Negative pressure adsorption jointed board device for depth control gong equipment

Abstract

The utility model relates to a negative pressure adsorption jointed board device for a depth control gong device. The technical scheme is characterized in that the negative pressure adsorption jointed board device comprises a mounting seat; a table-board base body is arranged on the mounting seat, and a negative pressure cavity is formed in the table-board base body; a vacuum pump is arranged on the mounting seat, and the negative pressure cavity is communicated with the vacuum pump; an adsorption plate is arranged on the table board base body, the adsorption plate covers an opening of the negative pressure cavity, a plurality of adsorption holes which are uniformly distributed are formed in the adsorption plate, and the adsorption holes are all communicated with the negative pressure cavity; the negative pressure cavity adsorbs the PCBs through the adsorption holes covered by the PCBs, so that the positions of all the PCBs placed on the adsorption plate are fixed, and the depth control milling operation of the multiple PCBs is met.

Description

Technical Field

[0001] This utility model relates to the field of PCB board processing equipment technology, and more specifically, it relates to a negative pressure adsorption splicing device for depth control milling equipment. Background Technology

[0002] Printed circuit boards (PCBs) are providers of electrical connections for electronic components. Their design is mainly layout design. The main advantages of using PCBs are that they greatly reduce wiring and assembly errors, and improve automation and productivity.

[0003] In the current PCB manufacturing industry, some products require the installation of certain components inside the PCB board. Therefore, during the processing of the PCB board's shape, it is necessary to create grooves on the PCB board. Typically, depth-controlled routers are used to create these grooves.

[0004] In existing depth-controlled drilling machines, suction cups are typically installed on the worktable to fix the position of the PCB board. For example, Chinese utility model patent application number 201921570997.9 discloses a drilling and drilling machine equipped with suction cups, which adsorb PCB boards on the worktable. However, the suction cups described above can only adsorb PCB boards at specific locations, making it difficult to adsorb multiple PCB boards simultaneously. This results in low space utilization and affects production efficiency. Utility Model Content

[0005] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a negative pressure adsorption splicing device for depth control gong equipment to solve the above-mentioned technical problems.

[0006] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a negative pressure adsorption splicing device for depth control gong equipment, comprising: a mounting base; a table base provided on the mounting base, and a negative pressure cavity provided on the table base; a vacuum pump provided on the mounting base, and the negative pressure cavity communicating with the vacuum pump; an adsorption plate provided on the table base, the adsorption plate covering the opening of the negative pressure cavity, and a plurality of evenly distributed adsorption holes provided on the adsorption plate, all of which are communicating with the negative pressure cavity.

[0007] Specifically, by using a vacuum pump to extract air from the negative pressure chamber, when the PCB board is placed on the adsorption plate, the negative pressure chamber adsorbs the PCB board through the adsorption holes covered by the PCB board, thereby fixing the position of all the PCB boards placed on the adsorption plate to meet the requirements of depth control router operation for multiple PCB boards.

[0008] Optionally, a dust removal mechanism is provided at the suction end of the vacuum pump.

[0009] Specifically, during the controlled-depth routing process of PCB boards, dust particles from the routing process are adsorbed into a negative pressure chamber on the PCB board. The dust is then collected by a dust removal mechanism at the suction end of the vacuum pump, ensuring the cleanliness of the adsorption board. The dust removal mechanism can be selected from various types, such as media-blocking, centrifugal, or oil-spraying, depending on the specific requirements.

[0010] Optionally, a plurality of support columns are provided inside the negative pressure chamber; gaps are provided between the plurality of support columns; and the vacuum pump is connected to the gaps.

[0011] Specifically, by setting several support columns inside the negative pressure chamber, the adsorption plate can be supported. The vacuum pump is connected to the adsorption holes through gaps. Since the adsorption plates have several adsorption holes evenly distributed, the support columns will not affect the adsorption effect on the PCB.

[0012] Optionally, the support column is a hexagonal column; a plurality of the support columns are distributed in a honeycomb pattern.

[0013] Specifically, setting the support columns in a honeycomb pattern allows for a more uniform distribution of negative pressure on the adsorption plate, further improving the stability and positional accuracy of the PCB board during processing.

