Supporting frame structure adaptive to installation of heating plate and warmer

By designing a support frame structure adapted to the installation of the heating plate, the problem of complex and unsightly structures in existing electric heating equipment has been solved, resulting in a thin and aesthetically pleasing heater suitable for the aesthetic needs of homes and public buildings.

CN224261806UActive Publication Date: 2026-05-19FOSHAN XINHAORUI TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
FOSHAN XINHAORUI TECH CO LTD
Filing Date
2025-07-15
Publication Date
2026-05-19

AI Technical Summary

Technical Problem

Existing electric heating equipment is complex, bulky, and unsightly, making it difficult to meet the aesthetic requirements of homes and public buildings.

Method used

The design incorporates a support frame structure adapted for heating plate installation, including a frame plate, mainboard mounting space, power connection point, and heat dissipation position. It supports easy assembly and power connection of the heating plate and is designed for wall mounting or vertical use.

Benefits of technology

It achieves a slimmer and more aesthetically pleasing design for heaters, making them suitable for spaces such as family living rooms and art galleries, satisfying both functional and aesthetic needs.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224261806U_ABST
Patent Text Reader

Abstract

The utility model provides a support frame structure adapted to the installation of a heating plate, which comprises a frame plate body, and the front side of the frame plate body is provided with a first installation position for the installation of a flat plate body; a main board mounting space used for positioning and assembling a main board assembly is arranged on the side, corresponding to the first mounting position, of the frame board body, and the main board mounting space communicates with the first mounting position; the frame plate body is provided with a power connection position corresponding to the side of the mainboard installation space, and the power connection position is communicated with the mainboard installation space. Through the arrangement of the supporting frame structure, installation of a flat heating plate and a matched mainboard assembly can be formed through simple combination, so that the mainboard assembly and the heating plate can be effectively installed on the heating plate assembly applying the supporting frame structure, external power connection is achieved, and the arrangement requirement of a thin plate-shaped external heating plate structure is met; therefore, the heater can replace a traditional heater with a heavy structure to serve as a furniture product applied to heating in an object.
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Description

Technical Field

[0001] This utility model relates to the field of heater technology, specifically to a support frame structure adapted for heating plate installation and a heater. Background Technology

[0002] Current technologies typically use heaters for heating, with electric heaters being the most common type. These heaters are widely used in various civil and public buildings, including residences, offices, hotels, shopping malls, hospitals, schools, train carriages, mobile heating systems, and temporary housing. However, existing electric heating devices often utilize metal or liquid as the heat transfer medium, resulting in complex and bulky structures that are difficult to move and aesthetically unappealing when placed in living rooms.

[0003] The prior art patent document CN 218735046 U discloses a structural design of a novel thin-plate heating element. Utility Model Content

[0004] The purpose of this utility model is to overcome the shortcomings of the prior art and provide a support frame structure and heater that are adapted to the installation of heating plates.

[0005] A support frame structure adapted for heating plate mounting includes a frame plate, a first mounting position for mounting a flat plate is provided on the front side of the frame plate; a motherboard mounting space for positioning and assembling a motherboard assembly is provided on the side of the frame plate corresponding to the first mounting position, the motherboard mounting space being connected to the first mounting position; and a power connection position is provided on the side of the frame plate corresponding to the motherboard mounting space, the power connection position being connected to the motherboard mounting space.

[0006] Furthermore, the first mounting position accounts for 85% to 100% of the front end face of the frame plate.

[0007] Furthermore, the frame plate is provided with a plurality of first heat dissipation positions through the rear side corresponding to the first mounting position; a connecting channel is provided between the motherboard mounting space and its adjacent first heat dissipation positions; a connecting groove is recessed on the first mounting position between two adjacent first heat dissipation positions.

[0008] Furthermore, the power connection position includes a power connection mounting space provided next to the first mounting position for positioning and assembling the power connection component. The power connection mounting space has a power connection opening on the outer periphery of the frame plate. The frame plate has a power connection cable groove that connects the motherboard mounting space and the power connection mounting space.

