Gold removing and tin coating equipment for solder wick

By using a desoldering rope to remove gold plating, the problems of uneven heating, uneven bottom pads, and residual solder dross during the gold plating process of chips have been solved. This achieves efficient and stable solder dross removal, and improves the flatness and coplanarity of the chips.

CN224258742UActive Publication Date: 2026-05-19SAIJIA INTELLIGENT TECHNOLOGY (SHANDONG) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SAIJIA INTELLIGENT TECHNOLOGY (SHANDONG) CO LTD
Filing Date
2025-06-26
Publication Date
2026-05-19

AI Technical Summary

Technical Problem

In the existing technology, there are risks of uneven heating, uneven bottom pads, failure to meet coplanarity requirements, and tin residue on the chip edge during the chip de-golding and tinning process. In addition, traditional methods are inefficient and have low accuracy.

Method used

The desoldering equipment using desoldering ropes combines a fixed module, a heating module, and a transmission module. The desoldering ropes are heated to absorb tin dross, and excess tin dross is removed by rotation, ensuring the uniformity and stability of the desoldering process.

Benefits of technology

It achieves uniform heating during the desoldering process, improves the flatness and coplanarity of the bottom pads, reduces the risk of residual solder dross at the chip edge, improves desoldering efficiency and accuracy, and has good stability.

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Abstract

The utility model discloses a solder wick gold removing and tin coating device, which belongs to the technical field of gold removing and tin coating of bottom bonding pad devices and comprises a fixing module and a solder wick, the fixing module is provided with a heating module and a transmission module, the solder wick sequentially passes through the fixing module, the heating module and the transmission module, the heating module comprises a heating table, and the transmission module comprises a transmission module. The transmission module comprises a driving roller and a driven roller, the driving roller and the driven roller abut against each other and are in rolling connection, and the solder sucking rope penetrates through the space between the driving roller and the driven roller. According to the utility model, after redundant tin slag is adsorbed through the tin sucking rope, redundant tin is taken away in a self-rotation manner, so that the gold removing and tin coating treatment of the chip is completed, and the effects of uniform heating in the gold removing and tin coating process, improvement of the flatness and coplanarity of a bottom bonding pad and reduction of the risk that the tin slag remains on the edge of the chip are achieved.
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Description

Technical Field

[0001] This utility model relates to the technical field of removing gold and tin from bottom solder pad devices, and in particular to a desoldering rope device for removing gold and tin. Background Technology

[0002] Currently, the processing of bottom-pad packaged devices typically involves manually tinning the bottom pads with a soldering iron, followed by desoldering with a desoldering wick and the soldering iron, or by using hot air leveling. However, manual desoldering generally requires specialized tooling and fixtures, which is inefficient and can be affected by the operator's skill level and condition. Furthermore, the lead fumes generated during desoldering pose a health risk to the operator.

[0003] Later, a hot air leveling method was developed to remove the tin plating from the gold-plated pads. This method involves heating the pads with hot air to melt the tin plating, and then using an air knife to process the molten tin, so that all the molten tin except for the tin adhering to the chip surface is blown away.

[0004] Regarding the aforementioned technologies, the applicant found that hot air leveling using air knives still has drawbacks. Due to the large range of chip sizes, the area requiring gold removal and tinning varies, leading to uneven heating or inconsistent gold removal results for chips of different sizes and areas. Furthermore, the solder dross blown away by hot air leveling is difficult to collect, causing dross accumulation inside the equipment. Additionally, the hot air leveling process may blow molten solder onto the side edges of the chip, posing a certain risk to device use. Utility Model Content

[0005] This invention addresses the shortcomings of existing technologies by providing a desoldering rope desoldering and tinning equipment. It overcomes the risks associated with uneven heating, uneven bottom pads due to hot air leveling, insufficient coplanarity, and residual solder dross at chip edges during the desoldering and tinning process. This invention uses a desoldering rope to absorb excess solder dross and then removes it by rotating, thus completing the desoldering and tinning process. It achieves uniform heating during the desoldering and tinning process, improves the flatness and coplanarity of the bottom pads, and reduces the risk of residual solder dross at chip edges.

[0006] The technical solution of this utility model to solve the above-mentioned technical problems is as follows:

[0007] A desoldering rope desoldering device includes a fixed module and a desoldering rope. The fixed module is equipped with a heating module and a transmission module. The desoldering rope passes through the fixed module, the heating module and the transmission module in sequence. The heating module includes a heating table. The transmission module includes a driving roller and a driven roller. The driving roller and the driven roller abut against each other and are in a rolling connection. The desoldering rope passes between the driving roller and the driven roller.

