Plate surface treatment device with multi-station synchronous polishing function

Abstract

The utility model discloses a multi-station synchronous polishing plate surface treatment device, which relates to the technical field of plate polishing and comprises a feeding mechanism, a placing mechanism is mounted on the upper portion of the feeding mechanism, a plurality of adjusting mechanisms are fixedly connected to the upper portion of the feeding mechanism, polishing mechanisms are mounted in the adjusting mechanisms respectively, and each adjusting mechanism comprises a mounting frame. A second servo motor is fixedly connected to the outer side of the mounting frame. According to the plate polishing device, rotation of the second lead screw is accurately controlled, the second lead screw is driven to move up and down along the second lead screw, and then the second connecting frame and the polishing mechanism are driven to achieve height adjustment, so that the polishing mechanism can dynamically adjust the vertical distance between the polishing wheel and the surface of a plate according to the thickness, material hardness and other characteristics of the plate; and the problem of over-polishing or insufficient polishing caused by the fixed height is avoided.

Description

Technical Field

[0001] This utility model relates to the field of plate polishing technology, and in particular to a plate surface treatment device for multi-station synchronous polishing. Background Technology

[0002] Multiple polishing stations are set up in the board production line. The boards are moved at a uniform speed by transmission devices such as conveyor belts and servo systems. The polishing equipment at each station performs collaborative processing on the board surface synchronously according to preset process parameters. Multiple processes such as rough polishing and fine polishing can be completed at the same time, or different areas can be treated. By setting up multiple polishing stations in the production line, the boards are processed by multiple sets of equipment at the same time during the movement. The original single-station sequential operation is transformed into multi-process parallel processing, which significantly shortens the processing time and meets the efficiency requirements of large-scale mass production.

[0003] However, in existing technologies, multi-station synchronous polishing devices generally adopt a fixed station spacing mode in their mechanical structure design. While this standardized design ensures the initial stability of the equipment, it significantly restricts the flexibility of the process and the space for intelligent upgrades. Different materials of plates have fundamentally different requirements for process gradients during polishing. High-hardness metal plates require greater pressure and coarse abrasive to remove surface defects or processing allowances during the rough polishing stage, resulting in deeper scratches and complex textures. Subsequent fine polishing processes require a longer working distance to ensure that fine abrasive fully covers the bottom of the scratches. On the other hand, soft plates such as aluminum alloys and copper have shallower scratches during rough polishing, and the station spacing required for fine polishing can be appropriately shortened to avoid over-grinding.

[0004] However, the fixed station spacing means that the mechanical distance between the roughing and fine polishing stations cannot be dynamically adjusted according to the material properties. When processing hard materials, the fine polishing station often leaves shallow scratches or uneven roughness due to insufficient range of action, affecting surface accuracy. When processing soft materials, the excessive spacing and polishing time may cause over-polishing of the surface, resulting in thickness deviation or abnormal gloss. Utility Model Content

[0005] The purpose of this invention is to solve the problems existing in the prior art by proposing a multi-station synchronous polishing plate surface treatment device.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a multi-station synchronous polishing plate surface treatment device, including a feeding mechanism, a placement mechanism installed on the upper part of the feeding mechanism, and multiple adjustment mechanisms fixedly connected to the upper part of the feeding mechanism. Each of the multiple adjustment mechanisms has a polishing mechanism installed inside. The adjustment mechanism includes a mounting frame, a second servo motor fixedly connected to the outside of the mounting frame, and a first connecting frame fixedly connected to the outside of the mounting frame. The first connecting frame is located below the second servo motor. A second lead screw is fixedly connected to the output end of the second servo motor. The second lead screw is rotatably connected to the first connecting frame, and a second thread block is threadedly connected to the surface of the second lead screw. The second connecting frame is fixedly connected to the surface of the second thread block. The polishing mechanism is fixedly connected to the bottom of the second connecting frame.