[0009] Furthermore, a panel mounting space for positioning and assembling the control panel is provided on the side of the frame plate corresponding to the first mounting position; a control cable groove is provided on the frame plate to connect the motherboard mounting space 12 and the panel mounting space.

[0010] Furthermore, the frame plate includes:

[0011] A first frame plate is located on the front side, with a first mounting position on its front side; a first mounting cavity is located on the rear side of the first frame plate, corresponding to the first mounting position; the first mounting cavity communicates with the first mounting position; a first connecting structure is located on the rear side of the first frame plate; a second frame plate is located on the rear side, with a second mounting cavity located on its front side, corresponding to the position of the first mounting cavity; the first mounting cavity and the second mounting cavity combine to form the motherboard mounting space; a second connecting structure is located on the front side of the second frame plate, cooperating with the first connecting structure; the first frame plate and the second frame plate are assembled and connected through the first connecting structure and the second connecting structure; the first frame plate and / or the second frame plate correspond to the power connection position beside the motherboard mounting space.

[0012] A heater includes: a support frame structure as described above; a first heating plate arranged in the shape of a flat plate, the first heating plate being positioned in the first mounting position; a main board assembly, positioned and assembled in the main board mounting space; the main board assembly having an electrical terminal led out to the electrical terminal, the main board assembly being electrically connected to the first heating plate.

[0013] Furthermore, a second mounting position is provided on the rear side of the frame plate, the second mounting position is connected to the motherboard mounting space, a second heating plate is provided on the second mounting position, and the second heating plate is electrically connected to the motherboard assembly.

[0014] Furthermore, a back plate is positioned and assembled on the rear side of the frame plate, and an external connector is provided on the rear side of the back plate for positioning and fitting with the external installation position; a decorative layer is provided on the surface of the first heating plate.

[0015] The beneficial effects of this utility model are as follows:

[0016] By setting up a supporting frame structure, it is easy to assemble and install a flat heating plate and a matching main board component. This allows the heating plate component to effectively install the main board component and the heating plate, and thus connect to the outside power source. This meets the requirements for a thin, flat external heating plate structure, and can replace traditional heavy-duty heaters as furniture products for heating in living spaces. Attached Figure Description

[0017] Figure 1 This is an exploded view of the heater structure according to Embodiment 1 of this utility model;

[0018] Figure 2 This is a schematic diagram of the support frame structure of Embodiment 1 of this utility model;

[0019] Figure 3 This is an exploded view of the heater structure according to Embodiment 2 of this utility model;

[0020] Figure 4 This is a schematic diagram of the support frame structure of Embodiment 2 of this utility model.

[0021] Figure label:

[0022] Frame plate 1, first mounting position 11, first heat dissipation position 111, connecting channel 112, connecting groove 113, motherboard mounting space 12, power connection position 13, power connection mounting space 131, power connection opening 132, power cable groove 133, panel mounting space 14, control cable groove 141, mounting screw holes 15.

[0023] First frame plate 2, first mounting cavity 21, first connecting structure 22, front positioning groove 23, front mounting opening 24.

[0024] Second frame plate 3, second mounting position 30, second heat dissipation position 301, second connecting channel 302, second connecting groove 303, second mounting cavity 31, second connecting structure 32, rear positioning groove 33, panel positioning groove 34.

[0025] First heating plate 41, second heating plate 42, main board assembly 5, control panel 6, power connection assembly 7, back plate 8, connection opening 81, positioning bracket 9, support base plate 91, clamping bracket 92, support side plate 93, caster wheel 94. Detailed Implementation

[0026] To make the technical solution, purpose and advantages of this utility model clearer, the following explanation is given in conjunction with the accompanying drawings and embodiments.

[0027] like Figures 1 to 4 As shown, this utility model provides a heater with a flat and thin overall structure, which occupies a small space and has a neat and beautiful appearance. It can be used for heating in spaces with specific aesthetic design requirements, such as family living rooms and art gallery exhibition halls.

[0028] Example 1:

[0029] In this embodiment, a wall-mounted heater with single-sided heating is provided.

