Printed circuit board, optical connector, and optical module
By employing three types of metal via structures on the printed circuit board, the near-end crosstalk and processing difficulty issues of the PCB fan-out structure in QSFP optical modules were resolved, enabling the design of optical modules with high port density and high signal transmission rate.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TENCENT TECHNOLOGY (SHENZHEN) CO LTD
- Filing Date
- 2025-05-09
- Publication Date
- 2026-05-19
AI Technical Summary
In the existing technology, the PCB fan-out structure of QSFP optical modules is difficult to meet the requirements of high port density and high signal transmission rate, resulting in increased near-end crosstalk and fan-out difficulty.
The printed circuit board design employs three types of metal via structures. By arranging a third metal via with grounding characteristics in the thickness direction of the circuit board, the overlap of the first and second metal vias is avoided, reducing near-end crosstalk. Furthermore, the metal vias are used for lead fan-out, simplifying the manufacturing process.
It reduces the difficulty of fan-out on printed circuit boards, improves signal integrity, reduces near-end crosstalk, lowers processing costs, and increases signal transmission density and module transmission rate.
Smart Images
Figure CN224265191U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of optical module technology, and in particular to a printed circuit board, an optical connector and an optical module. Background Technology
[0002] Optical modules are fundamental to data center network interconnection and are widely used in devices such as network interface cards (NICs), switches, and routers. QSFP (Quad Small Form-factor Pluggable) optical modules are currently the mainstream modules in AI networks.
[0003] However, with the increase in the bandwidth of switching chips, the number and rate of ports supported by a single device also increase. The port density and single-channel signal transmission rate are getting higher and higher, making it increasingly difficult for the PCB (Printed Circuit Board) fan-out of the optical connector in the QSFP optical module. The PCB fan-out structure provided by related technologies can no longer meet the system performance requirements. Utility Model Content
[0004] This application provides a printed circuit board, an optical connector, and an optical module that can solve the problem that the PCB fan-out structure can no longer meet the system performance requirements.
[0005] The technical solution is as follows:
[0006] On one hand, a printed circuit board is provided, the printed circuit board comprising: a circuit board body, at least two gold finger areas and at least one via area;
[0007] The circuit board body includes a first surface and a second surface;
[0008] The at least two gold finger regions include a first gold finger region and a second gold finger region, the first gold finger region is located on the first surface, the second gold finger region is located on the second surface, and the first gold finger region and the second gold finger region are arranged symmetrically back to back.
[0009] The first gold finger region includes at least one first gold finger, and the second gold finger region includes at least one second gold finger;
[0010] The via region includes at least one first metal via, at least one second metal via, and at least one third metal via, wherein the at least one first metal via, the at least one second metal via, and the at least one third metal via are spaced apart from each other and arranged along the thickness direction of the circuit board body, respectively.
[0011] Each of the first gold fingers is electrically connected to a first metal via via a first lead, and each of the second gold fingers is electrically connected to a second metal via via a second lead. The at least one third metal via is grounded, and at least one third metal via is provided between adjacent first and second metal vias.
[0012] On the other hand, an optical connector is provided, which includes the printed circuit board described in this application.
[0013] On the other hand, an optical module is provided, which includes the printed circuit board described in this application or the optical connector described in this application.
[0014] The beneficial effects of the technical solution provided in this application include at least the following:
[0015] The printed circuit board of this application has a first surface and a second surface of the circuit board body respectively used to arrange a first gold finger area and a second gold finger area. The via area has three types of metal vias. Metal vias are easier to process than blind vias. The first metal via is used to electrically connect the first gold finger in the first gold finger area through a first lead to realize a first type of signal transmission. The second metal via is used to electrically connect the second gold finger in the second gold finger area through a second lead to realize a second type of signal transmission. Furthermore, a third metal via with grounding characteristics is arranged between the first metal via and the second metal via. This avoids the problem of near-end crosstalk caused by the overlap of the first metal via and the second metal via in the thickness direction of the circuit board body. This helps to reduce the fan-out difficulty of the printed circuit board and can obtain a better signal integrity (SI) index. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is a schematic diagram of the printed circuit board provided in the embodiments of this application from a first-view perspective;
[0018] Figure 2 This is a schematic diagram of the printed circuit board provided in the embodiment of this application from a second perspective.
