap off the test seat.

[0013] Furthermore, the reset structure includes one or more of the following: spring reset structure, elastomer reset structure, pneumatic / hydraulic reset structure, shape memory alloy reset structure, electromagnetic reset structure, and torsion bar reset structure.

[0014] Furthermore, the cap also features a reset mechanism at the latch. Even further, a buffer pad is embedded at the end of the latch, which contacts the first fixed axis of the test base during engagement to prevent metal-on-metal collision noise.

[0015] According to some embodiments of this utility model, a reset torsion spring is also included. The reset torsion spring includes a spring coil and two force-applying arms connected thereto. The pressure cap has a receiving notch recessed from the side inward at the rotatable connection with the test seat. The test seat is provided with a first rotating shaft on the rotatable connection side of the pressure cap. The receiving notch is provided with two rotating holes along the axial direction of the rotating shaft. The two rotating holes are respectively sleeved on the first rotating shaft. The reset torsion spring is disposed in the receiving notch and the spring coil is sleeved on the first rotating shaft. The two force-applying arms abut against the inner top wall of the receiving notch and the outer side wall of the pressure cap, respectively.

[0016] According to some embodiments of the present invention, the test seat includes a fixed seat and a base. The fixed seat is disposed on the base, with both ends connected to the base and the middle part suspended on the base, so that a ventilation hole is formed between the fixed seat and the base.

[0017] According to some embodiments of the present invention, a ventilation fan is also included, which is disposed on the base and faces the ventilation hole.

[0018] According to some embodiments of this utility model, a dustproof net is provided on the fixing base.

[0019] According to some embodiments of the present invention, it further includes a circuit board and a male connector. The circuit board is laid on the base and located in the ventilation hole for electrical connection with the chip to be tested, and the male connector is electrically connected to the circuit board.

[0020] According to some embodiments of the present invention, an ammeter is also included, which is disposed on the base and electrically connected to the circuit board.

[0021] According to some embodiments of the present invention, the pressure cap is provided with a second fixed shaft passing through the heat dissipation hole, and the pressure block is connected to the second fixed shaft.

[0022] According to some embodiments of the present invention, the pressure cap is provided with a second rotating shaft above the first fixed shaft, and the hook is connected to the second rotating shaft and can rotate relative to the pressure cap to hook onto the first fixed shaft.

[0023] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0024] The above-described additional aspects and advantages of this invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0025] Figure 1 This is a schematic diagram of the overall structure of the chip testing device according to an embodiment of the present utility model;

[0026] Figure 2 This is a second-view structural schematic diagram of the chip testing device according to an embodiment of the present utility model;

[0027] Figure 3 yes Figure 2 Enlarged structural diagram of region A in the middle;

[0028] Figure 4 This is a cross-sectional view of a chip testing apparatus according to an embodiment of the present invention;

[0029] Figure 5 This is a schematic diagram of the test socket structure of the chip testing device according to an embodiment of the present utility model;

[0030] Figure 6 This is a schematic diagram of the bottom structure of the cover of the chip testing device according to an embodiment of the present invention.

[0031] Figure label:

[0032] Test base 100, base 110, support leg 111, fixed base 120, locking groove 121, first fixed shaft 122, first rotating shaft 123, ventilation hole 124, pressure cover 200, hook 210, heat dissipation hole 220, receiving notch 230, second rotating shaft 240, second fixed shaft 250, pressure block 300, protrusion 310, reset torsion spring 400, spring ring 410, force arm 420, ventilation fan 500, circuit board 600, male connector 700, ammeter 800. Detailed Implementation

[0033] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0034] In the description of this utility model, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0035] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0036] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0037] The following is for reference. Figures 1 to 6 This describes a chip testing apparatus according to an embodiment of the present invention.

