Preheating and cooling structure of eutectic chip mounter
By introducing preheating and precooling structures into the eutectic bonding machine, the problems of long heating time and internal stress in the eutectic bonding machine are solved, efficiency is improved and nitrogen consumption is reduced, and chip reliability is enhanced.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 中科光智(重庆)科技有限公司
- Filing Date
- 2025-04-28
- Publication Date
- 2026-05-19
AI Technical Summary
Existing eutectic bonding machines require prolonged heating of the substrate and chip during eutectic bonding, resulting in low efficiency, internal stress generated during high-temperature cooling, and high nitrogen consumption with poor performance.
Introducing preheating and precooling structures into the eutectic bonding machine, the preheating component preheats the substrate and provides nitrogen protection within a closed space, while the precooling component cools the high-temperature substrate, reducing eutectic bonding time and internal stress, and optimizing nitrogen usage.
It improves the working efficiency of the eutectic bonding machine, reduces nitrogen consumption, prevents oxidation of the bonding surface, and enhances chip reliability.
Smart Images
Figure CN224265426U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip mounting technology, specifically to a preheating and cooling structure for a eutectic chip mounter. Background Technology
[0002] Eutectic bonding machines are automated equipment that uses the eutectic bonding principle to bond chips to substrates, and are widely used in the electronics manufacturing industry.
[0003] Current eutectic bonding machines mainly consist of a main body, a loading / unloading module, and a eutectic stage module. Both the loading / unloading module and the eutectic stage module are mounted on the main body. During operation, the material to be eutectic bonded is mounted onto a substrate, which is then placed in the loading tray of the loading / unloading module. The loading / unloading module transports the substrate to the eutectic stage module for eutectic bonding processing. After eutectic bonding, the substrate is returned to the unloading tray of the loading / unloading module. In this type of eutectic bonding machine, the substrate and chip are typically heated before eutectic bonding, and after bonding, the high-temperature substrate with the chip is directly transferred to the unloading tray. Therefore, existing eutectic bonding machines have the following problems: 1. Heating the substrate and chip again during eutectic bonding often takes a long time, thus reducing the machine's efficiency. 2. Directly transferring the high-temperature substrate with the chip attached to the unloading tray results in a large temperature gradient during the cooling process of the substrate. This leads to significant internal stress between the chip and the substrate after cooling, reducing the reliability of the chip in subsequent use. 3. Existing eutectic bonding machines are prone to oxidation at the bonding surface due to the high temperatures during heating of the substrate and chip, as well as during eutectic bonding. Therefore, nitrogen gas needs to be introduced to prevent oxidation. However, current eutectic bonding machines on the market often introduce nitrogen gas into the entire module. This method not only consumes a large amount of nitrogen but also results in a low nitrogen concentration at the bonding surface, failing to achieve effective oxidation protection. Utility Model Content
[0004] In view of the above-mentioned shortcomings of the existing technology, the technical problem to be solved by this utility model is: how to provide a preheating and cooling structure for a eutectic bonding machine that can preheat the substrate before eutectic bonding, thereby reducing the time required for eutectic bonding and improving the working efficiency of the eutectic bonding machine.
[0005] In addition, this utility model also provides a working method for the preheating and cooling structure of a eutectic bonding machine.
[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:
[0007] A preheating and cooling structure for a eutectic bonding machine includes a preheating assembly. The preheating assembly includes a preheating mounting base, on which a preheating rod, a first substrate support plate, a first substrate top air isolation plate, and a first vertical moving assembly are provided. The first substrate support plate is used to place a substrate, and the preheating rod is used to preheat the substrate on the first substrate support plate. The first vertical moving assembly includes a first vertical power component, a first substrate pressing plate, and a first substrate side baffle. The power output end of the first vertical power component is connected to the first substrate pressing plate and the first substrate side baffle respectively through a first connecting plate. The first vertical power component is used to drive the first substrate pressing plate and the first substrate side baffle to move vertically to a first upper set position and a first lower set position. The first upper set position is the position where the first substrate pressing plate is separated from the substrate on the first substrate support plate, and the first lower set position is the position where the first substrate pressing plate is pressed against the substrate on the first substrate support plate. At the first lower set position, the first substrate support plate, the first substrate side baffle, and the first substrate top air isolation plate form a relatively closed space for substrate preheating.