[0019] Figure 3 This is a cross-sectional view of the printed circuit board provided in the embodiment of this application;
[0020] Figure 4 This is a structural perspective view of the printed circuit board provided in the embodiments of this application;
[0021] Figure 5 This is a schematic diagram of the structure of a printed circuit board provided in another embodiment of this application.
[0022] The reference numerals in the figure are respectively:
[0023] A. First direction; B. Second direction;
[0024] 1. Circuit board body;
[0025] 10a, First surface; 10b, Second surface;
[0026] 11. Mounting holes;
[0027] 2. Gold finger area;
[0028] 21. First Golden Finger Area; 211. First Golden Finger; 212. Third Golden Finger; 22. Second Golden Finger Area; 221. Second Golden Finger; 222. Fourth Golden Finger;
[0029] 3. Via area;
[0030] 31. First metal through-hole; 32. Second metal through-hole; 33. Third metal through-hole;
[0031] 4. First lead;
[0032] 5. Second lead. Detailed Implementation
[0033] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.
[0034] In the description of this application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the appendix. Figure 1The orientations or positional relationships shown are for the purpose of facilitating and simplifying the description of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0035] Unless otherwise defined, all technical terms used in the embodiments of this application have the same meaning as commonly understood by one of ordinary skill in the art.
[0036] In data center network products, high-density optical connectors typically employ a belly-to-belly (or ventral-to-ventral) layout to increase the interface density of the devices. However, the belly-to-belly arrangement doubles the number of high-speed signals that need to be fanned out per unit area, making it challenging to achieve high-density signal fanning out within a limited space.
[0037] The optical connector pins in related technologies use an LL arrangement. In order to keep the fan-out residual segments or branch lines as short as possible, the area of the fan-out traces and vias is limited to a small area.
[0038] However, the PCB fan-out structure in the relevant technology has at least the following problems.
[0039] 1. Differential lines need to be fanned out in a single-line manner, and there is mutual shuttle between opposite signal lines / vias. Moreover, the traces in the area near the vias must use neck lines, which is not conducive to impedance control.
[0040] 2. Significant near-end crosstalk exists. When the fan-out vias are elongated vias, these elongated vias overlap and intersect in the Z direction, resulting in significant near-end crosstalk.
[0041] Therefore, this application provides a printed circuit board with three types of metal vias in the via area. Metal vias are easier to process than blind vias. The third metal via, which has grounding characteristics, avoids near-end crosstalk caused by the overlap of the first and second metal vias in the thickness direction of the circuit board body. This helps to reduce the fan-out difficulty of the printed circuit board and achieve better SI indicators.
[0042] Furthermore, the printed circuit board provided in this application does not have the problem of signal lines / vias running back and forth, making impedance control easier.
[0043] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.
[0044] On the one hand, combined with Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, this embodiment provides a printed circuit board, which includes: a circuit board body 1, at least two gold finger areas 2 and at least one via area 3.
[0045] The circuit board body 1 includes a first surface 10a and a second surface 10b; at least two gold finger regions 2 include a first gold finger region 21 and a second gold finger region 22, the first gold finger region 21 is located on the first surface 10a, the second gold finger region 22 is located on the second surface 10b, and the first gold finger region 21 and the second gold finger region 22 are arranged symmetrically back to back.
[0046] The first gold finger region 21 includes at least one first gold finger 211, and the second gold finger region 22 includes at least one second gold finger 221.
[0047] The via region 3 includes at least one first metal via 31, at least one second metal via 32 and at least one third metal via 33, which are spaced apart from each other and arranged along the thickness direction of the circuit board body 1.
