Sulfuration-resistant novel resistor

Abstract

The utility model provides a novel anti-vulcanization resistor. The novel anti-vulcanization resistor comprises a substrate, a pair of back electrodes, a pair of front electrodes, a resistive layer, a protective layer and side electrodes, a gold layer is printed between the front electrode and the substrate; the protective layer comprises a first protective layer, a second protective layer and a third protective layer; the first protection layer is used for completely covering the resistance layer, the second protection layer covers the first protection layer, the third protection layer intersects with the side electrode and the second protection layer, and the third protection layer covers the two ends of the second protection layer; by adding the gold layer and the multiple protective layers, the vulcanization resistance is effectively improved, the durability of the resistor in a severe environment is enhanced, the gold layer is formed between the front electrode and the substrate, better corrosion resistance can be provided, and the stability between the resistive layer and the electrode can be remarkably improved due to the sequential stacking arrangement of the three protective layers.

Description

Technical Field

[0001] This utility model relates to the field of resistor technology, and more specifically, to a novel resistor resistant to sulfidation. Background Technology

[0002] With the rapid development of industrial automation, communication technology and automotive electronics, the requirements for the stability and reliability of electronic components in harsh working environments are increasing.

[0003] In environments with high concentrations of sulfiding gases, conventional anti-sulfidation resistors are insufficient to withstand extreme sulfidation conditions. In particular, when corrosive substances such as sulfur, bromine, and chlorine are present in the external environment, they can enter the electrodes through gaps and react, causing the electrodes to become less conductive or even lose conductivity. In severe cases, this can lead to electrode breakage, resulting in poor resistance.

[0004] Currently, chip resistors with high precision, low temperature coefficient, and superior anti-sulfurization performance are available on the market, but their product range is relatively limited and their prices are high, mainly targeting specific industries and high-end customers. They still cannot meet the requirements for normal use in the high-temperature and high-vibration environments of transportation vehicles such as automobiles and high-speed trains, or in areas containing sulfurous gases, such as seaside areas, hot spring areas, and mining areas—extreme environments with high sulfur content. Utility Model Content

[0005] In view of this, the purpose of this utility model is to provide a novel resistor resistant to sulfurization in order to solve the above problems.

[0006] The present invention adopts the following solution:

[0007] This application provides a novel sulfur-resistant resistor, comprising a substrate, a pair of back electrodes, a pair of front electrodes, a resistive layer, a protective layer, and side electrodes; the resistive layer covers the space between the front electrodes, the protective layer covers the resistive layer, and the side electrodes are respectively disposed on opposite sides of the substrate for electrode connection between the front electrodes and the corresponding back electrodes; a gold layer is printed between the front electrodes and the substrate; the protective layer includes a first protective layer, a second protective layer, and a third protective layer; the first protective layer completely covers the resistive layer, the second protective layer covers the first protective layer, and the third protective layer intersects with the side electrodes and the second protective layer, and covers both ends of the second protective layer.

[0008] As a further improvement, the front electrode is made of silver paste and the gold layer is made of gold.

[0009] As a further improvement, the thickness of the gold layer is less than the thickness of the front electrode.

[0010] As a further improvement, the first protective layer is made of glass, the second protective layer is made of epoxy resin, and the third protective layer is made of resin silver.

[0011] As a further improvement, the new resistor is constructed as an irregularly shaped resistor with an aspect ratio of 3:2.

[0012] As a further improvement, the dimensions of the irregularly shaped resistor are as follows: length L is 4.50±0.20mm, width W is 3.20±0.20mm, and height H is 0.55±0.20mm.

[0013] As a further improvement, the side electrode is disposed intersecting with the third protective layer and remains flush with each other on the front electrode.

[0014] As a further improvement, a nickel plating layer is also included; the nickel plating layer completely covers the back electrode, side electrode and front electrode, and overlaps the end face of the second protective layer on the third protective layer.

[0015] As a further improvement, a tin plating layer is also included; the tin plating layer covers the nickel plating layer and overlaps the end face of the second protective layer.

