Miniaturized split type two-way broadband power amplifier assembly

Abstract

The utility model relates to a power amplifier assembly, in particular to a miniaturized split type two-way broadband power amplifier assembly, which comprises an aluminum shell, a power division module shell, two power amplifier module shells and a power supply control device are fixed in an inner cavity of the aluminum shell, a power distribution module is fixed in the power division module shell, a first cover plate is fixed on the power division module shell, and a second cover plate is fixed on the power division module shell. A power amplification module is fixed in the power amplification module shell, a second cover plate is fixed on the power amplification module shell, a third cover plate is fixed above the second cover plate on the power amplification module shell, and a fourth cover plate is fixed above the first cover plate and the third cover plate on the aluminum shell; according to the technical scheme provided by the utility model, the defects that the size is large, the weight is heavy and the power amplification module is inconvenient to replace in the prior art can be effectively overcome.

Description

Technical Field

[0001] This utility model relates to power amplifier components, specifically to a miniaturized split-type dual-channel broadband power amplifier component. Background Technology

[0002] Traditional dual-channel broadband power amplifier assemblies typically integrate the power amplifier module and power control unit into a single-channel power amplifier structure. These two single-channel power amplifier structures are then combined to form a dual-channel broadband power amplifier assembly, which is then screwed into a housing. However, existing dual-channel broadband power amplifier assemblies suffer from problems such as large size, heavy weight, and low heat dissipation efficiency. Furthermore, when the power amplifier module fails and needs replacement, the large housing size makes replacement inconvenient. Utility Model Content

[0003] (a) Technical problems to be solved

[0004] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a miniaturized split dual-channel broadband power amplifier component, which can effectively overcome the defects of the existing technology, such as large size, heavy weight, and inconvenience in replacing the power amplifier module.

[0005] (II) Technical Solution

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A miniaturized split-type dual-channel broadband power amplifier assembly includes an aluminum housing. Inside the aluminum housing, a power distribution module housing, two power amplifier module housings, and a power control device are fixed. A power distribution module is fixed inside the power distribution module housing. A first cover plate is fixed on the power distribution module housing. A power amplification module is fixed inside the power amplifier module housing. A second cover plate is fixed on the power amplifier module housing. A third cover plate is fixed on the power amplifier module housing above the second cover plate. A fourth cover plate is fixed on the aluminum housing above the first and third cover plates.

[0008] Preferably, the power distribution module housing is fixed to the inner cavity of the aluminum housing by screws, and the power distribution module is fixed to the inside of the power distribution module housing by welding.

[0009] Preferably, the first cover plate is fixed to the power distribution module housing by screws, and a first milled groove is provided on the side of the first cover plate opposite to the power distribution module. The first milled groove is filled with a first wave-absorbing material that cooperates with the power distribution module by silicone.

[0010] Preferably, the power amplifier module housing is fixed to a fixing groove on the end face of the aluminum housing by screws, and the power amplifier module is fixed to the inside of the power amplifier module housing by welding.

[0011] Preferably, the second cover plate is fixed to the power amplifier module housing by screws, and a second milled groove is provided on the side of the second cover plate opposite to the power amplifier module. A second absorbing material that cooperates with the power amplifier module is glued inside the second milled groove with silicone.

[0012] Preferably, the third cover plate is fixed to the power amplifier module housing by screws, and the fourth cover plate is fixed to the aluminum housing by screws.

[0013] Preferably, the power control device is fixed to the inner cavity of the aluminum housing by screws, and the power control device adopts a multi-layer board method.

[0014] Preferably, insulators are welded and fixed to the aluminum housing, the power divider module housing, and the power amplifier module housing.

[0015] Preferably, the back of the aluminum housing is fixed with detachable heat dissipation teeth by screws, the interior of the detachable heat dissipation teeth is fixed with a mounting bracket by screws, the mounting bracket is fixed with a heat dissipation fan perpendicular to the tooth direction of the detachable heat dissipation teeth by screws, and a fifth cover plate is fixed with screws on the detachable heat dissipation teeth.

[0016] (III) Beneficial Effects

[0017] Compared with the prior art, the miniaturized split-type dual-channel broadband power amplifier component provided by this utility model has the following beneficial effects:

[0018] 1) This utility model adopts a dual-path miniaturized split structure layout design, which is simple in structure, convenient to process, effectively improves processing efficiency, and is easy to install and disassemble;

[0019] 2) When in use, this utility model is small in size, which saves space and is lightweight, making it suitable for different usage scenarios;

[0020] 3) In use, since the power distribution module, power amplification module and detachable heat dissipation fins are all independent of the aluminum housing, they can be installed and disassembled separately, which effectively improves the efficiency of maintenance and replacement.

