Chip power device packaging module with heat dissipation channel

Abstract

The utility model relates to the technical field of chip mounters, in particular to a chip power device packaging module with a heat dissipation channel. According to the technical scheme, the device comprises a mounting head, a sleeve is fixedly connected to one end of the mounting head, the sleeve is hollow, a pushing sleeve is slidably connected to the position, away from the mounting head, in the sleeve, a sliding pipe is fixedly connected to the end, away from the sleeve, of the pushing sleeve, and a blowing and sucking pipe is fixedly connected to the inner side of the sleeve; and a plurality of blowing and sucking pipes are arranged in the sleeve in a circumferential array. According to the utility model, pushing force generated when the rubber ring is contacted with the PCB is utilized to drive the sliding pipe and the rubber ring to slide, so that the rubber ring extrudes air in the sleeve, and the air is sprayed out along the position of the blowing and sucking pipe, thereby cooling glue overflowing from the power device as much as possible, and improving the production efficiency. The problem that the power device installed in a patch mode is not firm due to the fact that wind power of a cooling fan is upward in the past is solved, and the stability of the power device in the patch installation process is improved.

Description

Technical Field

[0001] This utility model relates to the field of chip mounter technology, and in particular to a chip mount power device packaging module with heat dissipation channels. Background Technology

[0002] A pick-and-place machine is an automated device that uses a moving placement head to precisely place surface mount components onto PCB pads. It is widely used in the electronics manufacturing industry. When using a pick-and-place machine, the adhesive needs to be heated before placing the required power devices onto the PCB board. Therefore, a unique heat dissipation structure is required to dissipate the heat and prevent the internal temperature of the equipment from becoming too high.

[0003] The existing heat dissipation method for pick-and-place machines is to use a water-cooled fan that flows through the inside of the equipment. The heat generated inside the equipment is removed through liquid heat absorption and air cooling, thereby controlling the internal temperature of the equipment within a specified range.

[0004] However, when power devices are surface-mounted, heat is concentrated near the surface-mount location. The airflow from the water-cooling fan is upward, which causes an upward force on the newly surface-mounted power device, resulting in an unstable installation. Therefore, this application proposes a surface-mount power device packaging module with a heat dissipation channel. Utility Model Content

[0005] The purpose of this invention is to address the problem in the background technology where, when power devices are surface-mounted, heat is concentrated near the surface-mount location. The upward airflow from the water-cooling fan causes the newly surface-mounted power device to experience an upward force, resulting in an unstable installation. This invention proposes a surface-mount power device packaging module with a heat dissipation channel.

[0006] The technical solution of this utility model is as follows: a surface-mount power device packaging module with heat dissipation channel, including a mounting head, a sleeve fixedly connected to one end of the mounting head, the sleeve being hollow, a push sleeve slidably connected inside the sleeve away from the mounting head, a slide tube fixedly connected to one end of the push sleeve away from the sleeve, a blow-suction tube fixedly connected to the inner side of the sleeve, a plurality of blow-suction tubes arranged in a circumferential array inside the sleeve, the blow-suction tubes communicating with the inside of the sleeve, and a tensioning component provided outside the slide tube.

[0007] Optionally, the tensioning assembly includes a reset tube, which is fixedly connected to the outside of the slide tube. A spring is fixedly connected inside the reset tube, and the end of the spring away from the reset tube is fixedly connected to the side of the mounting head near the sleeve.

[0008] Optionally, a protective tube is fixedly connected to the side of the mounting head near the sleeve, the protective tube is disposed outside the sleeve, and the protective tube is slidably connected to the outside of the reset tube.

[0009] Optionally, a rubber ring is fixedly connected to the end of the slide tube away from the push sleeve, and a connecting plate is fixedly connected to the side of the mounting head away from the sleeve. There are multiple mounting heads arranged in a linear array on one side of the connecting plate.

[0010] Optionally, a connecting block is fixedly connected to the side of the connecting plate away from the mounting head, an adjusting block is slidably connected inside the connecting block, and an adjusting bracket is fixedly connected to one side of the adjusting block.

[0011] Optionally, sliders are fixedly connected to both ends of the adjustment frame, and a housing is provided on the outside of the sliders.

[0012] Optionally, a groove is provided inside the housing near the slider, the slider is slidably connected inside the groove, and a base is fixedly connected to the inside of the housing near the bottom.

[0013] Optionally, a cooling fan is fixedly connected to the top of the casing, the cooling fan is connected to the inside of the casing, and a door panel is slidably connected inside the casing, with two door panels arranged symmetrically.