[0038] The chip testing device according to an embodiment of the present invention includes a test base 100, a pressure cover 200, and a pressure block 300. The top of the test base 100 is recessed with a retaining groove 121 for mounting the chip to be tested. The pressure cover 200 is disposed on the top of the test base 100, with one end rotatably connected to the test base 100 and the other end provided with a hook 210. The test base 100 has a first fixing shaft 122 at the hook 210 of the pressure cover 200. The hook 210 and the first fixing shaft... 122 are hooked together so that the cover 200 is fastened to the test base 100; the cover 200 has a through heat dissipation hole 220 above the locking groove 121, the pressure block 300 is set in the heat dissipation hole 220, and the bottom of the pressure block 300 is provided with a protrusion 310 that protrudes downward from the bottom of the cover 200. When the cover 200 is fastened to the test base 100, the protrusion 310 abuts against the chip under test to limit the chip under test. A gap is left between the pressure block 300 and the inner wall of the heat dissipation hole 220 for ventilation.

[0039] For example Figure 1 , Figure 4 , Figure 5 and Figure 6 As shown, the top of the test holder 100 is recessed with a retaining groove 121. The retaining groove 121 is designed for mounting the chip to be tested. Its size and shape are compatible with common chips, which can accurately fix the chip and prevent the chip from shifting during the test and affecting the test results.

[0040] A pressure cap 200 is disposed on the top of the test socket 100. One end is rotatably connected to the test socket 100, and the other end is provided with a hook 210. The test socket 100 has a first fixing shaft 122 at the hook 210 of the pressure cap 200. When the pressure cap 200 needs to be fastened onto the test socket 100, the hook 210 can engage with the first fixing shaft 122, achieving a tight connection between the pressure cap 200 and the test socket 100. A reset structure is provided at the rotatable connection between the pressure cap 200 and the test socket 100. This structure makes the opening and closing of the pressure cap 200 smoother and allows it to automatically reset after opening, facilitating chip loading and unloading by operators.

[0041] After the chip under test is installed inside the Anka-slot 121, the pressure block 300 can contact the chip under test through the protrusion 310, which can limit the chip and prevent the chip from shaking during the test, thereby improving the stability of the entire test system.

[0042] A heat dissipation hole 220 is located in the center of the pressure plate 200, above the retaining groove 121. The heat dissipation hole 220 not only provides space for the mounting of the pressure plate 300 but also provides a channel for heat dissipation. When the chip generates heat, the heat is conducted through the pressure plate 300 to the heat dissipation hole 220, and then exchanged with the outside air through the heat dissipation hole 220 to achieve heat dissipation. Simultaneously, the airflow through the gap creates a Venturi effect, increasing the flow rate and further enhancing heat dissipation efficiency.

[0043] Furthermore, the inner wall of the card slot 121 is coated with an anti-static coating to prevent electrostatic damage. An array of flexible conductive pins is located at the bottom of the slot, directly contacting the chip pins.

[0044] Furthermore, the pressure block 300 and the protrusion 310 are made of thermally conductive material, enabling heat dissipation. The protrusion 310 and the pressure block 300 transfer the heat generated by the chip to the outside of the test socket 100, thereby cooling the chip under test. The heat generated by the chip under test during the testing process can be quickly dissipated to the outside of the test socket 100 through the pressure block 300, avoiding the impact of poor heat dissipation of the chip under test on the component test parameters.

[0045] In some specific embodiments of this utility model, a reset structure is provided at the rotatable connection between the pressure cap 200 and the test seat 100. When the hook 210 is unhooked from the first fixed shaft 122, the reset structure will pop the pressure cap 200 off the test seat 100.

[0046] Popping the cover 200 off the test socket 100 can quickly release the pressure block 300 and the protrusion 310 from fixing the chip to be tested.

[0047] The reset structure provided at the rotatable connection between the pressure cap 200 and the test seat 100 includes one or more of the following: spring reset structure, elastomer reset structure, pneumatic / hydraulic reset structure, shape memory alloy reset structure, electromagnetic reset structure, and torsion bar reset structure.

[0048] Furthermore, the pressure cap 200 also has a reset structure at the hook 210.

[0049] Furthermore, the end of the hook 210 is embedded with a buffer pad, which contacts the first fixed shaft 122 of the test seat 100 when it is engaged, thus avoiding metal collision noise.

