Combined sensor and electronic equipment

Abstract

The utility model belongs to the technical field of chip packaging, and relates to a combined sensor and electronic equipment. The combined sensor comprises a shell, a microphone MEMS chip, a pressure sensor MEMS chip, a gas sensor MEMS chip and a conversion unit, the shell is provided with an outer vent hole, the microphone MEMS chip, the pressure sensor MEMS chip and the gas sensor MEMS chip are all arranged in the shell, and the microphone MEMS chip, the pressure sensor MEMS chip and the gas sensor MEMS chip are all connected with the conversion unit. And any one of the microphone MEMS chip, the pressure sensor MEMS chip and the gas sensor MEMS chip is arranged corresponding to the outer vent hole. According to the combined sensor and the electronic equipment provided by the utility model, the combined sensor can enable a plurality of sensors to acquire required physical signals and convert the required physical signals into corresponding digital signals by adopting one outer vent hole, so that the production cost of the combined sensor is effectively reduced, and the structural flexibility is improved; and meanwhile, the waterproof performance of the product can be effectively improved by adopting the design of the outer vent hole, and the use feeling is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and in particular to a combined sensor and electronic device. Background Technology

[0002] Currently, sensors are increasingly widely used in electronic products, such as microphone audio receivers, pressure sensors, and gas sensors. These sensors require air convection and are both sound and air permeable. If a hole were made for each sensor individually, it would increase production costs, reduce structural flexibility, and be detrimental to waterproofing.

[0003] Therefore, there is an urgent need for a product that can solve the above problems. Utility Model Content

[0004] The purpose of this invention is to solve the technical problems of high production cost, low structural flexibility and poor waterproofing of existing combined sensors.

[0005] To solve the above-mentioned technical problems, this utility model provides a combined sensor, which adopts the following technical solution:

[0006] The combined sensor includes a housing with an external vent, and a microphone MEMS chip, a pressure sensor MEMS chip, a gas sensor MEMS chip, and a conversion unit, all disposed within the housing. The microphone MEMS chip, the pressure sensor MEMS chip, and the gas sensor MEMS chip are all connected to the conversion unit, and any one of the microphone MEMS chip, the pressure sensor MEMS chip, and the gas sensor MEMS chip is configured to correspond to the external vent.

[0007] A substrate is provided on one side of the housing, the external vent is opened on the substrate, and the microphone MEMS chip, the pressure sensor MEMS chip and the gas sensor MEMS chip are all disposed on the substrate;

[0008] The microphone MEMS chip has a vent hole, the pressure sensor MEMS chip has a first internal vent hole, and the gas sensor MEMS chip has a second internal vent hole.

[0009] Optionally, the microphone MEMS chip is configured corresponding to the external vent.

[0010] The distance between the pressure sensor MEMS chip and the external vent is less than the distance between the gas sensor MEMS chip and the external vent, or the distance between the pressure sensor MEMS chip and the external vent is greater than the distance between the gas sensor MEMS chip and the external vent.

[0011] Optionally, the pressure sensor MEMS chip is configured corresponding to the external vent.

[0012] The distance between the microphone MEMS chip and the external vent is less than the distance between the gas sensor MEMS chip and the external vent, or the distance between the microphone MEMS chip and the external vent is greater than the distance between the gas sensor MEMS chip and the external vent.

[0013] Optionally, the gas sensor MEMS chip is configured corresponding to the external vent.

[0014] The distance between the microphone MEMS chip and the external vent is less than the distance between the pressure sensor MEMS chip and the external vent, or the distance between the microphone MEMS chip and the external vent is greater than the distance between the pressure sensor MEMS chip and the external vent.

[0015] Optionally, the conversion unit is a combined sensor ASIC chip.

[0016] Optionally, the conversion unit includes a microphone ASIC chip, a pressure sensor ASIC chip, and a gas sensor ASIC chip. The microphone ASIC chip is electrically connected to the microphone MEMS chip, the pressure sensor ASIC chip is electrically connected to the microphone ASIC chip, and the gas sensor ASIC chip is electrically connected to the pressure sensor ASIC chip.

