Transformer EI chip structure

Abstract

The utility model discloses a transformer EI chip structure which comprises chip assemblies and a connecting assembly, and the connecting assembly is located between the chip assemblies. According to the utility model, under the arrangement of the connecting assembly, when the E-type chip and the I-type chip need to be connected together, firstly, the fixing frame is pasted on the outer surface of the E-type chip, the fixing plate is pasted on the outer surface of the I-type chip, the E-type chip is placed at a required position, then the I-type chip is inserted at one side of the E-type chip, the fixing plate passes through the silica gel column, and then the E-type chip and the I-type chip are connected together. After the fixing plate is inserted into the fixing frame, the cover plate is placed on the top of the fixing plate, the surface of the connecting plate is coated with the mucilage glue, pushing force is applied to the connecting plate, and the limiting plate can be inserted into the cover plate after the connecting plate is attached to the guide frame. The transmission efficiency of the transformer is improved.

Description

Technical Field

[0001] This utility model relates to the field of EI chip technology, and in particular to a transformer EI chip structure. Background Technology

[0002] As a new type of transformer core structure, the EI chip structure not only has a high window utilization rate, can accommodate more coil turns, and improve the power density of the transformer, but also optimizes the size and shape of the "E" type and "I" type plates, which can make the magnetic flux distribution in the core more uniform, reduce leakage flux, and thus effectively reduce eddy current loss and hysteresis loss.

[0003] In practical use, existing chips have an air gap between the E-type chip and the I-type chip. Over long-term use, the air gap will gradually increase, which will increase magnetic resistance and leakage flux, resulting in a decrease in the transmission efficiency of the transformer. Therefore, it is necessary to provide a transformer EI chip structure to reduce the air gap between the E-type chip and the I-type chip, thereby reducing leakage flux and improving the transmission efficiency of the transformer. Utility Model Content

[0004] The purpose of this invention is to provide a transformer EI chip structure to solve the problem mentioned in the background art, where existing chips have an air gap between the E-type chip and the I-type chip during actual use. Over long-term use, the air gap will gradually increase, thereby increasing magnetic resistance, increasing leakage flux, and reducing the transmission efficiency of the transformer.

[0005] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0006] This utility model relates to a transformer EI chip structure, comprising:

[0007] Chip assemblies and connection assemblies, with the connection assemblies located between the chip assemblies, the chip assemblies including an E-type chip and an I-type chip located on one side of the E-type chip;

[0008] The connecting assembly includes a fixing frame, a fixing plate, silicone pillars, and a cover plate; the fixing frame is fixed to the outer surface of the E-type chip, the fixing plate is fixed to the outer surface of the I-type chip, the silicone pillars are fixed inside the fixing frame and located inside the fixing plate, and the cover plate is attached to the top of the fixing frame and the fixing plate.

[0009] Furthermore, a guide frame is fixed to one side of the upper surface of the E-type chip, and a connecting post is slidably connected inside the guide frame.

[0010] Furthermore, a limiting plate is fixed to the outer surface of one side of the connecting column, and the limiting plate is inserted into the inside of the cover plate. A connecting plate is fixed to the outer surface of the other side of the connecting column, and the connecting plate is bonded to the guide frame.

[0011] Furthermore, it also includes a separation component located inside the connecting column. The separation component includes a fixed column, a movable groove, and a movable plate. The fixed column is fixed to the outer surface of the limiting plate and inserted inside the connecting column. The movable groove is opened inside the other side of the fixed column, and the movable plate is movably connected to the inside of the movable groove.

[0012] Furthermore, a silicone block is fixed to the outer surface of the movable plate, and the silicone block is stuck inside the fixing column and the connecting column.

[0013] Furthermore, a silicone plate is snapped into the inside of the movable groove, and a guide post is fixed on the upper surface of the silicone plate.

[0014] Compared with existing technologies, the advantages of this utility model are:

[0015] I. In this utility model, with the connection component in place, when it is necessary to connect an E-type chip and an I-type chip together, firstly, the fixing frame is pasted on the outer surface of the E-type chip, and the fixing plate is pasted on the outer surface of the I-type chip. After placing the E-type chip in the required position, the I-type chip is then inserted into one side of the E-type chip, so that the fixing plate passes through the silicone pillar. After the fixing plate is inserted into the fixing frame, the cover plate is placed on top of the fixing plate, adhesive is applied to the surface of the connecting plate, and a pushing force is applied to the connecting plate. When the connecting plate is attached to the guide frame, the limiting plate can be inserted into the cover plate. This solution reduces the air gap between the E-type chip and the I-type chip by adding a gasket, thereby reducing leakage flux and improving the transmission efficiency of the transformer.

