Grinding machine for semiconductor material processing

Abstract

The utility model discloses a grinding machine for semiconductor material processing, which comprises a case, a driving mechanism arranged in the case, an open inclined plane arranged at the top of the case, a processing table obliquely arranged on the inclined plane, a circular groove arranged on the upper surface of the processing table, a grinding disc arranged in the circular groove, and a rotating shaft arranged at the center of the bottom of the grinding disc. The rotating shaft extends into the case and is in transmission connection with the driving mechanism; a hemispherical transparent protective cover is arranged above the grinding disc, a circle of turned-over edge is arranged on the outer ring of the protective cover, a circle of annular groove is formed in the side wall of the circular groove, the turned-over edge is embedded into the annular groove, the protective cover can rotate around the grinding disc, and an operation hole is formed in the protective cover; a cooling pipe is arranged in the protective cover, the rear end of the cooling pipe sequentially penetrates through the machining table and the machine box and then is provided with a connector, and the connector is externally connected with a water pump and a water source. According to the utility model, the semiconductor workpiece is cooled by cooling water through the cooling pipe, so that the semiconductor workpiece is prevented from cracking due to overhigh temperature during grinding.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and specifically to a grinding machine for semiconductor material processing. Background Technology

[0002] Semiconductor materials are a class of electronic materials with unique semiconductor properties. Their conductivity lies between that of conductors and insulators, allowing them to change their conductivity according to external conditions such as voltage and light. Therefore, semiconductor materials are widely used in the fabrication of various semiconductor devices and integrated circuits, becoming one of the core foundational materials of modern electronic information technology. In the processing of semiconductor materials, precision grinding is typically required to ensure surface accuracy and flatness. However, existing grinding equipment has some shortcomings in practical operation. For example, during the grinding of semiconductor workpieces, the heat generated by friction cannot be dissipated in time, and most grinding machines are not equipped with effective cooling systems, leading to a rapid increase in the surface temperature of the semiconductor workpiece. When the temperature is too high, the semiconductor material may crack or even break due to thermal stress, thus affecting the product yield and final quality. Utility Model Content

[0003] The purpose of this invention is to address the shortcomings and deficiencies of the existing technology by providing a grinding machine for semiconductor material processing.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a grinding machine for semiconductor material processing, including a chassis, the innovation of which lies in: a drive mechanism is provided inside the chassis; the top of the chassis is an open sloping surface, and a processing table is inclinedly arranged on the sloping surface; a circular groove is formed on the upper surface of the processing table, and a grinding disc is arranged in the circular groove; a rotating shaft is set at the bottom center of the grinding disc, and the rotating shaft extends into the chassis and is connected to the drive mechanism; a hemispherical transparent protective cover is provided above the grinding disc, and a flange is provided around the outer ring of the protective cover; an annular groove is formed on the side wall of the circular groove, and the flange is embedded in the annular groove; the protective cover can rotate around the grinding disc; an operating hole is provided on the protective cover; a cooling pipe is provided inside the protective cover, and an interface is provided at the rear end of the cooling pipe after passing through the processing table and the chassis; the interface is connected to a water pump and a water source.

[0005] Furthermore, the drive mechanism includes a motor, a drive gear, and a driven gear. The drive gear is mounted on the output shaft of the motor, and the driven gear is sleeved on the rotating shaft. The driven gear and the drive gear are meshed and connected. An inclined base is provided inside the housing, and the motor is mounted on the inclined base.

[0006] Furthermore, a drain outlet is provided at the lower part of the circular groove, and a liquid collection tank is provided below the drain outlet.

[0007] Furthermore, a filter screen is installed inside the liquid collection tank.

[0008] Furthermore, the cooling pipe is a corrugated pipe.

[0009] Furthermore, a tee is provided on the cooling pipe and connected to a flushing pipe, which is located in the gap between the grinding disc and the circular groove.

[0010] The beneficial effects of this utility model after adopting the above structure are as follows:

[0011] This invention uses cooling pipes to cool the semiconductor workpiece with cooling water, preventing the workpiece from cracking due to excessive temperature during grinding. The protective cover prevents cooling water or waste from splashing out, and it can also rotate to different angles or positions for grinding. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of this utility model.

[0013] Explanation of reference numerals in the attached figures:

[0014] 1. Chassis; 2. Drive mechanism; 21. Motor; 22. Drive gear; 23. Driven gear; 24. Inclined base; 3. Machining table; 4. Circular groove; 5. Grinding disc; 6. Rotary shaft; 7. Protective cover; 8. Flanged edge; 9. Annular groove; 10. Operating hole; 11. Cooling pipe; 12. Interface; 13. Drain outlet; 14. Liquid collection tank; 15. Filter screen; 16. Flushing pipe. Detailed Implementation

[0015] The present invention will be further described below with reference to the accompanying drawings.

[0016] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only for explaining the present utility model and are not intended to limit the present utility model.

