Optical signal transmission device
By connecting an external light source through a pluggable optical interface device and using an external laser for heat dissipation, the problem of high power consumption of the optical transceiver module is solved, and low-power, high-efficiency optical signal transmission is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN GIGALIGHT TECH
- Filing Date
- 2025-05-20
- Publication Date
- 2026-05-15
AI Technical Summary
Existing optical transceiver modules have high power consumption, especially in high-speed optical modules. Lasers are prone to failure in high-temperature environments, making power consumption and heat dissipation a challenge for high-density optical modules.
An external light source is connected using a pluggable optical interface device, and the external laser is cooled separately. High-density integration is achieved through the optical interface device, reducing the power consumption of the optical module.
It reduces the power consumption of the optical transceiver module, increases the lifespan of the pluggable optical module, optimizes the working conditions of the trunking optical module, and reduces the system maintenance cost.
Smart Images
Figure CN224249703U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of communication technology, and in particular to an optical signal transmission device. Background Technology
[0002] With the development of communication technology, optical communication technology has been widely used in various fields due to its characteristics such as large communication capacity and low loss. When information is transmitted through optical fiber, various types of optical signal transmission devices are generated, such as optical transceiver modules. An optical transceiver module includes a transmitter and a receiver. The transmitter is used to convert electrical signals into optical signals, and the receiver is used to convert optical signals back into electrical signals.
[0003] However, current optical transceiver modules suffer from high power consumption. Utility Model Content
[0004] Therefore, it is necessary to provide an optical signal transmission device that can reduce the power consumption of the optical transceiver module, addressing the aforementioned technical problems.
[0005] In a first aspect, this application provides an optical signal transmission device, which includes: an optical transmitter, an optical receiver, and an optical interface device; the optical transmitter is connected to an external light source through the optical interface device, and the optical transmitter is also connected to the optical receiver through the optical interface device; the optical interface device is a pluggable interface.
[0006] In one embodiment, the optical interface device includes an external input interface, an internal input interface, a first internal output interface, and a second internal output interface; wherein the optical transmitter is optically connected to the external light source through the external input interface and the first internal output interface; and the optical transmitter is optically connected to the optical receiver through the internal input interface and the second internal output interface.
[0007] In one embodiment, the optical interface device further includes an external output interface, through which the optical signal transmission device is optically connected to an external device.
[0008] In one embodiment, the first internal output interface, the internal input interface, and the second internal output interface are sequentially disposed on the first side of the optical interface device, and the external input interface and the external output interface are disposed on the second side of the optical interface device, with the first side and the second side being opposite sides.
[0009] In one embodiment, the optical transmitter includes a silicon photonic chip and a first fiber array assembly, the first fiber array assembly including a polarization-maintaining fiber for input light and a single-mode fiber for output light; the silicon photonic chip is connected to the optical interface device through the first fiber array assembly.
[0010] In one embodiment, the optical receiver includes a photodiode, a second fiber array assembly, and a transimpedance amplifier; one end of the photodiode is connected to the optical interface device through the second fiber array assembly, and the other end of the photodiode is connected to the transimpedance amplifier.
[0011] In one embodiment, the optical signal transmission device further includes a circuit board, on which both the optical transmitter and the optical receiver are fixed.
[0012] In one embodiment, the optical signal transmission device further includes a digital signal processor, which is electrically connected to the optical receiver;
[0013] The digital signal processor is used to process the electrical signals output by the optical receiver.
[0014] In one embodiment, the digital signal processor is also connected to the optical transmitter, and the digital signal processor is used to provide power to the optical transmitter.
[0015] In one embodiment, the optical signal transmission device further includes a power supply component connected to the digital signal processor, which supplies electrical energy to the digital signal processor to provide power to the optical transmitter.