[0008] The working principle of this utility model is as follows: The preheating and cooling structure of this solution is set between the loading and unloading module and the eutectic stage module. When preheating the substrate, the first vertical power component first drives the first substrate pressing sheet and the first substrate side baffle to move upward to the first upper set position. Then, the substrate in the loading box of the loading and unloading module is transported to the first substrate support plate. Then, the first vertical power component drives the first substrate pressing sheet and the first substrate side baffle to move downward to the first lower set position. At this time, the first substrate pressing sheet presses the substrate on the first substrate support plate to ensure the stability of the substrate during the preheating process. The first substrate side baffle blocks the first substrate support plates from both ends, so that the first substrate support plate, the first substrate side baffle and the air isolation plate at the top of the first substrate form a relatively closed space during substrate preheating. At this time, the preheating rod preheats the substrate. After the preheating process is completed, the first vertical power component drives the first substrate pressing sheet and the first substrate side baffle to move upward to the first upper set position again to facilitate the transport of the substrate to the eutectic stage module for eutectic bonding.
[0009] In summary, before eutectic bonding, this solution first transports the substrate in the loading box of the loading module to the preheating component of the preheating and cooling structure for preheating. This allows the substrate to be preheated promptly upon arrival at the eutectic bonding stage module. Furthermore, when processing multiple substrates continuously, while one substrate is being preheated at the eutectic bonding stage module, the next substrate to be processed can be preheated at the preheating component of the preheating and cooling structure. This reduces the time required for eutectic bonding and improves the working efficiency of the eutectic bonding machine.
[0010] Preferably, the first vertical power component is a first cylinder, the preheating mounting base is provided with a first guide rail, the first connecting plate is provided with a first slider, the first slider is slidably connected to the first guide rail, and the first connecting plate is connected to the power output end of the first cylinder, so that when the power output end of the first cylinder moves vertically, the first slider slides along the first guide rail to guide the vertical movement of the first substrate pressing sheet and the first substrate side baffle.
[0011] In this way, the first cylinder drives the first connecting plate to move vertically, and the first connecting plate drives the first slider to slide along the first guide rail, thereby guiding the first substrate pressing sheet and the side baffle of the first substrate and ensuring the accuracy of the moving position.
[0012] Preferably, a first air inlet plate is provided on both sides of the first substrate support plate along the axial direction, and a plurality of first nitrogen inlet holes are provided on the first air inlet plate for inputting nitrogen.
[0013] In this way, by setting multiple first nitrogen gas inlets on both sides of the first substrate support plate, nitrogen gas is introduced through the first nitrogen gas inlets when the substrate is preheated to prevent oxidation of the bonding surface. Since the first substrate support plate, the first substrate side baffle and the first substrate top air isolation plate form a relatively closed space when the substrate is preheated during the entire preheating process, the nitrogen gas introduced through the first nitrogen gas inlets can act better on the bonding surface, which not only reduces the amount of nitrogen gas used, but also ensures the effect of preventing oxidation of the bonding surface.
[0014] Preferably, the first substrate pressing sheet is provided with a plurality of plates along the longitudinal direction, and the first substrate side baffle is provided with two plates, and the two first substrate side baffles are respectively positioned opposite to the longitudinal sides of the first substrate support plate.
[0015] In this way, multiple first substrate pressing plates can press multiple positions of the substrate, further improving the stability of the substrate preheating process. The two first substrate side baffles correspond to the longitudinal sides of the first substrate support plate to better meet the requirements of the enclosed space.
[0016] Preferably, the preheating and cooling structure further includes a precooling component, which includes a precooling mounting base. The precooling mounting base is provided with a precooling rod, a second substrate support plate, a second substrate top air isolation plate, and a second vertical moving component. The second substrate support plate is used to place the substrate, and the precooling rod is used to precool the substrate on the second substrate support plate. The second vertical moving component includes a second vertical power member, a second substrate pressing plate, and a second substrate side baffle. The power output end of the second vertical power member is connected to the second substrate pressing plate and the second substrate side baffle respectively through a second connecting plate. The second vertical power member is used to drive the second substrate pressing plate and the second substrate side baffle to move vertically to a second upper set position and a second lower set position. The second upper set position is the position where the second substrate pressing plate is separated from the substrate on the second substrate support plate, and the second lower set position is the position where the second substrate pressing plate is pressed against the substrate on the second substrate support plate. In the second lower set position, the second substrate support plate, the second substrate side baffle, and the second substrate top air isolation plate form a relatively closed space for substrate precooling.
[0017] In this way, during the pre-cooling of the substrate, the second vertical power component first drives the second substrate pressing sheet and the second substrate side baffle to move upward to the second upper set position. Then, the substrate on the eutectic stage module is transported to the second substrate support plate. Then, the second vertical power component drives the second substrate pressing sheet and the second substrate side baffle to move downward to the second lower set position. At this time, the second substrate pressing sheet presses the substrate on the second substrate support plate to ensure the stability of the substrate during the pre-cooling process. The second substrate side baffle blocks the second substrate support plate from both ends, so that the second substrate support plate, the second substrate side baffle, and the air isolation plate at the top of the second substrate form a relatively closed space during the pre-cooling of the substrate. At this time, the pre-cooling rod performs pre-cooling treatment on the substrate. After the pre-cooling treatment is completed, the second vertical power component drives the second substrate pressing sheet and the second substrate side baffle to move upward to the second upper set position again, and then transports the substrate into the unloading box. By setting up a pre-cooling component, the substrate with the chip attached is pre-cooled, thereby reducing the temperature gradient during the cooling process of the high-temperature substrate, reducing the internal stress between the chip and the substrate after cooling, and improving the reliability of the chip in subsequent use.