[0017] See Figure 1A grinding machine for semiconductor material processing includes a chassis 1, a drive mechanism 2 inside the chassis 1, an open sloping top of the chassis 1, and a processing table 3 inclined on the sloping surface. A circular groove 4 is formed on the upper surface of the processing table 3, and a grinding disc 5 is placed inside the circular groove 4. A rotating shaft 6 is set at the bottom center of the grinding disc 5, and the rotating shaft 6 extends into the chassis 1 and is connected to the drive mechanism 2. A hemispherical transparent protective cover 7 is set above the grinding disc 5. A flange 8 is formed around the outer ring of the protective cover 7. An annular groove 9 is formed on the side wall of the circular groove 4, and the flange 8 is embedded in the annular groove 9. The protective cover 7 can rotate around the grinding disc 5. An operation hole 10 is formed on the protective cover 7. A cooling pipe 11 is set inside the protective cover 7. The rear end of the cooling pipe 11 passes through the processing table and the chassis in sequence and is set with an interface 12. The interface is connected to a water pump and a water source. Specifically, the semiconductor material is held in hand, passed through the operating hole 10, and placed on the rotating grinding disc 5 for grinding. A water pump delivers water to the cooling pipe 11, and the cold water sprayed during grinding cools the semiconductor material, preventing it from cracking due to excessive temperature. In addition, the cold water cleans the semiconductor workpiece during grinding, making it easier for workers to observe whether the workpiece has been ground sufficiently. During grinding, the protective cover 7 can rotate as the grinding position and direction are adjusted, thereby improving the practicality and flexibility of grinding. Preferably, there is a pair of operating holes 10, which can be operated by both hands in a coordinated manner. The drive mechanism 2 drives the grinding disc 5 to rotate through the rotating shaft 6. The inclined processing table 3 is more conducive to the collection of wastewater.

[0018] In this embodiment, the drive mechanism 2 includes a motor 21, a drive gear 22, and a driven gear 23. The drive gear 22 is mounted on the output shaft of the motor 21, and the driven gear 23 is sleeved on the rotating shaft 6. The driven gear 23 and the drive gear 22 are meshed and connected for transmission. An inclined base 24 is provided inside the housing 1, and the motor 21 is mounted on the inclined base 24. The inclined base 24 allows the motor 21 to be installed at an angle, matching the inclined processing table 3. When the motor 21 is started, it drives the rotating shaft 6 to rotate through the drive gear 22 and the driven gear 23, which in turn drives the grinding disc 5 to rotate, thus grinding the semiconductor material.

[0019] In this embodiment, a drain outlet 13 is provided at the lower part of the circular groove 4, and a liquid collection tank 14 is provided below the drain outlet 13. The drain outlet 13 discharges the generated waste liquid and waste materials in a unified manner, and the liquid collection tank 14 recycles and reuses them.

[0020] In this embodiment, a filter screen 15 is installed inside the liquid collection tank 14. The filter screen 15 is used to filter out waste materials in the wastewater and recycle the waste materials.

[0021] In this embodiment, the cooling pipe 11 is a corrugated pipe, which is easy to bend and extend, thereby facilitating the water cooling of the semiconductor material.

[0022] In this embodiment, a T-junction is provided on the cooling pipe 11, and a flushing pipe 16 is connected to it. The flushing pipe 16 is located in the gap between the grinding disc 5 and the circular groove 4. The flushing pipe 16 is used to flush away waste material in the gap between the grinding disc 5 and the circular groove 4, preventing it from accumulating in the gap.

[0023] The above description is only used to illustrate the technical solution of this utility model and is not intended to limit it. Any other modifications or equivalent substitutions made by those skilled in the art to the technical solution of this utility model, as long as they do not depart from the spirit and scope of the technical solution of this utility model, should be covered within the scope of the claims of this utility model.

Claims

1. A polishing machine for processing a semiconductor material, comprising a machine housing, characterized in that: The chassis houses a drive mechanism. The top of the chassis is an open, sloping surface with a machining table inclined on it. A circular groove is formed on the upper surface of the machining table, and a grinding disc is placed within this groove. A rotating shaft is located at the center of the bottom of the grinding disc, extending into the chassis and connected to the drive mechanism. A hemispherical transparent protective cover is positioned above the grinding disc, with a flanged outer ring. An annular groove is formed on the sidewall of the circular groove, into which the flanged edge is embedded. The protective cover can rotate around the grinding disc. An operating hole is provided on the protective cover. A cooling pipe is installed inside the protective cover, with its rear end passing through the machining table and chassis, and an interface connected to a water pump and water source.

2. The semiconductor material processing grinder of claim 1 wherein: The drive mechanism includes a motor, a drive gear, and a driven gear. The drive gear is mounted on the output shaft of the motor, and the driven gear is sleeved on the rotating shaft. The driven gear and the drive gear are meshed and connected. An inclined base is provided inside the housing, and the motor is mounted on the inclined base.

3. The semiconductor material processing grinder of claim 1 wherein: A drain outlet is provided at the bottom of the circular groove, and a liquid collection tank is provided below the drain outlet.

4. The semiconductor material processing grinder of claim 3 wherein: The liquid collection tank is equipped with a filter screen.

5. The semiconductor material processing grinder of claim 1 wherein: The cooling pipe is a corrugated pipe.

6. The semiconductor material processing grinder of claim 1 wherein: The cooling pipe is equipped with a tee and connected to a flushing pipe, which is located in the gap between the grinding disc and the circular groove.

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