High-voltage low-leakage wafer test probe

Abstract

The utility model provides a high-voltage low-leakage wafer test probe. The high-voltage low-leakage wafer test probe comprises a protective tube; the two movable openings are formed in the sides, opposite to each other, of the outer surface of the protection pipe, sliding rods are fixedly connected to the bottoms of the inner walls of the two movable openings, auxiliary springs are arranged on the outer surfaces of the sliding rods, sliding pieces are slidably connected to the outer surfaces of the sliding rods, and movable rings are fixedly connected to the adjacent ends of the two sliding pieces; the opposite ends of the two sliding sheets are fixedly connected with connecting sheets, and the other ends of the two connecting sheets are provided with limiting assemblies. According to the high-voltage low-leakage wafer test probe provided by the utility model, a protection structure can be arranged on the outer surface of the test probe through the design, so that the protection effect can be achieved when the test probe is not used, the electric wafer test probe is prevented from being damaged by external force, and the test probe can be conveniently used next time.

Description

Technical Field

[0001] This utility model relates to the field of electrical wafer test probe technology, and in particular to a high-voltage, low-leakage wafer test probe. Background Technology

[0002] A test probe is a special electronic component, usually made of metal, used in the testing of electronic equipment, semiconductor chips, etc., to form an electrical connection with the surface of the object under test, so as to perform operations such as signal transmission, parameter measurement, and functional verification. It can accurately transmit the signals generated by the test equipment to the object under test and transmit the signals fed back by the object under test back to the test equipment, thereby realizing the detection and analysis of various performance indicators of the object under test.

[0003] High-voltage, low-leakage wafer testing is a critical step in the semiconductor manufacturing process. It aims to detect leakage current in wafers under high-voltage environments to ensure wafer quality and performance. This testing process requires the use of specialized electrical wafer test probes.

[0004] The contact pins of the wafer test probes are relatively thin and lack protective structures after use, making them prone to damage and affecting future use.

[0005] Therefore, it is necessary to provide a high-voltage, low-leakage wafer test probe to solve the above-mentioned technical problems. Utility Model Content

[0006] This invention provides a high-voltage, low-leakage wafer test probe, which solves the problem that the contact pins of the wafer test probe are relatively thin and lack a protective structure after use, making them easily damaged by external forces and affecting their next use.

[0007] To solve the above-mentioned technical problems, the high-voltage, low-leakage wafer test probe provided by this utility model includes: a protective tube;

[0008] Two movable openings are located on opposite sides of the outer surface of the protective tube. A sliding rod is fixedly connected to the bottom of the inner wall of each of the two movable openings. An auxiliary spring is provided on the outer surface of the sliding rod. A sliding plate is slidably connected to the outer surface of each sliding rod. A movable ring is fixedly connected to one adjacent end of each of the two sliding plates. A connecting plate is fixedly connected to one opposite end of each of the two sliding plates. A limit component is installed at the other end of each of the two connecting plates. A limit frame is installed on one opposite side of the outer surface of the protective tube. An external threaded tube is fixedly connected to the bottom end of the protective tube.

[0009] A test probe is mounted on the inner surface of a movable ring. The test probe includes a sleeve. A top probe is mounted on the top of the inner wall of the sleeve. A return spring is mounted on the bottom of the top probe. A bottom probe is mounted on the bottom of the return spring. A bayonet is provided at the bottom of the bottom probe. A locking head is installed inside the bayonet. A contact pin is fixedly connected to the bottom of the locking head.

[0010] The movable opening is opened from the top of the protective tube, but does not extend to the bottom of the protective tube. The position of the limiting frame and the movable opening are corresponding. Two rows of openings that connect with the limiting frame are opened on the other side of the limiting frame. The bottom of the slide is connected to the top of the auxiliary spring, and the bottom of the auxiliary spring is connected to the bottom of the inner wall of the movable opening.

[0011] Preferably, the top of the probe is fixedly connected to a connector, and the top of the connector has a connection port.

