High-temperature heating test device of packaging device
The high-temperature heating test device, which integrates heating function and electrical performance test fixture, solves the problem of electrical testing of DFN 5×6 packaged devices in high-temperature environment, and realizes rapid heating, uniform heat conduction and precise temperature control, thereby improving test efficiency and equipment applicability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN SOUTHERN SEMICON TECH CO LTD
- Filing Date
- 2025-05-29
- Publication Date
- 2026-05-19
AI Technical Summary
Existing technologies make it difficult to perform electrical performance testing on DFN 5×6 packaged devices in high-temperature environments. Furthermore, traditional temperature chambers are bulky, have slow heating rates, poor temperature uniformity, and cannot accurately control temperature, resulting in low testing efficiency and high costs.
Design a high-temperature heating test device that integrates heating function and electrical performance test fixture, including heat dissipation module, heat insulation shell, heating element and heat conduction carrier. The device under test is placed through the positioning groove of the heat conduction carrier, and the electrical connection component is directly integrated on the heat conduction carrier to realize electrical connection, allowing electrical performance testing to be performed while heating.
It achieves rapid heating and uniform heat conduction of packaged devices in high-temperature environments, precise temperature control, avoids redundant energy consumption of overall fixture heating, and improves testing efficiency and equipment reuse rate.
Smart Images
Figure CN224263322U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of power semiconductor device testing technology, and in particular to a high-temperature heating test device for packaged devices. Background Technology
[0002] With the widespread adoption of power devices and high-density integrated circuits, DFN (Dual Flat No-leads) 5×6 packaged devices are widely used in automotive electronics, industrial control, and other fields due to their compact size and excellent heat dissipation performance. These devices require testing not only at room temperature but also at high temperatures to ensure their reliability under extreme conditions. However, existing testing technologies struggle to balance high-temperature environment simulation with efficient electrical connections, resulting in low testing efficiency and high costs.
[0003] Currently, testing of DFN5×6 packaged devices primarily relies on mechanical fixtures, which achieve electrical connections via probes or spring contacts. However, these fixtures can only operate at room temperature. To achieve high-temperature testing, traditional solutions require placing the fixture and device as a whole into a temperature chamber or environmental test chamber. However, temperature chambers are bulky, have slow heating rates, poor temperature uniformity, and cannot precisely control the temperature of individual devices, resulting in low testing efficiency. Furthermore, existing temperature chambers lack modular design, making them inflexible for adapting to different package sizes or test platforms, leading to low equipment reuse rates.
[0004] Therefore, there is a need for a high-temperature heating test device for packaged devices that can integrate heating function and electrical performance test fixture function, effectively solving the problem that packaged devices are difficult to test electrically in high-temperature environments. Utility Model Content
[0005] The purpose of this invention is to provide a high-temperature heating test device for packaged devices, which integrates heating function and electrical performance test fixture function, effectively solving the problem that packaged devices are difficult to test electrically in high-temperature environments.
[0006] To achieve the above objectives, this utility model provides a high-temperature heating test device for packaged devices, including a heat dissipation module, a heat insulation shell, a heating element, and a heat-conducting carrier. The heat insulation shell is fixed to the upper surface of the heat dissipation module, and a heat insulation mounting cavity is provided inside the heat insulation shell. The heating element and the heat-conducting carrier are arranged sequentially from bottom to top in the heat insulation mounting cavity, with the bottom surface of the heating element contacting the heat dissipation module and the top surface of the heating element contacting the heat-conducting carrier. The cable of the heating element passes through the heat insulation shell and is used to connect to an external temperature control system. The top surface of the heat-conducting carrier is provided with a positioning groove for placing the device under test, and the heat-conducting carrier is provided with an electrical connection component that forms an electrical connection between the device under test located in the positioning groove and an external test platform.
[0007] Preferably, the contact surface between the heating element and the heat-conducting carrier is provided with thermally conductive silicone grease.