[0021] 4) When this utility model is in use, since there are two cooling fans fixed on the detachable heat dissipation teeth, air cooling can be provided, which can quickly dissipate the working heat of the dual-channel broadband power amplifier components, greatly improve the heat dissipation efficiency, and avoid damage to the power amplifier chip due to excessive heat when the two power amplifier modules work at the same time.

[0022] 5) When this utility model is in use, the absorbing material can absorb clutter signals, ensuring the reliability of radio frequency signal transmission. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is an exploded view of the present invention;

[0025] Figure 2 This is a schematic diagram of the internal structure of the aluminum shell in this utility model;

[0026] Figure 3 This is a schematic diagram of the installation of the detachable heat dissipation teeth in this utility model. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0028] A miniaturized, split-type dual-channel broadband power amplifier component, such as Figure 1 and Figure 2 As shown, the device includes an aluminum housing 1. Inside the aluminum housing 1, a power distribution module housing 8, two power amplifier module housings 2, and a power control device 12 are fixed. Inside the power distribution module housing 8, a power distribution module 9 is fixed. A first cover plate 10 is fixed on the power distribution module housing 8. Inside the power amplifier module housings 2, a power amplification module 3 is fixed. A second cover plate 4 is fixed on the power amplifier module housings 2. A third cover plate 6 is fixed on the power amplifier module housings 2 above the second cover plate 4. A fourth cover plate 13 is fixed on the aluminum housing 1 above the first cover plate 10 and the third cover plate 6.

[0029] In the technical solution of this application, the power distribution module 9 is used to divide the received external radio frequency signal into two radio frequency signals with the same amplitude; the two power amplification modules 3 are used to convert the two radio frequency signals with the same amplitude into two radio frequency signals with increased amplitude (simultaneous or time-division output) through a driver amplifier and a power amplifier; the power control device 12 is used to provide a stable DC power supply, control signal and protection circuit for the power distribution module 9 and the power amplification module 3; the detachable heat dissipation fins 14, together with two cooling fans 16, are used to help the power distribution module 9 and the two power amplification modules 3 to dissipate heat quickly and effectively.

[0030] like Figure 1 and Figure 2 As shown, the power distribution module housing 8 is fixed to the inner cavity of the aluminum housing 1 by screws, and the power distribution module 9 is fixed to the inside of the power distribution module housing 8 by welding.

[0031] The first cover plate 10 is fixed to the power distribution module housing 8 by screws. A first milled groove is provided on the side of the first cover plate 10 opposite to the power distribution module 9. A first wave-absorbing material 11 that cooperates with the power distribution module 9 is glued inside the first milled groove with silicone.

[0032] like Figure 1 and Figure 2 As shown, the power amplifier module housing 2 is fixed to the fixing groove opened on the end face of the aluminum housing 1 by screws, and the power amplifier module 3 is fixed to the inside of the power amplifier module housing 2 by welding.

[0033] The second cover plate 4 is fixed to the power amplifier module housing 2 by screws. A second milling groove is provided on the side of the second cover plate 4 opposite to the power amplifier module 3. A second absorbing material 5 that cooperates with the power amplifier module 3 is glued inside the second milling groove with silicone.

[0034] The third cover plate 6 is fixed to the power amplifier module housing 2 with screws, and the fourth cover plate 13 is fixed to the aluminum housing 1 with screws.

[0035] In the technical solution of this application, the power distribution module 9 and the two power amplification modules 3 adopt a micro-assembly design. All devices use bare chips, which are highly integrated, effectively reducing the size and improving the space utilization, and realizing a dual-channel miniaturized split structure layout design.

[0036] The first milled groove on the first cover plate 10 and the second milled groove on the second cover plate 4 are used to directly attach the corresponding wave-absorbing material, which facilitates positioning and installation and can absorb clutter signals. At the same time, the milled grooves on the cover plates make full use of three-dimensional space, effectively reduce volume, improve space utilization, and realize a dual-path miniaturized split structure layout design.

[0037] like Figure 1 and Figure 2 As shown, the power control device 12 is fixed to the inner cavity of the aluminum housing 1 by screws, and the power control device 12 adopts a multi-layer board method.

[0038] Insulators 7 are welded and fixed to the aluminum housing 1, the power divider module housing 8, and the power amplifier module housing 2.

[0039] In the technical solution of this application, the power control device 12 provides a stable DC power supply, control signal and protection circuit to the power distribution module 9 and the power amplification module 3 through the insulator 7.

[0040] The power control device 12 adopts a multi-layer board design, which is highly integrated, effectively reduces the size, improves space utilization, and realizes a dual-channel miniaturized split structure layout design.