[0018] Preferably, the second vertical power component is a second cylinder, the pre-cooling mounting base is provided with a second guide rail, the second connecting plate is provided with a second slider, the second slider is slidably connected to the second guide rail, and the second connecting plate is connected to the power output end of the second cylinder, so that when the power output end of the second cylinder moves vertically, the first slider slides along the first guide rail to guide the vertical movement of the first substrate pressing sheet and the first substrate side baffle.
[0019] In this way, the second cylinder drives the second connecting plate to move vertically, and the second connecting plate drives the second slider to slide along the second guide rail, thereby guiding the second substrate pressing sheet and the side baffle of the second substrate and ensuring the accuracy of the movement position.
[0020] Preferably, a second air inlet plate is provided on both axial sides of the second substrate support plate, and a plurality of second nitrogen inlet holes are provided on the second air inlet plate for inputting nitrogen.
[0021] In this way, by setting multiple second nitrogen inlet holes on both sides of the second substrate support plate, nitrogen is introduced through the second nitrogen inlet holes when the substrate is pre-cooled to prevent oxidation of the bonding surface. Since the second substrate support plate, the second substrate side baffle and the second substrate top air isolation plate form a relatively closed space when the substrate is pre-cooled during the entire pre-cooling process, the nitrogen introduced through the second nitrogen inlet holes can act better on the bonding surface, which not only reduces the amount of nitrogen used, but also ensures the effect of preventing oxidation of the bonding surface.
[0022] Preferably, the second substrate pressing sheet is provided with a plurality of plates along the longitudinal direction, and the second substrate side baffle is provided with two plates, and the two second substrate side baffles are respectively positioned opposite to the longitudinal sides of the second substrate support plate.
[0023] In this way, multiple second substrate clamping plates can press multiple positions of the substrate, further improving the stability of the substrate pre-cooling process. The two side baffles of the second substrate correspond to the longitudinal sides of the second substrate support plate to better meet the requirements of the enclosed space.
[0024] Preferably, the preheating and cooling structure further includes a first axial moving component arranged along the axial direction. The fixing part of the first axial moving component is used to connect with the external body. The preheating mounting base and the precooling mounting base are both connected to the moving part of the first axial moving component, so that the moving part of the first axial moving component can bring the preheating mounting base and the precooling mounting base to move axially.
[0025] Thus, by setting up a first axial moving component, the preheating component and the precooling component can be moved axially. The axial movement of the preheating component aligns it with the loading box of the loading / unloading module, allowing the substrate in the loading box to be transported into the preheating component for preheating. Simultaneously, it aligns the preheating component with the ejector component, allowing the ejector component to transport the preheated substrate to the eutectic bonding module for eutectic bonding processing. Similarly, the axial movement of the precooling component aligns it with the ejector component, allowing the ejector component to transport the substrate after eutectic bonding processing at the eutectic bonding module to the precooling module for precooling, and then transport the precooled substrate into the unloading box.
[0026] Preferably, the preheating and cooling structure further includes a kicking assembly, which includes a mounting frame, a kicking arm, and a first longitudinal moving assembly. The mounting frame is used to connect to an external body. The fixing part of the first longitudinal moving assembly is connected to the mounting frame in the longitudinal direction. The moving part of the first longitudinal moving assembly is connected to the kicking arm so that the first longitudinal moving assembly can lead the kicking arm to move longitudinally.
[0027] Thus, when the ejector assembly needs to transport the preheated substrate to the eutectic bonding module for eutectic bonding processing, the first axial moving component first moves the preheating component to the position corresponding to the ejector arm. Then, the first longitudinal moving component moves the ejector arm longitudinally, using the ejector arm to push the substrate to the eutectic bonding module. When the ejector assembly needs to transport the substrate after eutectic bonding processing at the eutectic bonding module to the pre-cooling module for pre-cooling, and then transport the pre-cooled substrate to the unloading box, the first axial moving component first moves the pre-cooling component to the position corresponding to the ejector arm. Then, the first longitudinal moving component moves the ejector arm to the position corresponding to the eutectic bonding module. The first longitudinal moving component moves the ejector arm longitudinally, allowing the substrate on the eutectic bonding module to be transported to the pre-cooling module for cooling. After the substrate cooling is complete, the first longitudinal moving component further moves the ejector arm longitudinally, causing the ejector arm to push the substrate from the pre-cooling module into the unloading box.