[0012] Preferably, each of the sliding pieces has a sliding hole at its top, and the top of the protective tube is fitted with a sealing cap;

[0013] The sliding hole facilitates the movement of the slider on the outer surface of the slider rod, and the sealing cover has an opening that allows the top probe to move up and down.

[0014] Preferably, the limiting component includes a fixing plate, and a support spring is fixedly connected to one end of the fixing plate;

[0015] The support spring provides tension.

[0016] Preferably, the other end of the support spring is fixedly connected to a support plate, and the other end of the support plate is fixedly connected to one end of the inner wall of the movable tube;

[0017] One end of the movable tube is open, and a pull-out rod is installed inside the support spring.

[0018] Preferably, two limiting frames are fixedly connected to one end of the outer surface of the movable tube, and the limiting frames are L-shaped;

[0019] The two limit brackets are located on opposite sides of the outer surface of the movable tube, and the limit brackets can be inserted into the opening of the limit frame.

[0020] Compared with related technologies, the high-voltage, low-leakage wafer test probe provided by this utility model has the following advantages:

[0021] Beneficial effects:

[0022] This invention provides a high-voltage, low-leakage wafer test probe. To enhance protection of the wafer test probe when not in use, movable openings are provided on both sides of the protective tube. Two limiting frames with openings are then installed adjacent to the movable openings. A movable ring is then mounted on the outer surface of two sliding rods via a sliding piece, with the bottom of the sliding piece connected to the top of an auxiliary spring. A limiting component is installed at the opposite ends of the two sliding pieces via a connecting piece. When the movable ring moves to the corresponding position, it can be locked in place, and the detection end of the test probe is retracted into the protective tube, providing protection. In actual use, the test probe is first installed on the inner surface of the movable ring, and the contact pin is installed at the bottom end of the bottom probe via a clamp. This design creates a protective structure on the outer surface of the test probe, providing protection when the test probe is not in use, preventing damage from external forces, and facilitating future use of the test probe. Attached Figure Description

[0023] Figure 1 A schematic diagram of a preferred embodiment of the high-voltage, low-leakage wafer test probe provided by this utility model;

[0024] Figure 2 A schematic diagram of the spring structure is provided for this utility model;

[0025] Figure 3 This utility model provides a structural schematic diagram of an externally threaded tube;

[0026] Figure 4 Provided for this utility model Figure 3 An enlarged view of point A shown;

[0027] Figure 5 A schematic diagram of the structure of the support spring provided for this utility model.

[0028] The following are the labels in the diagram: 1. Protective tube, 2. Connector, 3. Connecting port, 4. Sealing cap, 5. Movable port, 6. Limiting frame, 7. Test probe, 701. Sleeve, 702. Bottom probe, 703. Contact pin, 704. Return spring, 705. Top probe, 706. Bayonet, 707. Clamp, 8. External threaded tube, 9. Sliding hole, 10. Movable ring, 11. Connecting piece, 12. Sliding piece, 13. Auxiliary spring, 14. Slip ring, 15. Sliding rod, 16. Limiting assembly, 161. Fixed plate, 162. Support spring, 163. Connecting plate, 164. Movable tube, 165. Limiting frame. Detailed Implementation

[0029] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0030] Please refer to the following: Figure 1 , Figure 2, Figure 3 , Figure 4 and Figure 5 ,in, Figure 1 A schematic diagram of a preferred embodiment of the high-voltage, low-leakage wafer test probe provided by this utility model; Figure 2 A schematic diagram of the spring structure is provided for this utility model; Figure 3 This utility model provides a structural schematic diagram of an externally threaded tube; Figure 4 Provided for this utility model Figure 3 An enlarged view of point A shown; Figure 5 A schematic diagram of the supporting spring is provided for this utility model. The high-voltage, low-leakage wafer test probe includes: a protective tube 1;