[0017] Optionally, the microphone ASIC chip and the pressure sensor ASIC chip are respectively stacked on any one of the microphone MEMS chip, the pressure sensor MEMS chip and the gas sensor MEMS chip;

[0018] The gas sensor ASIC chip is stacked on any one of the microphone MEMS chip, the pressure sensor MEMS chip, and the gas sensor MEMS chip, or it is embedded in the substrate.

[0019] To solve the above-mentioned technical problems, this utility model also provides an electronic device, which adopts the following technical solution:

[0020] The electronic device includes the aforementioned combined sensor.

[0021] Compared with the prior art, the combined sensor and electronic device provided by this utility model have the following advantages:

[0022] The housing of this combined sensor has an external vent. One of the microphone MEMS chip, pressure sensor MEMS chip, and gas sensor MEMS chip has a corresponding external vent. Gas enters the accommodating cavity through the external vent. The MEMS chip with the corresponding external vent first collects the physical signal of the gas. Then, the gas flows sequentially into the other two MEMS chips from near to far along the distance from the external vent, and the other two MEMS chips also collect the physical signal of the gas. This means that the combined sensor can use a single external vent to allow multiple sensors to acquire the required physical signals and convert them into corresponding digital signals. This effectively reduces the production cost of the combined sensor, increases structural flexibility, and improves the waterproof performance of the product, significantly enhancing the user experience. Attached Figure Description

[0023] To more clearly illustrate the solutions in this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0024] Figure 1 This is a schematic diagram of the planar structure of the combined sensor in one embodiment of the present invention;

[0025] Figure 2 This is a schematic diagram of the planar structure of the combined sensor in another embodiment of the present invention.

[0026] The labels in the attached diagram are as follows:

[0027] 100. Combined sensors;

[0028] 10. Housing; 11. Substrate; 12. External vent; 20. Microphone MEMS chip; 21. Vent hole; 30. Pressure sensor MEMS chip; 31. First internal vent; 40. Gas sensor MEMS chip; 41. Second internal vent; 50. Microphone ASIC chip; 60. Pressure sensor ASIC chip; 70. Gas sensor ASIC chip. Detailed Implementation

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. For example, terms such as “length,” “width,” “upper,” “lower,” “left,” “right,” “front,” “rear,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer” indicate orientations or positions based on the orientations or positions shown in the accompanying drawings and are merely for ease of description and should not be construed as limiting the invention.

[0030] The terms "comprising" and "having," and any variations thereof, in the specification, claims, and accompanying drawings of this utility model are intended to cover non-exclusive inclusion; the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish different objects, not to describe a specific order. "A plurality of" means two or more, unless otherwise explicitly specified.

[0031] In the description, claims, and accompanying drawings of this utility model, when an element is referred to as "fixed to," "mounted to," "set on," or "connected to" another element, it can be directly or indirectly located on that other element. For example, when an element is referred to as "connected to" another element, it can be directly or indirectly connected to that other element.

[0032] Furthermore, the reference to "embodiment" herein means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the present invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0033] This utility model embodiment provides a combined sensor 100, such as... Figure 1 and Figure 2As shown, the combined sensor 100 includes a housing 10 with an external vent 12, a microphone MEMS chip 20, a pressure sensor MEMS chip 30, a gas sensor MEMS chip 40, and a conversion unit. The microphone MEMS chip 20 measures sound waves, the pressure sensor MEMS chip 30 measures air pressure, and the gas sensor MEMS chip 40 measures gas concentration. The microphone MEMS chip 20, pressure sensor MEMS chip 30, gas sensor MEMS chip 40, and conversion unit can all be housed within the housing 10. Furthermore, the microphone MEMS chip 20, pressure sensor MEMS chip 30, and gas sensor MEMS chip 40 can all be electrically connected to the conversion unit. Any one of the microphone MEMS chip 20, pressure sensor MEMS chip 30, and gas sensor MEMS chip 40 can be positioned corresponding to the external vent 12, allowing gas to enter the housing 10 through the external vent 12 and flow into each MEMS chip sequentially from closest to furthest from the external vent 12.