[0008] Preferably, the heat-insulating outer shell includes a flip-top cover and an assembly shell. The assembly shell is fixed to the upper surface of the heat dissipation module. The heat-insulating mounting cavity is formed vertically through the assembly shell. The flip-top cover is rotatably connected to the upper part of the assembly shell. The heat-insulating mounting cavity is opened or closed by rotating the flip-top cover relative to the assembly shell.
[0009] Preferably, the flip-top cover is provided with a locking member, which is used to lock the flip-top cover to the assembly housing when the flip-top cover is rotated and closed relative to the assembly housing.
[0010] Preferably, the flip-top cover is provided with a fixing member, which is used to lock the device under test placed in the positioning groove so that the device under test is in close contact with the heat-conducting carrier.
[0011] Preferably, the heat-conducting carrier is detachably disposed within the insulation mounting cavity.
[0012] Preferably, the thermally conductive carrier includes a device carrier and a conductive carrier arranged vertically, the positioning groove is formed on the top surface of the device carrier, one end of the electrical connection component passes through the positioning groove and is used to electrically connect with the device under test located in the positioning groove, and the other end of the electrical connection component passes through the conductive carrier and is used to electrically connect with the external test platform.
[0013] Preferably, the electrical connection assembly includes spring probes and conductive copper sheets. A plurality of spring probes pass through the device carrier and are inserted into the positioning groove. The top of the spring probes is used to contact and connect with the pins of the device under test. A plurality of conductive copper sheets are respectively embedded in the upper surface of the conductive carrier. One end of the conductive copper sheet is in contact with the spring probe, and the other end of the conductive copper sheet extends out of the conductive carrier.
[0014] Preferably, the number of conductive copper sheets is three, namely a G-terminal copper sheet, a D-terminal copper sheet, and a S-terminal copper sheet. The device under test has four D-terminal pins on one side and one G-terminal pin and three S-terminal pins on the other side. The G-terminal copper sheet is connected to one G-terminal pin through one of the spring probes. The D-terminal copper sheet is connected to the four D-terminal pins one-to-one through the four spring probes. The S-terminal copper sheet is connected to the three S-terminal pins one-to-one through the three spring probes.
[0015] Preferably, the heating element is a PTC heater.
[0016] Compared with existing technologies, the high-temperature heating test device for packaged devices of this invention sets up a heating element and a heat-conducting carrier in the heat-insulating mounting cavity of the heat-insulating shell, places the device under test in the positioning groove of the heat-conducting carrier, and directly integrates the electrical connection component on the heat-conducting carrier. The electrical connection component can be used to form an electrical connection between the device under test located in the positioning groove and the external test platform. This allows electrical performance testing to be performed while the heating element heats the device under test through the heat-conducting carrier, without the need to transfer the device under test to a temperature chamber or environmental test chamber. Therefore, the high-temperature heating test device for packaged devices of this invention integrates heating function and electrical performance testing fixture function, effectively solving the problem that packaged devices are difficult to test electrically in high-temperature environments. Secondly, the high-temperature heating test device for packaged devices of this utility model achieves rapid heating and uniform heat conduction of the device under test through the direct contact design between the heating element and the heat conduction carrier, combined with the dynamic thermal balance of the heat dissipation module. At the same time, it focuses on the local heating of the device under test itself, avoiding the redundant energy consumption of traditional temperature chambers heating the entire fixture. It can achieve precise temperature control and can adjust the heating power in real time through the linkage between the heating element and the external temperature control system to ensure the dynamic stability of the temperature during the test. Attached Figure Description
[0017] Figure 1 This is a three-dimensional structural diagram of the high-temperature heating test device for the packaged device of this utility model.
[0018] Figure 2 This is a cross-sectional view of the high-temperature heating test device for the packaged device of this utility model.
[0019] Figure 3 This is an exploded view of the high-temperature heating test device for the packaged device of this utility model after the heat dissipation module has been removed.
[0020] Figure 4 This is a structural diagram of the heat-insulating shell of this utility model.
[0021] Figure 5 This is an exploded view of the heat-conducting carrier of this utility model.
[0022] Figure 6 This is a three-dimensional structural diagram of one embodiment of the device under test.
