Chip high temperature resistance testing device

Abstract

The utility model relates to the technical field of testing, and discloses a chip high temperature resistance testing device which comprises a box body, the rear side of the box body is fixedly connected with a mounting plate, the top of the mounting plate is fixedly connected with a moving assembly used for moving, the outside of the moving assembly is in threaded connection with a first moving block, and the first moving block is in threaded connection with a second moving block. A first fixing rod is fixedly connected to the left side of the interior of the box body, a second moving block is slidably connected to the outer portion of the first fixing rod, lifting assemblies used for height adjustment are fixedly connected to the top of the second moving block and the top of the first moving block, and the output ends of the two lifting assemblies are fixedly connected with a mounting frame. According to the utility model, after the mounting rack moves to a proper position, the electric push rod is started to drive the mounting rack to lift to a proper position, and then the fan is started to blow air in the box body, so that the chip can be uniformly heated, and the accuracy of testing the chip by the device can be improved.

Description

Technical Field

[0001] This utility model relates to the field of testing technology, and in particular to a chip high-temperature resistance testing device. Background Technology

[0002] When developing new chips, engineers need to understand their performance under different high-temperature conditions to verify the feasibility of the design. By using high-temperature testing equipment, the chip can be simulated under extreme operating environments to check whether its functions are normal and whether its electrical parameters are within the design range. This provides a basis for optimizing the chip design. When exploring new chip manufacturing materials and processes, researchers need to evaluate the impact of these new materials and processes on chip performance under high-temperature environments.

[0003] However, some existing high-temperature resistance testing devices for chips typically place the chip to be tested directly on top of a heating stage and then start the heating stage to heat the chip for high-temperature resistance testing. However, they do not consider that heating the chip directly through the heating stage will result in only one side of the chip being heated, which will lead to uneven heating of the chip.

[0004] Therefore, a chip high-temperature resistance testing device is proposed to address the above problems. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides a chip high-temperature resistance testing device, which aims to improve the problem of uneven heating of the chip caused by heating only one side of the chip in the prior art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A chip high-temperature resistance testing device includes a housing, a mounting plate fixedly connected to the rear side of the housing, a moving component fixedly connected to the top of the mounting plate, a moving block 1 threadedly connected to the outside of the moving component, a fixing rod 1 fixedly connected to the inside left side of the housing, a moving block 2 slidably connected to the outside of the fixing rod 1, a lifting component for height adjustment fixedly connected to the top of both the moving block 2 and the moving block 1, a mounting frame fixedly connected to the output ends of the two lifting components, and multiple fans provided on the outside of the mounting frame;

[0008] As a further description of the above technical solution:

[0009] The moving component includes a motor, the bottom of which is fixedly connected to the top of the mounting plate, and a threaded rod is fixedly connected to the output end of the motor. The middle part of the moving block is threadedly connected to the outside of the threaded rod.

[0010] As a further description of the above technical solution:

[0011] The bottom of the box is fixedly connected to a base plate. The left front and rear sides of the base plate are fixedly connected to fixed plates. The two fixed plates are fixedly connected to a second fixed rod on the adjacent side. The front and rear sides of the second fixed rod are fitted with springs. The outside of the second fixed rod is slidably connected to two closed doors.

[0012] As a further description of the above technical solution:

[0013] The lifting assembly includes two electric push rods, one of which is fixedly connected at the bottom to the top of the first moving block, and the other is fixedly connected at the bottom to the top of the second moving block. The output ends of the two electric push rods are respectively fixedly connected to the bottom left and right sides of the mounting frame.

[0014] As a further description of the above technical solution:

[0015] A heating detection platform is fixedly connected to the bottom inner wall of the box, and heating lamps are fixedly connected to the front and rear inner walls of the box.

[0016] As a further description of the above technical solution:

[0017] One end of the spring is fixedly connected to the outside of the fixed plate, and the other end of the spring is fixedly connected to the outside of the closed door;

[0018] As a further description of the above technical solution:

[0019] The outside of the closed door is in contact with the outside of the box body, and the bottom of the closed door is in contact with the top of the bottom plate;

[0020] As a further description of the above technical solution:

[0021] Both of the closed doors have viewing windows at the top, and both of the closed doors have handles fixedly connected to the outside.