[0028] Compared with existing technologies, the preheating and cooling structure of this invention effectively preheats and precools the chip and substrate before and after bonding, greatly saving time in eutectic bonding and ensuring its effectiveness. Furthermore, protective covers are added to isolate the chip from external air during both the preheating and precooling stages, and nitrogen is only introduced to the bonding surfaces requiring oxidation prevention, reducing nitrogen usage and effectively preventing oxidation of the bonding surfaces. Therefore, this invention effectively improves the efficiency and reliability of eutectic bonding. Attached Figure Description
[0029] Appendix Figure 1 This is a schematic diagram of the overall structure of a eutectic bonding machine with the preheating and cooling structure of this utility model;
[0030] Appendix Figure 2 This is a schematic diagram of the preheating and cooling structure of the eutectic bonding machine of this utility model;
[0031] Appendix Figure 3 This is a top view of the preheating and cooling structure of the eutectic bonding machine of this utility model;
[0032] Appendix Figure 4 This is a schematic diagram of the preheating component in the preheating and cooling structure of the eutectic bonding machine of this utility model (with the air isolation plate at the top of the first substrate removed).
[0033] Appendix Figure 5 This is a schematic diagram of the preheating component in the preheating and cooling structure of the eutectic bonding machine of this utility model;
[0034] Appendix Figure 6 This is a schematic diagram of the preheating and cooling component in the preheating and cooling structure of the eutectic bonding machine of this utility model (with the air isolation plate at the top of the second substrate removed).
[0035] Appendix Figure 7 This is a schematic diagram of the preheating and cooling component in the preheating and cooling structure of the eutectic bonding machine of this utility model.
[0036] Explanation of reference numerals in the attached drawings: 1. Machine body; 2. Loading / unloading module; 3. Feeding module; 4. Preheating and cooling structure; 4. First axial movement component; 401. Preheating component; 402. First vertical power component; 4021. First guide rail; 4022. Preheating rod; 4023. First substrate support plate; 4024. First substrate side baffle; 4025. First substrate pressing plate; 4026. First nitrogen inlet; 4027. First substrate top air isolation plate; 4028. Preheating component; 403. Second vertical... The components include: a power component 4031, a second guide rail 4032, a pre-cooling rod 4033, a second substrate support plate 4034, a second substrate side baffle 4035, a second substrate pressing plate 4036, a second nitrogen inlet 4037, a second substrate top air isolation plate 4038, a first longitudinal moving component 404, a kicking arm 405, a mounting bracket 406, a eutectic stage module 5, a wafer movement module 6, a lifting module 7, a chip picking module 8, a chip bonding module 9, and an adjustment module 10. Detailed Implementation
[0037] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely represents selected embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.
[0038] As attached Figure 1 The diagram shows a schematic of a eutectic bonding machine with the preheating and cooling structure described in this solution. The eutectic bonding machine includes a body 1, on which are mounted a feeding module 3, a loading / unloading module 2, a eutectic stage module 5, a wafer movement module 6, a lifting module 7, a chip pick-up module 8, an adjustment module 10, and a chip bonding module 9. The positions of each module on the body 1 are shown in the attached diagram. Figure 1 As shown in the diagram. The preheating and cooling structure 4 in this solution is located between the loading / unloading module 2 and the eutectic stage module 5. The preheating and cooling structure in this solution preheats the substrate in the loading box of the loading / unloading module 2 before conveying it to the eutectic stage module 5, and preheats the substrate after eutectic bonding treatment at the eutectic stage module 5 before conveying it to the unloading box of the loading / unloading module 2.
[0039] The preheating and cooling structure of this solution is described in detail below:
[0040] The preheating and cooling structure for the eutectic bonding machine provided in this solution is shown in the attached figure. Figure 2 and attached Figure 3 As shown, the assembly includes a preheating component 402, a precooling component 403, a kicking component, and a first axial movement component 401. The preheating component 402 is used to preheat the substrate, and the precooling component 403 is used to precool the substrate. The kicking component and the first axial movement component 401 are both mounted on the body of the eutectic bonding machine. The preheating component 402 and the precooling component 403 are mounted on the first axial movement component 401. The first axial movement component 401 is mainly used to realize the axial movement of the preheating component 402 and the precooling component 403 to facilitate the transport of the substrate. The kicking component is mainly used to realize the transport of the substrate on the preheating component 402 and the precooling component 403.
