Pressing device for processing multilayer circuit board

Abstract

The utility model discloses a press-fit device for processing a multilayer circuit board. The press-fit device comprises a machine table, a press-fit assembly and a workbench assembly. The pressing assembly comprises a telescopic air cylinder and a pressing block, and the telescopic air cylinder lifts the pressing block through a lifting and pressing plate or applies pressure to the pressing block. The working table assembly comprises a base and a table plate, a driving motor is embedded in the base plate, and an eccentric block is arranged on the driving motor. The driving motor can drive the platen to swing periodically through the eccentric block. When the circuit board is pressed, the telescopic air cylinder is started, the pressing block descends, and the pressing block firstly pre-presses the circuit board and then presses the circuit board. In the pre-pressing process, the pre-pressing pressure plays a pre-positioning and preliminary exhausting role on the circuit board, and the circuit board periodically swings or vibrates under the condition of keeping the pre-pressing pressure and lasts for a certain time, so that internal resin can generate micro-flow, the resin is easier to fill tiny gaps between layers in a low-viscosity state, cavities and bubbles are reduced, and the bonding strength of the circuit board is improved. Therefore, the uniformity of the laminated medium of the multilayer circuit board is improved.

Description

Technical Field

[0001] This utility model relates to the technical field of a pressing device for circuit boards, and more particularly to a pressing device for processing multilayer circuit boards. Background Technology

[0002] Multilayer boards are circuit boards with multiple wiring layers, with a dielectric layer between each pair of layers. A multilayer board has at least three conductive layers, two on the outer surface and the remaining conductive layers integrated within an insulating layer. Electrical connections between these layers are typically achieved through plated vias on the cross-section of the board. During the fabrication of multilayer boards, a lamination device is usually used for bonding. The lamination of multilayer boards essentially involves alternately layering a pre-fabricated core board with uncured insulating material (such as a prepreg, i.e., the bonding medium) and then bonding it under high temperature and pressure. Existing lamination devices generally place the board to be laminated on a workbench and apply pressure using a pressure plate to complete the lamination of the multilayer board. Since the thickness difference between the circuit board before and after lamination is small, the pressure exerted by the laminating plate on the circuit board is sudden. This sudden increase in pressure can easily cause the viscosity of the resin (prepreg is an incompletely cured epoxy resin glass fiber prepreg material with adhesive properties) to drop sharply and flow rapidly to the edge, resulting in insufficient resin in the center of the circuit board and excessive glue overflow at the edge. This reduces the uniformity of the lamination medium and affects the quality of the multilayer circuit board. Therefore, a lamination device for multilayer circuit board processing is proposed. Utility Model Content

[0003] The purpose of this invention is to provide a pressing device for multilayer circuit board processing, thereby solving the above-mentioned problems.

[0004] To achieve this objective, the present invention adopts the following technical solution:

[0005] A laminating apparatus for multilayer circuit board processing, comprising:

[0006] A machine platform, on which a support frame is provided;

[0007] The pressing assembly includes a telescopic cylinder and a pressing block disposed on the support frame. The pressing block has an inner cavity and a second through hole communicating with the inner cavity. The telescopic end of the telescopic cylinder passes through the second through hole and extends into the inner cavity. The telescopic end of the telescopic cylinder is provided with a lifting plate.

[0008] The workbench assembly includes a base disposed on the machine base and a table plate disposed on the base. The base is embedded with a drive motor, the output shaft of the drive motor is provided with an eccentric block, and the bottom surface of the table plate is provided with an eccentric groove corresponding to the eccentric block.

[0009] Optionally, the base is provided with a protrusion, and the bottom surface of the platform is provided with a groove corresponding to the protrusion.

[0010] Optionally, the platform is provided with a flexible fixing component;

[0011] The platform is provided with a mounting groove, and the bottom of the mounting groove is provided with a spring groove; the fixing component includes a baffle disposed in the mounting groove and a spring installed in the spring groove, one end of the spring is connected to the bottom of the spring groove, the other end is connected to the bottom surface of the baffle, and the top surface of the baffle protrudes from the platform surface.

[0012] Optionally, the mounting groove is inverted "T" shape, the bottom surface of the baffle is provided with a connecting plate, and one end of the spring is connected to the bottom surface of the baffle through the connecting plate.

[0013] Optionally, the machine base is provided with a slide rail, the slide rail is provided with a slider, and the worktable assembly is disposed on the slider.

[0014] Optionally, the workbench assembly further includes a handle disposed on one side of the base.

[0015] Optionally, the machine base is also equipped with a protective cover, and a switch button is provided on one side of the machine base.