[0050] In some specific embodiments of this utility model, the reset structure is a reset torsion spring 400. The reset torsion spring 400 includes a spring coil 410 and two force-applying arms 420 connected thereto. The pressure cover 200 has a receiving notch 230 recessed from the side at the rotatable connection with the test seat 100. The test seat 100 has a first rotating shaft 123 on the rotatable connection side of the pressure cover 200. The receiving notch 230 has two rotating holes along the axial direction of the rotating shaft. The two rotating holes are respectively sleeved on the first rotating shaft 123. The reset torsion spring 400 is disposed in the receiving notch 230 and the spring coil 410 is sleeved on the first rotating shaft 123. The two force-applying arms 420 abut against the inner top wall of the receiving notch 230 and the outer side wall of the pressure cover 200, respectively.

[0051] For example Figure 3 , Figure 4 and Figure 5As shown, the reset torsion spring 400 includes a spring coil 410 and two force-applying arms 420 connected thereto. The spring coil 410 of the reset torsion spring 400 is sleeved on the first rotating shaft 123, and the two force-applying arms 420 abut against the inner top wall of the receiving notch 230 and the outer side wall of the pressure cap 200, respectively. When the operator fastens the pressure cap 200 onto the test seat 100 using the hook 210, the pressure cap 200 rotates around the first rotating shaft 123, and the force-applying arms 420 of the reset torsion spring 400 are compressed, causing the spring coil 410 to undergo elastic deformation and store elastic potential energy. When the operator releases the hook 210, the elastic potential energy of the reset torsion spring 400 is released, and the force-applying arms 420 push the pressure cap 200 to rotate in the opposite direction around the first rotating shaft 123, causing the pressure cap 200 to automatically reset to the open state. This reset function greatly improves the efficiency of chip loading and unloading by the operator and reduces operation time.

[0052] One end of the pressure cap 200 is rotatably connected to the first rotating shaft 123 of the test seat 100 via a receiving notch 230 and a rotating hole. The design of the receiving notch 230 allows the reset torsion spring 400 to be easily installed therein, while also providing some space for the rotation of the pressure cap 200. The inner diameter of the rotating hole precisely matches the outer diameter of the first rotating shaft 123, ensuring that the pressure cap 200 can rotate smoothly around the first rotating shaft 123.

[0053] In some specific embodiments of this utility model, the test seat 100 includes a fixed seat 120 and a base 110. The fixed seat 120 is disposed on the base 110, with both ends connected to the base 110 and the middle suspended on the base 110, so that a ventilation hole 124 is formed between the fixed seat 120 and the base 110.

[0054] For example Figure 1 , Figure 2 and Figure 4 As shown, the test fixture 100 includes a fixed base 120 and a base 110. The fixed base 120 is disposed on the base 110, with both ends connected to the base 110 and the middle suspended on the base 110, forming a ventilation hole 124 between the fixed base 120 and the base 110, which has good heat dissipation performance and mechanical strength. The ventilation hole 124 can effectively promote air circulation and enhance the heat dissipation effect of the chip testing device.

[0055] In actual use, when the chip generates heat, hot air enters the ventilation hole 124 and is then exhausted through natural convection or with the help of external auxiliary equipment (such as a ventilation fan), thereby reducing the chip temperature and ensuring the stability and accuracy of the testing process.

[0056] In some specific embodiments of this utility model, a ventilation fan 500 is also included, which is disposed on the base 110 and faces the ventilation hole 124.

[0057] For example Figure 2 As shown, the chip testing device also includes a ventilation fan 500, which is mounted on the base 110 and faces the ventilation hole 124. When the chip testing device is working, the ventilation fan 500 starts, drawing in external cool air into the ventilation hole 124, accelerating the airflow speed within the ventilation hole 124, forming forced convection, and quickly removing the heat generated by the chip. The speed and airflow of the ventilation fan 500 can be adjusted according to actual testing needs to achieve the best heat dissipation effect. As the cool air flows around the chip, it can carry away the heat generated by the chip and then exhaust it through the ventilation hole 124, greatly improving the heat dissipation efficiency.

[0058] In some specific embodiments of this utility model, a dustproof net is provided on the fixing base 120.