[0041] The structure of each component of the preheating and cooling structure is described in detail below:
[0042] In this specific embodiment, as shown in the appendix Figure 4 and attached Figure 5 As shown, the preheating assembly 402 includes a preheating mounting base, on which a preheating rod 4023, a first substrate support plate 4024, a first substrate top air isolation plate 4028, and a first vertical moving assembly are provided. The first vertical moving assembly is provided on both axial sides of the first substrate support plate 4024. The first substrate support plate 4024 is used to place the substrate, and the preheating rod 4023 is used to preheat the substrate on the first substrate support plate 4024. The first vertical moving assembly includes a first vertical power member 4021, a first substrate pressing plate 4026, and a first substrate side baffle 4025. The power output end of the first vertical power member 4021 is connected to the first substrate support plate 4024 via a first connecting plate. The plate pressing sheet 4026 is connected to the first substrate side baffle 4025. The first vertical power member 4021 is used to drive the first substrate pressing sheet 4026 and the first substrate side baffle 4025 to move vertically to the first upper set position and the first lower set position. Specifically, the first vertical power member 4021 can be a first cylinder, or a first guide rail 4022 can be provided on the preheating mounting base. A first slider is provided on the first connecting plate. The first connecting plate is connected to the power output end of the first cylinder, so that when the power output end of the first cylinder moves vertically, the first slider slides along the first guide rail 4022 to guide the vertical movement of the first substrate pressing sheet 4026 and the first substrate side baffle 4025. Of course, the first vertical power member 4021 can be other structural forms, as long as it can realize the vertical movement of this solution. The first upper setting position is the position where the first substrate pressing sheet 4026 is separated from the substrate on the first substrate support plate 4024, and the first lower setting position is the position where the first substrate pressing sheet 4026 is pressed against the substrate on the first substrate support plate 4024. In the first lower setting position, the first substrate support plate 4024, the first substrate side baffle 4025 and the first substrate top air isolation plate 4028 form a relatively closed space when the substrate is preheated.
[0043] Thus, during substrate preheating, the first vertical power component 4021 first moves the first substrate pressing plate 4026 and the first substrate side baffle 4025 upward to a first upper set position. Then, the substrate in the loading box of the loading module is transported onto the first substrate support plate 4024. Next, the first vertical power component 4021 moves the first substrate pressing plate 4026 and the first substrate side baffle 4025 downward to a first lower set position. At this time, the first substrate pressing plate 4026 presses the substrate on the first substrate support plate 4024 to ensure stability during substrate preheating. The first substrate side baffle 4025 blocks the first substrate support plates 4024 at both ends, thereby forming a relatively closed space when the first substrate support plate 4024, the first substrate side baffle 4025 and the first substrate top air isolation plate 4028 are preheated. At this time, the preheating rod 4023 preheats the substrate. After the preheating is completed, the first vertical power member 4021 drives the first substrate pressing plate 4026 and the first substrate side baffle 4025 to move upward to the first upper set position to facilitate the transport of the substrate to the eutectic stage module for eutectic bonding.
[0044] In summary, before eutectic bonding, this solution first transports the substrate in the loading box of the loading module to the preheating component 402 of the preheating and cooling structure for preheating. This allows the substrate to be preheated promptly after arriving at the eutectic bonding stage module. Furthermore, when processing multiple substrates continuously, while one substrate is being preheated at the eutectic bonding stage module, the next substrate to be processed can be preheated at the preheating component 402 of the preheating and cooling structure. This reduces the time required for eutectic bonding and improves the working efficiency of the eutectic bonding machine.
[0045] In this specific embodiment, a first air inlet plate is provided on both axial sides of the first substrate support plate 4024, and a plurality of first nitrogen inlet holes 4027 are provided on the first air inlet plate for inputting nitrogen.
[0046] In this way, by providing multiple first nitrogen inlet holes 4027 on both sides of the first substrate support plate 4024, nitrogen gas is introduced through the first nitrogen inlet holes 4027 when the substrate is preheated to prevent oxidation of the bonding surface. Since the first substrate support plate 4024, the first substrate side baffle 4025 and the first substrate top air isolation plate 4028 form a relatively closed space when the substrate is preheated during the entire preheating process, the nitrogen gas introduced through the first nitrogen inlet holes 4027 can act better on the bonding surface, which not only reduces the amount of nitrogen gas used, but also ensures the effect of preventing oxidation of the bonding surface.
[0047] In this specific embodiment, a plurality of first substrate pressing sheets 4026 are provided along the longitudinal direction, and two first substrate side baffles 4025 are provided, with the two first substrate side baffles 4025 respectively corresponding to the longitudinal sides of the first substrate support plate 4024.
[0048] In this way, multiple first substrate pressing plates 4026 can press multiple positions of the substrate, further improving the stability of the substrate preheating process. The two first substrate side baffles 4025 correspond to the longitudinal sides of the first substrate support plate 4024 to better meet the requirements of the enclosed space.