[0016] Compared with the prior art, this utility model has the following beneficial effects: In the initial state, the top surface of the lifting plate contacts the inner top surface of the inner cavity and lifts the pressure block. When pressing the multilayer circuit board, the circuit board is placed on the platform of the workbench assembly, and the telescopic cylinder is activated. The telescopic cylinder drives the lifting plate to descend, thereby causing the pressure block to descend. During the process from the pressure block contacting the circuit board to the lifting plate exerting pressure on the pressure block (the process from the top surface of the lifting plate separating from the inner top surface of the inner cavity to the bottom surface of the lifting plate contacting the bottom surface of the inner cavity, i.e., the pre-pressing process), the circuit board is subjected to pressure from the weight of the pressure block itself. At this time, the drive motor is activated, and the drive motor drives the eccentric block to rotate. The eccentric block causes the platform, circuit board, and pressure block to oscillate periodically. After the bottom surface of the lifting plate contacts the inner bottom surface of the inner cavity, the drive motor is turned off, and the telescopic cylinder applies pressure to the pressure block through the lifting plate, thereby applying the pressure required for pressing the circuit board to complete the pressing. During the pre-pressing process, the pre-pressing pressure plays a role in pre-positioning and initial venting of the circuit board. While maintaining the pre-pressing pressure, the periodic oscillation or vibration lasts for a certain period of time (e.g., a few seconds to tens of seconds), which can cause micro-flow of the internal resin. The resin is more likely to fill the tiny gaps between layers in a low viscosity state, reducing voids and bubbles, thereby improving the uniformity of the bonding medium of the multilayer circuit board. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and purposes that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0019] Figure 1 This is a schematic diagram of the pressing device for multilayer circuit board processing according to the present invention;

[0020] Figure 2 This is a schematic diagram of the internal structure of the laminating device for multilayer circuit board processing according to this utility model;

[0021] Figure 3 Left view of a partially pressed component;

[0022] Figure 4 for Figure 3 Cross-sectional view of AA in the middle;

[0023] Figure 5 This is a structural diagram of the workbench assembly;

[0024] Figure 6 An exploded view of the workbench assembly;

[0025] Figure 7 This is a bottom view of the platform;

[0026] Figure 8 This is a cross-sectional view of the platform;

[0027] Figure 9 for Figure 8 Enlarged view of section A in the middle.

[0028] Illustrations: 10. Machine base; 11. Support frame; 12. Slide rail; 13. Slider; 14. Protective cover; 15. Switch button; 20. Pressing assembly; 21. Telescopic cylinder; 22. Pressing block; 23. Inner cavity; 24. Second through hole; 25. Lifting plate; 30. Workbench assembly; 31. Base; 32. Table; 33. Drive motor; 34. Eccentric block; 35. Eccentric groove; 36. Protrusion; 37. Slide groove; 38. Mounting groove; 40. Fixing assembly; 41. Baffle; 42. Spring; 43. Connecting plate. Detailed Implementation

[0029] To make the invention's objectives, features, and advantages more apparent and understandable, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0030] In the description of this utility model, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component centrally located at the same time.

[0031] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0032] Reference Figures 1 to 9This utility model provides a pressing device for processing multilayer circuit boards, including a machine base 10, a pressing assembly 20, and a worktable assembly 30. A support frame 11 is provided on the machine base 10, including a support column and a support plate, with a first through hole on the support plate. The pressing assembly 20 includes a telescopic cylinder 21 and a pressing block 22 disposed on the support frame 11, with the telescopic rod of the telescopic cylinder 21 passing through the first through hole. The pressing block 22 has an inner cavity 23, which is cubic in shape; a second through hole 24 communicating with the inner cavity 23 is provided on the pressing block 22, and the telescopic end of the telescopic cylinder 21 passes through the second through hole 24 and extends into the inner cavity 23; a lifting plate 25 is provided on the telescopic end of the telescopic cylinder 21. The cross-sectional area of ​​the lifting plate 25 in the XY plane is larger than that of the second through hole in the XY plane. This means the lifting plate 25 cannot pass through the second through hole to separate from the pressure block 22. Therefore, when the pressure block 22 separates from the worktable assembly 30, the lifting plate 25 can lift the pressure block 22. When the pressure block 22 contacts the worktable assembly 30 (or a circuit board placed on the worktable assembly 30), the lifting plate 25 can apply pressure to the pressure block 22. It should be noted that the distance between the top and bottom surfaces of the inner cavity 23 is greater than the thickness of the lifting plate 25.

