Anti-interference matching equipment and power supply module using same

Abstract

The utility model provides anti-interference matching equipment which comprises a shell, an input port and an output port, at least two radio frequency capacitors and at least one radio frequency inductor are arranged in the shell, at least one main fan and at least one auxiliary fan are arranged on one side of the shell, and a main air channel and an auxiliary air channel are formed in the shell; a top heat dissipation hole is formed in the top surface of the shell; a side heat dissipation hole is formed in one side, opposite to the main fan, of the shell; the main fan, the side heat dissipation holes and the main heat dissipation holes jointly form a main air channel in the shell, and the main air channel sequentially passes through the radio frequency inductor and the output port. The utility model also discloses a power supply module using the equipment. Through the scheme provided by the invention, the heat dissipation function of the matched equipment can be effectively realized.

Description

Technical Field

[0001] This utility model relates to the field of plasma applications, and in particular to an anti-interference matching device and a power module for using the device. Background Technology

[0002] In a typical radio frequency discharge plasma generation system, the output impedance of the radio frequency power supply is generally 50 ohms, while the equivalent impedance of the plasma reaction chamber is usually not 50 ohms, and it also varies under different process conditions. Transmission line theory indicates that when the output impedance of the radio frequency power supply differs from the load impedance (i.e., the equivalent impedance of the plasma reaction chamber), the output power of the radio frequency power supply will be lost, failing to reach maximum output efficiency, resulting in energy waste, damage to the radio frequency power supply itself, and even safety issues such as excessive local heat leading to fires. Furthermore, since the load impedance is related to the process conditions for plasma generation, an impedance matching device that automatically adjusts the load impedance is needed between the radio frequency power supply and the plasma reaction chamber when using an inductively coupled plasma source. This impedance matching device can adjust the actual value of adjustable components, such as adjustable capacitors, based on the actual impedance of the plasma reaction chamber under different process conditions, through built-in sensors and control systems, thereby ensuring the load impedance equals 50 ohms and achieving impedance matching to avoid the aforementioned problems.

[0003] 1. Matching units include high-voltage and low-voltage components. They are very sensitive to electromagnetic interference (EMI) during use. EMI can cause unstable operation of the equipment or even damage to the components, which is a significant limiting factor for the quality of matching unit equipment.

[0004] 2. With the development of technology and the improvement of integration level, matching devices need to complete the necessary heat dissipation on a small volume, which puts forward higher requirements for the heat dissipation efficiency of matching devices. It is necessary to achieve better heat dissipation effect within a limited space to adapt to the layout of this equipment system. Referring to the technical solution disclosed in CN217470562U, a matching device structure is disclosed. This structure divides the high and low voltage areas into partitions through a plate (38) to meet the requirements of electromagnetic interference resistance, and adopts an independent fan heat dissipation form to ensure the heat dissipation efficiency of the high voltage area. Utility Model Content

[0005] This application provides a matching device, including a housing, an input port, and an output port. The housing contains at least two RF capacitors and at least one RF inductor. At least one main fan and at least one auxiliary fan are provided on one side of the housing. A main air duct and an auxiliary air duct are formed inside the housing. A top heat dissipation hole is provided on the top surface of the housing, and a side heat dissipation hole is provided on the side of the housing opposite to the main fan. The main fan, the side heat dissipation hole, and the main heat dissipation hole together form a main air duct inside the housing, which passes through the RF inductor and the output port in sequence.

[0006] A fan is a powered machine that generates airflow. A fan can consist of rotating blades or blades, usually made of plastic or metal, that act on the air. In particular, the fan should be configured to generate airflow from the outside of the casing to the inside of the casing, and vice versa.

[0007] Ventilation vents are paths through which air can flow. Specifically, in this context, it means that air can flow from the inside of the casing to the outside, and vice versa. Ventilation vents can be covered with mesh or perforated panels to protect internal components from mechanical damage or breakage.

[0008] Arranging the main fan and at least one auxiliary fan on one side of the casing means that the two fans are arranged on a parallel plane, such as with their central axes parallel, or more specifically, on the same plane, such as with their structural planes on the same horizontal plane, so as to direct the airflow in one direction.