[0049] In this specific embodiment, the preheating and cooling structure further includes a preheating and cooling component 403, as shown in the attached figure. Figure 6 and attached Figure 7 As shown, the pre-cooling assembly 403 includes a pre-cooling mounting base, on which a pre-cooling rod 4033, a second substrate support plate 4034, a second substrate top air isolation plate 4038, and a second vertical moving assembly are provided. The second substrate support plate 4034 has second vertical moving assemblies on both axial sides. The second substrate support plate 4034 is used to place the substrate, and the pre-cooling rod 4033 is used to pre-cool the substrate on the second substrate support plate 4034. The second vertical moving assembly includes a second vertical power member 4031, a second substrate pressing plate 4036, and a second substrate side baffle 4035. The power output end of the second vertical power member 4031 is connected to the second substrate support plate 4038 via a second connecting plate. The plate pressing sheet 4036 is connected to the second substrate side baffle 4035. The second vertical power member 4031 is used to drive the second substrate pressing sheet 4036 and the second substrate side baffle 4035 to move in the vertical direction to the second upper set position and the second lower set position. The second upper set position is the position where the second substrate pressing sheet 4036 is separated from the substrate on the second substrate support plate 4034. The second lower set position is the position where the second substrate pressing sheet 4036 is pressed against the substrate on the second substrate support plate 4034. In the second lower set position, the second substrate support plate 4034, the second substrate side baffle 4035 and the second substrate top air isolation plate 4038 form a relatively closed space when the substrate is pre-cooled.
[0050] Thus, during the pre-cooling of the substrate, the second vertical power member 4031 first moves the second substrate pressing plate 4036 and the second substrate side baffle 4035 upward to a second upper set position. Then, the substrate on the eutectic stage module is transported onto the second substrate support plate 4034. Next, the second vertical power member 4031 moves the second substrate pressing plate 4036 and the second substrate side baffle 4035 downward to a second lower set position. At this time, the second substrate pressing plate 4036 presses the substrate on the second substrate support plate 4034 firmly, ensuring the substrate is properly cooled during the pre-cooling process. For stability, the second substrate side baffle 4035 shields the second substrate support plates 4034 at both ends, thereby forming a relatively enclosed space between the second substrate support plates 4034, the second substrate side baffle 4035, and the second substrate top air isolation plate 4038 during substrate pre-cooling. At this time, the pre-cooling rod 4033 pre-cools the substrate. After the pre-cooling process is completed, the second vertical power member 4031 again drives the second substrate pressing sheet 4036 and the second substrate side baffle 4035 upwards to the second upper set position, and then transports the substrate into the unloading box. By setting the pre-cooling component 403, the substrate with the chip attached is pre-cooled, thereby reducing the temperature gradient during the high-temperature substrate cooling process, reducing the internal stress between the chip and the substrate after cooling, and improving the reliability of the chip in subsequent use.
[0051] In this specific embodiment, the second vertical power component 4031 is a second cylinder, the pre-cooling mounting base is provided with a second guide rail 4032, the second connecting plate is provided with a second slider, the second slider is slidably connected to the second guide rail 4032, and the second connecting plate is connected to the power output end of the second cylinder, so that when the power output end of the second cylinder moves vertically, the first slider slides along the first guide rail 4022 to guide the vertical movement of the first substrate pressing sheet 4026 and the first substrate side baffle 4025.
[0052] In this way, the second cylinder drives the second connecting plate to move vertically, and the second connecting plate drives the second slider to slide along the second guide rail 4032, thereby guiding the second substrate pressing sheet 4036 and the side baffle 4035 of the second substrate and ensuring the accuracy of the moving position.
[0053] In this specific embodiment, a second air inlet plate is provided on both axial sides of the second substrate support plate 4034, and a plurality of second nitrogen inlet holes 4037 are provided on the second air inlet plate for inputting nitrogen.
[0054] In this way, by providing multiple second nitrogen inlet holes 4037 on both sides of the second substrate support plate 4034, nitrogen gas is introduced through the second nitrogen inlet holes 4037 during the pre-cooling of the substrate to prevent oxidation of the bonding surface. Since the second substrate support plate 4034, the second substrate side baffle 4035 and the second substrate top air isolation plate 4038 form a relatively closed space during the pre-cooling of the substrate, the nitrogen gas introduced through the second nitrogen inlet holes 4037 can better act on the bonding surface, which not only reduces the amount of nitrogen used, but also ensures the effect of preventing oxidation of the bonding surface.
[0055] In this specific embodiment, multiple second substrate pressing sheets 4036 are provided along the longitudinal direction, and two second substrate side baffles 4035 are provided, with the two second substrate side baffles 4035 respectively corresponding to the longitudinal sides of the second substrate support plate 4034.
[0056] In this way, multiple second substrate pressing plates 4036 can press multiple positions of the substrate, further improving the stability of the substrate pre-cooling process. The two second substrate side baffles 4035 correspond to the longitudinal sides of the second substrate support plate 4034 to better meet the requirements of the enclosed space.