[0048] Each first gold finger 211 is electrically connected to a first metal through hole 31 through a first lead 4, and each second gold finger 221 is electrically connected to a second metal through hole 32 through a second lead 5. At least one third metal through hole 33 is grounded, and at least one third metal through hole 33 is provided between adjacent first metal through holes 31 and second metal through holes 32.
[0049] In this embodiment, the first surface 10a and the second surface 10b of the circuit board body 1 are used to arrange the first gold finger region 21 and the second gold finger region 22, respectively. The via region 3 has three types of metal vias. Metal vias are easier to process than blind vias. The first metal via 31 is used to electrically connect the first gold finger 211 in the first gold finger region 21 through the first lead 4 to realize the first type of signal transmission. The second metal via 32 is used to electrically connect the second gold finger 221 in the second gold finger region 22 through the second lead 5 to realize the second type of signal transmission. Moreover, a third metal via 33 with grounding characteristics is arranged between the first metal via 31 and the second metal via 32 to avoid the problem of near-end crosstalk caused by the overlap of the first metal via 31 and the second metal via 32 in the thickness direction of the circuit board body 1. This helps to reduce the fan-out difficulty of the printed circuit board and can obtain better SI indicators.
[0050] During the fabrication of a printed circuit board (PCB), blind vias can be used on the first surface 10a and the second surface 10b to fan out the leads. Since the blind vias on the first surface 10a and the second surface 10b do not overlap in the thickness direction of the PCB body 1, near-end crosstalk is relatively low. However, blind via technology is complex, increasing the fabrication difficulty and manufacturing cost of the PCB. In this embodiment, the PCB uses metal vias for lead fan-out, reducing the fabrication difficulty and cost. Furthermore, by arranging a third metal via 33 with grounding characteristics between the first metal via 31 and the second metal via 32, the near-end crosstalk problem between the first metal via 31 and the second metal via 32 is solved.
[0051] In some possible implementations, the number of gold finger regions 2 is not limited to two (e.g., the first gold finger region 21 and the second gold finger region 22), but may include three, four, or more gold finger regions 2.
[0052] The number of via regions 3 can be, for example, one, two, three, four, etc. For instance, the number of via regions 3 is in a one-to-two relationship with the number of gold finger regions 2; that is, each via region 3 corresponds to two gold finger regions 2 arranged back-to-back on the first surface 10a and the second surface 10b. If there is one via region 3, there are two gold finger regions 2; if there are two via regions 3, there are four gold finger regions 2, and so on.
[0053] In some possible implementations, signal integrity (SI) metrics include, but are not limited to: insertion loss (IL), return loss (RL), crosstalk, impedance continuity, etc.
[0054] Combination Figure 4 As shown, in some embodiments, at least one via region 3 is located on one side of the first gold finger region 21 and the second gold finger region 22 along the first direction A.
[0055] The spacing between the first metal through hole 31 and the first gold finger 211 along the first direction A is different from the spacing between the second metal through hole 32 and the second gold finger 221 along the first direction A, and the orthographic projection of the first metal through hole 31 along the first direction A and the orthographic projection of the second metal through hole 32 along the first direction A do not coincide.
[0056] With the above arrangement, the spacing between the first metal through hole 31 and the second metal through hole 32 and the corresponding first gold finger 211 and second gold finger 221 is different. That is, the first metal through hole 31 and the second metal through hole 32 are arranged with a gap along the first direction A, which realizes a reasonable layout of the first metal through hole 31 and the second metal through hole 32. Moreover, the orthographic projections of the first metal through hole 31 and the second metal through hole 32 along the first direction A do not overlap. Therefore, the first metal through hole 31 and the second metal through hole 32 will not interfere with the fan-out of the first lead 4 and the second lead 5, which helps to reduce the fan-out difficulty of the first lead 4 and the second lead 5.