[0034] Understandably, the working principle of this combined sensor 100 is roughly as follows:

[0035] First, gas enters the MEMS chip located at the external vent 12 through the external vent 12, and the MEMS chip collects the required gas physical signal. Then, the gas flows to another MEMS chip close to the aforementioned MEMS chip, and this MEMS chip collects the required gas physical signal. Next, the gas continues to flow to the MEMS chip furthest from the external vent 12, and this MEMS chip also collects the required gas physical signal. Finally, the conversion unit converts the gas physical signals collected by each MEMS chip into digital signals and sends them to the main controller.

[0036] In summary, compared with existing technologies, this combined sensor 100 has at least the following beneficial effects:

[0037] The housing 10 of the combined sensor 100 has an external vent 12. One of the following three MEMS chips—microphone MEMS chip 20, pressure sensor MEMS chip 30, and gas sensor MEMS chip 40—is positioned corresponding to the external vent 12. Gas enters the accommodating cavity through the external vent 12. The MEMS chip positioned corresponding to the external vent 12 first acquires the physical signal of the gas. Then, the gas flows sequentially from near to far along the external vent 12 into the other two MEMS chips, which also acquire the physical signal of the gas. This means that the combined sensor 100, using only one external vent 12, allows multiple sensors to acquire the required physical signals and convert them into corresponding digital signals. This effectively reduces the production cost of the combined sensor 100, increases its structural flexibility, and improves the product's waterproof performance, significantly enhancing the user experience.

[0038] To enable those skilled in the art to better understand the present invention, the following will be described in conjunction with the appendix. Figure 1 and Figure 2 The technical solutions in the embodiments of this utility model will be clearly and completely described.

[0039] In some embodiments, such as Figure 1 or Figure 2 As shown, the microphone MEMS chip 20 may have a vent 21, the pressure sensor MEMS chip 30 may have a first internal vent 31, and the gas sensor MEMS chip 40 may have a second internal vent 41. Understandably, gas flowing into the microphone MEMS chip 20 can flow to other MEMS chips through the vent 21. The first internal vent 31 of the pressure sensor MEMS chip 30 and the second internal vent 41 of the gas sensor MEMS chip 40 are similar and will not be described further here.

[0040] In some embodiments, the gas sensor MEMS chip 40 can also be used in conjunction with a barometer and a temperature sensor, and the gas sensor MEMS chip 40 and the barometer share the same temperature sensor for calibration.

[0041] In some embodiments, such as Figure 1 or Figure 2 As shown, a substrate 11 can be provided on one side of the housing 10, and an external vent 12 can be opened on the substrate 11. The external vent 12 can connect the external environment with the inside of the housing 10. The microphone MEMS chip 20, the pressure sensor MEMS chip 30 and the gas sensor MEMS chip 40 can all be disposed on the substrate 11.

[0042] In some embodiments, as a configuration of the conversion unit, the conversion unit can be configured as a combined sensor 100 ASIC chip, that is, the combined sensor 100 has only one ASIC chip, and all gas physical signals collected by MEMS chips are converted into corresponding digital signals by this single combined sensor 100 ASIC chip. This configuration enables the combined sensor 100 to be lightweight and reduces costs.

[0043] In some embodiments, as another way of setting up the conversion unit, such as Figure 1 or Figure 2 As shown, the conversion unit includes a microphone ASIC chip 50, a pressure sensor ASIC chip 60, and a gas sensor ASIC chip 70. The microphone ASIC chip 50 can be electrically connected to the microphone MEMS chip 20, the pressure sensor ASIC chip 60 can be electrically connected to the microphone ASIC chip 50, and the gas sensor ASIC chip 70 can be electrically connected to the pressure sensor ASIC chip 60. This configuration ensures that the gas physical signals collected by each MEMS chip are converted by the corresponding ASIC chip, effectively improving the efficiency of signal processing.

[0044] Based on another configuration of the conversion unit, the microphone ASIC chip 50, pressure sensor ASIC chip 60, and gas sensor ASIC chip 70 may be configured in, but are not limited to, the following two ways:

[0045] The first type: such as Figure 1 As shown, the microphone ASIC chip and the pressure sensor ASIC chip 60 can be stacked on any one of the microphone MEMS chip 20, the pressure sensor MEMS chip 30 and the gas sensor MEMS chip 40, respectively, and the gas sensor ASIC chip 70 can be embedded in the substrate 11.