[0016] The aforementioned optical signal transmission device includes an optical transmitter, an optical receiver, and an optical interface device. The optical transmitter is connected to an external light source via the optical interface device, and the optical transmitter is also connected to the optical receiver via the optical interface device. The optical interface device is a pluggable interface. Since the external light source can be pluggably connected or disconnected from the optical signal transmission device via the optical interface device in this embodiment, this embodiment can achieve a high-density integrated data network by using pluggable optical modules without silicon photonics sources to connect to external light sources. This reduces the power consumption of the cluster optical modules and increases the lifespan of the pluggable optical modules. Furthermore, by moving the laser externally, the operating conditions of the cluster optical modules can be optimized, and the laser in the external light source can be individually cooled, further reducing the power consumption and maintenance costs of the system containing the optical modules. Therefore, the optical signal transmission device can reduce the power consumption of the optical transceiver module. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a schematic diagram of the structure of an optical signal transmission device in one embodiment;
[0019] Figure 2 This is a schematic diagram of an optical signal transmission device including an optical interface device in one embodiment;
[0020] Figure 3 This is a schematic diagram of the structure of an optical signal transmission device including an optical interface device in another embodiment;
[0021] Figure 4 This is a schematic diagram of the optical signal transmission device connected to an external source in one embodiment;
[0022] Figure 5 This is a schematic diagram of the specific structure of an optical signal transmission device in one embodiment;
[0023] Figure 6 This is a schematic diagram of the structure of an optical signal transmission device including a power supply component in one embodiment;
[0024] Figure 7 This is a schematic diagram of a packaged optical signal transmission device in one embodiment;
[0025] Figure 8 This is a three-dimensional schematic diagram of an optical signal transmission device in one embodiment.
[0026] The attached figures are labeled as follows:
[0027] Optical signal transmission device A; optical transmitter 1; optical receiver 2; optical interface device 3; external light source B; external input interface 31; internal input interface 32; first internal output interface 33; second internal output interface 34; external output interface 35; silicon photonics chip 11; first fiber optic array assembly 12; photodiode 21; second fiber optic array assembly 22; transimpedance amplifier 23; circuit board 4; digital signal processor 5; power supply assembly 6. Detailed Implementation
[0028] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.
[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.
[0030] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0032] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0033] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0034] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0035] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0036] With the development of communication technology, optical communication technology has been widely used in various fields due to its characteristics of large communication capacity and low loss. When information is transmitted through optical fiber, various types of optical signal transmission devices are generated, such as optical transceiver modules (or simply optical modules). An optical transceiver module includes a transmitter and a receiver. The transmitter is used to convert electrical signals into optical signals, and the receiver is used to convert optical signals back into electrical signals.
[0037] However, the increased data rates in optical transceiver modules have led to high power consumption. Traditional high-speed optical modules, such as 800G DR8, 1.6T DR8, and 1.6T DR16 modules, consume very high power when operating on switches with throughputs of 51.6Tb / s, 115.2Tb / s, and above. This poses a significant challenge to the use of trunking optical modules and also to the reliability and lifespan of pluggable optical modules. Furthermore, in high-speed optical modules, the two main high-temperature points are the DSP (Digital Signal Processor) and the laser. The laser, in particular, is a component prone to failure in overheated environments. Therefore, in high-intensity data processing and transmission, achieving better heat dissipation for the laser necessitates further increasing the power consumption of the optical module. Thus, managing the power consumption and heat dissipation of high-density optical modules is a significant challenge. Therefore, current optical transceiver modules suffer from high power consumption.
[0038] In one embodiment, such as Figure 1 As shown, Figure 1 This is a schematic diagram of the structure of an optical signal transmission device in one embodiment. An optical signal transmission device A is provided, which includes: an optical transmitter 1, an optical receiver 2, and an optical interface device 3; the optical transmitter 1 is connected to an external light source B through the optical interface device 3, and the optical transmitter 1 is also connected to the optical receiver 2 through the optical interface device 3; the optical interface device 3 is a pluggable interface.
[0039] Among them, the optical signal transmission device A is a pluggable optical module, and the optical transmitter 1 may include, but is not limited to, silicon photonic chips, etc. It should be noted that the optical transmitter 1 does not include a laser; the optical receiver 2 may include, but is not limited to, photodiodes and transimpedance amplifiers, etc.; the optical interface device 3 is a pluggable interface, such as an optical port. Optionally, the optical port can be an MPO (Multi-fiber Push On, a high-density fiber optic connector), or it can be other parallel optical ports, or it can be an interface designed using a pigtail. Of course, the embodiments of this application do not limit the optical port.
[0040] External light source B may include, but is not limited to, silicon photonics light sources, which may include, but are not limited to, any type of laser. Optionally, the external light source may be a pluggable optical module in OSFP (Octal Small Form-factor Pluggable), OSFP-XD (Octal Small Form-factor Pluggable - Extra Dense), QSFP-DD (Quad Small Form-factor Pluggable - Double Density), or ELSFP package. Of course, this application embodiment does not limit the packaging method of the external light source. For example, the external light source may be a high-power laser coupled to the MPO and connected to the aforementioned optical signal transmission device A via a branch cable. It should be noted that the external light source B can be pluggably connected to or disconnected from the optical signal transmission device A via the optical interface device 3.