[0022] This utility model has the following beneficial effects:

[0023] 1. In this utility model, the chip is placed on top of the heating test platform, and then the heating test platform and heating lamp are turned on to heat the chip. At this time, the motor is started according to the heating status of the chip, and the output end of the motor drives the threaded rod to rotate. When the threaded rod rotates, it drives the first moving block to move. Then, when the first moving block moves, it drives one of the electric push rods to move the mounting bracket. When the mounting bracket moves, it drives the second moving block to slide outside the fixed rod through another electric push rod. When the mounting bracket moves to the appropriate position, the electric push rod is activated to raise and lower the mounting bracket to the appropriate position. Then, the fan is turned on to blow air inside the box, which can make the chip heat evenly, thereby improving the accuracy of chip testing by the device.

[0024] 2. In this utility model, when placing the chip into the box, the closing door needs to be pulled, so that the closing door will slide outside the fixed rod two, and then the closing door will compress the spring. After the chip is placed, the two closing doors will fit tightly under the spring's reset force, thereby sealing the internal space of the box and improving the testing efficiency of the device. Attached Figure Description

[0025] Figure 1 This is a three-dimensional schematic diagram of a chip high-temperature resistance testing device proposed in this utility model;

[0026] Figure 2 This is a schematic diagram of the threaded rod of a chip high-temperature resistance testing device proposed in this utility model;

[0027] Figure 3 for Figure 1 Enlarged view of point A.

[0028] Legend:

[0029] 1. Housing; 2. Mounting plate; 3. Motor; 4. Threaded rod; 5. Moving block one; 6. Fixed rod one; 7. Moving block two; 8. Electric push rod; 9. Mounting bracket; 10. Fan; 11. Heating test platform; 12. Heating lamp; 13. Base plate; 14. Fixed plate; 15. Fixed rod two; 16. Spring; 17. Sealing door; 18. Viewing window. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] Reference Figures 1 to 2 This utility model provides an embodiment of a chip high-temperature resistance testing device, comprising a housing 1, which is the main body of the device and forms a testing space inside. It works in conjunction with a sealing door 17 to create a sealed environment, ensuring a stable temperature field during testing and preventing interference from external airflow. A mounting plate 2 is fixedly connected to the rear side of the housing 1, providing a mounting base for the moving component. The mounting plate 2 is connected to the rear wall of the housing 1 to ensure stable installation of the moving parts and reduce vibration. A moving component is fixedly connected to the top of the mounting plate 2. The moving component drives the mounting frame 9 to move laterally within the housing 1, converting the rotational motion of the motor 3 into linear motion, adjusting the lateral position of the fan 10 to adapt to the testing requirements of different chips. A moving block 5 is threadedly connected to the external side of the moving component. The moving block 5 converts the rotational motion of the threaded rod 4 into linear motion, driving the lifting component and the mounting frame 9 to move laterally, precisely adjusting the lateral testing position of the fan 10. The moving component includes a motor 3, the bottom of which is fixedly connected to the top of the mounting plate 2. The motor 3 is the power source, driving the threaded rod 4 to rotate, providing power to the moving component; the speed is adjustable. The output end of motor 3 is fixedly connected to threaded rod 4, which converts the rotational motion of motor 3 into the linear motion of moving block 5, ensuring smooth movement and accurate positioning.

[0032] The central thread of movable block 5 is connected to the outside of threaded rod 4. This connection allows movable block 5 to move along the axis of threaded rod 4, using thread self-locking to maintain its position and prevent displacement deviation during testing. A fixed rod 6 is fixedly connected to the left side of the interior of housing 1. Fixed rod 6 provides guide support for movable block 7, forming a double-rail guide system with threaded rod 4 to ensure the straightness of movable block 7's horizontal movement. Movable block 7 is slidably connected to the outside of fixed rod 6. Movable block 7 moves in coordination with movable block 5, maintaining the horizontal stability of mounting bracket 9 during movement with the guidance of fixed rod 6, preventing tilting and jamming. Both movable block 7 and movable block 5 have fixedly connected lifting components for height adjustment. The lifting components adjust the vertical height of mounting bracket 9, adapting to the height requirements of fan 10 during chip testing at different heights via the movement of electric push rod 8. Mounting bracket 9 is fixedly connected to the output ends of the two lifting components. Mounting bracket 9 is used to mount fan 10, transmitting the movement of electric push rod 8 to fan 10 and adjusting the distance between fan 10 and chip surface.