[0007] Preferably, a limiting guide rail is fixedly connected to the side of the first connecting frame, and a limiting roller is rotatably connected to the side of the second wire block, with the limiting roller fitting against the side of the limiting guide rail.

[0008] Preferably, the feeding mechanism includes a fixed frame, a first servo motor is fixedly connected to the upper part of the fixed frame, a first lead screw is fixedly connected to the output end of the first servo motor, the first lead screw is rotatably connected to the fixed frame, and a first lead block is threadedly connected to the surface of the first lead screw, and the upper part of the first lead block is fixedly connected to the placement mechanism.

[0009] Preferably, a slide rail is fixedly connected to the upper part of the fixed frame, and a slider is slidably connected to the upper part of the slide rail. The slider is fixedly connected to the bottom of the placement mechanism.

[0010] Preferably, the placement mechanism includes a placement rack, and a clamping component is mounted on the upper part of the placement rack.

[0011] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0012] 1. In this utility model, by precisely controlling the rotation of the No. 2 lead screw, the No. 2 lead block is driven to move up and down along the No. 2 lead screw, thereby driving the No. 2 connecting frame and polishing mechanism to achieve height adjustment. This design enables the polishing mechanism to dynamically adjust the vertical distance between the polishing wheel and the surface of the board according to the characteristics of the board thickness, material hardness and other characteristics, avoiding the problem of over-polishing or under-polishing caused by a fixed height.

[0013] 2. In this utility model, during the movement of the second wire block, the limiting roller rolls along the limiting guide rail. Through the precise cooperation between the two, the movement trajectory of the second wire block is rigidly constrained, effectively eliminating the radial sway that may be generated during the screw drive process, ensuring that the polishing mechanism maintains a vertical posture during the lifting process, avoiding uneven polishing pressure caused by tilting, and improving the surface consistency when polishing complex materials. Attached Figure Description

[0014] Figure 1A first three-dimensional structural schematic diagram of a multi-station synchronous polishing plate surface treatment device is provided for this utility model.

[0015] Figure 2 This utility model presents a second three-dimensional structural diagram of a multi-station synchronous polishing plate surface treatment device;

[0016] Figure 3 A cross-sectional three-dimensional structural diagram of the mounting frame in a multi-station synchronous polishing plate surface treatment device is provided for this utility model.

[0017] Figure 4 A three-dimensional structural diagram of the adjustment mechanism in a multi-station synchronous polishing plate surface treatment device is provided for this utility model.

[0018] Figure 5 This invention presents a three-dimensional structural diagram of the feeding mechanism in a multi-station synchronous polishing plate surface treatment device.

[0019] Legend: 1. Feeding mechanism; 11. Fixing frame; 12. Servo motor No. 1; 13. Lead screw No. 1; 14. Lead block No. 1; 15. Slide rail; 16. Slider; 2. Placement mechanism; 21. Placement frame; 22. Clamping assembly; 3. Adjustment mechanism; 31. Mounting frame; 32. Servo motor No. 2; 33. Connecting frame No. 1; 34. Lead screw No. 2; 35. Lead block No. 2; 36. Connecting frame No. 2; 37. Limiting guide rail; 38. Limiting roller; 4. Polishing mechanism. Detailed Implementation

[0020] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0021] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0022] Example 1: As Figures 1-5As shown, this utility model provides a multi-station synchronous polishing surface treatment device for sheet metal, including a feeding mechanism 1, a placement mechanism 2 mounted on the upper part of the feeding mechanism 1, and multiple adjustment mechanisms 3 fixedly connected to the upper part of the feeding mechanism 1. Polishing mechanisms 4 are respectively installed inside the multiple adjustment mechanisms 3. Each adjustment mechanism 3 includes a mounting frame 31, a second servo motor 32 fixedly connected to the outside of the mounting frame 31, and a first connecting frame 33 fixedly connected to the outside of the mounting frame 31. The first connecting frame 33 is located at the second servo motor 32. Below 2, the output end of the second servo motor 32 is fixedly connected to the second lead screw 34. The second lead screw 34 is rotatably connected to the first connecting frame 33, and the surface of the second lead screw 34 is threadedly connected to the second lead block 35. The surface of the second lead block 35 is fixedly connected to the second connecting frame 36. The polishing mechanism 4 is fixedly connected to the bottom of the second connecting frame 36. The side of the first connecting frame 33 is fixedly connected to the limit guide rail 37. The side of the second lead block 35 is rotatably connected to the limit roller 38. The limit roller 38 is in contact with the side of the limit guide rail 37.