[0008] Furthermore, the transmission module includes a bearing mounting base, which is connected to the fixed module. The bearing mounting base is equipped with a drive bearing, and the drive roller is rotatably connected to the bearing mounting base through the drive bearing.

[0009] Furthermore, an internal retaining ring is provided on one side of the drive bearing, and the internal retaining ring is placed on the bearing mounting seat and in contact with the drive bearing.

[0010] Furthermore, the transmission module includes a driven pressure rod and a spring fixing block. The driven pressure rod is hinged to the fixed module, the spring fixing block is connected to the fixed module, the driven pressure rod is rotatably connected to the driven roller, and a driven spring is provided on the driven pressure rod. The end of the driven spring away from the driven pressure rod is connected to the spring fixing block.

[0011] Furthermore, the transmission module includes a stepper motor, which is connected to the drive roller.

[0012] Furthermore, the heating module includes a heating fixing base, which is connected to the fixing module. The heating fixing base is provided with a heating spring support column, which is slidably connected to the heating table. A heating support spring is sleeved on the heating spring support column and is placed between the heating fixing base and the heating table.

[0013] Furthermore, an E-type retaining ring is fitted onto the heating spring support column, and the E-type retaining ring is in contact with the heating fixing base.

[0014] Furthermore, the fixing module includes a base plate with a through hole located on the side of the heating module away from the transmission module.

[0015] In summary, compared with the prior art, the beneficial effects of the above technical solution are:

[0016] 1. This utility model uses a desoldering rope to absorb excess solder dross and then uses its own rotation to remove the excess solder, thus completing the gold removal and tinning process on the chip. It has the effects of uniform heating during the gold removal and tinning process, improving the flatness and coplanarity of the bottom pads, and reducing the risk of solder dross residue on the chip edge.

[0017] 2. The desoldering rope of this utility model uses heating to absorb solder dross, and then removes the solder dross by rotating it. This effectively eliminates the drawbacks of low efficiency and low accuracy of traditional manual desoldering, as well as the instability of hot air blowing desoldering.

[0018] 3. This utility model ensures sufficient space for the next desoldering process, and the desoldering rope has a relatively stable and effective desoldering function. Attached Figure Description

[0019] Figure 1 This is a front view of the overall structure of an embodiment of the present utility model;

[0020] Figure 2 This is a side view of the overall structure of an embodiment of the present utility model;

[0021] Figure 3 This is a schematic diagram of the bearing mounting base in an embodiment of this utility model.

[0022] Explanation of reference numerals in the attached figures:

[0023] 1. Base plate; 2. Heating platform; 3. Stepper motor; 4. Motor mounting plate; 5. Bearing mounting seat; 6. Driven roller; 7. Driven roller; 8. Driven mounting seat; 9. Driven pressure rod; 10. Heating mounting base A; 11. Heating mounting base B; 12. Heating mounting base C; 13. Heating spring support column; 14. Heating support spring; 15. Driven spring; 16. Driven screw; 17. Spring fixing block; 18. E-type snap ring; 19. Driven mounting screw; 20. Internal snap ring; 21. Driven bearing; 22. Driven support column; 23. External snap ring. Detailed Implementation

[0024] The principles and features of this utility model are described below with reference to all the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0025] This utility model discloses a device for removing gold tinning using a desoldering rope.

[0026] Reference Figure 1 A desoldering rope desoldering device includes a fixed module and a desoldering rope. The fixed module is equipped with a heating module and a transmission module. The fixed module includes a base plate 1, which is a complete plate surface. A through hole is opened on the base plate 1, which is located on the side of the heating module away from the transmission module.

[0027] Reference Figure 1 and Figure 2The desoldering rope passes sequentially through a fixing module, a heating module, and a transmission module. The heating module includes a heating table 2, and the transmission module includes a driving roller 7 and a driven roller 6. The driving roller 7 and the driven roller 6 are in contact with each other and are connected in a rolling manner. The desoldering rope passes between the driving roller 7 and the driven roller 6. After the desoldering rope absorbs excess solder dross, it carries away the excess solder by rotating itself, completing the gold removal and soldering process on the chip. This method has the advantages of uniform heating during the gold removal and soldering process, improving the flatness and coplanarity of the bottom pads, and reducing the risk of solder dross residue on the chip edges. The desoldering rope uses heating to absorb solder dross and then carries it away by rotation, effectively eliminating the disadvantages of low efficiency and low accuracy of traditional manual solder removal, as well as the instability of hot air blowing solder removal. This ensures sufficient space for the next solder removal cycle. The desoldering rope has a relatively stable and effective solder removal function.

