Compressor controller and compressor

Abstract

Specifically, the compressor controller comprises a circuit board arranged in a cavity formed by a shell and a cover plate, the shell comprises a heat dissipation area and a frame, the heat dissipation area is arranged at the position, corresponding to a heat source on the circuit board, of the shell, and the rest of the shell is made of heat-conducting plastic or non-heat-conducting plastic with the heat conductivity coefficient being 1-3 W / mK. The heat dissipation area is made of heat conduction plastic with the heat conduction coefficient of 1-20 W / mK, the shell and the frame are integrally formed, and a heat source on the circuit board is attached to the heat dissipation area through heat conduction glue. The controller is simple in structure, low in cost, good in sealing performance, high in machining and assembling efficiency and suitable for the compressor to be used in humid and dusty environments and the like. The heat-conducting plastic is particularly suitable for a high-power compressor, provides a novel heat dissipation thought of a controller, is beneficial to popularization and application of the heat-conducting plastic in the compressor industry, and has excellent energy-saving and carbon-reducing effects compared with a metal aluminum plate.

Description

Technical Field

[0001] This invention belongs to the field of compression equipment, specifically relating to compressor controllers and compressors. Background Technology

[0002] With the increasing use of compressors in cooling and heating devices (such as refrigerators and air conditioners), the demand for compressor control technology is also rising. Controllers (also known as junction boxes) with circuit boards are typically located near the compressor as a crucial component, used to control and protect it. The high power of compressors requires rapid heat dissipation from the heat-generating chips and other electronic components on the circuit board, placing higher demands on the controller's heat dissipation capabilities to ensure the compressor's safe operation and extend its lifespan.

[0003] The existing controller includes a circuit board and a housing. The housing, made of plastic, has a hollow structure with an open bottom, such as... Figure 1 and Figure 2 As shown, the heat sink aluminum plate is fixed in the hollow structure and limited by a fixing mechanism, utilizing the deformation characteristics of the plastic material. It is then assembled with the circuit board using thermal adhesive to dissipate heat from the circuit board chip. Heat dissipation fins are provided on the back of the heat sink aluminum plate and the outer surface of the nearby housing to improve heat dissipation efficiency. The circuit board, through the installation of electronic components such as a boost converter, converts low-voltage DC power into high-voltage DC power to drive electrical equipment requiring high voltage, such as a refrigerator compressor. However, within the relatively compact controller housing, the presence of the heat sink aluminum plate can often cause circuit continuity or other adverse effects on the pins of other electronic components on the circuit board, with the boost circuit experiencing a greater impact. Existing technology uses a large area of ​​solid insulating thermally conductive adhesive to transfer the heat generated by the chip to the heat sink aluminum plate for dissipation, while preventing the conductivity of the heat sink aluminum plate from affecting the normal operation of various electronic components (such as the pins of protruding electronic components located on the same side as the chip). However, the large-area use of insulating thermally conductive adhesive is costly and difficult to apply.

[0004] Furthermore, because the compressor operates in humid and dusty environments, the electronic components on the controller and its internal circuit boards are prone to electric creep, especially on high-voltage circuit boards, affecting safety. A seal is needed for the controller housing. Existing heat dissipation aluminum plates require additional machining to create grooves or steps to fit the housing, resulting in high manufacturing costs. Additionally, other mechanisms are needed to improve the sealing performance (such as tightening sealing rings), making the structure complex. Summary of the Invention

[0005] In order to overcome one of the aforementioned technical problems in the prior art, the purpose of this application is to provide a controller that is simple in structure, low in cost, has good sealing performance, high processing and assembly efficiency, and is suitable for compressors to be used in humid and dusty environments. This is achieved through the following technical solution:

[0006] The compressor controller includes a circuit board disposed within a cavity formed by a housing and a cover plate. The housing includes a heat dissipation area and a frame. The heat dissipation area is located on the housing corresponding to the heat source position on the circuit board. The remaining parts are made of thermally conductive plastic or non-thermally conductive plastic with a thermal conductivity of 1~3W / mK. The heat dissipation area is made of thermally conductive plastic with a thermal conductivity of 1~20W / mK. The housing and the frame are integrally formed. The heat source on the circuit board is attached to the heat dissipation area by thermally conductive adhesive.

[0007] Optionally, the housing is integrally molded from thermally conductive plastic with a thermal conductivity of 1~3W / mK, and the heat dissipation area is integrally molded with a thermally conductive metal plate through an insert injection molding process. The thermally conductive metal plate is provided with one or more avoidance areas to avoid the pins of electronic components on the same side of the chip on the circuit board.