[0041] Furthermore, the optical module in this application embodiment can be not only a 1.6T OSFP-XD DR8 optical module, but also a 1.6T OSFP-XD DR16 optical module, a 1.6T OSFP-XD 4XFR4 optical module, a 1.6T OSFP-XD 2XFR4 optical module, a 1.6T OSFP DR8 optical module, a 1.6T QSFP-DD DR8 optical module, an 800G OSFP DR4 optical module, or an 800G QSFP-DD DR8 optical module.
[0042] In this embodiment, the optical signal transmission device A includes an optical transmitter 1, an optical receiver 2, and an optical interface device 3. The optical transmitter 1 is connected to an external light source B via the optical interface device 3, and is also connected to the optical receiver 2 via the optical interface device 3. The optical transmitter 1 and the optical interface device 3 are connected via optical fiber, as are the optical receiver 2 and the optical interface device 3. The optical interface device 3 is also connected to the external light source B via optical fiber. The external light source B outputs at least one optical signal to the optical interface device 3. The optical interface device 3 transmits this at least one optical signal to the optical transmitter 1. The optical transmitter 1 performs optical signal processing on the at least one optical signal, such as phase modulation or amplitude modulation, and transmits the processed optical signal to the optical interface device 3. The optical interface device 3 also transmits the processed optical signal to the optical receiver 2, which performs photoelectric conversion on the processed optical signal to generate an electrical signal corresponding to the at least one optical signal.
[0043] The aforementioned optical signal transmission device includes an optical transmitter, an optical receiver, and an optical interface device. The optical transmitter is connected to an external light source via the optical interface device, and the optical transmitter is also connected to the optical receiver via the optical interface device. The optical interface device is a pluggable interface. Since the external light source can be pluggably connected or disconnected from the optical signal transmission device via the optical interface device in this embodiment, this embodiment can achieve a high-density integrated data network by using a pluggable optical module without a silicon photonics source to connect to an external light source. This reduces the power consumption of the cluster optical module and increases the lifespan of the pluggable optical module. Furthermore, by moving the laser externally, the operating conditions of the cluster optical module can be optimized, and the laser in the external light source can be individually cooled, further reducing the power consumption and maintenance costs of the system containing the optical module. Therefore, the optical signal transmission device can reduce the power consumption of the optical transceiver module.
[0044] In one embodiment, such as Figure 2 As shown, Figure 2 This is a schematic diagram of an optical signal transmission device including an optical interface device in one embodiment. The optical interface device 3 includes an external input interface 31, an internal input interface 32, a first internal output interface 33, and a second internal output interface 34. The optical transmitter 1 is connected to an external light source B via the external input interface 31 and the first internal output interface 33 through optical fiber. The optical transmitter 1 is connected to the optical receiver 2 via the internal input interface 32 and the second internal output interface 34 through optical fiber.
[0045] In this embodiment of the application, the optical interface device 3 includes an external input interface 31, an internal input interface 32, a first internal output interface 33, and a second internal output interface 34. The external light source B is connected to the external input interface 31 via an optical fiber, the optical transmitter 1 is connected to the first internal output interface 33 via an optical fiber, the optical transmitter 1 is connected to the internal input interface 32 via an optical fiber, and the second internal output interface 34 is connected to the optical receiver 2 via an optical fiber.
[0046] In one embodiment, such as Figure 3 As shown, Figure 3 This is a schematic diagram of the structure of an optical signal transmission device including an optical interface device in another embodiment. The optical interface device 3 also includes an external output interface 35, and the optical signal transmission device A is connected to an external device via optical fiber through the external output interface 35.
[0047] The external device may include, but is not limited to, any device such as a switch. In this embodiment, the optical interface device 3 is provided with an external output interface 35, and the external output interface 35 is connected to the external device via optical fiber.
[0048] In one embodiment, combined Figure 3 As shown, the first internal output interface 33, the internal input interface 32, and the second internal output interface 34 are sequentially disposed on the first side of the optical interface device 3, and the external input interface 31 and the external output interface 35 are disposed on the second side of the optical interface device 3. The first side and the second side are opposite sides of the optical interface device 3.
[0049] In this embodiment, the optical interface device includes an external input interface, an internal input interface, a first internal output interface, a second internal output interface, and an external output interface. Through the multiple interfaces provided in the optical interface device, an external light source can be accurately and detachably connected to or disconnected from the optical signal transmission device, thereby enabling accurate and effective transmission of optical signals and photoelectric conversion.