[0014] Optionally, a tabletop moving mechanism is provided on the mounting base; the tabletop base is located at the output end of the tabletop moving mechanism.

[0015] Specifically, when PCB boards need to be picked up or placed, the tabletop moving mechanism moves the tabletop base to a designated position to facilitate loading and unloading. After the PCB board is placed on the tabletop base, the tabletop moving mechanism moves the tabletop base directly below the cutting tool so that the cutting tool can perform depth control milling on the corresponding position on the PCB board.

[0016] Optionally, the tabletop moving mechanism includes: a drive motor, a lead screw, a lead screw nut, and a rotating shaft seat; the drive motor is mounted on the mounting base, and the rotating shaft seat is mounted on the mounting base; one end of the lead screw is coaxially connected to the drive motor, and the other end is mounted on the rotating shaft seat; the lead screw nut is mounted on the tabletop base; the lead screw nut is threadedly connected to the lead screw.

[0017] Specifically, the drive motor drives the lead screw to rotate, and the lead screw nut on the table base moves the table base along the direction of the lead screw under the action of the lead screw, thereby driving the table base to move back and forth to facilitate loading and unloading of the table base.

[0018] Optionally, a guide rail is provided on the mounting base, and a guide block adapted to the guide rail is provided on the platform base.

[0019] Specifically, the cooperation of guide rails and guide blocks makes the movement of the platform base on the mounting base more stable.

[0020] Optionally, a cutter head is provided on the table base.

[0021] Specifically, the cutter head contains cutting tools. When performing depth control router on a PCB board, the table base is first moved so that the cutter head is below the depth control router spindle. The spindle moves down and grabs the cutting tools in the cutter head, and then the PCB board is subjected to depth control router.

[0022] Optionally, a tool retraction seat is provided on the table base.

[0023] Specifically, when a tool change is needed, move the table base so that the spindle is facing the tool retractor. Insert the tool on the spindle into the tool retractor and separate the spindle from the tool. Place the retracted tool in the tool retractor, and then pick up a new tool from the tool turret.

[0024] In summary, this utility model has the following beneficial effects: by drawing air from the negative pressure chamber using a vacuum pump, when the PCB board is placed on the adsorption plate, the negative pressure chamber adsorbs the PCB board through the adsorption holes covered by the PCB board, thereby fixing the position of all PCB boards placed on the adsorption plate to meet the requirements of depth control router operation for multiple PCB boards. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of the negative pressure adsorption panel device according to an embodiment of this utility model;

[0026] Figure 2 This is a schematic diagram of the exploded structure of the negative pressure chamber according to an embodiment of this utility model.

[0027] In the diagram: 1. Mounting base; 2. Tabletop base; 3. Negative pressure chamber; 4. Adsorption plate; 5. Adsorption hole; 6. Support column; 7. Gap; 8. Tabletop moving mechanism; 81. Drive motor; 82. Lead screw; 83. Lead screw nut; 84. Rotary shaft seat; 9. Guide rail; 10. Guide block; 11. Cutter head; 12. Retractor. Detailed Implementation

[0028] To make the objectives, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model are described in detail below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein.

[0029] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.

[0030] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0031] Example 1

[0032] This embodiment provides a negative pressure adsorption splicing plate device for depth-controlled gong equipment, such as... Figure 1 and Figure 2 As shown, it includes: a mounting base 1; a tabletop base 2 on the mounting base 1, and a negative pressure chamber 3 on the tabletop base 2; a vacuum pump on the mounting base 1, and the negative pressure chamber 3 is connected to the vacuum pump; an adsorption plate 4 on the tabletop base 2, the adsorption plate 4 covering the opening of the negative pressure chamber 3, and a plurality of evenly distributed adsorption holes 5 on the adsorption plate 4, all of which are connected to the negative pressure chamber 3.