[0008] Optionally, the heat dissipation area of ​​the housing is made of thermally conductive plastic with a thermal conductivity of 4~20W / mK, the frame is made of thermally conductive plastic with a thermal conductivity of 1~3W / mK, and the heat dissipation area is provided with one or more avoidance areas to avoid the pins of electronic components on the same side of the chip on the circuit board. The thermally conductive plastic with a thermal conductivity of 1~3W / mK is filled in the avoidance area, and the housing is integrally formed by two-color injection molding process.

[0009] Optionally, the heat dissipation area of ​​the housing is made of thermally conductive plastic with a thermal conductivity of 4~20W / mK, the frame is made of ordinary plastic, and the heat dissipation area is provided with one or more avoidance areas to avoid the pins of electronic components on the same side of the chip on the circuit board. Ordinary plastic is filled in the avoidance area, and the housing is integrally formed by two-color injection molding process.

[0010] Optionally, the heat dissipation area includes a double-layer structure composed of a first thermally conductive layer and a second thermally conductive layer. The first thermally conductive layer is made of thermally conductive plastic with a thermal conductivity of 1~3W / mK, and the second thermally conductive layer is made of thermally conductive plastic with a thermal conductivity of 4~20W / mK. The first and second thermally conductive layers are integrally molded using a two-color injection molding process. The first thermally conductive layer is located on the inner surface of the housing, and the second thermally conductive layer is located on the outer surface of the housing. The second thermally conductive layer extends one or more thermally conductive platforms to the inner surface of the housing through mating holes on the first thermally conductive layer. The thermally conductive platforms rapidly reduce the heat from the heat source through thermally conductive adhesive, and the thermally conductive platforms are bonded to the heat source through thermally conductive adhesive.

[0011] Optionally, the outer surface of the heat dissipation area is provided with fins.

[0012] Optionally, the thermally conductive adhesive is a thermally conductive silicone grease or a thermally conductive pad structure.

[0013] Optionally, the housing may also be provided with one or more fixing posts for assembling with the cover plate.

[0014] Optionally, the heat dissipation area protrudes from the inner surface of the plane on the frame where the heat dissipation area is located, and the height of the clearance area is kept on the same plane as the frame.

[0015] This application also provides a compressor, including the controller described in any of the foregoing embodiments.

[0016] Compared with existing technologies, this application offers the following advantages: Compared to existing solutions using aluminum heat dissipation plates and frames made of metal or ordinary plastic, this application's solution features lower material costs, simpler processing and assembly, and greater design freedom for the housing. Furthermore, it eliminates the need for sealing rings and other additional sealing structures, improving housing sealing and mitigating creepage issues in humid and dusty environments. This application boasts a simple structure, low cost, excellent sealing, and high processing and assembly efficiency, making it suitable for compressor controllers used in humid and dusty environments. It is particularly suitable for high-power compressors, providing a novel heat dissipation approach for controllers, which is beneficial for the promotion and application of thermally conductive plastics in the compressor industry. Compared to aluminum metal plates, it offers superior energy saving and carbon reduction effects. Attached Figure Description

[0017] Figure 1 A perspective view of the inner side of the compressor controller housing in the prior art;

[0018] Figure 2 This is a three-dimensional disassembled view of the outer side of the compressor controller housing in the prior art;

[0019] Figure 3 This is a perspective view of the inner side of the compressor controller housing described in Example 1;

[0020] Figure 4 This is a perspective view of the outer side of the compressor controller housing described in Example 1;

[0021] Figure 5 This is a perspective view of the inner side of the compressor controller housing described in Example 2;

[0022] Figure 6 This is a perspective view of the inner side of the compressor controller housing described in Example 3;

[0023] Figure 7 This is a perspective view of the inner side of the compressor controller housing described in Example 5;

[0024] Figure 8 This is a perspective view of the inner side of the compressor controller housing described in Example 5;

[0025] In the figure, the reference numerals are: 1-shell, 2-heat dissipation area, 201-first heat-conducting layer, 202-second heat-conducting layer, 203 mating hole, 204 heat-conducting platform, 3-frame, 4-avoidance area, 5-heat-conducting metal plate, 6-fins, 7-fixing column. Detailed Implementation

[0026] The specific implementation of this application is described in detail below through examples. However, the specific implementation of this application is not intended to limit the technical solution of this application. Any non-substantial changes, such as replacing common technical solutions in the field, using the technical solutions described in the embodiments of this application are within the protection scope of this application. Example 1