[0033] The lifting assembly includes two electric actuators 8, which convert electrical energy into linear motion to achieve high-precision displacement control and ensure smooth lifting. One electric actuator 8 is fixedly connected at its bottom to the top of the first moving block 5. This connection allows the electric actuator 8 to move laterally with the first moving block 5, while simultaneously controlling the height of the left side of the mounting bracket 9, thus adjusting the three-dimensional position of the fan 10. The other electric actuator 8 is fixedly connected at its bottom to the top of the second moving block 7. This connection allows the electric actuator 8 to move laterally with the second moving block 7, while simultaneously controlling the height of the right side of the mounting bracket 9. Working in conjunction with the left electric actuator 8, it adjusts the levelness of the mounting bracket 9, thereby ensuring that the fan 10 is parallel to the chip surface. The output ends of the two electric actuators 8 are fixedly connected to the bottom left and right sides of the mounting bracket 9, respectively. This symmetrical arrangement keeps the mounting bracket 9 level during lifting, preventing tilting and ensuring that the fan 10 is parallel to the chip surface. Multiple fans 10 are installed externally on the mounting bracket 9. During testing, the fans 10 generate airflow to ensure uniform temperature distribution within the housing 1. The airflow speed is adjusted according to the chip size to ensure consistent heating of the chip.

[0034] A heating detection platform 11 is fixedly connected to the bottom inner wall of the housing 1. The heating detection platform 11 carries the chip and integrates heating elements and temperature sensors to directly heat the bottom surface of the chip, and the temperature is controllable. Heating lamps 12 are fixedly connected to the inner walls of the front and rear sides of the housing 1. The heating lamps 12 serve as auxiliary heating sources and heat the top surface of the chip through infrared radiation. This bidirectional heating with the heating detection platform 11 shortens the heating time and improves temperature uniformity.

[0035] Reference Figure 1 and Figure 3 A base plate 13 is fixedly connected to the bottom of the housing 1. The base plate 13 is the basic support structure of the device, connected to the bottom of the housing 1, transferring the weight of the equipment, and providing sliding track support for the closed door 17. Fixing plates 14 are fixedly connected to the front and rear sides of the left side of the base plate 13. The fixing plates 14 provide the mounting base for the second fixing rod 15 and the spring 16, and are connected to the base plate 13 to ensure the stability of the sliding guide structure of the closed door 17. The second fixing rod 15 is fixedly connected to the adjacent side of the two fixing plates 14. The second fixing rod 15 provides sliding guidance for the closed door 17, forming a double-track guide system with the base plate 13 to ensure the straightness of the horizontal movement of the closed door 17. Springs 16 are fitted on the front and rear sides of the outer side of the second fixing rod 15. The springs 16 provide elastic restoring force to the closed door 17. After the external force is removed, the closed door 17 is pushed back to its original position, ensuring the sealing of the test space. The external sliding connection of the fixed rod 15 has two closed doors 17. The closed doors 17 are used to quickly open and close the box 1. They can be manually pushed and pulled to slide on the fixed rod 15. After closing, they form a sealed contact with the box 1.

[0036] One end of the spring 16 is fixedly connected to the outside of the fixed plate 14. This connection fixes one end of the spring 16, allowing it to deform and store energy for resetting when the closed door 17 is opened. The other end of the spring 16 is fixedly connected to the outside of the closed door 17. This connection allows the elastic force of the spring 16 to act on the closed door 17, ensuring a tight seal between the closed door 17 and the chamber 1 when there is no external force, maintaining a stable test environment temperature. The outside of the closed door 17 contacts the outside of the chamber 1, forming a sealed interface to prevent heat loss during testing and ensure a stable temperature inside the chamber 1. The bottom of the closed door 17 contacts the top of the base plate 13, providing bottom support for the closed door 17, ensuring smooth movement, bearing vertical loads when closed, and ensuring structural stability.

[0037] Both closed doors 17 have viewing windows 18 at their tops, allowing operators to observe the testing process without opening the closed doors 17. These windows are made of high-temperature resistant glass. Each of the two closed doors 17 has a handle fixedly connected to its exterior, providing a point of force for pushing and pulling the doors, making it convenient for operators to open or close them.