[0023] Figure 7 yes Figure 6 The pin structure diagram of the device under test is shown.
[0024] Figure 8 This is a connection diagram of the electrical connection component of this utility model and the device under test.
[0025] Figure 9This is a connection diagram of the high-temperature heating test device for the packaged device of this utility model with the external temperature control system and the external test platform. Detailed Implementation
[0026] To explain the technical content and structural features of this utility model in detail, the following description is provided in conjunction with the embodiments and accompanying drawings.
[0027] Please see Figures 1 to 3 The high-temperature heating test device 100 for the packaged device of this utility model includes a heat dissipation module 1, a heat insulation shell 2, a heating element 3, and a heat conduction carrier 4. The heat insulation shell 2 is fixed to the upper surface of the heat dissipation module 1. The heat insulation shell 2 is provided with a heat insulation mounting cavity 21. The heating element 3 and the heat conduction carrier 4 are arranged in the heat insulation mounting cavity 21 from bottom to top. The bottom surface of the heating element 3 is in contact with the heat dissipation module 1, and the top surface of the heating element 3 is in contact with the heat conduction carrier 4. The cable of the heating element 3 passes through the heat insulation shell 2 and is used to connect to an external temperature control system 300. The top surface of the heat conduction carrier 4 is provided with a positioning groove 41 for placing the device under test 200. The heat conduction carrier 4 is provided with an electrical connection component 5 that forms an electrical connection between the device under test 200 located in the positioning groove 41 and the external test platform 400.
[0028] The high-temperature heating test device 100 for packaged devices of this utility model sets up a heating element 3 and a heat-conducting carrier 4 in the heat-insulating mounting cavity 21 of the heat-insulating shell 2. The device under test 200 is placed in the positioning groove 41 of the heat-conducting carrier 4, and the electrical connection component 5 is directly integrated on the heat-conducting carrier 4. The device under test 200 located in the positioning groove 41 can be electrically connected to the external test platform 400 by the electrical connection component 5. This allows electrical performance testing to be performed while the heating element 3 heats the device under test 200 through the heat-conducting carrier 4, effectively solving the problem that it is difficult to perform electrical testing on packaged devices in a high-temperature environment.
[0029] In one embodiment, thermal grease is provided on the contact surface between the heating element 3 and the heat-conducting carrier 4. On the one hand, the thermal grease can fill the gap between the heating element 3 and the heat-conducting carrier 4; on the other hand, the thermal grease can reduce thermal resistance and enhance the heat conduction efficiency of the heating element 3 to the heat-conducting carrier 4.
[0030] Please see Figures 2 to 4In one embodiment, the thermal insulation shell 2 includes a flip-top cover 22 and an assembly shell 23. The assembly shell 23 is fixed to the upper surface of the heat dissipation module 1. The thermal insulation mounting cavity 21 is formed vertically through the assembly shell 23. The flip-top cover 22 is rotatably connected to the upper part of the assembly shell 23. The thermal insulation mounting cavity 21 is opened or closed by rotating the flip-top cover 22 relative to the assembly shell 23. By driving the flip-top cover 22 to rotate and open relative to the assembly shell 23, the thermal insulation mounting cavity 21 is opened, thereby facilitating the placement of the device under test 200 into the positioning groove 41 of the heat-conducting carrier 4. By driving the flip-top cover 22 to rotate and close relative to the assembly shell 23, the thermal insulation mounting cavity 21 is covered. Specifically, the assembly shell 23 can be fixed to the surface of the heat dissipation module 1 by bolts, and the flip-top cover 22 is mounted on the upper part of the assembly shell 23 by hinges. The thermal insulation shell 2 is mainly used to fix the device and reduce heat loss.
[0031] Specifically, the assembly housing 23 has a hollow structure and forms an insulated mounting cavity 21 inside. The heating element 3, the heat-conducting carrier 4, and the device under test 200 are placed in the insulated mounting cavity 21 from bottom to top. Furthermore, the assembly housing 23 is made of a high thermal resistance insulation material to reduce the heat dissipation of the heating element 3 into the air, thereby improving heating efficiency.