[0027] like Figure 3 and Figure 4 The compressor controller shown includes a circuit board (not shown in the figure, but can be adjusted by those skilled in the art according to the specific compressor cover) located within the cavity formed by the housing 1 and the cover plate (not shown in the figure, but can be adjusted by those skilled in the art according to the specific compressor cover). For example, the refrigerator compressor housing needs to be set with a structure that matches the terminal blocks on the compressor surface. The housing 1 includes a heat dissipation area 2 and a frame 3. The heat dissipation area 2 is located at the position of the heat source on the circuit board on the housing 1. The remaining parts are made of thermally conductive plastic or non-thermal conductive plastic with a thermal conductivity of 1~3W / mK. The heat dissipation area 2 is made of thermally conductive plastic with a thermal conductivity of 1~20W / mK. The housing 1 and the frame 3 are integrally formed. The heat source on the circuit board is attached to the heat dissipation area 2 by thermally conductive adhesive (not shown in the figure, but those skilled in the art know the structure and shape of the thermally conductive adhesive).

[0028] In this embodiment, the outer surface of the heat dissipation area 2 is provided with fins 6. In other embodiments, the fins 6 may also be provided in other parts of the housing 1.

[0029] In this embodiment, the thermally conductive adhesive is either thermally conductive silicone grease or a thermally conductive pad structure. Those skilled in the art can choose according to their needs.

[0030] In this embodiment, the housing 1 is further provided with one or more fixing posts 7 for assembling with the cover plate. In other embodiments, other structures equivalent to the fixing posts 7 can be used instead, such as a snap-fit ​​structure, which is an equivalent feature of the fixing posts 7. The fixing posts 7 do not exclude the protection scope of other solutions, as those skilled in the art will understand.

[0031] It should be noted that the cover plate used in conjunction with the compressor controller housing 1 is a conventional choice for its field, depending on the different application requirements. For example, when using a cover plate for the refrigerator compressor controller housing 1, those skilled in the art can adopt the cover plate structure disclosed in patent CN207835981U, or other structures, as long as the requirements are met.

[0032] This embodiment fully utilizes the insulating properties of thermally conductive plastics with a thermal conductivity of 1~3W / mK, eliminating the need for insulating thermally conductive adhesive at the pins of electronic components located on the same side of the chip on the circuit board, further reducing costs. Example 2

[0033] like Figure 5 The compressor controller described herein has a structure largely the same as that in Embodiment 1, and the external perspective view of housing 1 is the same. Figure 3 The same, so it will not be repeated. The difference is that in this embodiment, the housing 1 is integrally molded from thermally conductive plastic with a thermal conductivity of 1~3W / mK, and the heat dissipation area 2 is integrally molded with a thermally conductive metal plate 5 through an insert injection molding process. The thermally conductive metal plate 5 is provided with one or more avoidance areas 4 to avoid the pins of electronic components on the same side of the chip on the circuit board. Embedding the thermally conductive metal plate 5 in the heat dissipation area 2 through the insert injection molding process can compensate for the heat dissipation effect when the heat source has a higher heat dissipation power. However, the thermally conductive metal plate 5 itself is conductive. In this solution, avoidance areas 4 are set according to the position of the pins of electronic components on the same side of the chip on the circuit board. Figure 3 In the diagram, the avoidance zone 4 is only for illustration; in reality, there can be one or more zones, with regular or irregular shapes, which can be designed according to requirements. The process of stamping the heat-conducting metal plate 5 into a specific shape is relatively simple and low-cost. Example 3

[0034] like Figure 6 The compressor controller described herein has a structure largely the same as that in Embodiment 1, and the external perspective view of housing 1 is the same. Figure 3 The same applies, so it will not be repeated. The difference is that in this embodiment, the heat dissipation area 2 of the housing 1 is made of thermally conductive plastic with a thermal conductivity of 4~20W / mK, the frame 3 is made of thermally conductive plastic with a thermal conductivity of 1~3W / mK, and the heat dissipation area 2 is provided with one or more avoidance areas 4 to avoid the pins of electronic components on the same side of the chip on the circuit board. The thermally conductive plastic with a thermal conductivity of 1~3W / mK is filled in the avoidance area 4, and the housing 1 is integrally formed by a two-color injection molding process. Example 4