[0038] Working principle: First, pull open the two sealing doors 17 by the handle. The sealing doors 17 slide along the second fixing rod 15 and compress the spring 16, placing the chip to be tested on the top surface of the heated testing stage 11. Release the sealing doors 17, and the spring 16 returns to its original position, causing the sealing doors 17 to fit tightly against the housing 1, forming a sealed testing space. At this time, the chip placement position can be observed through the viewing window 18.

[0039] The heating test platform 11 and heating lamp 12 are activated. The heating test platform 11 directly heats the chip through the bottom heating element, while the heating lamp 12 heats the top surface of the chip through infrared radiation, creating a bidirectional heating environment. Based on the chip size, the motor 3 drives the threaded rod 4 to rotate, and the first moving block 5 moves laterally along the threaded rod 4, causing the left electric push rod 8 to move synchronously. Simultaneously, the second moving block 7 slides along the first fixed rod 6, and the right electric push rod 8 moves accordingly. The two electric push rods 8 adjust the height of the fan 10 via the mounting bracket 9, ensuring the fan 10 maintains the optimal distance from the chip surface. During adjustment, the mounting bracket 9 is kept horizontal by synchronous control of the two push rods. The fan 10 is activated, and airflow circulates inside the housing 1. The fan 10's lateral movement is controlled by adjusting the motor 3 speed, covering different areas of the chip and ensuring a uniform temperature distribution.

[0040] After heating to the set temperature, the system enters a heat preservation phase, where the heating detection platform 11 and heating lamp 12 maintain a constant temperature output. The fan 10 operates at a low speed to maintain air convection and prevent localized temperature gradients. During this phase, the chip status is observed through the viewing window 18, and temperature data is recorded.

[0041] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A chip high-temperature resistance testing device, comprising a housing (1), characterized in that: A mounting plate (2) is fixedly connected to the rear side of the housing (1). A moving component for moving is fixedly connected to the top of the mounting plate (2). A moving block (5) is threadedly connected to the outside of the moving component. A fixing rod (6) is fixedly connected to the inside left side of the housing (1). A moving block (7) is slidably connected to the outside of the fixing rod (6). A lifting component for height adjustment is fixedly connected to the top of both the moving block (7) and the moving block (5). A mounting frame (9) is fixedly connected to the output end of the two lifting components. Multiple fans (10) are provided on the outside of the mounting frame (9).

2. The chip high-temperature resistance testing device according to claim 1, characterized in that: The moving component includes a motor (3), the bottom of which is fixedly connected to the top of the mounting plate (2), and the output end of the motor (3) is fixedly connected to a threaded rod (4). The middle part of the moving block (5) is threadedly connected to the outside of the threaded rod (4).

3. The chip high-temperature resistance testing device according to claim 1, characterized in that: The bottom of the box (1) is fixedly connected to a bottom plate (13). The bottom plate (13) is fixedly connected to two fixed plates (14) on the front and back sides of the left side. The two fixed plates (14) are fixedly connected to a second fixed rod (15) on the adjacent side. The second fixed rod (15) is fitted with springs (16) on the front and back sides of the outside. The second fixed rod (15) has two closed doors (17) slidably connected to the outside.

4. The chip high-temperature resistance testing device according to claim 1, characterized in that: The lifting assembly includes two electric push rods (8), the bottom of one of the electric push rods (8) is fixedly connected to the top of the first moving block (5), and the bottom of the other electric push rod (8) is fixedly connected to the top of the second moving block (7). The output ends of the two electric push rods (8) are respectively fixedly connected to the bottom left and right sides of the mounting bracket (9).

5. The chip high-temperature resistance testing device according to claim 1, characterized in that: A heating detection platform (11) is fixedly connected to the bottom inner wall of the box (1), and heating lamps (12) are fixedly connected to the front and rear inner walls of the box (1).

6. The chip high-temperature resistance testing device according to claim 3, characterized in that: One end of the spring (16) is fixedly connected to the outside of the fixed plate (14), and the other end of the spring (16) is fixedly connected to the outside of the closed door (17).

7. The chip high-temperature resistance testing device according to claim 3, characterized in that: The outside of the closed door (17) is in contact with the outside of the box (1), and the bottom of the closed door (17) is in contact with the top of the bottom plate (13).

8. The chip high-temperature resistance testing device according to claim 3, characterized in that: Both of the closed doors (17) have a viewing window (18) at the top, and both of the closed doors (17) have handles fixedly connected to the outside.

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