[0057] In some possible implementations, the distance between the first metal through-hole 31 and the first gold finger 211 along the first direction A is greater than the distance between the second metal through-hole 32 and the second gold finger 221 along the first direction A; or, the distance between the first metal through-hole 31 and the first gold finger 211 along the first direction A is less than the distance between the second metal through-hole 32 and the second gold finger 221 along the first direction A.
[0058] Combination Figure 4 As shown, in some embodiments, the number of first metal through holes 31 and second metal through holes 32 are both multiple.
[0059] The spacing between the plurality of first metal through holes 31 and the first gold fingers 211 along the first direction A is the same, and the spacing between the plurality of second metal through holes 32 and the first gold fingers 211 along the first direction A is the same. The plurality of first metal through holes 31 and the plurality of second metal through holes 32 are arranged at intervals along the second direction B. The second direction B is perpendicular to the first direction A.
[0060] In this embodiment, when there are multiple first metal through holes 31 and multiple second metal through holes 32, the spacing between the multiple first metal through holes 31 and the first gold finger 211 is the same, and the spacing between the multiple second metal through holes 32 and the second gold finger 221 is the same. That is, the multiple first metal through holes 31 are arranged parallel to each other along the same straight line on one side of the first gold finger 211, and the multiple second metal through holes 32 are arranged parallel to each other along the same straight line on one side of the second gold finger 221.
[0061] Thus, the first metal through hole 31 and the second metal through hole 32 are arranged in a row along two straight lines parallel to the first gold finger 211 and the second gold finger 221, respectively. The layout of the first metal through hole 31 and the second metal through hole 32 is more regular. On the one hand, it is conducive to increasing the design and processing difficulty of the first metal through hole 31 and the second metal through hole 32. On the other hand, it is conducive to standardizing the fan-out direction of the first lead 4 and the second lead 5 and reducing the fan-out difficulty.
[0062] Combination Figure 3 and Figure 4As shown, in some embodiments, the number of the first metal through-hole 31 and the second metal through-hole 32 are four each.
[0063] Four first metal through holes 31 are arranged in pairs along the second direction B at intervals, and four second metal through holes 32 are arranged in pairs along the second direction B at intervals.
[0064] The orthographic projection of any group of first metal through holes 31 along the first direction A and the orthographic projection of all second metal through holes 32 along the first direction A do not coincide.
[0065] With the above arrangement, the number of the four first metal through holes 31 and the four second metal through holes 32 are arranged in pairs. The four first metal through holes 31 can realize the transmission of four first signals, and the four second metal through holes 32 can also realize the transmission of four second signals. This is beneficial to improve the signal transmission density, increase the number of ports supported by the optical connector and optical module, and thus improve the transmission rate of the optical connector and optical module.
[0066] Combination Figure 3 and Figure 4 As shown, in some embodiments, at least one third metal through hole 33 is arranged on both sides of each group of first metal through holes 31 along the second direction B. Therefore, the third metal through holes 33 can be arranged in the same direction as the first metal through holes 31, which helps to reduce the processing difficulty of the third metal through holes 33.
[0067] Combination Figure 3 and Figure 4 As shown, in some embodiments, at least one third metal through hole 33 is arranged on both sides of each group of second metal through holes 32 along the second direction B. Therefore, the third metal through holes 33 can be arranged in the same direction as the second metal through holes 32, which helps to reduce the processing difficulty of the third metal through holes 33.
[0068] In some embodiments, the distance between any two adjacent holes of at least one first metal through-hole 31, at least one second metal through-hole 32, and at least one third metal through-hole 33 is less than or equal to 26 mil. Here, mil is an imperial unit of length, 1 mil = 1 / 1000 inch = 0.0254 mm.
[0069] With the above arrangement, the first metal via 31, the second metal via 32 and the third metal via 33 can be tightly coupled, which is beneficial to optimize impedance continuity, improve SI performance, reduce the space of via region 3, and reduce the fan-out difficulty of the printed circuit board.