[0030] The heater structure includes a frame plate 1. A first mounting position 11 for mounting a flat plate is provided on the front side of the frame plate 1. A first heating plate 41, also in the shape of a flat plate, is mounted on the first mounting position 11. A main board mounting space 12 is provided beside the first mounting position 11 on the frame plate 1. A main board assembly 5 is positioned and assembled in the main board mounting space 12. The main board mounting space 12 is connected to the first mounting position 11 so that the main board assembly 5 and the first heating plate 41 are electrically connected via wiring. A power connection position 13 is provided beside the main board mounting space 12 on the frame plate 1. The power connection position 13 is connected to the main board mounting space 12 so that the main board assembly 5 extends a power connection terminal to the power connection position 13, thereby meeting the application requirements for external power supply.

[0031] The first heating plate 41 structure used in this embodiment can be a thin plate-shaped heating element of the prior art. By connecting to the power terminal of the main board component 5, the heating element is electrically driven to generate heat, thus satisfying the heating application of the heater.

[0032] In a preferred embodiment, a back plate 8 is positioned and assembled on the rear side of the frame plate 1. An external connector for positioning and engaging with an external installation location is provided on the rear side of the back plate 8. A decorative layer is provided on the surface of the first heating plate 41. With this structural configuration, the external connector can utilize conventional connection structures such as hooks and buckles, allowing the heater structure of this embodiment to be wall-mounted. Furthermore, the front end face of the first heating plate 41 is designed with a decorative layer featuring painting or decorative patterns, making the heater structure resemble a hanging painting, thus satisfying the need for concealed installation in home spaces, art galleries, and other similar environments, maximizing both functional and aesthetic design requirements.

[0033] In this embodiment, the frame plate 1 is structurally configured as follows:

[0034] The frame plate 1 is rectangular in shape, matching the structural shape of the first heating plate 41, thus achieving a "narrow frame" simulation as a structural design application for hanging paintings. The first mounting position 11 can occupy 85% to 100% of the front end face of the frame plate 1. In this embodiment, the first mounting position 11 (first heating plate 41) occupies 90% of the front side of the frame plate 1. After the first heating plate 41 is installed in the first mounting position 11, the front end face of the first heating plate 41 is flush with the frame plate 1. The first heating plate 41 is fixedly connected to the first mounting position 11 by adhesive.

[0035] The first mounting position 11 (first heating plate 41) is positioned on the side of the frame plate 1 along its length relative to the front side, while a motherboard mounting space 12 is provided on the other side of the frame plate 1 along its length. The frame plate 1 has several first heat dissipation positions 111 extending through the rear side of the first mounting position 11. A connecting channel 112 connects the motherboard mounting space 12 with its adjacent first heat dissipation positions 111. A connecting groove 113 is recessed on the first mounting position 11 between two adjacent first heat dissipation positions 111. The connecting channel 112 allows for the electrical connection of the motherboard component 5 wiring in the motherboard mounting space 12 to the lead wires of the first heating plate 41 located on the first mounting position 11. The connecting groove 113 accommodates the external wiring requirements that the first heating plate 41 may have. As a further design approach, the position of the connecting slot 113 will correspond to the position of the connecting channel 112 in the horizontal direction. In this way, when the first heating plate 41 with segmented heating is applied, the lead wire from the main board component 5 can be connected to the local heating potential of the corresponding first heating plate 41 across the length direction through the corresponding connecting slot 113, so as to realize the heating and heating needs of the first heating plate 41 with multiple local heating points in the heater.

[0036] The power connection position 13 includes a power connection installation space 131 located beside the first mounting position 11 for positioning and assembling the power connection component 7. The power connection installation space 131 is located on the other side of the frame plate 1 along its length and below the main board mounting space 12. The power connection installation space 131 has a power connection opening 132 on the outer periphery of the frame plate 1. The frame plate 1 has a power connection cable groove 133 connecting the main board mounting space 12 and the power connection installation space 131. The power connection position 13 is designed to allow the insertion of an independent power connection component 7 through the power connection installation space 131, and to set the power connection end of the power connection component 7 to the external power connection opening 132, so as to meet the power connection conversion requirements of different external power supply specifications and make the heater more adaptable to the power connection environment.

