Planetary system carrier for plating pot of evaporator

Abstract

The utility model discloses an evaporator plating pot planetary system carrier which comprises an evaporation cavity, a plating pot umbrella stand and an annular guide rail surrounding the periphery of the plating pot umbrella stand are arranged in the evaporation cavity, the plating pot umbrella stand is connected with the annular guide rail in a sliding mode through idler wheels, the top of the plating pot umbrella stand is further connected with a claw plate through a bolt, and the claw plate is fixedly connected with the evaporation cavity. The top of the claw plate is also movably connected with the compensation plate, the end of the compensation plate is fixed to the planetary disc in a movable connection mode, the angle of the compensation plate can be adjusted so that the compensation plate can adapt to coating angles needed by different technologies, and an evaporation source is further arranged at the bottom of the evaporation cavity and used for emitting a thin film to the base plate. According to the utility model, through the design of the compensation plate, different angles can be adjusted to adapt to the requirements of different processes, and the angle adjustment design of the compensation plate has great advantages due to the fact that most of current coating planetary system carriers cannot be subjected to angle adjustment, so that the expenditure cost of the carrier is reduced, and one set of carrier can be suitable for various different angles.

Description

Technical Field

[0001] This utility model relates to the semiconductor field, specifically to a planetary system carrier for a vapor deposition machine. Background Technology

[0002] Vacuum evaporation deposition, which involves heating and vaporizing a coating material and depositing it into a film in a high-vacuum environment, is widely used in thin film preparation. In current technology, the workpiece to be deposited is typically fixed within the deposition chamber by a planetary rotating carrier, which is driven by a motor to revolve / rotate to achieve multi-angle deposition. However, the tilt angle of existing carriers is fixed and cannot be adjusted. Most carriers rely on overall rotation to change the substrate orientation, making it impossible to adjust the relative geometric relationship between the incident angle of the coating particles and the substrate. With the increasing prevalence of various optical devices, different angles are required for different materials to be deposited. Existing fixed-angle carriers cannot meet this demand, leading to uneven film thickness and low efficiency. Therefore, it is necessary to design a planetary system carrier with flexibly adjustable angles to improve the adaptability and accuracy of the deposition process. Utility Model Content

[0003] The purpose of this invention is to provide a planetary system carrier for a vapor deposition machine to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] A planetary system carrier for a vapor deposition machine includes a vapor deposition chamber, a vapor deposition source disposed at the bottom of the vapor deposition chamber, and a drive shaft penetrating the top of the vapor deposition chamber. It also includes a vapor deposition chamber frame for placing the workpiece to be deposited, disposed within the vapor deposition chamber. A claw plate is connected to the side wall of the vapor deposition chamber frame, and the end of the claw plate is movably connected to a compensation plate. The compensation plate is movably connected to a planetary disk above it. By adjusting the relative distance between the compensation plate and the planetary disk, the angle of the vapor deposition chamber frame can be adjusted by the claw plate. The planetary disk is fixedly mounted on the drive shaft, and the drive shaft drives the vapor deposition chamber frame to rotate by driving the planetary disk.

[0006] Through the above technical solution, the connection between the plating pot umbrella frame and the claw plate can provide both high strength and meet the requirements of stability, such as preventing deviations in coating accuracy due to shaking. The angle of the plating pot umbrella frame can be adjusted by adjusting the relative distance between the compensation plate and the planetary disk. The compensation plate and the claw plate are then connected by a locking component, which is the main innovation of this utility model. The planetary disk is surrounded by the drive shaft.

[0007] Preferably, the plating pot umbrella frame is also surrounded by a guide rail, and a roller mounted on the plating pot umbrella frame is provided above the guide rail, with the roller slidably connected to the guide rail.

[0008] Through the above technical solutions, the introduction of rollers reduces the coefficient of friction of the equipment, ensuring that the plating pan frame maintains low torque when rotating at high speed, improving rotational stability, and reducing coating thickness error.

[0009] Preferably, the relative movement between the compensation plate and the planetary disk allows for an angle adjustment range of 15° to 75°.

[0010] The above technical solution offers many advantages by setting the compensation angle within this range. For example, different coating processes require different angles, and operators can precisely adjust the required angle to complete production tasks, improve equipment versatility, and quickly troubleshoot problems caused by the angle during maintenance.

[0011] Preferably, the plating pan frame includes several plating trays for placing plating parts, and the plating trays are arranged in a ring array on the plating pan frame.

[0012] The above technical solution ensures that the diffusion direction of particles generated by the evaporation source is consistent, reducing uneven coating caused by the position deviation of the evaporation pads. Moreover, the distribution of the array can make full use of the space of the evaporation cavity and improve the integration of the equipment.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] (1) Improve process adjustability and can meet the needs of the previous process, such as metal stripping process, etc.

[0015] (2) Reduce the expenditure cost of planetary system vehicles, and the angle adjustment of the compensation plate can be applied to different angles and can be adjusted for different coating processes. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the interior of the vapor deposition machine cavity, which is a planetary system carrier for a vapor deposition machine.

[0018] Figure 2 This is a schematic diagram of the initial angle of the compensation plate of a planetary system carrier for a vapor deposition machine.

[0019] Figure 3 A schematic diagram of the maximum adjustable angle of the compensation plate of a planetary system carrier for a vapor deposition machine.