[0028] Reference Figure 1 and Figure 2 , Figure 3 The transmission module includes a bearing mounting base 5, which is connected to the base plate 1 of the fixed module. A drive bearing 21 is provided on the bearing mounting base 5, and the drive roller 7 is rotatably connected to the bearing mounting base 5 through the drive bearing 21. An internal retaining spring 20 is provided on one side of the drive bearing 21, which is placed on the bearing mounting base 5 and abuts against the drive bearing 21.

[0029] Reference Figure 1 and Figure 2 The transmission module also includes a driven pressure rod 9 and a spring fixing block 17. The driven pressure rod 9 is hinged to the base plate 1 of the fixed module, and the spring fixing block 17 is connected to the base plate 1 of the fixed module. The driven pressure rod 9 is rotatably connected to the driven roller 6. A driven spring 15 is provided on the driven pressure rod 9, and the end of the driven spring 15 away from the driven pressure rod 9 is connected to the spring fixing block 17. The driven roller 6 is directly connected to the driven pressure rod 9 through a driven support column 22. The driven pressure rod 9 is fixed to the driven fixing seat 8 through a driven screw 16. The driven pressure rod 9 and the spring fixing block 17 are connected through the driven spring 15, so that it has a certain pressure to apply to the desoldering rope.

[0030] Reference Figure 1 The transmission module also includes a stepper motor 3, which is connected to the drive roller 7. The drive roller 7 is directly connected to the stepper motor 3 through a bearing mounting seat 5. A motor mounting plate 4 is provided on one side of the bearing mounting seat 5. The motor mounting plate 4 is placed between the stepper motor 3 and the bearing mounting seat 5. The driven roller 6 has a bearing embedded inside, which ensures clamping while also assisting the drive roller 7 in driving the desoldering rope to be conveyed.

[0031] Reference Figure 1 and Figure 2The active roller 7 is connected to the stepper motor 3 via the bearing mounting seat 5. The driven roller 6 is fixed to the driven pressure rod 9 by the driven support column 22. The driven spring 15 applies pressure to the active roller 7. When the desoldering rope passes through the base plate 1, goes above the heating table 2, and then enters the pressure gap between the active roller 7 and the driven roller 6, the heating table 2 transfers heat to the desoldering rope so that it can melt the solder dross. When the stepper motor 3 is working, the active roller 7 and the driven roller 6 drive the desoldering rope to move, thereby removing excess solder dross.

[0032] Reference Figure 1 and Figure 2 , Figure 3 The driving roller 7 is installed inside the driving bearing 21 within the bearing mounting base 5. The driving bearing 21 is fixed in the bearing mounting base 5 using an internal retaining spring 20. The stepper motor 3 is also installed on the bearing mounting base 5 via a motor mounting plate 4. The drive shaft inside the stepper motor 3 is nested inside the driving roller 7 and locked using a set screw. The bearing mounting base 5 is installed on the base plate 1. The driven roller 6 is nested on the driven support column 22 and fixed by an external retaining spring 23. The driven support column 22 is nested inside the driven pressure rod 9. The driven pressure rod 9 is locked to the driven mounting base 8 by a driven screw 16. The driven mounting base 8 is fixed on the base plate 1. There is a driven spring 15 between the driven pressure rod 9 and the spring fixing block 17. The driven spring 15 is installed on the driven pressure rod 9 by a driven fixing screw 19, so that the driven roller 6 applies a certain pressure to the desoldering rope.

[0033] Reference Figure 1 and Figure 2 The heating module includes a heating fixing base connected to the base plate 1 of the fixing module. A heating spring support column 13 is provided on the heating fixing base, and the heating spring support column 13 is slidably connected to the heating platform 2. A heating support spring 14 is sleeved on the heating spring support column 13, and the heating support spring 14 is positioned between the heating fixing base and the heating platform 2. In this embodiment, the heating fixing base can be further divided into heating fixing base A10, heating fixing base B11, and heating fixing base C12 according to different structural parts. An E-type retaining spring 18 is sleeved on the heating spring support column 13, and the E-type retaining spring 18 is in contact with the heating fixing base.