[0033] The worktable assembly 30 includes a base 31 mounted on the machine tool 10 and a table 32 mounted on the base 31. A drive motor 33 is embedded in the base 31, and an eccentric block 34 is mounted on the output shaft of the drive motor 33. The bottom surface of the table 32 has an eccentric groove 35 corresponding to the eccentric block 34. When the drive motor 33 is started, it drives the eccentric block 34 to rotate, causing the sidewall of the eccentric block 34 to press against the groove wall of the eccentric groove 35, thus causing the table 32 to oscillate periodically.

[0034] In the initial state, the top surface of the lifting plate 25 contacts the inner top surface of the inner cavity 23 and lifts the pressure block 22. When pressing the multilayer circuit board, the circuit board is placed on the table plate 32 of the workbench assembly 30, and the telescopic cylinder 21 is activated. The telescopic cylinder 21 drives the lifting plate 25 to descend, thereby driving the pressure block 22 to descend. During the process from the contact between the pressure block 22 and the circuit board to the pressure exerted by the lifting plate 25 on the pressure block 22 (from the separation of the top surface of the lifting plate 25 from the inner top surface of the inner cavity 23 to the contact between the bottom surface of the lifting plate 25 and the bottom surface of the inner cavity 23, i.e., the pre-pressing process), the circuit board is subjected to pressure from the weight of the pressure block 22 itself. At this time, the drive motor 33 is started, and the drive motor 33 drives the eccentric block 34 to rotate. The eccentric block 34 drives the platform 32, the circuit board and the pressure block 22 to swing periodically. After the bottom surface of the lifting plate 25 contacts the inner bottom surface of the inner cavity 23, the drive motor 33 is turned off, and the telescopic cylinder 21 applies pressure to the pressure block 22 through the lifting plate 25, thereby applying the pressure required for pressing the circuit board to complete the pressing. During the pre-pressing process, the pre-pressing pressure plays a role in pre-positioning and initial venting of the circuit board. While maintaining the pre-pressing pressure, the periodic oscillation or vibration lasts for a certain period of time (e.g., a few seconds to tens of seconds), which can cause micro-flow of the internal resin. The resin is more likely to fill the tiny gaps between layers in a low viscosity state, reducing voids and bubbles, thereby improving the uniformity of the bonding medium of the multilayer circuit board.

[0035] It should be noted that a first pressure sensor (not shown) is provided on the top surface of the lifting plate 25, and a second pressure sensor (not shown) is provided on the bottom surface of the lifting plate 25. The force between the lifting plate 25 and the pressure block 22 is detected by the first and second pressure sensors. When the pressure detected by the first pressure sensor drops to 0, the drive motor 33 is started; when the pressure detected by the second pressure sensor is greater than 0, the drive motor 33 is turned off. That is, the drive motor 33 is only started when the pressure detected by both the first and second pressure sensors is 0. The detection principle and control method of the first and second pressure sensors are well known to those skilled in the art, and will not be described in detail in this application.

[0036] Furthermore, the base 31 is provided with a protrusion 36, and the bottom surface of the platform 32 is provided with a groove 37 corresponding to the protrusion 36. The groove 37 can slide based on the protrusion 36, that is, the platform 32 can slide relative to the base 31. It should be noted that the length direction of the groove 37 is the X-axis direction, that is, when the drive motor 33 is working, the drive motor 33 can drive the platform 32 to swing in the X-axis direction through the eccentric block 34.

[0037] Furthermore, the platform 32 is provided with an elastic fixing component 40, which is used to fix the circuit board to be pressed. Specifically, the platform 32 is provided with a mounting groove 38, the length direction of the mounting groove 38 is the Y-axis direction, and the bottom of the mounting groove 38 is provided with a spring groove (not shown in the figure). The fixing component 40 includes a baffle 41 disposed in the mounting groove 38 and a spring 42 installed in the spring groove. One end of the spring 42 is connected to the bottom of the spring groove, and the other end is connected to the bottom surface of the baffle 41. The top surface of the baffle 41 protrudes from the platform surface of the platform 32. It should be noted that there are two sets of fixing components 40 to clamp and fix the circuit board. With this technical solution, the multilayer circuit board to be pressed is placed between two baffles 41, which can fix the circuit board in the X-axis direction. At the same time, when the pressure block 22 presses down on the circuit board, the top surface of the baffle 41 is subjected to the pressure of the pressure block 22, and the spring 42 is compressed. At this time, the top surface of the baffle 41 and the top surface of the circuit board are on the same plane, that is, the circuit board is fixed in the X-axis direction without affecting the pressure block 22 applying pressure to the circuit board.