[0009] Secondly, this application provides an RF power module, including the aforementioned matching device. The power module further includes a power output port, which is connected to the input port of the matching device via an RF cable.

[0010] Through the above technical solutions, compared with the prior art, this utility model has the following beneficial effects: by arranging appropriate components and designing air ducts, it achieves a heat dissipation effect far exceeding that of similar matching equipment; and achieves a more efficient electromagnetic isolation effect.

[0011] Increasing the creepage distance successfully prevented the voltage from the output port from creeping onto the casing. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of any embodiment of this application.

[0013] Figure 2 This is a schematic diagram of the radio frequency component layout in any embodiment of this application.

[0014] Figure 3 This is a schematic diagram showing the position of the main fan in any embodiment of this application.

[0015] Figure 4This is a cross-sectional view of the first radio frequency capacitor layout in any embodiment of this application.

[0016] Figure 5 This is a circuit diagram of the radio frequency section of this application.

[0017] Figure 6 The thermal simulation results are for any embodiment of this application.

[0018] Figure 7 This is the second comparative thermal simulation result of this application.

[0019] Figure 8 This is the first comparative thermal simulation result of this application.

[0020] Figure 9 This is the third comparative thermal simulation result of this application.

[0021] Figure 10 This is a schematic diagram of the connection of the radio frequency power module according to any embodiment of this application. Detailed Implementation

[0022] Any embodiment of this application discloses a matching device applied in the field of plasma, used for impedance matching between a power supply and a plasma device.

[0023] like Figure 1 and Figure 2 As shown, in any embodiment of this application, this application discloses a matching device, including a housing 100, an output port 230 is provided at one end of the housing 100, and an input port 22 is provided on a side wall of the housing that is different from the output port 230.

[0024] like Figure 2 and Figure 3 As shown, in any embodiment of this application, two radio frequency (RF) capacitors are disposed inside the housing, both of which are variable capacitors, namely a first RF capacitor 200 and a second RF capacitor 201, and an RF inductor 210 is included. The output port 230 is installed on the side wall of the housing 1 away from the first RF capacitor 200 and the second RF capacitor 201. A bias bar 25 is installed on the side wall of the housing 100 opposite to the input port 22. In this design, the RF inductor 210 adopts a linear design, mainly for the purpose of matching the low inductance value required by the scheme. Other design forms can be selected in different schemes, for example, a spiral coil can be selected for high inductance value requirements.

[0025] like Figure 2 and Figure 3As shown, in any embodiment of this application, the tails of the first RF capacitor 200 and the second RF capacitor 201 are electrically connected to one end of the RF inductor 210. The central axis of the RF inductor 210 is perpendicular to the central axis of the first RF capacitor 200. The end of the RF inductor 210 away from the first RF capacitor 200 is electrically connected to the output port 230 via a conductive connector.

[0026] Through the above scheme, the components mainly used to achieve impedance matching in any embodiment of this application are a first RF capacitor 200, a second RF capacitor 201, and an RF inductor 210. Both the first RF capacitor 200 and the second RF capacitor 201 are variable capacitors with controllable capacitance values ​​within a certain range. For the purpose of covering the matching range, their actual variable capacitance ranges are not the same. The first RF capacitor 200 controls the imaginary part of the impedance, while the second RF capacitor 201 controls the real part of the impedance. Only by combining the two can the real-time impedance value of the matching device be adjusted to complete impedance matching. This design scheme selects only two variable capacitors as components for matching path control, mainly for the following reasons: in matching path control, two variable capacitors are sufficient; more variable capacitors would only complicate the control algorithm and increase the overall size of the matching device. The RF inductor 210 is a basic component inside the matching device, participating in the impedance matching process, and its inductance value is fixed.

[0027] like Figure 3 and Figure 4 As shown, in any embodiment of this application, a main fan 300 and an auxiliary fan 301 are provided on the side of the housing 100 near the first RF capacitor 200. The orthographic projection of the RF inductor 210 corresponding to the side of the main fan 300 partially overlaps with that of the main fan 300, and the orthographic projection of the first RF capacitor 200 corresponding to the side of the auxiliary fan 301 partially overlaps with that of the auxiliary fan 301.