[0033] Specifically, air is extracted from the negative pressure chamber 3 by a vacuum pump. When the PCB board is placed on the adsorption plate 4, the negative pressure chamber 3 adsorbs the PCB board through the adsorption holes 5 covered by the PCB board, thereby fixing the position of all PCB boards placed on the adsorption plate 4 to meet the requirements of depth-controlled router operations for multiple PCB boards. During the depth-controlled router process, dust on the PCB board that has been routerted is adsorbed into the negative pressure chamber 3. Since the vacuum pump has a dust removal structure, the dust is collected in the dust removal structure of the vacuum pump, thus ensuring the cleanliness of the adsorption plate 4. The vacuum pump is usually located at the bottom or side of the depth-controlled router equipment and is connected to the negative pressure chamber 3 through an adsorption pipe.

[0034] Optionally, a dust removal mechanism is provided at the suction end of the vacuum pump.

[0035] Specifically, during the controlled-depth routing process of the PCB board, dust from the PCB board is adsorbed into the negative pressure chamber. The dust is then collected by the dust removal mechanism at the suction end of the vacuum pump, ensuring the cleanliness of the adsorption plate. The dust removal mechanism can be selected from media-blocking, centrifugal, or oil-spraying types, depending on the specific requirements. In this embodiment, a media-blocking dust removal mechanism is used. A removable filter screen is installed at the suction end of the vacuum pump to block dust from entering the vacuum pump. The filter screen is cleaned regularly to ensure the effective adsorption of the vacuum pump.

[0036] Optionally, a number of support columns 6 are provided inside the negative pressure chamber 3; gaps 7 are provided between the support columns 6; the vacuum pump is connected to the gaps 7.

[0037] Specifically, by setting several support columns 6 inside the negative pressure chamber 3, the adsorption plate 4 can be supported. The vacuum pump is connected to the adsorption holes 5 through the gap 7. Since several adsorption holes 5 are evenly distributed on the adsorption plate 4, the support columns 6 will not affect the adsorption effect of the PCB.

[0038] The gaps 7 between the support columns 6 are interconnected and the adsorption holes 5 are connected through the gaps 7, which can ensure that there are several adsorption holes 5 connected to the vacuum pump in the area covered by the PCB board, so as to ensure the adsorption stability of the PCB board.

[0039] Optionally, the support column 6 is a hexagonal column; several support columns 6 are distributed in a honeycomb pattern.

[0040] Specifically, setting the support columns 6 in a honeycomb pattern allows for a more uniform distribution of negative pressure on the adsorption plate 4, further improving the stability and positional accuracy of the PCB board during processing.

[0041] Among them, the support column 6 is set as a hexagonal column and the support column 6 is distributed in a honeycomb pattern. Compared with the rectangular array distribution, the honeycomb distribution has more oblique gaps 7, which makes the negative pressure distribution more uniform.

[0042] Example 2

[0043] This embodiment provides a negative pressure adsorption splicing plate device for depth-controlled gong equipment, such as... Figure 1 and Figure 2 As shown, it includes: a mounting base 1; a tabletop base 2 on the mounting base 1, and a negative pressure chamber 3 on the tabletop base 2; a vacuum pump on the mounting base 1, and the negative pressure chamber 3 is connected to the vacuum pump; an adsorption plate 4 on the tabletop base 2, the adsorption plate 4 covering the opening of the negative pressure chamber 3, and a plurality of evenly distributed adsorption holes 5 on the adsorption plate 4, all of which are connected to the negative pressure chamber 3.

[0044] Specifically, air is extracted from the negative pressure chamber 3 by a vacuum pump. When the PCB board is placed on the adsorption plate 4, the negative pressure chamber 3 adsorbs the PCB board through the adsorption holes 5 covered by the PCB board, thereby fixing the position of all PCB boards placed on the adsorption plate 4 to meet the requirements of depth-controlled router operations for multiple PCB boards. During the depth-controlled router process, dust on the PCB board that has been routerted is adsorbed into the negative pressure chamber 3. Since the vacuum pump has a dust removal structure, the dust is collected in the dust removal structure of the vacuum pump, thus ensuring the cleanliness of the adsorption plate 4. The vacuum pump is usually located at the bottom or side of the depth-controlled router equipment and is connected to the negative pressure chamber 3 through an adsorption pipe.

[0045] Optionally, a dust removal mechanism is provided at the suction end of the vacuum pump.