[0035] The compressor controller described in this embodiment has a structure that is generally the same as that in Embodiment 1 (including the figure, which is also the same as that in Embodiment 1, so the schematic diagram is omitted). The difference is that in this embodiment, the heat dissipation area 2 of the housing 1 is made of thermally conductive plastic with a thermal conductivity of 4~20W / mK, the frame 3 is made of ordinary plastic, and the heat dissipation area 2 is provided with one or more avoidance areas 4 to avoid the pins of electronic components on the same side of the chip on the circuit board. Ordinary plastic is filled in the avoidance area 4, and the housing 1 is integrally formed by two-color injection molding process. Example 5

[0036] like Figure 7and Figure 8 The compressor controller described herein has a generally similar structure to that in Embodiment 1, the difference being that the external perspective view of housing 1 is different. Figure 3 Same as above, will not be repeated. In this embodiment, the heat dissipation area 2 includes a double-layer structure composed of a first thermally conductive layer 201 and a second thermally conductive layer 202. The first thermally conductive layer 201 is made of thermally conductive plastic with a thermal conductivity of 1~3W / mK, and the second thermally conductive layer 202 is made of thermally conductive plastic with a thermal conductivity of 4~20W / mK. The first thermally conductive layer 201 and the second thermally conductive layer 202 are integrally formed by a two-color injection molding process. The first thermally conductive layer 201 is located on the inner surface of the shell 1, and the second thermally conductive layer 202 is located on the outer surface of the shell 1. The second thermally conductive layer 202 extends one or more thermally conductive platforms 204 to the inner surface of the shell 1 through the mating holes 203 on the first thermally conductive layer 201. The thermally conductive platforms 204 rapidly reduce the heat of the heat source through thermally conductive adhesive. The thermally conductive platforms 204 are attached to the heat source through thermally conductive adhesive. That is, the thermally conductive platforms 204 rapidly disperse the heat of the heat source to the second thermally conductive layer 202 through thermally conductive adhesive to reduce the heat. The thermally conductive platforms 204 are attached to the heat source through thermally conductive adhesive. The arrangement of the first thermal conductive layer 201 and the second thermal conductive layer 202, on the one hand, makes full use of the high thermal conductivity of the second thermal conductive layer 202 for rapid cooling, and on the other hand, makes full use of the thermal conductivity and insulation properties of the first thermal conductive layer 201, eliminating the need for a large-sized insulating thermal conductive pad as thermal conductive adhesive, avoiding the influence of the second thermal conductive layer 202 on the pins of electronic components on the same side of the chip on the circuit board, reducing the risk of creepage, and significantly saving the cost of large-sized insulating thermal conductive pads, especially for circuit boards containing boost modules.

[0037] In this embodiment, Figure 7 As can be seen, the heat dissipation area 2 protrudes from the inner surface of the plane containing the heat dissipation area 2 on the frame 1, and the height of the clearance area 4 is flush with the frame 3. This provides sufficient space for the clearance area 4, increasing the distance between the pins of the electronic components on the circuit board and the inner surface of the housing 1. This further reduces the probability of mutual interference between electronic components. In other embodiments, this feature may not be included.

[0038] In this embodiment, the heat-conducting platform 204 protrudes from the inner surface of the first heat-conducting layer 201. In other embodiments, it may be flush with the inner surface of the first heat-conducting layer 201.

[0039] It should be noted that in this embodiment, the mating holes on the actual product do not need to be clearly marked. It is only necessary to use thermally conductive plastic with a thermal conductivity of 4~20W / mK to lead the heat conduction platform 204 out of the outer surface of the housing 1 through the mating holes. Example 6

[0040] A compressor includes the compressor controller described in any one of embodiments 1 to 5.

[0041] It should be noted that in Examples 3 and 4, those skilled in the art can select ordinary plastics or thermally conductive plastics with a thermal conductivity of 1~3 W / mK according to the ideas of this application and actual needs, such as the mechanical performance requirements of the shell.

[0042] It should be noted that the thermal conductivity is tested according to GB / T 22588-2008 standard or ASTM E 1461 standard.

[0043] It should be noted that non-thermal conductive plastics refer to plastics that have not been modified by filling with special thermally conductive fillers. This does not mean that the thermal conductivity must be 0. The reason is that, under normal circumstances, some plastic matrices and their fillers can still have thermal conductivity, usually within 0.5 W / mK, such as 0.2 W / mK or 0.3 W / mK. Those skilled in the art do not regard them as thermally conductive plastics. Compared with thermally conductive plastics, they are only defined as non-thermal conductive plastics or ordinary plastics.