[0028] like Figure 3 and Figure 4 As shown, in any embodiment of this application, two side heat dissipation holes are respectively provided on the side of the housing opposite to the main fan 300 and the auxiliary fan 301 at the positions of the main fan 300 and the auxiliary fan 301. These are a main side heat dissipation hole 310 at the position of the main fan 300 and an auxiliary side heat dissipation hole 320 at the position of the auxiliary fan 301. Through the above scheme, this application uses the main fan 300 and the main side heat dissipation hole 310 to form a main airflow channel, mainly for heat dissipation of the RF inductor 210 and its surrounding components. The auxiliary fan 301 and the auxiliary side heat dissipation hole 320 form an auxiliary airflow channel for heat dissipation of the first RF capacitor 200 and the second RF capacitor 201 and their surrounding components.

[0029] The central axis of the first RF capacitor 200 is on the same horizontal plane as the central axis of the auxiliary fan 301, which further enhances the heat dissipation capability of the auxiliary fan 301 for the first RF capacitor 200.

[0030] like Figure 3 and Figure 4 As shown, the top plate 103 of the housing has top heat dissipation holes 330 at the positions corresponding to the first RF capacitor 200, the second RF capacitor 201, and the RF inductor 210. The top heat dissipation holes 330 further improve the airflow capacity inside the housing 100, preventing vortices from forming at the top of the housing and hindering heat dissipation. Combined with... Figure 1-3 This feature can be seen more clearly. Simulation tests show that the above solution has better heat dissipation performance compared to traditional layout solutions or single-fan cooling solutions. The comparison results are as follows:

[0031]

[0032] Horizontal comparison: With the internal components arranged as described in any embodiment of this application, the dual-fan cooling system can reduce the maximum temperature of capacitor 200 to 100°C, while the single-fan cooling system can only reduce it to 134°C. The dual-fan cooling effect is more significant compared to the single-fan cooling system.

[0033] In a longitudinal comparison: On the one hand, under the same dual-fan operating conditions, the highest temperature of the capacitor is 10°C higher after the component positions are changed compared to the component arrangement according to the embodiments of this application. This indicates that when using a dual-fan cooling system as the basis for heat dissipation, the sequential arrangement of components is the better position. On the other hand, under the same single-fan operating conditions, the highest temperatures of the capacitor are closer after the component positions are changed compared to the sequential arrangement of components. However, the highest temperature of the inductor is higher after the position is changed compared to the sequential arrangement. This indicates that when using a single-fan cooling system as the basis for heat dissipation, the sequential arrangement of components is the better position.

[0034] Based on the results of the above horizontal and vertical comparisons, it can be concluded that the dual-fan design with components arranged in sequence is the best design among the four options.

[0035] like Figure 2 and Figure 3 As shown, a partition 110 is provided inside the housing 100. The partition 110 is used to divide the housing space into a radio frequency space and a low voltage space. The low voltage space is used to accommodate low voltage components, and the radio frequency space is used to accommodate radio frequency circuit components, including the radio frequency capacitor and radio frequency inductor 210. By dividing the internal space of the housing 100 by the partition 110, the negative impact of electromagnetic interference on the components can be effectively avoided.

[0036] like Figure 2 and Figure 4As shown, a groove 231 is formed around the output port 230 on the outer surface of the housing 100. By setting the groove 231, the creepage distance can be increased, thereby further preventing the voltage from the output port from creeping onto the housing and improving the operational stability of the matched equipment. Furthermore, the housing 100 at the position corresponding to the output port 230 can be made of insulating material, and the groove can be set on the insulating material. The insulating material can avoid creepage problems under normal specifications. For applications with excessively high voltage, the combination of insulating material and groove can further solve the creepage problem.