[0023] The specific settings and functions of this embodiment are described in detail below. During the polishing process of the polishing mechanism 4 polishing different plates, the second servo motor 32 drives the second lead screw 34 to rotate, causing the second lead block 35 to move up and down along the second lead screw 34, thereby driving the second connecting frame 36 to move up and down, and then driving the polishing mechanism 4 to adjust its height. During the up and down movement of the second lead block 35, the limiting roller 38 rolls along the limiting guide rail 37 to limit the movement of the second lead block 35, thereby improving the stability of the polishing mechanism 4 during the moving operation.

[0024] The second servo motor 32 serves as the power source. By precisely controlling the rotation of the second lead screw 34, it drives the second lead block 35 to move up and down along the second lead screw 34, thereby driving the second connecting frame 36 and the polishing mechanism 4 to achieve height adjustment. This design allows the polishing mechanism 4 to dynamically adjust the vertical distance between the polishing wheel and the surface of the plate according to the characteristics of the plate thickness and material hardness. For example, for stainless steel plates with high hardness, the polishing pressure can be increased (by lowering the height of the polishing mechanism 4), while for soft aluminum alloy plates, the pressure can be reduced (by raising the height of the polishing mechanism 4), avoiding over-polishing or under-polishing problems caused by a fixed height.

[0025] During the movement of the second wire block 35, the limiting roller 38 rolls along the limiting guide rail 37. Through the precise cooperation of the two, the movement trajectory of the second wire block 35 is rigidly constrained, effectively eliminating the radial sway that may be generated during the screw drive process, ensuring that the polishing mechanism 4 maintains a vertical posture during the lifting process, avoiding uneven polishing pressure caused by tilting, and improving the surface consistency when polishing complex materials.

[0026] Example 2: Figures 1-5As shown, the feeding mechanism 1 includes a fixed frame 11, a servo motor 12 is fixedly connected to the upper part of the fixed frame 11, a lead screw 13 is fixedly connected to the output end of the servo motor 12, the lead screw 13 is rotatably connected to the fixed frame 11, and a lead block 14 is threadedly connected to the surface of the lead screw 13. The upper part of the lead block 14 is fixedly connected to the placement mechanism 2. A slide rail 15 is fixedly connected to the upper part of the fixed frame 11, and a slider 16 is slidably connected to the upper part of the slide rail 15. The slider 16 is fixedly connected to the bottom of the placement mechanism 2. The placement mechanism 2 includes a placement frame 21, and a clamping assembly 22 is installed on the upper part of the placement frame 21.

[0027] The overall effect of this embodiment is that the plate is placed on the surface of the placement rack 21, and the side of the plate is clamped and fixed by the clamping component 22, thereby stably limiting the plate on the surface of the placement rack 21. Then, the first servo motor 12 drives the first lead screw 13 to rotate, which drives the first lead block 14 and the placement mechanism 2 fixed on its upper part to move. The slider 16 slides along the slide rail 15 to limit the movement of the placement mechanism 2, thereby improving the stability of the placement mechanism 2 when it moves, and thus improving the stability of the plate during the polishing process. The multiple polishing mechanisms 4 inside the multiple adjustment mechanisms 3 fixed on the upper part of the fixed frame 11 perform multi-station synchronous polishing on the plate.