[0032] Please see Figure 2 and Figure 4 In one embodiment, the flip-top cover 22 is provided with a locking member 221, which is used to lock the flip-top cover 22 onto the assembly housing 23 when the flip-top cover 22 is rotated and closed relative to the assembly housing 23. When the flip-top cover 22 is driven to rotate and close relative to the assembly housing 23, the locking member 221 can be used to lock the flip-top cover 22 onto the assembly housing 23 to prevent the components inside the assembly housing 23 from falling off. Specifically, the locking member 221 adopts a locking screw structure. By rotating the locking member 221, the locking member 221 locks the flip-top cover 22 onto the assembly housing 23.
[0033] Please see Figure 2 and Figure 4 In one embodiment, the flip-top cover 22 is provided with a fixing member 222, which is used to lock the device under test 200 placed in the positioning groove 41 so that the device under test 200 is in close contact with the heat-conducting carrier 4. Specifically, the fixing member 222 adopts a fixing screw structure. By rotating the fixing member 222, the downward pressure of the fixing member 222 on the device under test 200 is increased, so that the device under test 200 is in close contact with the heat-conducting carrier 4.
[0034] Please see Figure 2 and Figure 3In one embodiment, the heat-conducting carrier 4 is detachably disposed within the heat-insulating mounting cavity 21. The heat-conducting carrier 4 is a replaceable component; replacing it with different heat-conducting carriers 4 can adapt to the test device 200 with different packaging types, thereby improving the applicability of this device.
[0035] Please see Figure 2 and Figure 5 In one embodiment, the heat-conducting carrier 4 includes a device carrier 42 and a conductive carrier 43 arranged vertically. A positioning groove 41 is formed on the top surface of the device carrier 42. One end of the electrical connection component 5 passes through the positioning groove 41 and is used for electrical connection with the device under test 200 located in the positioning groove 41. The other end of the electrical connection component 5 passes through the conductive carrier 43 and is used for electrical connection with the external test platform 400. Specifically, the device carrier 42 and the conductive carrier 43 are tightly connected by adhesive or other means. Generally, the device carrier 42 and the conductive carrier 43 are considered as a single unit. The heat-conducting carrier 4 is made of a material with high thermal conductivity, and in this invention, a ceramic material is used. The lower surface of the heat-conducting carrier 4 is in contact with the heating element 3 through thermally conductive silicone grease. The heat from the heating element 3 is transferred to the device under test 200 through the heat-conducting carrier 4, heating the device under test 200 to the required test temperature.
[0036] Please see Figure 2 and Figure 5 In one embodiment, the electrical connection assembly 5 includes spring probes 51 and conductive copper sheets 52. Several spring probes 51 penetrate the device carrier 42 and are inserted into the positioning groove 41. The top of each spring probe 51 is used to contact the pins of the device under test 200. Several conductive copper sheets 52 are embedded in the upper surface of the conductive carrier 43. One end of each conductive copper sheet 52 contacts the spring probe 51, and the other end extends out of the conductive carrier 43. The electrode pins of the device under test 200 are led outwards through the spring probes 51 and conductive copper sheets 52. After the cables of the external test platform 400 are connected to the conductive copper sheets 52, an electrical connection can be formed between the device under test 200 and the test platform 400.
[0037] Please see Figures 6 to 8 In one embodiment, there are three conductive copper sheets 52, namely a G-terminal copper sheet 521, a D-terminal copper sheet 522, and a S-terminal copper sheet 523. One side of the device under test 200 has four D-terminal pins 201, and the other side has one G-terminal pin 202 and three S-terminal pins 203. The G-terminal copper sheet 521 is connected to one G-terminal pin 202 via a spring probe 51. The D-terminal copper sheet 522 is connected to the four D-terminal pins 201 one-to-one via the four spring probes 51. The S-terminal copper sheet 523 is connected to the three S-terminal pins 203 one-to-one via the three spring probes 51. In this embodiment, as... Figure 6 and Figure 7As shown, the device under test 200 is a DFN5*6 packaged device. The DFN5*6 packaged MOSFET is a field-effect transistor using dual flat no-leads packaging technology, featuring a compact structure and high performance. The package size is typically 5mm*6mm, with a thickness of approximately 0.8-1.0mm. The bottom surface features exposed thermal pads for direct soldering to the PCB to improve heat dissipation efficiency. A typical pin configuration is 8 pins. Figure 7 For example, the four pins in the upper half are the D pin 201, the first pin on the left side of the lower half is the G pin 202, and the last three pins are the S pin 203.