[0057] In this specific embodiment, the preheating and cooling structure further includes a first axial moving component 401 arranged along the axial direction. The fixing component of the first axial moving component 401 is used to connect with the external body. Both the preheating mounting base and the precooling mounting base are connected to the moving component of the first axial moving component 401, so that the moving component of the first axial moving component 401 can move the preheating mounting base and the precooling mounting base axially. The first axial moving component 401 achieves linear motion in the axial direction. This linear motion can be achieved using a linear motor and linear guide rail structure, or a slider and guide rail structure, etc. These structural forms for achieving linear motion are all prior art. Those skilled in the art can choose the specific structure according to actual design needs. Moreover, the implementation of this linear structure does not have a substantial impact on the present solution and is not part of the technical solution to be protected. Therefore, it will not be discussed in detail here.
[0058] Thus, by setting up the first axial movement component 401, the axial movement of the preheating component 402 and the precooling component 403 is realized. The axial movement of the preheating component 402 allows it to align with the loading box of the loading / unloading module, enabling the substrate in the loading box to be transported into the preheating component 402 for preheating. Simultaneously, it aligns the preheating component 402 with the ejector component, allowing the ejector component to transport the preheated substrate to the eutectic bonding module for eutectic bonding processing. The axial movement of the precooling component 403 aligns it with the ejector component, allowing the ejector component to transport the substrate after eutectic bonding processing at the eutectic bonding module to the precooling module for precooling, and then transport the precooled substrate into the unloading box.
[0059] In this specific embodiment, the preheating and cooling structure further includes a kicking assembly, which includes a mounting frame 406, a kicking arm 405, and a first longitudinal moving assembly 404. The mounting frame 406 is used to connect to an external body. The fixing part of the first longitudinal moving assembly 404 is connected to the mounting frame 406 in the longitudinal direction, and the moving part of the first longitudinal moving assembly 404 is connected to the kicking arm 405 so that the first longitudinal moving assembly 404 can move the kicking arm 405 in the longitudinal direction. The first longitudinal moving assembly 404 achieves linear motion in the longitudinal direction. This linear motion can be achieved using a linear motor and linear guide rail structure, or a slider and guide rail structure, etc. These linear motion structures are all prior art. For those skilled in the art, the specific structure can be selected according to actual design needs. Moreover, the implementation of this linear structure does not have a substantial impact on the present solution and is not part of the technical solution to be protected. Therefore, it will not be discussed in detail here.
[0060] Thus, when the kicking assembly needs to transport the preheated substrate to the eutectic stage module for eutectic bonding, the first axial moving assembly 401 first drives the preheating assembly 402 to move to the position corresponding to the kicking arm 405, and then the first longitudinal moving assembly 404 drives the kicking arm 405 to move longitudinally, using the kicking arm 405 to push the substrate to the eutectic stage module. When the ejector assembly needs to transport the substrate after eutectic bonding at the eutectic stage module to the pre-cooling module for pre-cooling, and then transport the pre-cooled substrate into the unloading box, the first axial moving assembly 401 drives the pre-cooling assembly 403 to the position corresponding to the ejector arm 405. Then, the first longitudinal moving assembly 404 drives the ejector arm 405 to the position corresponding to the eutectic stage module. The first longitudinal moving assembly 404 drives the ejector arm 405 to move longitudinally, so that the substrate on the eutectic stage module is transported to the pre-cooling module for cooling. After the substrate cooling is completed, the first longitudinal moving assembly 404 further drives the ejector arm 405 to move longitudinally, so that the ejector arm 405 pushes the substrate of the pre-cooling module into the unloading box.