[0038] It should be noted that the length of the through hole in the X-axis direction is greater than the diameter of the telescopic rod of the telescopic cylinder 21, and the length of the inner cavity 23 in the X-axis direction is greater than the length of the lifting plate 25 in the X-axis direction. That is, during the pre-pressing process, when the drive motor 33 drives the platform 32 and the circuit board to swing in the X-axis direction through the eccentric block 34, since the pressure block 22 exerts pressure on the circuit board, and there is no force between the lifting plate 25 and the pressure block 22, the pressure block 22 swings synchronously with the platform 32 and the circuit board. In addition, since the baffle 41 fixes the circuit board in the X-axis direction, it prevents the inertia of the pressure block 22 from causing misalignment between the layers of the multilayer circuit board during swinging.

[0039] Furthermore, the mounting groove 38 is inverted "T" shape, and a connecting plate 43 is provided on the bottom surface of the baffle 41. One end of the spring 42 is connected to the bottom surface of the baffle 41 through the connecting plate 43. When the baffle 41 is not under the pressure of the pressure block 22, the elastic force of the spring 42 causes the top surface of the connecting plate 43 to fit against the stepped inner top wall of the mounting groove 38. It should be noted that the spring 42 is always in a compressed state, that is, the top surface of the connecting plate 43 fits against the stepped inner top wall of the mounting groove 38, thereby making the baffle 41 relatively stably protrude from the table surface of the platform 32, avoiding the baffle 41 from shaking when placing the circuit board, and making it convenient for the staff to place the circuit board to be pressed between the two baffles 41.

[0040] Furthermore, the machine tool 10 is equipped with a slide rail 12, and a slider 13 is mounted on the slide rail 12. The worktable assembly 30 is mounted on the slider 13. The worktable assembly 30 also includes a handle located on one side of the base 31. The machine tool 10 is also equipped with a protective cover 14. When it is necessary to press the circuit board, the operator pulls the worktable assembly 30 out of the protective cover 14 using the handle. After the circuit board is placed, the operator pushes the worktable assembly 30 back into the protective cover 14 using the handle. Optionally, a switch button 15 is provided on one side of the machine tool 10.

[0041] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A laminating device for processing multilayer circuit boards, characterized in that, include: Machine base (10), on which a support frame (11) is provided; The pressing assembly (20) includes a telescopic cylinder (21) and a pressing block (22) disposed on the support frame (11). The pressing block (22) has an inner cavity (23). The pressing block (22) is provided with a second through hole (24) communicating with the inner cavity (23). The telescopic end of the telescopic cylinder (21) passes through the second through hole (24) and extends into the inner cavity (23). The telescopic end of the telescopic cylinder (21) is provided with a lifting plate (25). The workbench assembly (30) includes a base (31) disposed on the machine base (10) and a table plate (32) disposed on the base (31). The base (31) is embedded with a drive motor (33). The output shaft of the drive motor (33) is provided with an eccentric block (34). The bottom surface of the table plate (32) is provided with an eccentric groove (35) corresponding to the eccentric block (34).

2. The laminating apparatus for multilayer circuit board processing according to claim 1, characterized in that, The base (31) is provided with a protrusion (36), and the bottom surface of the platform (32) is provided with a groove (37) corresponding to the protrusion (36).

3. The laminating apparatus for multilayer circuit board processing according to claim 1, characterized in that, The platform (32) is provided with an elastic fixing component (40); The platform (32) is provided with an installation groove (38), and the bottom of the installation groove (38) is provided with a spring groove; the fixing component (40) includes a baffle (41) disposed in the installation groove (38) and a spring (42) installed in the spring groove. One end of the spring (42) is connected to the bottom of the spring groove, and the other end is connected to the bottom surface of the baffle (41). The top surface of the baffle (41) protrudes from the platform (32).

4. The laminating apparatus for multilayer circuit board processing according to claim 3, characterized in that, The mounting groove (38) is inverted "T" shape, and a connecting plate (43) is provided on the bottom surface of the baffle (41). One end of the spring (42) is connected to the bottom surface of the baffle (41) through the connecting plate (43).

5. The laminating apparatus for multilayer circuit board processing according to claim 1, characterized in that, The machine base (10) is provided with a slide rail (12), and a slider (13) is provided on the slide rail (12). The workbench assembly (30) is provided on the slider (13).

6. The laminating apparatus for multilayer circuit board processing according to claim 1, characterized in that, The workbench assembly (30) also includes a handle located on one side of the base (31).

7. The laminating apparatus for multilayer circuit board processing according to claim 1, characterized in that, The machine base (10) is also equipped with a protective cover (14), and a switch button (15) is provided on one side of the machine base (10).

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