[0059] The dust filter, installed on the mounting base 120, is made of fine filter material and effectively prevents dust, lint, and other impurities from entering the chip testing device. Furthermore, the dust filter is located at the inlet of the ventilation hole 124. With the help of the ventilation fan 500, air passes through the dust filter before entering the ventilation hole 124, ensuring clean air entering the testing device. This protects the chip and testing equipment from dust and extends the equipment's lifespan.

[0060] In some specific embodiments of this utility model, a circuit board 600 and a male connector 700 are also included. The circuit board 600 is laid on the base 110 and located in the ventilation hole 124 for electrical connection with the chip to be tested. The male connector 700 is electrically connected to the circuit board 600.

[0061] For example Figure 1 and Figure 4 As shown, circuit board 600 is mounted on base 110 within ventilation hole 124 for electrical connection to the chip under test. Circuit board 600 integrates various test circuits and signal transmission lines, enabling accurate transmission of test signals to the chip and transmitting feedback signals from the chip to external devices for analysis and processing. Male connector 700 is electrically connected to circuit board 600, facilitating data transmission and power supply to external devices, ensuring compatibility and interoperability of the testing device with different testing systems.

[0062] In some specific embodiments of this utility model, an ammeter 800 is also included, which is disposed on the base 110 and electrically connected to the circuit board 600.

[0063] For example Figure 1 As shown, the ammeter 800 is mounted on the base 110 and electrically connected to the circuit board 600. The ammeter 800 can monitor the current consumption of the chip during the test in real time, providing important test data for the testers.

[0064] For example, when testing the power consumption of a new chip, an ammeter 800 can accurately measure the current value of the chip under different operating conditions. Based on this current data and the chip's operating voltage, testers can calculate the chip's power consumption, evaluate its energy efficiency, and provide important information for optimizing the chip's performance.

[0065] In some specific embodiments of this utility model, the pressure cover 200 is provided with a second fixed shaft 250 that passes through the heat dissipation hole 220, and the pressure block 300 is connected to the second fixed shaft 250.

[0066] For example Figure 6 As shown, the pressure cap 200 is provided with a second fixing shaft 250 that penetrates the heat dissipation hole 220, and the pressure block 300 is connected to the second fixing shaft 250. By fixing the pressure block 300 to the second fixing shaft 250, the position of the pressure block 300 within the heat dissipation hole 220 is ensured to remain stable and not to shift due to vibration or other factors. This prevents friction between the pressure block 300 and the inner wall of the heat dissipation hole 220, which could cause a change in the position of the pressure block 300 and affect the heat dissipation effect. By connecting the pressure block 300 to the second fixing shaft 250, it is ensured that the pressure block 300 is always in close contact with the chip, achieving efficient heat dissipation.

[0067] In some specific embodiments of this utility model, the pressure cap 200 is provided with a second rotating shaft 240 above the first fixed shaft 122, and the hook 210 is connected to the second rotating shaft 240 and can rotate relative to the pressure cap 200 to hook onto the first fixed shaft 122.

[0068] For example Figure 6 As shown, a second rotating shaft 240 is provided above the first fixed shaft 122 on the pressure cap 200. The hook 210 is connected to the second rotating shaft 240 and can rotate relative to the pressure cap 200 to hook onto the first fixed shaft 122. The shape and size of the hook 210 are carefully designed to accurately hook onto the first fixed shaft 122. The head of the hook 210 is designed with rounded corners to facilitate insertion into the first fixed shaft 122 while avoiding scratching the surface of the first fixed shaft 122. An operating handle is provided at the tail of the hook 210 for easy manual operation by the operator.

[0069] The hook 210 has a certain degree of elasticity. When it is hooked onto the first fixed shaft 122, it can generate a certain clamping force to ensure the secure fixation of the cover 200. When designing the elasticity of the hook 210, the material properties and structural dimensions of the hook 210 need to be considered to ensure that the hook 210 will not experience elastic fatigue or deformation during long-term use. When the operator needs to fasten the cover 200, simply rotate the hook 210 gently to hook it onto the first fixed shaft 122. When removing the cover 200, rotate the hook 210 in the opposite direction to disengage it from the first fixed shaft 122; the operation is simple and convenient. Compared with traditional fixed hooks 210, this rotatable hook 210 design is more flexible, can adapt to different operational needs, and improves the ease of use of the testing device.