[0070] In some embodiments, the lengths of the first lead 4 and the second lead 5 are in the range of 80-100 mil, which helps to reduce the difficulty of lead impedance control, improve SI performance, and save fan-out space.
[0071] Combination Figure 4 As shown, in some embodiments, there are multiple first gold fingers 211, and the multiple first gold fingers 211 are arranged at intervals along the second direction B; there are multiple second gold fingers 221, and the multiple second gold fingers 221 are arranged at intervals along the second direction B.
[0072] With the above arrangement, the printed circuit board can use multiple first gold fingers 211 and multiple second gold fingers 221 to realize multi-channel signal transmission, which is conducive to improving signal transmission density, increasing the number of ports supported by optical connectors and optical modules, and thus improving the transmission rate of optical connectors and optical modules.
[0073] Combination Figure 1 As shown, in some embodiments, the first gold finger region 21 further includes at least two third gold fingers 212, each of which is grounded and located on both sides of the first gold finger 211 along the second direction B.
[0074] In some possible implementations, multiple first gold fingers 211 are arranged in pairs at intervals, with a third gold finger 212 between each pair of first gold fingers 211.
[0075] Combination Figure 2 As shown, in some embodiments, the second gold finger region 22 further includes at least two fourth gold fingers 222, each of which is grounded and located on both sides of the second gold finger 221 along the second direction B.
[0076] In some possible implementations, multiple second gold fingers 221 are arranged in pairs at intervals, with a fourth gold finger 222 between each pair of second gold fingers 221.
[0077] Combination Figure 5 As shown, in some embodiments, there are four gold finger regions 2 and four via regions 3; each gold finger region 2 is provided with a via region 3 on one side along the first direction A; the four gold finger regions 2 are arranged in a 2×2 array along the first direction A and the second direction B, and the two gold finger regions 2 and the corresponding two via regions 3 arranged at intervals along the second direction B are symmetrical to each other; wherein, the second direction B is perpendicular to the first direction A.
[0078] With the above arrangement, the printed circuit board can form four communication channels, which can support the implementation of QSFP (Quad Small Form-factor Pluggable) optical modules.
[0079] Combination Figure 5As shown, in some embodiments, the circuit board body 1 is provided with at least one mounting hole 11, which is used for mounting and fixing the circuit board body 1.
[0080] When the mounting hole 11 is close to the via area 3, part of the third metal through hole 33 can be omitted to avoid the mounting hole 11. For example, the mounting hole 11 is grounded.
[0081] On the other hand, this embodiment provides an optical connector, which includes the printed circuit board described in this application. The optical connector of this embodiment uses the printed circuit board of this application and has all the beneficial technical effects of all embodiments herein.
[0082] In this embodiment, the optical connector can also be called an optical fiber connector. It can quickly connect two optical fibers, so that the optical signal can be continuous and form an optical path. It is a device for detachable (movable) connection between optical fibers.
[0083] Among the possible implementations, the types of optical connectors include LC, SC, FC, ST, and so on.
[0084] On the other hand, this embodiment provides an optical module, which includes the printed circuit board or the optical connector described in this application. The optical module of this embodiment uses the printed circuit board or optical connector described in this application and has all the beneficial technical effects of all embodiments herein.
[0085] It should be noted that in this article, "several" and "at least one" refer to one or more, while "multiple" and "at least two" refer to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.
[0086] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0087] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0088] In the description of this specification, the references to the terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples" refer to specific features, structures, materials, or characteristics described in connection with the embodiments or examples that are included in at least one embodiment or example of this application.
[0089] The above description is merely an embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this application should be included within the protection scope of this application.