[0028] The placement rack 21 serves as the basic support platform, and together with the clamping component 22, it clamps the side of the plate in both directions, keeping the plate stably positioned at the preset work station. This prevents surface scratches or uneven polishing caused by the plate shaking during polishing. The first servo motor 12 serves as the power source, driving the first lead screw 14 through the high-precision first lead screw 13, which in turn drives the placement mechanism 2 to move linearly along the slide rail 15. At the same time, the cooperation between the slider 16 and the slide rail 15 forms a rigid limit for the transmission process, ensuring that the action time of each work station is consistent during multi-station polishing, and avoiding surface roughness differences caused by uneven speed.

[0029] The method of use and working principle of this device: The plate is placed on the surface of the placement rack 21, and the side of the plate is clamped and fixed by the clamping assembly 22, thereby stably limiting the plate on the surface of the placement rack 21. Then, the first servo motor 12 drives the first lead screw 13 to rotate, which drives the first lead block 14 and the placement mechanism 2 fixed on its upper part to move. The plate is polished synchronously in multiple stations by the multiple adjustment mechanisms 3 fixed on the upper part of the fixed frame 11 and the multiple polishing mechanisms 4 inside.

[0030] During the polishing process of the polishing mechanism 4 polishing different materials, the second servo motor 32 drives the second lead screw 34 to rotate, causing the second lead block 35 to move up and down along the second lead screw 34, thereby driving the second connecting frame 36 to move up and down, and then driving the polishing mechanism 4 to adjust its height, so that the polishing mechanism 4 can polish different materials.

[0031] The above are merely preferred embodiments of this utility model and are not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from the technical solution of this utility model shall still fall within the protection scope of this utility model.

Claims

1. A multi-station synchronous polishing plate surface treatment device, comprising a feeding mechanism (1), a placement mechanism (2) mounted on the upper part of the feeding mechanism (1), and multiple adjustment mechanisms (3) fixedly connected to the upper part of the feeding mechanism (1), each of the multiple adjustment mechanisms (3) having a polishing mechanism (4) installed inside, characterized in that: The adjustment mechanism (3) includes a mounting bracket (31), a second servo motor (32) is fixedly connected to the outside of the mounting bracket (31), and a first connecting bracket (33) is fixedly connected to the outside of the mounting bracket (31). The first connecting bracket (33) is located below the second servo motor (32). A second lead screw (34) is fixedly connected to the output end of the second servo motor (32). The second lead screw (34) is rotatably connected to the first connecting bracket (33), and a second thread block (35) is threadedly connected to the surface of the second lead screw (34). A second connecting bracket (36) is fixedly connected to the surface of the second thread block (35). The polishing mechanism (4) is fixedly connected to the bottom of the second connecting bracket (36).

2. A multi-station synchronous polishing plate surface treatment apparatus according to claim 1, characterized in that: The first connecting frame (33) is fixedly connected to the side of the limiting guide rail (37), and the second wire block (35) is rotatably connected to the side of the limiting roller (38). The limiting roller (38) is in contact with the side of the limiting guide rail (37).

3. A multi-station synchronous polishing plate surface treatment apparatus according to claim 1, characterized in that: The feeding mechanism (1) includes a fixed frame (11), a first servo motor (12) is fixedly connected to the upper part of the fixed frame (11), a first lead screw (13) is fixedly connected to the output end of the first servo motor (12), the first lead screw (13) is rotatably connected to the fixed frame (11), and a first lead block (14) is threadedly connected to the surface of the first lead screw (13), and the upper part of the first lead block (14) is fixedly connected to the placement mechanism (2).

4. A multi-station synchronous polishing apparatus for plate surface treatment according to claim 3, characterized in that: A slide rail (15) is fixedly connected to the upper part of the fixed frame (11), and a slider (16) is slidably connected to the upper part of the slide rail (15). The slider (16) is fixedly connected to the bottom of the placement mechanism (2).

5. The apparatus for processing the surface of a plate according to claim 1, wherein: The placement mechanism (2) includes a placement rack (21) with a clamping assembly (22) mounted on the upper part of the placement rack (21).

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