[0037] As an optional structural implementation, in this embodiment, a control panel 6 can also be provided on the frame plate 1 of the heater, allowing the user to operate the main board assembly 5 to link with the first heating plate 41 to perform heating operations in different modes via the control panel 6. A panel mounting space 14 for positioning and assembling the control panel 6 is provided on the side of the frame plate 1 corresponding to the first mounting position 11. Specifically, the panel mounting space 14 is located above the first mounting position 11 and close to the main board mounting space 12. A control cable groove 141 is provided on the frame plate 1, connecting the main board mounting space 12 and the panel mounting space 14, and the control cable groove 141 is arranged around the periphery of the first mounting position 11. Through the control cable groove 141, the control panel 6 and the main board assembly 5 can be electrically connected via wiring.

[0038] The frame plate 1 is provided with a plurality of mounting screw holes 15 on its rear side, and the back plate 8 is provided with a plurality of connecting openings 81 corresponding to each mounting screw hole 15. The mounting screw holes 15 and the connecting openings 81 are connected by screws to realize the assembly connection between the frame plate 1 and the back plate 8.

[0039] Example 2:

[0040] In this embodiment, a vertical heater with double-sided heating is provided.

[0041] Its basic structural setup is similar to that of Embodiment 1 described above: it includes a frame plate 1, with a first mounting position 11 for mounting a flat plate on the front side of the frame plate 1; a motherboard mounting space 12 for positioning and assembling the motherboard assembly 5 is provided on the side of the frame plate 1 corresponding to the first mounting position 11, and the motherboard mounting space 12 is connected to the first mounting position 11; a power connection position 13 is provided on the side of the frame plate 1 corresponding to the motherboard mounting space 12, and the power connection position 13 is connected to the motherboard mounting space 12. The difference is that a second mounting position 30 is provided on the rear side of the frame plate 1, the second mounting position 30 is connected to the motherboard mounting space 12, a second heating plate 42 is provided on the second mounting position 30, and the second heating plate 42 is electrically connected to the motherboard assembly 5; a positioning bracket 9 is provided on the lower side of the frame plate 1.

[0042] The aforementioned frame plate 1 can be configured with the same structural principle as Embodiment 1, by replacing the back plate 8 with the second heating plate 42, and through structural adaptation adjustments, to obtain a thin, double-sided heating plate-shaped heater. Supported by the positioning bracket 9, this plate-shaped heater is vertically positioned, achieving the function of heating from both sides, suitable for multi-position heating applications in daily living rooms. Similarly, the surfaces of the corresponding first heating plate 41 and second heating plate 42 can optionally be decorated with painted patterns, decorative designs, or other decorative layers.

[0043] As a preferred structural implementation, in this embodiment, the frame plate 1 structure can be applied as a combined connection structure with separate frame plates on both sides, and its specific structural configuration is as follows:

[0044] The frame body includes: a first frame plate 2 located on the front side, with a first mounting position 11 on the front side of the first frame plate 2; a first mounting cavity 21 located on the rear side of the first frame plate 2, corresponding to the first mounting position 11; the first mounting cavity 21 communicating with the first mounting position 11; a first connecting structure 22 on the rear side of the first frame plate 2; a second frame plate 3 located on the rear side, with a second mounting cavity 31 located on the front side of the second frame plate 3 corresponding to the position of the first mounting cavity 21; the first mounting cavity 21 and the second mounting cavity 31 combined to form the motherboard mounting space 12; a second connecting structure 32 on the front side of the second frame plate 3 cooperating with the first connecting structure 22; the first frame plate 2 and the second frame plate 3 are assembled and connected through the first connecting structure 22 and the second connecting structure 32; the first frame plate 2 and / or the second frame plate 3 correspond to the power connection position 13 on the side of the motherboard mounting space 12.