[0037] like Figure 3 and Figure 4 As shown, the housing 100 includes a bottom plate 101, side plates 102, and a top plate 103. The bottom plate 101 is planar. The side plates 102 are composed of three planar plates sequentially connected at a 90-degree angle, partially surrounding the bottom plate 101. The output port 230 is located on one of the middle planar plates of the side plates 102. The top plate 103 is fixedly connected to the bottom plate 100 by a planar plate identical to the bottom plate and another planar plate at a 90-degree angle. The top plate 103 and the side plates 102 together surround the four sides of the bottom plate 101. The side plates 102 and the bottom plate 101 are fixedly connected; the top plate 103 can be detachably connected to both the side plates 102 and the bottom plate 101. Fixed connections can be made using bolts, welding, etc., while detachable connections can be made using bolts, snap-fit ​​connections, etc. Figure 3 This is to hide the state after the top plate 103 is hidden.

[0038] The detachable connection between the top plate 103, side plate 102, and bottom plate 101 allows for easy disassembly of the top plate 103 when maintenance or component replacement is required, thus improving convenience.

[0039] The radio frequency capacitors are a first radio frequency capacitor 200 and a second radio frequency capacitor, respectively.

[0040] This application also discloses a power module 400 using the matching device disclosed in any of the above embodiments. The input-to-output connection of the power module is as follows: the output port 401 of the power module 400 is connected to the input port 22 of the matching device 1 through an RF cable 402, and enters the end of the first RF capacitor 200 through a conductive connector. The end of the second RF capacitor 201 is grounded through a grounding inductor. The tails of the first RF capacitor 200 and the second RF capacitor 201 are connected to one end of the RF inductor 210 through a conductive connector. The other end of the RF inductor 210 is connected to the output port 23 through a conductive connector.

Claims

1. A matching device, comprising a housing, an input port, and an output port, wherein at least two radio frequency capacitors and at least one radio frequency inductor are disposed inside the housing, characterized in that, At least one main fan and at least one auxiliary fan are provided on one side of the housing, and a main air duct and an auxiliary air duct are formed inside the housing; The top surface of the housing has a top heat dissipation hole, and the side of the housing opposite to the main fan has a side heat dissipation hole; The main fan, the side heat dissipation holes, and the main heat dissipation holes together form a main air duct inside the housing, and the main air duct passes through the RF inductor and the output port in sequence.

2. The matching device according to claim 1, characterized in that, The housing is provided with a partition, which is used to divide the housing space into a radio frequency space and a low voltage space. The low voltage space is used to accommodate low voltage components, and the radio frequency space is used to accommodate radio frequency circuit components including the radio frequency capacitor and the radio frequency inductor.

3. The matching device according to claim 1, characterized in that, The central axis of the radio frequency capacitor and the central axis of the auxiliary fan are located in the same plane.

4. The matching device according to claim 3, characterized in that, At least one of the radio frequency capacitors has a projection of the auxiliary fan that at least partially overlaps with the auxiliary fan.

5. The matching device according to any one of claims 1-4, characterized in that, An auxiliary air duct is formed between the auxiliary fan and the side heat dissipation hole, and the auxiliary air duct passes through at least all of the radio frequency capacitors.

6. The matching device according to claim 5, characterized in that, The output port is located at one end of the housing, and a groove is formed around the output port on the outer surface of the housing.

7. The matching device according to claim 5, characterized in that, The housing includes a bottom plate, side plates and a top plate. The bottom plate is planar. The side plates are three planar plates that are sequentially fixedly connected at a 90-degree angle. The top plate is fixedly connected by a planar plate identical to the bottom plate and another planar plate at a 90-degree angle. The side plate and the bottom plate are fixedly connected; The top plate is detachably connected to the side plate and the bottom plate.

8. The matching device according to claim 5, characterized in that, The radio frequency capacitors are a first radio frequency capacitor and a second radio frequency capacitor, respectively. One end of the first RF capacitor is electrically connected to the input port, and the other end is electrically connected to the RF inductor; The second RF capacitor has one end electrically connected to the input port, and the other end electrically connected to a grounding inductor and grounded through the grounding inductor.

9. A radio frequency power supply module, comprising the matching device as described in any one of claims 1-8, characterized in that, The power module also includes a power output port, which is connected to the input port of the matching device via an RF cable.

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