[0038] Specifically, such as Figure 8 As shown, the conductive copper plates 52, from left to right, represent the G electrode copper plate 521, the D electrode copper plate 522, and the S electrode copper plate 523, respectively. This electrode distribution corresponds to the pin distribution of the TO247 packaged device and can be adapted to the test sockets of most semiconductor testers. The G electrode copper plate 521 is connected to one G electrode pin 202 of the device under test 200 via one spring probe 51; the D electrode copper plate 522 is connected to four D electrode pins 201 of the device under test 200 via four spring probes 51; and the S electrode copper plate 523 is connected to three S electrode pins 203 of the device under test 200 via three spring probes 51.
[0039] Combination Figures 1 to 9 The specific usage method of the high-temperature heating test device 100 for the packaged device of this utility model is as follows:
[0040] Device installation: First, fix the assembly shell 23 of the insulation shell 2 to the heat dissipation module 1 with bolts. Then, place the heating element 3 into the insulation mounting cavity 21 of the assembly shell 23, and lead the cable of the heating element 3 out from the back of the assembly shell 23. Next, apply thermal grease to the bottom of the heat-conducting carrier 4, place it on top of the heating element 3, and finally, tightly connect the two by bolts or adhesive.
[0041] Assemble the device under test (DUT) 200: First, place the DUT 200 with the pads facing down into the square groove of the heat-conducting carrier 4, and position it correctly according to the pin arrangement, so that the pins of the DUT 200 correspond one-to-one with the spring probe 51 and the conductive copper sheet 52. Then, close the flip-top cover 22 of the heat insulation shell 2, and lock the flip-top cover 22 to the assembly shell 23 using the locking member 221. Press down the DUT 200 placed in the positioning groove 41 using the fixing member 222, so that the DUT 200 can make close contact with the spring probe 51.
[0042] High-temperature test: Connect the heating element 3's cable to the external temperature control system 300, and connect the external test platform 400's test cable to the conductive copper plate 52. Start the temperature control system 300 and maintain the heating element 3 at the test temperature for a period of time to allow the device under test 200 and the heating element 3 to reach thermal equilibrium. Start the external test platform 400 for electrical testing. After the test, turn off the temperature control system 300 and allow the heat from the heating element 3 to dissipate from the heat dissipation module 1, or add fans to both sides of the heat dissipation module 1 to enhance heat dissipation. Finally, open the flip-top cover 22 and remove the device under test 200.
[0043] In summary, the high-temperature heating test device 100 for packaged devices of this invention directly integrates the electrical connection component 5 onto the heat-conducting carrier 4. The electrical connection component 5 can be used to form an electrical connection between the device under test 200 located in the positioning groove 41 and the external test platform 400. This allows for electrical performance testing while the heating body 3 heats the device under test 200 through the heat-conducting carrier 4, without the need to transfer the device under test to a temperature chamber or environmental test chamber. Therefore, the high-temperature heating test device 100 for packaged devices of this invention integrates heating function and electrical performance testing fixture function, effectively solving the problem that packaged devices are difficult to test electrically in high-temperature environments. Secondly, the high-temperature heating test device 100 of this utility model achieves rapid heating and uniform heat conduction of the device under test 200 through the direct contact design between the heating element 3 and the heat conduction carrier 4, combined with the dynamic thermal balance of the heat dissipation module 1. At the same time, it focuses on the local heating of the device under test 200 itself, avoiding the redundant energy consumption of traditional temperature chambers heating the entire fixture, and can achieve precise temperature control. The heating power can be adjusted in real time through the linkage between the heating element 3 and the external temperature control system 300 to ensure the dynamic stability of the temperature during the test.