[0070] In some specific embodiments of this utility model, the bottom of the test base 100 is provided with a plurality of support legs 111.

[0071] For example Figure 1 and Figure 2 As shown, four legs 111 are evenly distributed at the bottom of the test socket 100, which can stably support the test socket 100 and prevent it from shaking during operation. For example, in a working environment with high vibration, the test socket 100 without legs 111 is easily affected by vibration, causing the chip to shift during testing and affecting the accuracy of the test results. The test socket 100 with legs 111 can effectively reduce the impact of vibration on the testing device and ensure the stability and reliability of chip testing.

[0072] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0073] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A chip testing device, characterized in that, include: The test socket (100) has a retaining groove (121) recessed inward on its top, which is used to install the chip to be tested; A pressure cap (200) is disposed on the top of the test base (100). One end of the pressure cap (200) is rotatably connected to the test base (100), and the other end is provided with a hook (210). The test base (100) is provided with a first fixed shaft (122). The hook (210) and the first fixed shaft (122) are hooked together, so that the pressure cap (200) is rotatably connected to the test base (100). The pressure cap (200) is fastened onto the test socket (100); The pressure block (300) has a through heat dissipation hole (220) on the pressure cover (200). The pressure block (300) is disposed in the heat dissipation hole (220). The bottom of the pressure block (300) has a downward protrusion (310). When the pressure cover (200) is fastened to the test socket (100), the protrusion (310) abuts against the chip under test to limit the chip under test. A gap is left between the pressure block (300) and the inner wall of the heat dissipation hole (220) for ventilation.

2. The chip testing apparatus according to claim 1, characterized in that, A reset structure is provided at the rotatable connection between the pressure cap (200) and the test seat (100). When the hook (210) is disengaged from the first fixed shaft (122), the reset structure will pop the pressure cap (200) off the test seat (100).

3. The chip testing apparatus according to claim 2, characterized in that, The reset structure is a reset torsion spring (400), which includes a spring coil (410) and two force arms (420) connected thereto. The pressure cap (200) has a recessed receiving notch (230) at the rotatable connection with the test seat (100) from the side. The test seat (100) has a first rotating shaft (123) on the rotatable connection side of the pressure cap (200). The receiving notch (230) has two rotating holes along the axial direction of the rotating shaft. The two rotating holes are respectively sleeved on the first rotating shaft (123). The reset torsion spring (400) is disposed in the receiving notch (230) and the spring coil (410) is sleeved on the first rotating shaft (123). The two force arms (420) abut against the inner top wall of the receiving notch (230) and the outer wall of the pressure cap (200) respectively.

4. The chip testing apparatus according to claim 1, characterized in that, The test stand (100) includes a fixed seat (120) and a base (110). The fixed seat (120) is disposed on the base (110), with both ends connected to the base (110) and the middle part suspended on the base (110), so that a ventilation hole (124) is formed between the fixed seat (120) and the base (110).

5. The chip testing apparatus according to claim 4, characterized in that, It also includes a ventilation fan (500), which is disposed on the base (110) and faces the ventilation hole (124).

6. The chip testing apparatus according to claim 4, characterized in that, A dustproof net is provided on the fixed base (120).

7. The chip testing apparatus according to claim 4, characterized in that, It also includes a circuit board (600) and a male connector (700), the circuit board (600) being laid on the base (110) and located in the ventilation hole (124) for electrical connection with the chip to be tested, and the male connector (700) being electrically connected to the circuit board (600).

8. The chip testing apparatus according to claim 7, characterized in that, It also includes an ammeter (800), which is disposed on the base (110) and electrically connected to the circuit board (600).

9. The chip testing apparatus according to claim 1, characterized in that, The pressure cap (200) is provided with a second fixed shaft (250) that passes through the heat dissipation hole (220), and the pressure block (300) is connected to the second fixed shaft (250).

10. The chip testing apparatus according to claim 1, characterized in that, The pressure cap (200) has a second rotating shaft (240) above the first fixed shaft (122). The hook (210) is connected to the second rotating shaft (240) and can rotate relative to the pressure cap (200) to hook onto the first fixed shaft (122).

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