[0016] By adopting the above technical solution, the present invention can achieve the following technical effects:

[0017] The novel sulfur-resistant resistor of this application effectively improves sulfur resistance by adding a gold layer and multiple protective layers, enhancing the resistor's durability in harsh environments. The gold layer, formed between the front electrode and the substrate, provides better corrosion resistance. The sequential stacking of the three protective layers significantly improves the stability between the resistive layer and the electrode, greatly avoiding the erosion of sulfurous gases and enhancing the reliability of the resistor. It is particularly suitable for use in high sulfur environments, such as in industrial or automotive electronics fields. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of the novel sulfide-resistant resistor according to an embodiment of the present invention;

[0019] Figure 2 This is a schematic diagram of the irregular dimensions of the novel anti-sulfurization resistor according to an embodiment of this utility model;

[0020] Figure 3 This is a morphological image of a resistor after sulfidation in the prior art;

[0021] Figure 4 This is a morphological diagram of the sulfidation-resistant novel resistor according to an embodiment of this utility model after sulfidation;

[0022] Figure 5This is a process flow diagram of the novel sulfide-resistant resistor according to an embodiment of this utility model.

[0023] Icons: 1-Substrate; 2-Back electrode; 3-Front electrode; 4-Resistor layer; 5-Side electrode; 6-Gold layer; 7-First protective layer; 8-Second protective layer; 9-Third protective layer; 10-Nickel plating layer; 11-Tin plating layer. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely to represent selected embodiments of this utility model.

[0025] Example

[0026] Combination Figures 1 to 5 This embodiment provides a novel sulfide-resistant resistor, including a substrate 1, a pair of back electrodes 2, a pair of front electrodes 3, a resistive layer 4, a protective layer, and a side electrode 5.

[0027] The resistive layer 4 covers the front electrode 3, the protective layer covers the resistive layer 4, and the side electrodes 5 are respectively disposed on opposite sides of the substrate 1 for electrode connection between the front electrode 3 and the corresponding back electrode 2.

[0028] A gold layer 6 is printed between the front electrode 3 and the substrate 1. The protective layer includes a first protective layer 7, a second protective layer 8, and a third protective layer 9. The first protective layer 7 completely covers the resistive layer 4, the second protective layer 8 covers the first protective layer 7, and the third protective layer 9 is intersected with the side electrode 5 and the second protective layer 8, and covers both ends of the second protective layer 8.

[0029] The novel resistor described above effectively improves its resistance to sulfidation by adding a gold layer 6 and multiple protective layers, enhancing its durability in harsh environments. The gold layer 6, formed between the front electrode 3 and the substrate 1, provides better corrosion resistance. The sequential stacking of the three protective layers significantly improves the stability between the resistive layer 4 and the electrode, greatly preventing the corrosion of sulfiding gases and enhancing the reliability of the resistor. It is particularly suitable for use in high-sulfidation environments, such as in industrial or automotive electronics fields.

[0030] Preferably, the front electrode 3 is a silver paste material, and the gold layer 6 is a gold material. Using silver paste as the front electrode 3, combined with the gold layer 6, further improves the resistor's resistance to sulfidation and its conductivity. Furthermore, the silver paste material is a palladium-silver alloy, exhibiting excellent corrosion resistance, especially in high-temperature and chemically corrosive environments, while the gold layer 6 provides a more stable electrical connection and higher resistance to oxidation and sulfidation. Specifically, the palladium content of the silver paste material is 20% or more.

[0031] The thickness of the gold layer 6 is less than the thickness of the front electrode 3. This helps reduce material costs while maintaining good conductivity. Preferably, the first protective layer 7 is made of glass, the second protective layer 8 is made of epoxy resin, and the third protective layer 9 is made of silver resin. Using glass paste to form the first protective layer 7, epoxy resin paste to form the second protective layer 8, and silver resin paste to form the third protective layer 9, three protective layers of different materials are used to improve the resistor's resistance to penetration, preventing the intrusion of external substances such as sulfur, bromine, and chlorine. Furthermore, adding a gold layer 6 printed on the lower surface of the front electrode 3 prevents sulfur from entering the resistor, greatly extending the resistor's lifespan in harsh environments.

[0032] It should be noted that the resin silver material has good conductivity and protective properties. Applying it to the third protective layer 9 not only provides additional physical protection for the electrode, further resisting the water vapor erosion of the electrode by the external environment, but also maintains the conductivity of the electrode, effectively preventing resistance changes or failures caused by corrosion.