[0034] Reference Figure 1 and Figure 2 The bottom support of the heating platform 2 is four heating spring support columns 13, which allows it to have some downward compression space to avoid excessive pressure at the top that could damage the chip.

[0035] Reference Figure 1 The upper heating platform 2 is heated, and the heating platform 2 transfers heat to the desoldering rope. After the desoldering rope reaches the melting point of the solder dross, the driving roller 7 and the driven roller 6 can work to move the desoldering rope forward and remove the excess solder dross.

[0036] Reference Figure 1 and Figure 2 The heating platform 2 is slidably fixed on the heating base C12 by the heating spring support column 13 and fixed in the initial position by the E-type snap ring 18. Each heating spring support column 13 is fitted with a heating support spring 14 so that there can be a certain downward compression force when the pressure above is too large. The heating base C12 is fixed on the heating base B11 with screws. The heating base B11 is fixed on the heating base A10 with screws. The heating base A10 is fixed on the base plate 1 with screws.

[0037] The implementation principle of the desoldering rope desoldering device of this utility model is as follows:

[0038] During operation, the desoldering rope passes through the through-hole on the base plate 1, ascends from the bottom of the base plate 1, passes above the heating platform 2, and is placed downwards into the gap between the driving roller 7 and the driven roller 6. The driven roller 6 presses the desoldering rope against the driving roller 7 by the elastic force of the driven spring 15. The stepper motor 3 starts working, driving the driving roller 7 to move through the bearing mounting seat 5. The desoldering rope moves forward under the combined movement of the driving roller 7 and the driven roller 6. After the chip is desoldered and reaches above the desoldering rope, the heating platform 2 transfers heat to the desoldering rope, melting the excess solder dross on the chip surface. After contacting the desoldering rope, the movement of the desoldering rope removes the excess solder dross. The desoldering rope then passes through the outlet hole of the base plate 1 to the bottom of the base plate 1 for recycling, completing the desoldering rope desoldering process.

[0039] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A desoldering rope desoldering device, comprising a fixing module and a desoldering rope, characterized in that: The fixed module is equipped with a heating module and a transmission module. The desoldering rope passes through the fixed module, the heating module and the transmission module in sequence. The heating module includes a heating table (2). The transmission module includes a driving roller (7) and a driven roller (6). The driving roller (7) and the driven roller (6) abut against each other and are connected in a rolling manner. The desoldering rope passes between the driving roller (7) and the driven roller (6).

2. The desoldering rope desoldering equipment according to claim 1, characterized in that: The transmission module includes a bearing mounting base (5), which is connected to the fixed module. The bearing mounting base (5) is provided with an active bearing (21), and the active roller (7) is rotatably connected to the bearing mounting base (5) through the active bearing (21).

3. The desoldering rope desoldering equipment according to claim 2, characterized in that: An internal retaining ring (20) is provided on one side of the active bearing (21). The internal retaining ring (20) is placed on the bearing fixing seat (5) and is in contact with the active bearing (21).

4. The desoldering rope desoldering equipment according to claim 1, characterized in that: The transmission module includes a driven pressure rod (9) and a spring fixing block (17). The driven pressure rod (9) is hinged to the fixed module, and the spring fixing block (17) is connected to the fixed module. The driven pressure rod (9) is rotatably connected to the driven roller (6). A driven spring (15) is provided on the driven pressure rod (9), and the end of the driven spring (15) away from the driven pressure rod (9) is connected to the spring fixing block (17).

5. The desoldering rope desoldering equipment according to claim 1, characterized in that: The transmission module includes a stepper motor (3), which is connected to the drive roller (7).

6. The desoldering rope desoldering equipment according to claim 1, characterized in that: The heating module includes a heating fixed base, which is connected to the fixed module. A heating spring support column (13) is provided on the heating fixed base. The heating spring support column (13) is slidably connected to the heating platform (2). A heating support spring (14) is sleeved on the heating spring support column (13) and is placed between the heating fixed base and the heating platform (2).

7. The desoldering rope desoldering equipment according to claim 6, characterized in that: An E-type retaining ring (18) is fitted on the heating spring support column (13), and the E-type retaining ring (18) is in contact with the heating fixing base.

8. The desoldering rope desoldering equipment according to claim 1, characterized in that: The fixing module includes a base plate (1), on which a through hole is provided. The through hole is located on the side of the heating module away from the transmission module.