[0045] Based on the structural design of the first frame plate 2 and the second frame plate 3, the installation requirements of the main board assembly 5 can be met by connecting the first frame plate 2 and the second frame plate 3. Simultaneously, in product processing and sales, the first frame plate 2 can be connected and assembled with the first heating plate 41 first, and the second frame plate 2 can be connected and assembled with the second heating plate 42 first. This allows the corresponding frame plates and heating plates to be pre-assembled into an integrated product component for packaging and sale. Users can then simply connect the main board assembly 5, control panel 6, and power connection component 7, insert them into the corresponding installation space between the first frame plate 2 and the second frame plate 3, and then connect the first connection structure 22 and the second connection structure 32 to complete the overall assembly of the heater body. This design features reliable structure and simple, efficient installation. Furthermore, as independent pre-assembled products, the first heating plate 41 and the second heating plate 42 can be decorated with corresponding painted patterns and decorative designs according to actual needs, allowing users to choose and assemble them independently, making it more suitable for market sales applications.

[0046] Specifically, the first frame plate 2 has a plurality of first heat dissipation positions 111 extending through the rear side of the first mounting position 11; a connecting channel 112 is provided between the first mounting cavity 21 and its adjacent first heat dissipation positions 111; a connecting groove 113 is recessed between two adjacent first heat dissipation positions 111 on the first mounting position 11; and the second frame plate 3 has a second heat dissipation position 301 extending through the front side of the second mounting position 30; a second connecting channel 302 is provided between the second mounting cavity 31 and its adjacent second heat dissipation positions 301; a second connecting groove 303 is recessed between two adjacent second heat dissipation positions 301 on the second mounting position 30. The design and application principle of the corresponding second connecting channel 302 and second connecting groove 303 is the same as that of the connecting channel 112 and connecting groove 113, and the purpose is to connect the contact potentials of different heat dissipation areas on the motherboard assembly 5 and the corresponding second heating plate 42, so as to realize the application of heat control for different positions on different heating plates.

[0047] The power connection position 13 comprises a front positioning groove 23 located on the outer periphery of the first frame plate 2 near the first mounting cavity 21, and a rear positioning groove 33 located on the outer periphery of the second frame plate 3 corresponding to the front positioning groove 23. The front positioning groove 23 and the rear positioning groove 33 together form a power connection installation space 131. The power connection groove 133 is provided on the front side of the second frame plate 3 between the rear positioning groove 33 and the second mounting cavity 31, thus satisfying the application requirements for installing the power connection component 7 on the joined first frame plate 2 and second frame plate 3.

[0048] The first frame plate 2 has a through front mounting opening 24 on the side corresponding to the first mounting position 11; the second frame plate 3 has a panel positioning groove 34 on its front side corresponding to the position of the front mounting opening 24. The front mounting opening 24 and the panel positioning groove 34 are combined to form a panel mounting space 14 for positioning and assembling the control panel 6. In this structural design, the first frame plate 2 and the second frame plate 3 are joined together to meet the application requirements for mounting the control panel 6, and the control end face of the control panel 6 faces the front side for application.

[0049] The control wire groove 141 is provided on the front side of the second frame plate 3 between the second mounting cavity 31 and the panel positioning groove 34; the control wire groove 141 is arranged around the outer periphery of the second mounting cavity 31; to meet the wiring application requirements between the control panel 6 and the motherboard assembly 5 in the joined first frame plate 2 and second frame plate 3.

[0050] The first connecting structure 22 includes a plurality of first connecting holes disposed on the outer periphery of the rear side of the first frame plate 2, and the second connecting structure 32 includes second connecting holes disposed on the second frame plate 3 corresponding to each of the first connecting holes. The first connecting holes and the second connecting holes are connected by screws to realize the assembly connection between the first frame plate 2 and the second frame plate 3, thereby satisfying the installation and joining requirements of the first frame plate 2 and the second frame plate 3.