[0031] Two movable openings 5 ​​are opened on opposite sides of the outer surface of the protective tube 1. A sliding rod 15 is fixedly connected to the bottom of the inner wall of each of the two movable openings 5. An auxiliary spring 13 is provided on the outer surface of the sliding rod 15. A sliding piece 12 is slidably connected to the outer surface of each of the two sliding pieces 15. A movable ring 10 is fixedly connected to one adjacent end of each of the two sliding pieces 12. A connecting piece 11 is fixedly connected to one opposite end of each of the two sliding pieces 12. A limit component 16 is installed on the other end of each of the two connecting pieces 11. A limit frame 6 is installed on one opposite side of the outer surface of the protective tube 1. An external threaded tube 8 is fixedly connected to the bottom end of the protective tube 1.

[0032] Test probe 7 is installed on the inner surface of movable ring 10. Test probe 7 includes sleeve 701. Top probe 705 is installed on the top of the inner wall of sleeve 701. Reset spring 704 is installed at the bottom of top probe 705. Bottom probe 702 is installed at the bottom of reset spring 704. A bayonet 706 is opened at the bottom of bottom probe 702. A locking head 707 is installed inside the bayonet 706. A contact pin 703 is fixedly connected to the bottom of locking head 707.

[0033] The movable opening 5 is opened from the top of the protective tube 1, but does not penetrate to the bottom of the protective tube 1. The position of the limiting frame 6 corresponds to the movable opening 5. Two rows of openings that connect with the limiting frame 165 are opened on the other side of the limiting frame 6. The bottom of the sliding plate 12 is connected to the top of the auxiliary spring 13. The bottom of the auxiliary spring 13 is connected to the bottom of the inner wall of the movable opening 5. The movable ring 10 and the protective tube 1 are both made of insulating material. The external threaded tube 8 can fix the protective tube 1 in the corresponding position.

[0034] The top of the probe 705 is fixedly connected to a connector 2, and the top of the connector 2 is provided with a connection port 3;

[0035] Connection port 3 facilitates the connection of the top probe 705 and external lines.

[0036] Each of the sliding plates 12 has a sliding hole 9 at its top, and the top of the protective tube 1 is fitted with a sealing cap 4.

[0037] The sliding hole 9 facilitates the movement of the sliding plate 12 on the outer surface of the sliding rod 15, and the sealing cover 4 has an opening that allows the top probe 705 to move up and down.

[0038] The limiting component 16 includes a fixing plate 161, and a support spring 162 is fixedly connected to one end of the fixing plate 161.

[0039] The support spring 162 provides tension, and the fixed plate 161 is connected by bolts and connecting piece 11.

[0040] The other end of the support spring 162 is fixedly connected to the support plate 163, and the other end of the support plate 163 is fixedly connected to one end of the inner wall of the movable tube 164.

[0041] One end of the movable tube 164 is open, and the support spring 162 has a pull rod inside, which can increase the stability of the movable tube 164.

[0042] Two limiting brackets 165 are fixedly connected to one end of the outer surface of the movable tube 164. The limiting brackets 165 are L-shaped.

[0043] Two limiting brackets 165 are located on opposite sides of the outer surface of the movable tube 164. The limiting brackets 165 can be inserted into the opening of the limiting frame 6 to fix the movable ring 10.

[0044] The working principle of the high-voltage, low-leakage wafer test probe provided by this utility model is as follows:

[0045] Movable openings 5 ​​are provided on both sides of the protective tube 1. Two limiting frames 6 with openings are then installed adjacent to the positions of the movable openings 5. The movable ring 10 is then installed on the outer surface of the two sliding rods 15 via a sliding piece 12, with the bottom of the sliding piece 12 connected to the top of the auxiliary spring 13. A limiting component 16 is installed at the opposite ends of the two sliding pieces 12 via a connecting piece 11. This allows the movable ring 10 to be locked in place after moving to the corresponding position, and also provides protection when the detection end of the test probe 7 is retracted into the protective tube 1. In actual use, the test probe 7 is first installed on the inner surface of the movable ring 10, and the contact pin 703 is installed on the bottom via a clamp 707. When needed, the bottom end of probe 702 is first fixed in the corresponding position by the protective tube 1 through the external threaded tube 8. Then, simply pull the limiting component 16 to release the restriction on the movable ring 10, and the movable ring 10 can be pushed down to compress the auxiliary spring 13, allowing the contact pin 703 and bottom probe 702 of the test probe 7 to protrude from the protective tube 1. After that, release the limiting component 16 to lock the movable ring 10, and the high voltage and low leakage test can be performed on the wafer. After the test is completed, simply pull the limiting component 16 to reset the movable ring 10 under the pushing force of the auxiliary spring 13, and the bottom probe 702 and contact pin 703 of the test probe 7 can be retracted into the interior of the protective tube 1 for protection.

[0046] Compared with related technologies, the high-voltage, low-leakage wafer test probe provided by this utility model has the following advantages:

[0047] Beneficial effects:

[0048] To enhance the protection of the wafer test probe when not in use, movable openings 5 ​​are provided on both sides of the protective tube 1. Two limiting frames 6 with openings are then installed adjacent to the movable openings 5. A movable ring 10 is then mounted on the outer surface of two sliding rods 15 via a slider 12, with the bottom of the slider 12 connected to the top of the auxiliary spring 13. A limiting component 16 is installed at the opposite ends of the two sliders 12 via a connecting piece 11. When the movable ring 10 moves to the corresponding position, it can be locked in place, and the detection end of the test probe 7 is retracted into the protective tube 1, providing protection. In actual use, the test probe 7 is first installed on the inner surface of the movable ring 10, and the contact pin 703 is installed at the bottom end of the bottom probe 702 via a clamp 707. This design creates a protective structure on the outer surface of the test probe 7, providing protection when the test probe 7 is not in use, preventing damage from external forces, and facilitating the next use of the test probe 7.

[0049] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A high-voltage, low-leakage wafer test probe, characterized in that, include: Protective tube; Two movable openings are located on opposite sides of the outer surface of the protective tube. A sliding rod is fixedly connected to the bottom of the inner wall of each of the two movable openings. An auxiliary spring is provided on the outer surface of the sliding rod. A sliding plate is slidably connected to the outer surface of each sliding rod. A movable ring is fixedly connected to one adjacent end of each of the two sliding plates. A connecting plate is fixedly connected to one opposite end of each of the two sliding plates. A limit component is installed at the other end of each of the two connecting plates. A limit frame is installed on one opposite side of the outer surface of the protective tube. An external threaded tube is fixedly connected to the bottom end of the protective tube. The test probe is mounted on the inner surface of the movable ring. The test probe includes a sleeve. A top probe is mounted on the top of the inner wall of the sleeve. A return spring is mounted on the bottom end of the top probe. A bottom probe is mounted on the bottom end of the return spring. A bayonet is provided at the bottom end of the bottom probe. A locking head is installed inside the bayonet. A contact pin is fixedly connected to the bottom end of the locking head.

2. The high-voltage, low-leakage wafer test probe according to claim 1, characterized in that, The top of the probe is fixedly connected to a connector, and the top of the connector has a connection port.

3. The high-voltage, low-leakage wafer test probe according to claim 1, characterized in that, Each of the sliding plates has a sliding hole at its top, and the top of the protective tube is fitted with a sealing cap.

4. The high-voltage, low-leakage wafer test probe according to claim 1, characterized in that, The limiting component includes a fixing plate, and a support spring is fixedly connected to one end of each fixing plate.

5. The high-voltage, low-leakage wafer test probe according to claim 4, characterized in that, The other end of the support spring is fixedly connected to a support plate, and the other end of the support plate is fixedly connected to one end of the inner wall of the movable tube.

6. The high-voltage, low-leakage wafer test probe according to claim 5, characterized in that, Two limiting brackets are fixedly connected to one end of the outer surface of the movable tube, and the limiting brackets are L-shaped.

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