[0046] The second type: such as Figure 2 As shown, the microphone ASIC chip, pressure sensor ASIC chip 60, and gas sensor ASIC chip 70 can be stacked on any one of the microphone MEMS chip 20, pressure sensor MEMS chip 30, and gas sensor MEMS chip 40, respectively.

[0047] Understandably, the two layout methods of the microphone ASIC chip 50, pressure sensor ASIC chip 60, and gas sensor ASIC chip 70 effectively meet the design requirements for product miniaturization.

[0048] The combined sensor 100 provided in this embodiment of the utility model has a microphone MEMS chip 20, a pressure sensor MEMS chip 30, and a gas sensor MEMS chip 40 arranged in order of priority from high to low, corresponding to the distance from the external vent 12 from near to far, according to different application scenarios. The following will be briefly described through six embodiments.

[0049] Example 1

[0050] The microphone MEMS chip 20 is positioned corresponding to the external vent 12. Based on this, as follows: Figure 1 or Figure 2 As shown, the distance between the pressure sensor MEMS chip 30 and the external vent 12 is set to be less than the distance between the gas sensor MEMS chip 40 and the external vent 12.

[0051] Understandably, the working principle of this deployment method is roughly as follows:

[0052] First, gas enters the microphone MEMS chip 20 through the external vent 12, and the microphone MEMS chip 20 collects the required gas physical signals; then, the gas flows to the pressure sensor MEMS chip 30, and the pressure sensor MEMS chip 30 collects the required gas physical signals; finally, the gas continues to flow to the gas sensor MEMS chip 40, and the gas sensor MEMS chip 40 collects the required gas physical signals.

[0053] Example 2

[0054] The microphone MEMS chip 20 is configured to correspond to the external vent 12. Based on this, the distance between the pressure sensor MEMS chip 30 and the external vent 12 is set to be greater than the distance between the gas sensor MEMS chip 40 and the external vent 12.

[0055] Understandably, the working principle of this deployment method is roughly as follows:

[0056] First, the gas enters the microphone MEMS chip 20 through the external vent 12, and the microphone MEMS chip 20 collects the required gas physical signal; then, the gas flows to the gas sensor MEMS chip 40, and the gas sensor MEMS chip 40 collects the required gas physical signal; finally, the gas continues to flow to the pressure sensor MEMS chip 30, and the pressure sensor MEMS chip 30 collects the required gas physical signal.

[0057] Example 3

[0058] The pressure sensor MEMS chip 30 is configured to correspond to the external vent 12. Based on this, the distance between the microphone MEMS chip 20 and the external vent 12 is set to be less than the distance between the gas sensor MEMS chip 40 and the external vent 12.

[0059] Understandably, the working principle of this deployment method is roughly as follows:

[0060] First, the gas enters the pressure sensor MEMS chip 30 through the external vent 12, and the pressure sensor MEMS chip 30 collects the required gas physical signal; then, the gas flows to the microphone MEMS chip 20, and the microphone MEMS chip 20 collects the required gas physical signal; finally, the gas continues to flow to the gas sensor MEMS chip 40, and the gas sensor MEMS chip 40 collects the required gas physical signal.

[0061] Example 4

[0062] The pressure sensor MEMS chip 30 is configured to correspond to the external vent 12. Based on this, the distance between the microphone MEMS chip 20 and the external vent 12 is set to be greater than the distance between the gas sensor MEMS chip 40 and the external vent 12.

[0063] Understandably, the working principle of this deployment method is roughly as follows:

[0064] First, the gas enters the pressure sensor MEMS chip 30 through the external vent 12, and the pressure sensor MEMS chip 30 collects the required gas physical signal. Then, the gas flows to the gas sensor MEMS chip 40, and the gas sensor MEMS chip 40 collects the required gas physical signal. Finally, the gas continues to flow to the microphone MEMS chip 20, and the microphone MEMS chip 20 collects the required gas physical signal.

[0065] Example 5

[0066] The gas sensor MEMS chip 40 is positioned corresponding to the external vent 12. Based on this, the distance between the microphone MEMS chip 20 and the external vent 12 is less than the distance between the pressure sensor MEMS chip 30 and the external vent 12.