[0014] Compared with the prior art, this application includes at least one of the following beneficial technical effects: This device utilizes the thrust generated when the rubber ring contacts the PCB board to drive the slide tube and the rubber ring to slide, allowing the rubber ring to compress air inside the sleeve, and allowing the air to be sprayed out along the blow-suction tube, thereby cooling the overflowing glue of the power device as much as possible. This solves the problem that the upward airflow of the cooling fan caused the surface mount power device to be unstable, and improves the stability of the surface mount power device. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of a surface-mount power device package module with heat dissipation channels;

[0016] Figure 2 This is a schematic diagram of the overall cross-sectional structure of a surface-mount power device package module with heat dissipation channels;

[0017] Figure 3 for Figure 2 Enlarged structural diagram at point A in the middle;

[0018] Figure 4 This is a schematic diagram of the adjustment frame structure;

[0019] Figure 5 for Figure 4 Enlarged structural diagram at point B;

[0020] Figure 6 This is a schematic diagram of the cross-sectional structure of the clamping head;

[0021] Figure 7 for Figure 6 Enlarged structural diagram at point C.

[0022] Reference numerals in the attached drawings: 1. Mounting head; 2. Sleeve; 3. Push sleeve; 4. Slide tube; 5. Rubber ring; 6. Blow-suction tube; 7. Reset tube; 8. Spring; 9. Protective tube; 10. Connecting plate; 11. Connecting block; 12. Adjusting block; 13. Adjusting frame; 14. Slider; 15. Slide groove; 16. Housing; 17. Cooling fan; 18. Base; 19. Door panel. Detailed Implementation

[0023] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0024] like Figure 6 and Figure 7 As shown, the surface-mount power device packaging module with heat dissipation channel proposed in this utility model includes a mounting head 1. A sleeve 2 is fixedly connected to one end of the mounting head 1. The sleeve 2 is hollow. A push sleeve 3 is slidably connected inside the sleeve 2 away from the mounting head 1. A slide tube 4 is fixedly connected to the end of the push sleeve 3 away from the sleeve 2. A blow-suction tube 6 is fixedly connected to the inside of the sleeve 2. There are multiple blow-suction tubes 6 arranged in a circumferential array inside the sleeve 2. The blow-suction tubes 6 are connected to the inside of the sleeve 2. The hollow structure of the slide tube 4, together with the blow-suction tubes 6, can squeeze the air inside the sleeve 2 when the push sleeve 3 moves upward, thereby blowing air to the position of the power device. When the push sleeve 3 moves downward, it can suck the air into the sleeve 2. A tensioning assembly is provided outside the slide tube 4. The tensioning assembly includes a reset tube 7. The reset tube 7 is fixedly connected to the outside of the slide tube 4. A spring 8 is fixedly connected inside the reset tube 7. The end of the spring 8 away from the reset tube 7 is fixedly connected to the side of the mounting head 1 near the sleeve 2. The spring 8 can be used to reset the slide tube 4 and the reset tube 7.

[0025] in addition Figures 5-7 As shown, a protective tube 9 is fixedly connected to the side of the mounting head 1 near the sleeve 2. The protective tube 9 is located outside the sleeve 2 and is slidably connected to the outside of the reset tube 7. The sliding of the reset tube 7 inside the protective tube 9 can protect the extension and retraction of the spring 8. A rubber ring 5 is fixedly connected to the end of the slide tube 4 away from the push sleeve 3. The rubber ring 5 can better fit with the PCB board. A connecting plate 10 is fixedly connected to the side of the mounting head 1 away from the sleeve 2. There are multiple mounting heads 1 arranged in a linear array on one side of the connecting plate 10. Multiple connecting plates 10 can be used to assemble multiple sets of PCB boards simultaneously.

[0026] like Figure 3 , Figure 4 and Figure 5As shown, a connecting block 11 is fixedly connected to the side of the connecting plate 10 away from the mounting head 1. An adjusting block 12 is slidably connected inside the connecting block 11. The connecting block 11 can be adjusted along the Z-axis by sliding outside the adjusting block 12. An adjusting frame 13 is fixedly connected to one side of the adjusting block 12. The adjusting frame 13 allows the adjusting block 12 to be adjusted along the X-axis and Y-axis outside of it. Slider 14 is fixedly connected to both ends of the adjusting frame 13. A housing 16 is provided outside the slider 14.

[0027] In addition, such as Figure 1 and Figure 2 As shown, a slide groove 15 is provided inside the housing 16 near the slider 14. The slider 14 is slidably connected inside the slide groove 15. The sliding of the housing 16 inside the slide groove 15 makes the movement of the adjustment frame 13 more stable. A base 18 is fixedly connected to the inside of the housing 16 near the bottom. A cooling fan 17 is fixedly connected to the top of the housing 16. The cooling fan 17 is connected to the inside of the housing 16 and can dissipate the heat generated inside the housing 16. A door panel 19 is slidably connected inside the housing 16. There are two door panels 19 arranged symmetrically.