[0016] II. Based on the first beneficial effect, when the E-type chip and I-type chip need to be separated by using the separation components, the guide post is grasped with tweezers, and an upward pulling force is applied to the tweezers to remove the silicone plate from the movable slot. A pushing force is applied to the silicone block to displace the movable plate, and then a pushing force is applied to the movable plate to completely retract the silicone block into the fixed post. Finally, an upward pulling force is applied to the cover plate. This solution can quickly remove the cover plate from the bottom of the fixed frame, thus quickly and easily separating the E-type chip and the I-type chip. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a three-dimensional schematic diagram of the present invention;

[0019] Figure 2This is a structural diagram of the connecting component of this utility model;

[0020] Figure 3 This is a cross-sectional view of the connecting component of this utility model;

[0021] Figure 4 This is a structural diagram of the separation component of this utility model.

[0022] The attached diagram lists the components represented by each number as follows:

[0023] 11. Type E chip; 12. Type I chip;

[0024] 21. Fixing frame; 22. Fixing plate; 23. Silicone pillar; 24. Cover plate; 25. Guide frame; 26. Connecting pillar; 27. Limiting plate; 28. Connecting plate;

[0025] 31. Fixed column; 32. Movable groove; 33. Movable plate; 34. Silicone block; 35. Silicone plate; 36. Guide column. Detailed Implementation

[0026] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0027] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0028] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0029] Please see Figures 1-3 As shown, this embodiment is a transformer EI chip structure, including:

[0030] The chip assembly and the connection assembly are located between the chip assemblies. The chip assembly includes an E-type chip 11 and an I-type chip 12 located on one side of the E-type chip 11.

[0031] As one of the main components of the transformer core, the E-type chip 11, together with the I-type chip 12, forms a complete magnetic circuit. Through its specific shape and size, it guides the direction of magnetic flux, thereby realizing the functions of voltage transformation and energy transfer.

[0032] The connecting assembly includes a fixing frame 21, a fixing plate 22, silicone pillars 23, and a cover plate 24; the fixing frame 21 is fixed to the outer surface of the E-type chip 11, the fixing plate 22 is fixed to the outer surface of the I-type chip 12, the silicone pillars 23 are fixed inside the fixing frame 21 and are located inside the fixing plate 22, and the cover plate 24 is attached to the top of the fixing frame 21 and the fixing plate 22.

[0033] The fixing frame 21 is used to cooperate with the fixing plate 22 so that the E-type chip 11 and the I-type chip 12 are tightly connected together. The fixing frame 21 and the fixing plate 22 are made of stainless steel, which can also relieve the stress caused by the thermal expansion and contraction of the iron core due to temperature changes and prevent the iron core from deforming or cracking. The silicone pillar 23 is used to connect the fixing frame 21 and the fixing plate 22 together, and the cover plate 24 is used to fix the fixing plate 22 inside the fixing frame 21.

[0034] A guide frame 25 is fixed on one side of the upper surface of the E-type chip 11, and a connecting post 26 is slidably connected inside the guide frame 25.

[0035] The guide frame 25 is used to connect the column 26 to move inside it, and the connecting column 26 is used to change the position of the limiting plate 27;

[0036] A limiting plate 27 is fixed to the outer surface of one side of the connecting column 26. The limiting plate 27 is inserted into the inside of the cover plate 24. A connecting plate 28 is fixed to the outer surface of the other side of the connecting column 26. The connecting plate 28 is bonded to the guide frame 25.

[0037] The limiting plate 27 is used to restrict the cover plate 24 to the desired position, and the connecting plate 28 is used to fix it to the surface of the guide frame 25, thereby fixing the limiting plate 27 to the desired position.

[0038] Working principle: When it is necessary to connect the E-type chip 11 and the I-type chip 12 together, firstly, the fixing frame 21 is pasted on the outer surface of the E-type chip 11, and the fixing plate 22 is pasted on the outer surface of the I-type chip 12. After placing the E-type chip 11 in the required position, the I-type chip 12 is inserted into one side of the E-type chip 11, so that the fixing plate 22 passes through the silicone pillar 23. After the fixing plate 22 is inserted into the fixing frame 21, the cover plate 24 is placed on top of the fixing plate 22, adhesive is applied to the surface of the connecting plate 28, and a pushing force is applied to the connecting plate 28. When the connecting plate 28 is attached to the guide frame 25, the limiting plate 27 can be inserted into the cover plate 24.