[0051] The positioning bracket 9 includes a support base plate 91 supported at the bottom of the frame plate 1, the extension dimension of which is adapted to the length extension dimension of the frame plate 1; clamping brackets 92 are provided at both ends of the support base plate 91 corresponding to the front and rear sides of the frame plate 1, the clamping spacing of the clamping brackets 92 is adapted to the thickness of the frame plate 1 (the first frame plate 2 and the second frame plate 3 are connected and combined). A support side plate 93 extends along the front and rear direction on the lower side of the clamping bracket 92 to form effective support for the frame plate 1; universal wheels 94 are provided on the lower side of the support side plate 93, and four sets of universal wheels 94 are arranged at the four corners to facilitate the overall turning and movement of the heater.

[0052] The above description is only a preferred embodiment of the present utility model. For those skilled in the art, modifications can still be made to the embodiments without departing from the first principle of the present utility model, and the corresponding modifications should also be considered within the protection scope of the present utility model.

Claims

1. A support frame structure adapted for heating plate installation, characterized in that, The device includes a frame plate, with a first mounting position for mounting a flat plate on the front side of the frame plate; a motherboard mounting space for positioning and assembling a motherboard assembly is provided on the side of the frame plate corresponding to the first mounting position, and the motherboard mounting space is connected to the first mounting position; and a power connection position is provided on the side of the frame plate corresponding to the motherboard mounting space, and the power connection position is connected to the motherboard mounting space.

2. The supporting frame structure as described in claim 1, characterized in that, The first mounting position accounts for 85% to 100% of the front end face of the frame plate.

3. The supporting frame structure as described in claim 1, characterized in that, The frame plate is provided with a plurality of first heat dissipation positions through the rear side corresponding to the first mounting position; the motherboard mounting space is connected to the adjacent first heat dissipation positions by a connecting channel; and a connecting groove is recessed between two adjacent first heat dissipation positions on the first mounting position.

4. The supporting frame structure as described in claim 1, characterized in that, The power connection location includes a power connection installation space located next to the first mounting position for positioning and assembling the power connection component. The power connection installation space has a power connection opening on the outer periphery of the frame plate. The frame plate has a power connection cable groove that connects the motherboard mounting space and the power connection installation space.

5. The supporting frame structure as described in claim 1, characterized in that, The frame plate is provided with a panel mounting space for positioning and assembling the control panel on the side corresponding to the first mounting position; a control cable groove is provided on the frame plate to connect the motherboard mounting space and the panel mounting space.

6. The support frame structure as described in any one of claims 1 to 5, characterized in that, The frame plate includes: A first frame plate is located on the front side, and a first mounting position is provided on the front side of the first frame plate; a first mounting cavity is provided on the rear side of the first frame plate next to the first mounting position; the first mounting cavity communicates with the first mounting position; and a first connecting structure is provided on the rear side of the first frame plate. A second frame plate is located on the rear side, and a second mounting cavity is provided on the front side of the second frame plate corresponding to the position of the first mounting cavity. The first mounting cavity and the second mounting cavity are combined to form the motherboard mounting space. The front side of the second frame plate has a second connecting structure that cooperates with the first connecting structure. The first frame plate and the second frame plate are assembled and connected through the first connecting structure and the second connecting structure. The first frame plate and / or the second frame plate correspond to the power connection position next to the motherboard mounting space.

7. A heater, characterized in that, include: The support frame structure as described in any one of claims 1 to 6; A first heating plate is arranged in the shape of a flat plate and is positioned in the first mounting position. The motherboard assembly is positioned and assembled in the motherboard mounting space; the motherboard assembly extends a power connection terminal to the power connection position, and the motherboard assembly is electrically connected to the first heating plate.

8. The heater as described in claim 7, characterized in that, A second mounting position is provided on the rear side of the frame plate. The second mounting position is connected to the motherboard mounting space. A second heating plate is provided on the second mounting position. The second heating plate is electrically connected to the motherboard assembly.

9. The heater as described in claim 7, characterized in that, The frame plate is positioned and assembled with a back plate on its rear side, and the back plate is provided with an external connector for positioning and fitting with an external installation position; a decorative layer is provided on the surface of the first heating plate.