[0028] In this embodiment, when performing surface mount technology (SMT), the door panel 19 is first opened, and then the raw material tray is placed on top of the base 18. After starting the equipment, the PCB board is placed along one side of the housing 16. The mounting head 1 can then move according to a predetermined program. When the mounting head 1 moves, it can slide outside the adjusting block 12 by relying on the connecting plate 10 and the connecting block 11 to move along the Z-axis. The adjusting block 12 can move along the X-axis on one side of the adjusting frame 13, and the adjusting frame 13 can move along the Y-axis by relying on the slider 14. In this way, different positions can be moved and SMT can be installed.

[0029] When the mounting head 1 is installed, it needs to be pressed down. When the mounting head 1 is pressed down, it will cause the rubber ring 5 to contact the PCB board. The slide groove 15 will then cause the slide tube 4 and the push sleeve 3 to slide inside the sleeve 2. In this way, the push sleeve 3 can squeeze the gas inside the sleeve 2. The gas will be sprayed out from the blow-suction tube 6 under the pressure of the push sleeve 3. This can blow the glue overflowing from the power device on the PCB board to a semi-dry state, preventing the glue from being in a melted state and loosening after the power device is installed.

[0030] After the power device is installed, the mounting head 1 is lifted, and the spring 8 will push the reset tube 7 downward inside the protective tube 9, so that the reset tube 7 drives the slide tube 4 to reset. When the slide tube 4 is reset, the mounting head 1 has been lifted from the surface of the power device. At this time, the blow-suction tube 6 will simultaneously draw air into the sleeve 2 again, so as to facilitate blowing air to the position of the power device during the next installation.

[0031] It should be noted that this device utilizes the thrust generated when the rubber ring 5 contacts the PCB board to drive the slide tube 4 and the rubber ring 5 to slide, allowing the rubber ring 5 to compress air inside the sleeve 2, and then spraying the air out along the blow-suction tube 6, thereby cooling the overflowing glue of the power device as much as possible. This solves the problem that the upward airflow of the cooling fan caused the surface mount power device to be unstable, and improves the stability of the surface mount power device.

[0032] The above specific embodiments are merely several optional embodiments of this utility model. Based on the technical solution of this utility model and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. A surface-mount power device package module with a heat dissipation channel, including a mounting head (1), characterized in that: One end of the mounting head (1) is fixedly connected to a sleeve (2). The sleeve (2) is hollow. A push sleeve (3) is slidably connected inside the sleeve (2) away from the mounting head (1). A slide tube (4) is fixedly connected to the end of the push sleeve (3) away from the sleeve (2). A blow-suction tube (6) is fixedly connected to the inside of the sleeve (2). There are multiple blow-suction tubes (6) arranged in a circumferential array inside the sleeve (2). The blow-suction tubes (6) are connected to the inside of the sleeve (2). A tensioning component is provided on the outside of the slide tube (4).

2. The surface-mount power device package module with heat dissipation channel according to claim 1, characterized in that, The tensioning assembly includes a reset tube (7), which is fixedly connected to the outside of the slide tube (4). A spring (8) is fixedly connected inside the reset tube (7), and the end of the spring (8) away from the reset tube (7) is fixedly connected to the side of the mounting head (1) near the sleeve (2).

3. The surface-mount power device packaging module with heat dissipation channel according to claim 2, characterized in that, The mounting head (1) is fixedly connected to a protective tube (9) on the side near the sleeve (2). The protective tube (9) is located outside the sleeve (2) and is slidably connected to the outside of the reset tube (7).

4. The surface-mount power device package module with heat dissipation channel according to claim 1, characterized in that, A rubber ring (5) is fixedly connected to the end of the slide tube (4) away from the push sleeve (3), and a connecting plate (10) is fixedly connected to the side of the mounting head (1) away from the sleeve (2). There are multiple mounting heads (1) arranged in a linear array on one side of the connecting plate (10).

5. The surface-mount power device package module with heat dissipation channel according to claim 4, characterized in that, A connecting block (11) is fixedly connected to the side of the connecting plate (10) away from the mounting head (1). An adjusting block (12) is slidably connected inside the connecting block (11). An adjusting bracket (13) is fixedly connected to one side of the adjusting block (12).

6. The surface-mount power device package module with heat dissipation channel according to claim 5, characterized in that, The adjusting frame (13) has sliders (14) fixedly connected to both ends, and the sliders (14) are provided with a shell (16) on the outside.

7. The surface-mount power device package module with heat dissipation channel according to claim 6, characterized in that, The housing (16) has a groove (15) inside near the slider (14), the slider (14) is slidably connected inside the groove (15), and a base (18) is fixedly connected to the inside of the housing (16) near the bottom.

8. The surface-mount power device package module with heat dissipation channel according to claim 7, characterized in that, A cooling fan (17) is fixedly connected to the top of the housing (16). The cooling fan (17) is connected to the inside of the housing (16). A door panel (19) is slidably connected inside the housing (16). There are two door panels (19) arranged symmetrically.

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