[0046] Specifically, during the controlled-depth routing process of PCB boards, dust particles from the routing process are adsorbed into a negative pressure chamber on the PCB board. The dust is then collected by a dust removal mechanism at the suction end of the vacuum pump, ensuring the cleanliness of the adsorption board. The dust removal mechanism can be selected from various types, such as media-blocking, centrifugal, or oil-spraying, depending on the specific requirements.

[0047] In this embodiment, the dust removal mechanism simultaneously employs media blocking, centrifugal, and oil spraying methods. A removable filter screen is installed at the suction end of the vacuum pump to block dust outside the pump, and the filter screen is cleaned regularly to ensure the vacuum pump's adsorption effect. Some dust passing through the filter screen is caused to settle due to centrifugal force generated by the airflow rotation within the vacuum pump. Furthermore, under the circulation of the oil pump, the dust combines with an oil film or oil mist, achieving adhesive filtration.

[0048] Optionally, a number of support columns 6 are provided inside the negative pressure chamber 3; gaps 7 are provided between the support columns 6; the vacuum pump is connected to the gaps 7.

[0049] Specifically, by setting several support columns 6 inside the negative pressure chamber 3, the adsorption plate 4 can be supported. The vacuum pump is connected to the adsorption holes 5 through the gap 7. Since several adsorption holes 5 are evenly distributed on the adsorption plate 4, the support columns 6 will not affect the adsorption effect of the PCB.

[0050] The gaps 7 between the support columns 6 are interconnected and the adsorption holes 5 are connected through the gaps 7, which can ensure that there are several adsorption holes 5 connected to the vacuum pump in the area covered by the PCB board, so as to ensure the adsorption stability of the PCB board.

[0051] Optionally, the support column 6 is a hexagonal column; several support columns 6 are distributed in a honeycomb pattern.

[0052] Specifically, setting the support columns 6 in a honeycomb pattern allows for a more uniform distribution of negative pressure on the adsorption plate 4, further improving the stability and positional accuracy of the PCB board during processing.

[0053] Among them, the support column 6 is set as a hexagonal column and the support column 6 is distributed in a honeycomb pattern. Compared with the rectangular array distribution, the honeycomb distribution has more oblique gaps 7, which makes the negative pressure distribution more uniform.

[0054] Optionally, a tabletop moving mechanism 8 is provided on the mounting base 1; the tabletop base 2 is located at the output end of the tabletop moving mechanism 8.

[0055] Specifically, when PCB boards need to be picked up or placed, the tabletop moving mechanism 8 moves the tabletop base 2 to a designated position to facilitate loading and unloading. After the PCB board is placed on the tabletop base 2, the tabletop moving mechanism 8 moves the tabletop base 2 directly below the cutting tool, so that the cutting tool can perform depth control milling on the corresponding position on the PCB board. The tabletop moving mechanism 8 can be selected from rodless cylinders, lead screw mechanisms, pulley mechanisms, or other mechanisms capable of driving the tabletop base 2 to move horizontally, depending on the requirements.

[0056] Optionally, the tabletop moving mechanism 8 includes: a drive motor 81, a lead screw 82, a lead screw nut 83, and a rotating shaft seat 84; the drive motor 81 is mounted on the mounting base 1, and the rotating shaft seat 84 is mounted on the mounting base 1; one end of the lead screw is coaxially connected to the drive motor 81, and the other end is mounted on the rotating shaft seat 84; the lead screw nut is mounted on the tabletop base 2; the lead screw nut is threadedly connected to the lead screw.

[0057] Specifically, the screw is driven to rotate by the drive motor 81, and the screw nut on the table base 2 moves the table base 2 along the screw direction under the action of the screw, thereby driving the table base 2 to move back and forth, so as to facilitate loading and unloading of the table base 2.

[0058] Optionally, a guide rail 9 is provided on the mounting base 1, and a guide block 10 adapted to the guide rail 9 is provided on the table base 2.

[0059] Specifically, the cooperation between the guide rail 9 and the guide block 10 makes the movement of the table base 2 on the mounting base 1 more stable.