[0050] In one exemplary embodiment, such as Figure 4 As shown, Figure 4 This is a schematic diagram of the connection between an optical signal transmission device and an external source in one embodiment. The optical signal transmission device A can be pluggably connected to an external device via an optical interface device 3 and an optical fiber. The optical signal transmission device A can also be pluggably connected to an external light source B via an optical interface device 3 and an optical fiber. In this way, the external light source B can transmit at least one optical signal to the optical signal transmission device A, and the optical signal transmission device A can transmit the data corresponding to the optical signal to the external device via an optical fiber.
[0051] In one embodiment, such as Figure 5 As shown, Figure 5 The diagram below shows a specific structure of an optical signal transmission device in one embodiment. The optical transmitter 1 includes a silicon photonic chip 11 and a first fiber array assembly 12. The first fiber array assembly 12 includes a polarization-maintaining fiber for light input and a single-mode fiber for light output. The silicon photonic chip 11 is connected to the optical interface device 3 through the first fiber array assembly 12.
[0052] The silicon photonic chip 11 incorporates a photonic integrated circuit (PIC) and includes a multiplexer. The silicon photonic chip 11 is used to amplitude modulate at least one optical signal to obtain an amplitude-modulated optical signal. This amplitude-modulated optical signal is then transmitted to the optical interface device 3 via a first fiber optic array assembly 12 (TX FA, Transmit Fiber Array). The first fiber optic array assembly 12 includes a polarization-maintaining fiber for the incoming light (i.e., the incoming PIC light) and a single-mode fiber for the outgoing light.
[0053] In this embodiment, the optical transmitter includes a silicon photonic chip and a first fiber array assembly. The first fiber array assembly includes a polarization-maintaining fiber for input light and a single-mode fiber for output light. Thus, the silicon photonic chip can be connected to an optical interface device through the first fiber array assembly.
[0054] In one embodiment, combined Figure 5 As shown, the optical receiver 2 includes a photodiode 21, a second fiber array assembly 22, and a transimpedance amplifier 23; one end of the photodiode 21 is connected to the optical interface device 3 through the second fiber array assembly 22, and the other end of the photodiode 21 is connected to the transimpedance amplifier 23.
[0055] In this embodiment, the photodiode 21 (PD) receives the processed optical signal through the second fiber array assembly 22 (RX FA, Receive Fiber Array), performs photoelectric conversion on the processed optical signal to obtain a photoelectric converted electrical signal, and transmits the photoelectric converted electrical signal to the transimpedance amplifier 23. The linear transimpedance amplifier 23 (TIA) amplifies the photoelectric converted electrical signal to generate the electrical signal corresponding to the at least one optical signal. The second fiber array assembly 22 is a single-mode fiber, and the TX FA / RX FA optical signals are connected via an MPO (Multi-fiber Push On, a high-density fiber optic connector).
[0056] In this embodiment, the optical receiver includes a photodiode, a second fiber array assembly, and a transimpedance amplifier. Through the cooperation of the photodiode and the signal amplifier, the processed optical signal can be photoelectrically converted and amplified to generate an electrical signal corresponding to at least one optical signal.
[0057] In one embodiment, combined Figure 5 As shown, the optical signal transmission device also includes a circuit board 4, and the optical transmitter 1 and the optical receiver 2 are both fixed on the circuit board 4 (Printed Circuit Board, PCB).
[0058] In one embodiment, combined Figure 5 As shown, the optical signal transmission device also includes a digital signal processor 5, which is electrically connected to the optical receiver 2.
[0059] The digital signal processor 5 is used to process the electrical signals output by the optical receiver 2.
[0060] In one embodiment, combined Figure 5 As shown, the digital signal processor 5 is also connected to the optical transmitter 1, and the digital signal processor 5 is also used to provide power to the optical transmitter 1.
[0061] In one embodiment, such as Figure 6 As shown, Figure 6 This is a schematic diagram of the structure of an optical signal transmission device including a power supply component in one embodiment. The optical signal transmission device A further includes a power supply component 6, which is connected to a digital signal processor 5. The power supply component 6 transmits electrical energy to the digital signal processor 5 so that the digital signal processor 5 provides electrical energy to the optical transmitter 1.