[0039] This step reduces the air gap between the E-type chip 11 and the I-type chip 12 by adding a shim, thereby reducing leakage flux and improving the transmission efficiency of the transformer.

[0040] Please see Figures 1-4As shown, this embodiment, based on the above embodiment, also includes a separation component. The separation component is located inside the connecting column 26 and includes a fixed column 31, a movable groove 32, and a movable plate 33. The fixed column 31 is fixed to the outer surface of the limiting plate 27 and inserted into the connecting column 26. The movable groove 32 is opened inside the other side of the fixed column 31, and the movable plate 33 is movably connected to the inside of the movable groove 32.

[0041] The fixed column 31 is used to connect the connecting column 26 and the limiting plate 27 together, the movable groove 32 provides space for the movement of the movable plate 33, and the movable plate 33 is used to change the position of the silicone block 34.

[0042] A silicone block 34 is fixed to the outer surface of the movable plate 33, and the silicone block 34 is stuck inside the fixed post 31 and the connecting post 26.

[0043] The silicone block 34 is used to be locked inside the fixing post 31 and the connecting post 26, thereby confining the fixing post 31 inside the connecting post 26;

[0044] A silicone plate 35 is snapped into the inside of the movable groove 32, and a guide post 36 is fixed on the upper surface of the silicone plate 35.

[0045] The silicone plate 35 is used to confine the movable plate 33 inside the movable groove 32, preventing it from moving, while the guide post 36 facilitates the removal of the silicone plate 35 from inside the movable groove 32.

[0046] Working principle: When it is necessary to separate the E-type chip 11 and the I-type chip 12, grasp the guide post 36 with tweezers, apply an upward pulling force to the tweezers to remove the silicone plate 35 from the inside of the movable groove 32, apply a pushing force to the silicone block 34 to make the movable plate 33 displace, and then apply a pushing force to the movable plate 33 to make the silicone block 34 completely retract into the fixed post 31. Finally, apply an upward pulling force to the cover plate 24.

[0047] This step allows the cover plate 24 to be quickly removed from the bottom of the fixing frame 21, thus enabling the E-type chip 11 and the I-type chip 12 to be separated quickly and easily.

[0048] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0049] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A transformer EI chip structure, characterized in that, include: Chip assembly and connection assembly, the connection assembly being located between chip assemblies, the chip assembly including an E-type chip (11) and an I-type chip (12) located on one side of the E-type chip (11). The connecting assembly includes a fixing frame (21), a fixing plate (22), a silicone pillar (23), and a cover plate (24); the fixing frame (21) is fixed to the outer surface of the E-type chip (11), the fixing plate (22) is fixed to the outer surface of the I-type chip (12), the silicone pillar (23) is fixed inside the fixing frame (21), and the silicone pillar (23) is located inside the fixing plate (22), and the cover plate (24) is attached to the top of the fixing frame (21) and the fixing plate (22).

2. The transformer EI chip structure according to claim 1, characterized in that, A guide frame (25) is fixed on one side of the upper surface of the E-type chip (11), and a connecting post (26) is slidably connected inside the guide frame (25).

3. The transformer EI chip structure according to claim 2, characterized in that, A limiting plate (27) is fixed on the outer surface of one side of the connecting column (26). The limiting plate (27) is inserted into the inside of the cover plate (24). A connecting plate (28) is fixed on the outer surface of the other side of the connecting column (26). The connecting plate (28) and the guide frame (25) are connected by adhesive.

4. The transformer EI chip structure according to claim 1, characterized in that, It also includes a separation component located inside the connecting column (26). The separation component includes a fixed column (31), a movable groove (32), and a movable plate (33). The fixed column (31) is fixed to the outer surface of the limiting plate (27) and inserted inside the connecting column (26). The movable groove (32) is opened inside the other side of the fixed column (31), and the movable plate (33) is movably connected to the inside of the movable groove (32).

5. The transformer EI chip structure according to claim 4, characterized in that, The outer surface of the movable plate (33) is fixed with a silicone block (34), and the silicone block (34) is stuck inside the fixed column (31) and the connecting column (26).

6. The transformer EI chip structure according to claim 4, characterized in that, The movable groove (32) is fitted with a silicone plate (35), and a guide post (36) is fixed on the upper surface of the silicone plate (35).

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