[0060] Example 3

[0061] This embodiment provides a negative pressure adsorption splicing plate device for depth-controlled gong equipment, such as... Figure 1 and Figure 2 As shown, it includes: a mounting base 1; a tabletop base 2 on the mounting base 1, and a negative pressure chamber 3 on the tabletop base 2; a vacuum pump on the mounting base 1, and the negative pressure chamber 3 is connected to the vacuum pump; an adsorption plate 4 on the tabletop base 2, the adsorption plate 4 covering the opening of the negative pressure chamber 3, and a plurality of evenly distributed adsorption holes 5 on the adsorption plate 4, all of which are connected to the negative pressure chamber 3.

[0062] Specifically, air is extracted from the negative pressure chamber 3 by a vacuum pump. When the PCB board is placed on the adsorption plate 4, the negative pressure chamber 3 adsorbs the PCB board through the adsorption holes 5 covered by the PCB board, thereby fixing the position of all PCB boards placed on the adsorption plate 4 to meet the requirements of depth-controlled router operations for multiple PCB boards. During the depth-controlled router process, dust on the PCB board that has been routerted is adsorbed into the negative pressure chamber 3. Since the vacuum pump has a dust removal structure, the dust is collected in the dust removal structure of the vacuum pump, thus ensuring the cleanliness of the adsorption plate 4. The vacuum pump is usually located at the bottom or side of the depth-controlled router equipment and is connected to the negative pressure chamber 3 through an adsorption pipe.

[0063] Optionally, a dust removal mechanism is provided at the suction end of the vacuum pump.

[0064] Specifically, during the controlled-depth routing process of PCB boards, dust particles from the routing process are adsorbed into a negative pressure chamber on the PCB board. The dust is then collected by a dust removal mechanism at the suction end of the vacuum pump, ensuring the cleanliness of the adsorption board. The dust removal mechanism can be selected from various types, such as media-blocking, centrifugal, or oil-spraying, depending on the specific requirements.

[0065] In this embodiment, the dust removal mechanism simultaneously employs media blocking, centrifugal, and oil spraying methods. A removable filter screen is installed at the suction end of the vacuum pump to block dust outside the pump, and the filter screen is cleaned regularly to ensure the vacuum pump's adsorption effect. Some dust passing through the filter screen is caused to settle due to centrifugal force generated by the airflow rotation within the vacuum pump. Furthermore, under the circulation of the oil pump, the dust combines with an oil film or oil mist, achieving adhesive filtration.

[0066] Optionally, a number of support columns 6 are provided inside the negative pressure chamber 3; gaps 7 are provided between the support columns 6; the vacuum pump is connected to the gaps 7.

[0067] Specifically, by setting several support columns 6 inside the negative pressure chamber 3, the adsorption plate 4 can be supported. The vacuum pump is connected to the adsorption holes 5 through the gap 7. Since several adsorption holes 5 are evenly distributed on the adsorption plate 4, the support columns 6 will not affect the adsorption effect of the PCB.

[0068] The gaps 7 between the support columns 6 are interconnected and the adsorption holes 5 are connected through the gaps 7, which can ensure that there are several adsorption holes 5 connected to the vacuum pump in the area covered by the PCB board, so as to ensure the adsorption stability of the PCB board.

[0069] Optionally, the support column 6 is a hexagonal column; several support columns 6 are distributed in a honeycomb pattern.

[0070] Specifically, setting the support columns 6 in a honeycomb pattern allows for a more uniform distribution of negative pressure on the adsorption plate 4, further improving the stability and positional accuracy of the PCB board during processing.

[0071] Among them, the support column 6 is set as a hexagonal column and the support column 6 is distributed in a honeycomb pattern. Compared with the rectangular array distribution, the honeycomb distribution has more oblique gaps 7, which makes the negative pressure distribution more uniform.

[0072] Optionally, a tabletop moving mechanism 8 is provided on the mounting base 1; the tabletop base 2 is located at the output end of the tabletop moving mechanism 8.

[0073] Specifically, when PCB boards need to be picked up or placed, the tabletop moving mechanism 8 moves the tabletop base 2 to a designated position to facilitate loading and unloading. After the PCB board is placed on the tabletop base 2, the tabletop moving mechanism 8 moves the tabletop base 2 directly below the cutting tool, so that the cutting tool can perform depth control milling on the corresponding position on the PCB board. The tabletop moving mechanism 8 can be selected from rodless cylinders, lead screw mechanisms, pulley mechanisms, or other mechanisms capable of driving the tabletop base 2 to move horizontally, depending on the requirements.