Claims
1. A printed circuit board, characterized in that, The printed circuit board includes: a circuit board body (1), at least two gold finger areas (2) and at least one via area (3); The circuit board body (1) includes a first surface (10a) and a second surface (10b); The at least two gold finger regions (2) include a first gold finger region (21) and a second gold finger region (22). The first gold finger region (21) is located on the first surface (10a), and the second gold finger region (22) is located on the second surface (10b). The first gold finger region (21) and the second gold finger region (22) are arranged symmetrically back to back. The first gold finger region (21) includes at least one first gold finger (211), and the second gold finger region (22) includes at least one second gold finger (221); The via region (3) includes at least one first metal via (31), at least one second metal via (32) and at least one third metal via (33), wherein the at least one first metal via (31), the at least one second metal via (32) and the at least one third metal via (33) are spaced apart from each other and are arranged along the thickness direction of the circuit board body (1); Each of the first gold fingers (211) is electrically connected to a first metal via (31) via a first lead (4), and each of the second gold fingers (221) is electrically connected to a second metal via (32) via a second lead (5). The at least one third metal via (33) is grounded, and at least one third metal via (33) is provided between adjacent first metal vias (31) and second metal vias (32).
2. The printed circuit board according to claim 1, characterized in that, The at least one via region (3) is located on one side of the first gold finger region (21) and the second gold finger region (22) along the first direction (A); The spacing between the first metal through hole (31) and the first gold finger (211) along the first direction (A) is different from the spacing between the second metal through hole (32) and the second gold finger (221) along the first direction (A), and the orthographic projection of the first metal through hole (31) along the first direction (A) and the orthographic projection of the second metal through hole (32) along the first direction (A) do not coincide.
3. The printed circuit board according to claim 2, characterized in that, The number of the first metal through hole (31) and the number of the second metal through hole (32) are both multiple; The spacing between the plurality of first metal through holes (31) and the first gold fingers (211) along the first direction (A) is the same, the spacing between the plurality of second metal through holes (32) and the first gold fingers (211) along the first direction (A) is the same, and the plurality of first metal through holes (31) and the plurality of second metal through holes (32) are arranged at intervals along the second direction (B). Wherein, the second direction (B) is perpendicular to the first direction (A).
4. The printed circuit board according to claim 3, characterized in that, The number of the first metal through hole (31) and the number of the second metal through hole (32) are four each; The four first metal through holes (31) are arranged in pairs along the second direction (B) at intervals; the four second metal through holes (32) are arranged in pairs along the second direction (B) at intervals. The orthographic projection of any group of the first metal through holes (31) along the first direction (A) and the orthographic projection of all the second metal through holes (32) along the first direction (A) do not coincide.
5. The printed circuit board according to claim 4, characterized in that, Each group of first metal through holes (31) is provided with at least one third metal through hole (33) on both sides of the second direction (B); And / or, Each group of second metal through holes (32) shall have at least one third metal through hole (33) arranged on both sides of the second direction (B).
6. The printed circuit board according to claim 1, characterized in that, The spacing between any two adjacent holes of the at least one first metal through hole (31), the at least one second metal through hole (32), and the at least one third metal through hole (33) is less than or equal to 26 mil.
7. The printed circuit board according to any one of claims 1 to 6, characterized in that, The number of first gold fingers (211) is multiple, and the multiple first gold fingers (211) are arranged at intervals along the second direction (B); the number of second gold fingers (221) is multiple, and the multiple second gold fingers (221) are arranged at intervals along the second direction (B).
8. The printed circuit board according to any one of claims 1 to 6, characterized in that, The number of the gold finger region (2) and the via region (3) is four each; Each of the gold finger regions (2) is provided with a via region (3) on one side along the first direction (A); The four gold finger regions (2) are arranged in a 2×2 array along the first direction (A) and the second direction (B), and the two gold finger regions (2) and the two corresponding via regions (3) arranged at intervals along the second direction (B) are symmetrical to each other; Wherein, the second direction (B) is perpendicular to the first direction (A).
9. An optical connector, characterized in that, The optical connector comprises a printed circuit board according to any one of claims 1 to 8.
10. An optical module, characterized in that, The optical module includes a printed circuit board according to any one of claims 1 to 8, or an optical connector according to claim 9.