[0044] It should be noted that thermally conductive plastics with a thermal conductivity of 1~3 W / mK have a high surface resistance and are generally considered to be insulating thermally conductive plastics. Their insulation performance meets the requirement that the pins of electronic components located on the same side of the chip on the circuit board will not interfere with each other. For thermally conductive plastics with a thermal conductivity of 4~20 W / mK, the surface resistance gradually decreases and the insulation performance gradually declines. The insulation performance is relatively poor under high voltage. According to the idea of ​​this application, an additional avoidance area is set to reduce the probability that the pins of electronic components located on the same side of the chip on the circuit board will not interfere with each other.

[0045] It should be noted that the heat dissipation area 2 described in this application does not strictly refer to the fact that only the heat dissipation area 2 can dissipate heat while other components such as the frame 3 do not dissipate heat. Rather, it emphasizes an area located near the heat source, which is represented by dashed lines in the attached drawings. Except for line obscuration caused by differences in actual structure or materials, those skilled in the art will understand that it is not strictly limited to shapes such as rectangles.

[0046] It should be noted that in this application, the heat source may refer to a chip on the circuit board that generates heat, or it may be other structures that require heat dissipation.

[0047] It should be noted that the components used in the above embodiments can be selected or replaced by those skilled in the art according to their needs, without exceeding the scope of protection of this application.

Claims

1. A compressor controller comprising a circuit board disposed within a cavity defined by a housing and a cover plate, the compressor controller characterized by, The housing includes a heat dissipation area and a frame. The heat dissipation area is located on the housing at the position of the heat source on the circuit board. The remaining parts are made of thermally conductive plastic or non-thermally conductive plastic with a thermal conductivity of 1~3W / mK. The heat dissipation area is made of thermally conductive plastic with a thermal conductivity of 1~20W / mK. The housing and the frame are integrally formed. The heat source on the circuit board is attached to the heat dissipation area by thermally conductive adhesive.

2. The controller of claim 1, wherein, The housing is integrally molded from thermally conductive plastic with a thermal conductivity of 1~3W / mK. The heat dissipation area is integrally molded with a thermally conductive metal plate through an insert injection molding process. The thermally conductive metal plate is provided with one or more avoidance areas to avoid the pins of electronic components on the same side of the chip on the circuit board.

3. The controller of claim 1, wherein, The heat dissipation area of ​​the housing is made of thermally conductive plastic with a thermal conductivity of 4~20W / mK, and the frame is made of thermally conductive plastic with a thermal conductivity of 1~3W / mK. The heat dissipation area is provided with one or more avoidance areas to avoid the pins of electronic components on the same side of the chip on the circuit board. The thermally conductive plastic with a thermal conductivity of 1~3W / mK is filled in the avoidance area. The housing is integrally formed by two-color injection molding process.

4. The controller of claim 1, wherein, The heat dissipation area of ​​the housing is made of thermally conductive plastic with a thermal conductivity of 4~20W / mK, the frame is made of ordinary plastic, and the heat dissipation area is provided with one or more avoidance areas to avoid the pins of electronic components on the same side of the chip on the circuit board. Ordinary plastic is filled in the avoidance area, and the housing is integrally formed by two-color injection molding process.

5. The controller of claim 1, wherein, The heat dissipation area includes a double-layer structure consisting of a first thermally conductive layer and a second thermally conductive layer. The first thermally conductive layer is made of thermally conductive plastic with a thermal conductivity of 1~3W / mK, and the second thermally conductive layer is made of thermally conductive plastic with a thermal conductivity of 4~20W / mK. The first and second thermally conductive layers are integrally molded using a two-color injection molding process. The first thermally conductive layer is located on the inner surface of the housing, and the second thermally conductive layer is located on the outer surface of the housing. The second thermally conductive layer extends one or more thermally conductive platforms to the inner surface of the housing through mating holes on the first thermally conductive layer. The thermally conductive platforms rapidly reduce the heat from the heat source through thermally conductive adhesive, and the thermally conductive platforms are bonded to the heat source through thermally conductive adhesive.

6. The controller of any one of claims 1 to 5, wherein, The outer surface of the heat dissipation area is provided with fins.

7. The controller of any one of claims 1-5, wherein, The thermally conductive adhesive is either thermally conductive silicone grease or a thermally conductive pad structure.

8. The controller of any one of claims 1-5, wherein, The housing is also provided with one or more fixing posts for assembling the cover plate.

9. The controller of any one of claims 2 to 4, wherein, The heat dissipation area protrudes from the inner surface of the plane on the frame where the heat dissipation area is located, and the height of the clearance area is kept at the same plane as the frame.

10. A compressor characterized by, Includes the controller as described in any one of claims 1 to 9.

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