[0074] Optionally, the tabletop moving mechanism 8 includes: a drive motor 81, a lead screw 82, a lead screw nut 83, and a rotating shaft seat 84; the drive motor 81 is mounted on the mounting base 1, and the rotating shaft seat 84 is mounted on the mounting base 1; one end of the lead screw is coaxially connected to the drive motor 81, and the other end is mounted on the rotating shaft seat 84; the lead screw nut is mounted on the tabletop base 2; the lead screw nut is threadedly connected to the lead screw.

[0075] Specifically, the screw is driven to rotate by the drive motor 81, and the screw nut on the table base 2 moves the table base 2 along the screw direction under the action of the screw, thereby driving the table base 2 to move back and forth, so as to facilitate loading and unloading of the table base 2.

[0076] Optionally, a guide rail 9 is provided on the mounting base 1, and a guide block 10 adapted to the guide rail 9 is provided on the table base 2.

[0077] Specifically, the cooperation between the guide rail 9 and the guide block 10 makes the movement of the table base 2 on the mounting base 1 more stable.

[0078] Optionally, a cutter head 11 is provided on the table base 2.

[0079] Specifically, the cutter head 11 contains cutting tools. When performing depth control router on the PCB board, the table base 2 is moved first so that the cutter head 11 is below the depth control router spindle. The spindle moves down and grabs the cutting tools in the cutter head 11, and then the PCB board is subjected to depth control router.

[0080] Optionally, a tool retraction seat 12 is provided on the table base 2.

[0081] Specifically, when a tool change is needed, the table base 2 is moved so that the spindle is facing the tool retractor 12. The tool on the spindle is inserted into the tool retractor 12, and the spindle is separated from the tool. The retracted tool is placed in the tool retractor 12, and a new tool can be picked up from the tool turret 11.

[0082] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.

Claims

1. A negative pressure adsorption splicing device for depth control of a rodding equipment, characterized in that, include: Mounting base; A platform base is provided on the mounting base, and a negative pressure chamber is provided on the platform base; a vacuum pump is provided on the mounting base, and the negative pressure chamber is connected to the vacuum pump; an adsorption plate is provided on the platform base, the adsorption plate covers the opening of the negative pressure chamber, and a plurality of evenly distributed adsorption holes are provided on the adsorption plate, all of which are connected to the negative pressure chamber.

2. The negative pressure adsorption splicing device for depth control rodding equipment according to claim 1, characterized in that, A dust removal mechanism is provided at the suction end of the vacuum pump.

3. The negative pressure adsorption splicing device for depth control rodding equipment according to claim 1, characterized in that, The negative pressure chamber is provided with several support columns; gaps are provided between the support columns; the vacuum pump is connected to the gaps.

4. The negative pressure adsorption splicing device for depth control rodding equipment according to claim 3, characterized in that, The support column is a hexagonal column; several of the support columns are distributed in a honeycomb pattern.

5. The negative pressure adsorption splicing device for depth control rodding equipment according to claim 1, characterized in that, A tabletop moving mechanism is provided on the mounting base; the tabletop base is located at the output end of the tabletop moving mechanism.

6. The negative pressure adsorption splicing device for depth control rodding equipment according to claim 5, characterized in that, The tabletop moving mechanism includes: a drive motor, a lead screw, a lead screw nut, and a rotating shaft seat; the drive motor is mounted on the mounting base, and the rotating shaft seat is mounted on the mounting base; one end of the lead screw is coaxially connected to the drive motor, and the other end is mounted on the rotating shaft seat; the lead screw nut is mounted on the tabletop base; the lead screw nut is threadedly connected to the lead screw.

7. The negative pressure adsorption splicing device for depth control rodding equipment according to claim 5, characterized in that, A guide rail is provided on the mounting base, and a guide block adapted to the guide rail is provided on the platform base.

8. The negative pressure adsorption splicing device for depth control rodding equipment according to claim 5, characterized in that, A cutter head is provided on the table base.

9. The negative pressure adsorption splicing device for depth control rodding equipment according to claim 5, characterized in that, A tool retraction seat is provided on the table base.

Images