[0020] Figure label:

[0021] 1. Evaporation chamber; 2. Evaporation pot frame; 3. Evaporation source; 4. Guide rail; 5. Claw plate; 6. Planetary disk; 7. Compensation plate; 8. Evaporation tray; 9. Drive shaft; 10. Roller; 11. Crucible; 12. Electron beam emission aperture; 100. Locking component. Detailed Implementation

[0022] The utility model will now be further described with reference to the accompanying drawings and specific embodiments:

[0023] Example 1:

[0024] like Figure 1 As shown, a planetary system carrier for a vapor deposition machine includes a vapor deposition chamber 1. At the bottom of the vapor deposition chamber 1 is a vapor deposition source 3, which includes an electron beam emission aperture 12 and a crucible 11. The crucible 11 is generally used to hold the vapor deposition material, such as inorganic materials like metals or metal compounds. The electron beam emission aperture 12, located above the crucible 11, is generally used for heating. When the vapor deposition machine starts working, the electron beam emission aperture 12 first heats the material in the crucible 11, causing the material temperature to rise rapidly to above its melting point or even boiling point, evaporating it into gaseous atoms. Due to the precise coordination between the crucible 11 and the electron beam emission aperture 12, the evaporation rate of the vapor deposition material can be stably controlled. By adjusting the power of the electron beam emission aperture 12, the evaporation amount per unit time can also be controlled. For example, when preparing a thick metal film, the emission power can be increased to accelerate the evaporation rate; when preparing a thin metal material, the emission power can be reduced to ensure uniform coating.

[0025] like Figure 1 As shown, a planetary system carrier for a vapor deposition machine has an annular guide rail 4 at the top of the vapor deposition chamber 1. When the vapor deposition machine is working, the drive shaft 9 at the top provides power from the motor to drive the rotation of the annular guide rail 4. The vapor deposition pan holders 2 inside the annular guide rail 4 revolve within the vapor deposition chamber 1. This greatly improves the uniformity of the coating. Multiple vapor deposition pan holders 2 are distributed in the center of the annular guide rail 4. Several annular array coating trays 8 are provided on the vapor deposition pan holders 2. The vapor deposition pan holders 2 rotate with the rotation of the annular guide rail 4, vapor deposition is performed on the parts to be coated in the coating trays 8 on each vapor deposition pan holder 2, so that the coating is evenly distributed on the top. The use of the annular guide rail 4 also allows for flexible adjustment of parameters according to different coating processes, such as changing the running speed of the annular guide rail 4, the number and position of the vapor deposition pan holders 2, etc., all of which are conducive to the uniform distribution of the coating.

[0026] like Figure 1As shown, a planetary system carrier for a vapor deposition machine has a coating pan 2 whose center is connected to the end of a claw plate 5 via a roller 10. The top of the claw plate 5 is connected to a compensation plate 7 via a locking member 100. The planetary disk 6 is connected to the top of the compensation plate 7 via a movable connection, wherein the angle can be adjusted by moving the position of the compensation plate 7.

[0027] like Figure 2 As shown, a planetary system carrier for a vapor deposition machine has a compensation plate 7 whose angle can be adjusted. The initial angle is 15°. When different metal materials are being coated, the angle can be adjusted. The compensation plate 7 is provided with bolts that connect to the planetary disk 6. When the vapor deposition of the metal material needs to be adjusted to another angle, the compensation plate 7 can be pulled horizontally in the direction of the claw plate 5 and then fixed to the end of the planetary disk 6.

[0028] like Figure 3 As shown, a planetary system carrier for a vapor deposition machine's plating pan has a compensation plate 7 with an angle set at 75°, which is connected to... Figure 2 In contrast, the top of the compensation plate 7 can be folded to adapt to different angle requirements. In this figure, the upper right end of the claw plate 5 is connected to the end of the planetary disk 6. At this time, the angle can be adapted to the needs of the metal material to be coated. The biggest improvement of this utility model is that the compensation plate 7 can be moved and fixed to adjust the angle to adapt to the needs of different coating processes.

[0029] In this utility model, unless otherwise explicitly specified and limited, the terms "installation", "setting", "connection", "fixing", "screw connection", etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0030] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0031] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A planetary system carrier for a vapor deposition machine, comprising a vapor deposition chamber (1), a vapor deposition source (3) disposed at the bottom of the vapor deposition chamber (1), and a drive shaft (9) penetrating the top of the vapor deposition chamber (1), characterized in that, The device includes a plating pan frame (2) for placing the workpiece to be plated, which is set in the vapor deposition chamber (1). A claw plate (5) is connected to the side wall of the plating pan frame (2). The end of the claw plate (5) is movably connected to a compensation plate (7). The compensation plate (7) is movably connected to a planetary disk (6) above. By adjusting the relative distance between the compensation plate (7) and the planetary disk (6), the claw plate (5) is driven to adjust the angle of the plating pan frame (2). The planetary disk (6) is fixedly installed on the drive shaft (9). The drive shaft (9) drives the plating pan frame (2) to rotate by driving the planetary disk (6).

2. The planetary system carrier for a vapor deposition machine as described in claim 1, characterized in that, The galvanizing umbrella frame (2) is also surrounded by a guide rail (4), and a roller (10) is mounted on the galvanizing umbrella frame (2) above the guide rail (4). The roller (10) is slidably connected to the guide rail (4).

3. The planetary system carrier for a vapor deposition machine as described in claim 1, characterized in that, The relative movement of the compensation plate (7) and the planetary disk (6) allows for an angle adjustment range of 15° to 75°.

4. The planetary system carrier for a vapor deposition machine as described in claim 1, characterized in that, The plating pan frame (2) includes several plating trays (8) for placing the parts to be plated, and the plating trays (8) are arranged in a ring array on the plating pan frame (2).

Images