[0062] The optical signal transmission device also includes a power supply component 6. The signal in the power supply component 6 can be provided through gold fingers. The power supply component 6 is electrically connected to the digital signal processor 5. The power supply component 6 is used to drive the silicon photonics chip. Optionally, the power supply component 6 can directly drive the silicon photonics chip; or, the power supply component 6 can be combined with the digital signal processor to jointly drive the silicon photonics chip.
[0063] In this embodiment, the optical signal transmission device A further includes a digital signal processor (DSP). The first input terminal of the DSP is connected to the power supply component 6, and the first output terminal is connected to the silicon photonics chip in the optical transmitter 1. The DSP processes the initial electrical signal output from the power supply component 6 to obtain a drive signal, and sends the drive signal to the DSP, thereby providing power to the optical transmitter 1. The second input terminal of the DSP is electrically connected to the optical receiver 2, so the DSP can also process the electrical signal output from the optical receiver 2.
[0064] In this embodiment, the digital signal processor 5 is connected to the circuit board 4 via a flip chip (FC), the transimpedance amplifier 23 is bonded to the circuit board 4 with silver paste, the photodiode 21 is connected to the transimpedance amplifier 23 via the FC, the silicon photonics chip 11 is bonded to a metal block with adhesive, and the metal block is bonded to the circuit board 4 with adhesive. The second fiber array assembly 22 (RXFA) and the first fiber array assembly 12 (TXFA) are fixed to the circuit board 4 and the metal block by coupling. The optical signal transmission device in this embodiment can be applied to high-speed silicon photonics products and is suitable for high-speed interconnection in data centers and 5G communication scenarios.
[0065] In one exemplary embodiment, such as Figure 7 As shown, Figure 7 This is a schematic diagram of a packaged optical signal transmission device in one embodiment. The packaging method of the optical signal transmission device is not limited in this embodiment. Figure 8 As shown, Figure 8 This is a three-dimensional schematic diagram of an optical signal transmission device in one embodiment. The components of the optical signal transmission device have been described in the above embodiments and will not be repeated here.
[0066] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.
[0067] The above embodiments are merely illustrative of several implementation methods of this application, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.
Claims
1. An optical signal transmission device, characterized in that, The optical signal transmission device includes: an optical transmitter, an optical receiver, and an optical interface device; the optical transmitter is connected to an external light source through the optical interface device, and the optical transmitter is also connected to the optical receiver through the optical interface device; the optical interface device is a pluggable interface.
2. The apparatus according to claim 1, characterized in that, The optical interface device includes an external input interface, an internal input interface, a first internal output interface, and a second internal output interface; wherein, the optical transmitter is optically connected to the external light source through the external input interface and the first internal output interface; and the optical transmitter is optically connected to the optical receiver through the internal input interface and the second internal output interface.
3. The apparatus according to claim 2, characterized in that, The optical interface device also includes an external output interface, through which the optical signal transmission device is connected to external devices via optical fiber.
4. The apparatus according to claim 3, characterized in that, The first internal output interface, the internal input interface, and the second internal output interface are sequentially disposed on the first side of the optical interface device, and the external input interface and the external output interface are disposed on the second side of the optical interface device, with the first side and the second side being opposite sides.
5. The apparatus according to claim 1, characterized in that, The optical transmitter includes a silicon photonic chip and a first fiber array assembly, the first fiber array assembly including a polarization-maintaining fiber for input light and a single-mode fiber for output light; the silicon photonic chip is connected to the optical interface device through the first fiber array assembly.
6. The apparatus according to claim 1, characterized in that, The optical receiver includes a photodiode, a second fiber array assembly, and a transimpedance amplifier; one end of the photodiode is connected to the optical interface device through the second fiber array assembly, and the other end of the photodiode is connected to the transimpedance amplifier.
7. The apparatus according to claim 1, characterized in that, The optical signal transmission device also includes a circuit board, on which both the optical transmitter and the optical receiver are fixed.
8. The apparatus according to claim 1, characterized in that, The optical signal transmission device further includes a digital signal processor, which is electrically connected to the optical receiver; The digital signal processor is used to process the electrical signals output by the optical receiver.
9. The apparatus according to claim 8, characterized in that, The digital signal processor is also connected to the optical transmitter, and the digital signal processor is used to provide power to the optical transmitter.
10. The apparatus according to claim 8, characterized in that, The optical signal transmission device further includes a power supply component connected to the digital signal processor. The power supply component transmits electrical energy to the digital signal processor so that the digital signal processor provides power to the optical transmitter.