[0041] Both power supply and radio frequency signal transmission use sintered insulators, which are welded and fixed to the aluminum shell 1, the power divider module shell 8 and the power amplifier module shell 2. This ensures the reliability of signal transmission and the sealing of the product, while effectively reducing the size, improving space utilization, and realizing a dual-channel miniaturized split structure layout design.

[0042] like Figure 3 As shown, a removable heat dissipation tooth 14 is fixed to the back of the aluminum housing 1 by screws. A mounting bracket 15 is fixed to the inside of the removable heat dissipation tooth 14 by screws. A cooling fan 16 perpendicular to the tooth direction of the removable heat dissipation tooth 14 is fixed to the mounting bracket 15 by screws. A fifth cover plate 17 is fixed to the removable heat dissipation tooth 14 by screws.

[0043] In the technical solution of this application, the structural layout design adopts a split structure of aluminum shell 1, power distribution module 9, power amplifier module 3 and detachable heat dissipation fins 14. The front inner cavity of aluminum shell 1 is equipped with power distribution module shell 8, two power amplifier module shells 2 and power control device 12. The spatial isolation is improved by the cavity and cover design. The back of aluminum shell 1 is equipped with detachable heat dissipation fins 14 and two cooling fans 16, which play a role in heat dissipation. The detachable heat dissipation fins 14 can also be removed to further reduce the size and weight.

[0044] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A miniaturized, split-type dual-channel broadband power amplifier component, characterized in that: The device includes an aluminum housing (1), and the inner cavity of the aluminum housing (1) is fixed with a power distribution module housing (8), two power amplifier module housings (2) and a power control device (12). The power distribution module housing (8) is fixed with a power distribution module (9). The power distribution module housing (8) is fixed with a first cover plate (10). The power amplifier module housing (2) is fixed with a power amplification module (3). The power amplifier module housing (2) is fixed with a second cover plate (4). The power amplifier module housing (2) is fixed with a third cover plate (6) above the second cover plate (4). The aluminum housing (1) is fixed with a fourth cover plate (13) above the first cover plate (10) and the third cover plate (6).

2. The miniaturized split-type dual-channel broadband power amplifier component according to claim 1, characterized in that: The power distribution module housing (8) is fixed to the inner cavity of the aluminum housing (1) by screws, and the power distribution module (9) is fixed to the inside of the power distribution module housing (8) by welding.

3. The miniaturized split-type dual-channel broadband power amplifier component according to claim 1, characterized in that: The first cover plate (10) is fixed to the power distribution module housing (8) by screws. A first milled groove is provided on the side of the first cover plate (10) opposite to the power distribution module (9). The first milled groove is filled with a first wave-absorbing material (11) that cooperates with the power distribution module (9) by silicone.

4. The miniaturized split-type dual-channel broadband power amplifier component according to claim 1, characterized in that: The power amplifier module housing (2) is fixed to the fixing groove opened on the end face of the aluminum housing (1) by screws, and the power amplifier module (3) is fixed to the inside of the power amplifier module housing (2) by welding.

5. The miniaturized split-type dual-channel broadband power amplifier assembly according to claim 1, characterized in that: The second cover plate (4) is fixed to the power amplifier module housing (2) by screws. A second milling groove is provided on the side of the second cover plate (4) opposite to the power amplifier module (3). A second absorbing material (5) that cooperates with the power amplifier module (3) is pasted inside the second milling groove with silicone.

6. The miniaturized split-type dual-channel broadband power amplifier component according to claim 1, characterized in that: The third cover plate (6) is fixed to the power amplifier module housing (2) by screws, and the fourth cover plate (13) is fixed to the aluminum housing (1) by screws.

7. The miniaturized split-type dual-channel broadband power amplifier assembly according to claim 1, characterized in that: The power control device (12) is fixed to the inner cavity of the aluminum housing (1) by screws, and the power control device (12) adopts a multi-layer board method.

8. The miniaturized split-type dual-channel broadband power amplifier component according to claim 1, characterized in that: Insulators (7) are welded and fixed on the aluminum housing (1), the power divider module housing (8), and the power amplifier module housing (2).

9. The miniaturized split-type dual-channel broadband power amplifier component according to claim 1, characterized in that: The back of the aluminum housing (1) is fixed with a removable heat dissipation tooth (14) by screws. The interior of the removable heat dissipation tooth (14) is fixed with a mounting bracket (15) by screws. A cooling fan (16) perpendicular to the tooth direction of the removable heat dissipation tooth (14) is fixed on the mounting bracket (15) by screws. A fifth cover plate (17) is fixed on the removable heat dissipation tooth (14) by screws.

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