[0044] The above-disclosed examples are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Therefore, any equivalent variations made in accordance with the claims of the present utility model shall fall within the scope of the present utility model.
Claims
1. A high-temperature heating test device for packaged devices, characterized in that, The device includes a heat dissipation module, an insulation shell, a heating element, and a heat-conducting carrier. The insulation shell is fixed to the upper surface of the heat dissipation module. The insulation shell has an insulation mounting cavity. The heating element and the heat-conducting carrier are arranged sequentially from bottom to top in the insulation mounting cavity. The bottom surface of the heating element contacts the heat dissipation module, and the top surface of the heating element contacts the heat-conducting carrier. The cable of the heating element passes through the insulation shell and is used to connect to an external temperature control system. The top surface of the heat-conducting carrier has a positioning groove for placing the device under test (DUT). The heat-conducting carrier has an electrical connection component that connects the DUT located in the positioning groove to an external test platform.
2. The high-temperature heating test apparatus for packaged devices according to claim 1, characterized in that, The contact surface between the heating element and the heat-conducting carrier is provided with thermally conductive silicone grease.
3. The high-temperature heating test apparatus for packaged devices according to claim 1, characterized in that, The heat-insulating outer shell includes a flip-top cover and an assembly shell. The assembly shell is fixed to the upper surface of the heat dissipation module. The heat-insulating mounting cavity is formed vertically through the assembly shell. The flip-top cover is rotatably connected to the upper part of the assembly shell. The heat-insulating mounting cavity is opened or closed by rotating the flip-top cover relative to the assembly shell.
4. The high-temperature heating test apparatus for packaged devices according to claim 3, characterized in that, The flip-top cover is provided with a locking element, which is used to lock the flip-top cover to the assembly housing when the flip-top cover is rotated and closed relative to the assembly housing.
5. The high-temperature heating test apparatus for packaged devices according to claim 3, characterized in that, The flip-top cover is provided with a fixing member, which is used to lock the device under test placed in the positioning groove so that the device under test is in close contact with the heat-conducting carrier.
6. The high-temperature heating test apparatus for packaged devices according to claim 1, characterized in that, The heat-conducting carrier is detachably disposed within the insulation installation cavity.
7. The high-temperature heating test apparatus for packaged devices according to claim 1, characterized in that, The thermally conductive carrier includes a device carrier and a conductive carrier arranged vertically. The positioning groove is formed on the top surface of the device carrier. One end of the electrical connection component passes through the positioning groove and is used to electrically connect with the device under test located in the positioning groove. The other end of the electrical connection component passes through the conductive carrier and is used to electrically connect with the external test platform.
8. The high-temperature heating test apparatus for packaged devices according to claim 7, characterized in that, The electrical connection assembly includes spring probes and conductive copper sheets. A plurality of spring probes pass through the device carrier and are inserted into the positioning groove. The top of the spring probes is used to contact and connect with the pins of the device under test. A plurality of conductive copper sheets are embedded in the upper surface of the conductive carrier. One end of the conductive copper sheet is in contact with the spring probe, and the other end of the conductive copper sheet extends out of the conductive carrier.
9. The high-temperature heating test apparatus for packaged devices according to claim 8, characterized in that, The number of conductive copper sheets is three, namely a G-terminal copper sheet, a D-terminal copper sheet, and a S-terminal copper sheet. The device under test has four D-terminal pins on one side and one G-terminal pin and three S-terminal pins on the other side. The G-terminal copper sheet is connected to one G-terminal pin through one of the spring probes. The D-terminal copper sheet is connected to the four D-terminal pins one-to-one through the four spring probes. The S-terminal copper sheet is connected to the three S-terminal pins one-to-one through the three spring probes.
10. The high-temperature heating test apparatus for packaged devices according to claim 1, characterized in that, The heating element is a PTC heater.