[0033] like Figure 2As shown, in this embodiment, the novel resistor is constructed as an irregularly shaped resistor with an aspect ratio of 3:2. The dimensions of the irregularly shaped resistor are: length L = 4.50 ± 0.20 mm, width W = 3.20 ± 0.20 mm, and height H = 0.55 ± 0.20 mm. Furthermore, the lengths A and B of the electroplated layer are both 0.50 ± 0.20 mm. In the prior art, the aspect ratio of conventional resistors is close to 2:1, while the aspect ratio of the irregularly shaped resistor is set to 3:2, resulting in a larger electrode area and a larger welding area, thus providing better stress and bending resistance. Moreover, the low aspect ratio results in a smaller size and higher power, effectively saving materials and conforming to sustainable development.

[0034] In this embodiment, the side electrode 5 is intersecting with the third protective layer 9 and is flush with each other on the front electrode 3, which ensures a smooth transition between the electrode surface and the external electrical connection, reduces poor contact problems caused by height differences, and thus improves the electrical connection reliability of the resistor.

[0035] In this embodiment, the novel resistor further includes a nickel plating layer 10. The nickel plating layer 10 completely covers the back electrode 2, the side electrode 5, and the front electrode 3, and overlaps the end face of the second protective layer 8 on top of the third protective layer 9. Furthermore, the novel resistor also includes a tin plating layer 11. The tin plating layer 11 covers the nickel plating layer 10 and overlaps the end face of the second protective layer 8. It should be noted that the tin plating layer 11 and the nickel plating layer 10 are existing structures, and therefore will not be described in detail here.

[0036] like Figure 3 The image shown is a schematic diagram of the morphology of a resistor after sulfidation in the prior art. A significant difference is that, as... Figure 4 As shown in the schematic diagram of the morphology of the novel resistor in this embodiment after sulfidation, the degree of sulfidation corrosion is greatly reduced.

[0037] like Figure 5 As shown, the fabrication process of the novel resistor in this embodiment is as follows: C2 (back electrode) printing → C1 (front electrode) gold layer printing → C1 silver layer printing → C1 / C2 sintering → R (resistive layer) printing → R sintering → G1 (first protective layer) printing → G1 sintering → laser cutting → G2 (second protective layer) printing → G2 sintering → C4 (third protective layer) printing → C4 sintering... and so on.

[0038] The above are merely preferred embodiments of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions that fall within the scope of this utility model's concept are protected by this utility model.

Claims

1. A novel sulfide-resistant resistor, comprising a substrate, a pair of back electrodes, a pair of front electrodes, a resistive layer, a protective layer, and side electrodes; the resistive layer covers the area between the front electrodes, the protective layer covers the resistive layer, and the side electrodes are respectively disposed on opposite sides of the substrate for electrode connection between the front electrodes and the corresponding back electrodes; characterized in that, A gold layer is printed between the front electrode and the substrate; the protective layer includes a first protective layer, a second protective layer and a third protective layer; the first protective layer is used to completely cover the resistive layer, the second protective layer covers the first protective layer, the third protective layer is disposed intersecting with the side electrode and the second protective layer, and the third protective layer covers both ends of the second protective layer.

2. The novel sulfide-resistant resistor according to claim 1, characterized in that, The front electrode is made of silver paste, and the gold layer is made of gold.

3. The novel sulfide-resistant resistor according to claim 2, characterized in that, The thickness of the gold layer is less than the thickness of the front electrode.

4. The novel sulfide-resistant resistor according to claim 1, characterized in that, The first protective layer is made of glass, the second protective layer is made of epoxy resin, and the third protective layer is made of resin silver.

5. The novel sulfide-resistant resistor according to claim 1, characterized in that, This new type of resistor is constructed as an irregularly shaped resistor with an aspect ratio of 3:

2.

6. The novel sulfide-resistant resistor according to claim 5, characterized in that, The dimensions of the irregularly shaped resistor are as follows: length L is 4.50±0.20mm, width W is 3.20±0.20mm, and height H is 0.55±0.20mm.

7. The novel sulfide-resistant resistor according to claim 1, characterized in that, The side electrode is intersecting with the third protective layer and is flush with each other on the front electrode.

8. The novel sulfide-resistant resistor according to claim 1, characterized in that, It also includes a nickel plating layer; the nickel plating layer completely covers the back electrode, side electrode and front electrode, and overlaps the end face of the second protective layer on the third protective layer.

9. The novel sulfide-resistant resistor according to claim 8, characterized in that, It also includes a tin plating layer; the tin plating layer covers the nickel plating layer and overlaps the end face of the second protective layer.

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