[0067] Understandably, the working principle of this deployment method is roughly as follows:

[0068] First, gas enters the gas sensor MEMS chip 40 through the external vent 12, and the gas sensor MEMS chip 40 collects the required gas physical signals; then, the gas flows to the microphone MEMS chip 20, and the microphone MEMS chip 20 collects the required gas physical signals; finally, the gas continues to flow to the pressure sensor MEMS chip 30, and the pressure sensor MEMS chip 30 collects the required gas physical signals.

[0069] Example 6

[0070] The gas sensor MEMS chip 40 is positioned corresponding to the external vent 12. Based on this, the distance between the microphone MEMS chip 20 and the external vent 12 is greater than the distance between the pressure sensor MEMS chip 30 and the external vent 12.

[0071] Understandably, the working principle of this deployment method is roughly as follows:

[0072] First, gas enters the gas sensor MEMS chip 40 through the external vent 12, and the gas sensor MEMS chip 40 collects the required gas physical signals; then, the gas flows to the pressure sensor MEMS chip 30, and the pressure sensor MEMS chip 30 collects the required gas physical signals; finally, the gas continues to flow to the microphone MEMS chip 20, and the microphone MEMS chip 20 collects the required gas physical signals.

[0073] Based on the aforementioned combined sensor 100, this embodiment of the invention also provides an electronic device, wherein the electronic device includes the aforementioned combined sensor 100. The electronic device can be a sensor, a mobile phone, a tablet, a laptop, etc.

[0074] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A combined sensor, characterized in that, The device includes a housing with an external vent, and a microphone MEMS chip, a pressure sensor MEMS chip, a gas sensor MEMS chip, and a conversion unit, all disposed within the housing. The microphone MEMS chip, the pressure sensor MEMS chip, and the gas sensor MEMS chip are all connected to the conversion unit, and any one of the microphone MEMS chip, the pressure sensor MEMS chip, and the gas sensor MEMS chip is provided corresponding to the external vent. A substrate is provided on one side of the housing, the external vent is opened on the substrate, and the microphone MEMS chip, the pressure sensor MEMS chip and the gas sensor MEMS chip are all disposed on the substrate; The microphone MEMS chip has a vent hole, the pressure sensor MEMS chip has a first internal vent hole, and the gas sensor MEMS chip has a second internal vent hole.

2. The combined sensor according to claim 1, characterized in that, The microphone MEMS chip is configured corresponding to the external vent. The distance between the pressure sensor MEMS chip and the external vent is less than the distance between the gas sensor MEMS chip and the external vent, or the distance between the pressure sensor MEMS chip and the external vent is greater than the distance between the gas sensor MEMS chip and the external vent.

3. The combined sensor according to claim 1, characterized in that, The pressure sensor MEMS chip is configured corresponding to the external vent. The distance between the microphone MEMS chip and the external vent is less than the distance between the gas sensor MEMS chip and the external vent, or the distance between the microphone MEMS chip and the external vent is greater than the distance between the gas sensor MEMS chip and the external vent.

4. The combined sensor according to claim 1, characterized in that, The gas sensor MEMS chip is configured corresponding to the external vent. The distance between the microphone MEMS chip and the external vent is less than the distance between the pressure sensor MEMS chip and the external vent, or the distance between the microphone MEMS chip and the external vent is greater than the distance between the pressure sensor MEMS chip and the external vent.

5. The combined sensor according to claim 1, characterized in that, The conversion unit is a combined sensor ASIC chip.

6. The combined sensor according to claim 5, characterized in that, The conversion unit includes a microphone ASIC chip, a pressure sensor ASIC chip, and a gas sensor ASIC chip. The microphone ASIC chip is electrically connected to the microphone MEMS chip, the pressure sensor ASIC chip is electrically connected to the microphone ASIC chip, and the gas sensor ASIC chip is electrically connected to the pressure sensor ASIC chip.

7. The combined sensor according to claim 6, characterized in that, The microphone ASIC chip and the pressure sensor ASIC chip are respectively stacked on any one of the microphone MEMS chip, the pressure sensor MEMS chip and the gas sensor MEMS chip; The gas sensor ASIC chip is stacked on any one of the microphone MEMS chip, the pressure sensor MEMS chip, and the gas sensor MEMS chip, or it is embedded in the substrate.

8. An electronic device, characterized in that, The electronic device includes a combined sensor according to any one of claims 1 to 7.

Images