[0061] The following is a more detailed explanation of the overall working principle of the eutectic chip mounter with the preheating and cooling structure of this solution, so as to better understand the working process of the preheating and cooling structure of this solution: When the eutectic chip mounter with the preheating and cooling structure of this solution is in use, the substrate is first placed in the loading box of the loading and unloading module 2, and then the feeding module 3 transports the substrate in the corresponding position of the loading box to the preheating component 402. The substrate is preheated in the preheating assembly 402 by the installed preheating rod 4023 under nitrogen protection. The specific preheating process is as follows: First, the first vertical power member 4021 drives the first substrate pressing plate 4026 and the first substrate side baffle 4025 to move upward to the first upper set position. Then, the feeding module 3 transports the substrate in the loading box to the first substrate support plate 4024. Then, the first vertical power member 4021 drives the first substrate pressing plate 4026 and the first substrate side baffle 4025 to move downward to the first lower set position. At this time, the first substrate pressing plate 4026 presses the substrate on the first substrate support plate 4024 to ensure the stability of the substrate during the preheating process. The first substrate side baffle 4025 blocks the first substrate support plate 4024 from both ends, so that the first substrate support plate 4024, the first substrate side baffle 4025 and the first substrate top air isolation plate 4028 form a relatively closed space during substrate preheating. The preheating rod 4023 preheats the substrate. Meanwhile, the chip picking module 8 picks up the chip from the wafer movement module 6 and places it on the adjustment module 10, and then the chip bonding module 9 picks up the chip from the adjustment module 10. After the preheating component has preheated the substrate, the ejector arm 405 transports the substrate on the preheating component 402 to the eutectic bonding module 5 for eutectic bonding processing. After the eutectic bonding processing of all materials on the substrate is completed, the ejector arm 405 is used again to transport the substrate after eutectic bonding to the precooling component 403 for further processing. The precooling component 403 is essentially a heating component, but the heating power of the precooling rod is much smaller than that of the preheating rod 4023. This makes the temperature inside the precooling component 403 higher than the ambient temperature, but lower than the temperature of the substrate after heating, so that the temperature of the substrate gradually decreases when it enters the precooling component 403.During the pre-cooling of the substrate, the second vertical power component first moves the second substrate pressing sheet and the second substrate side baffle upward to the second upper set position. Then, the ejector arm 405 transports the substrate on the eutectic stage module 5 to the second substrate support plate. Next, the second vertical power component moves the second substrate pressing sheet and the second substrate side baffle downward to the second lower set position. At this time, the second substrate pressing sheet presses the substrate on the second substrate support plate to ensure stability during the pre-cooling process. The second substrate side baffle blocks the second substrate support plate from both ends, thus forming a relatively closed space between the second substrate support plate, the second substrate side baffle, and the air isolation plate at the top of the second substrate during the pre-cooling process. At this time, the pre-cooling rod performs pre-cooling treatment on the substrate, and nitrogen is introduced through the second nitrogen inlet to achieve oxidation protection. After the pre-cooling treatment is completed, the second vertical power component moves the second substrate pressing sheet and the second substrate side baffle upward to the second upper set position again, and the ejector arm 405 transports the substrate into the unloading box. Subsequently, the feeding module pushes the next substrate in the loading box of the loading module into the preheating and cooling module 4, and so on, to complete the eutectic bonding of all substrates in the loading box.
[0062] Compared with existing technologies, the preheating and cooling structure of this invention effectively preheats and precools the chip and substrate before and after bonding, greatly saving time in eutectic bonding and ensuring its effectiveness. Furthermore, protective covers are added to isolate the chip from external air during both the preheating and precooling stages, and nitrogen is only introduced to the bonding surfaces requiring oxidation prevention, reducing nitrogen usage and effectively preventing oxidation of the bonding surfaces. Therefore, this invention effectively improves the efficiency and reliability of eutectic bonding.
[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model and not to limit the technical solutions. Those skilled in the art should understand that any modifications or equivalent substitutions to the technical solutions of this utility model that do not depart from the spirit and scope of this technical solution should be covered within the scope of the claims of this utility model.
Claims
1. A preheating and cooling structure of a eutectic pasting machine, characterized in that, The system includes a preheating assembly, which comprises a preheating mounting base. The preheating mounting base is provided with a preheating rod, a first substrate support plate, a first substrate top air isolation plate, and a first vertical moving assembly. The first substrate support plate is used to place a substrate, and the preheating rod is used to preheat the substrate on the first substrate support plate. The first vertical moving assembly includes a first vertical power component, a first substrate pressing plate, and a first substrate side baffle. The power output end of the first vertical power component is connected to the first substrate pressing plate and the first substrate side baffle respectively through a first connecting plate. The first vertical power component is used to drive the first substrate pressing plate and the first substrate side baffle to move vertically to a first upper set position and a first lower set position. The first upper set position is the position where the first substrate pressing plate is separated from the substrate on the first substrate support plate, and the first lower set position is the position where the first substrate pressing plate is pressed against the substrate on the first substrate support plate. At the first lower set position, the first substrate support plate, the first substrate side baffle, and the first substrate top air isolation plate form a relatively enclosed space for substrate preheating.
2. The pre-heating and cooling structure of the eutaxy tablet machine according to claim 1, wherein, The first vertical power component is a first cylinder. The preheating mounting base is provided with a first guide rail. The first connecting plate is provided with a first slider. The first slider is slidably connected to the first guide rail. The first connecting plate is connected to the power output end of the first cylinder so that when the power output end of the first cylinder moves vertically, the first slider slides along the first guide rail to guide the vertical movement of the first substrate pressing sheet and the first substrate side baffle.
3. The pre-heating and cooling structure of the eutaxy pasting machine according to claim 2, wherein, A first air inlet plate is provided on both sides of the first substrate support plate along its axial direction. A plurality of first nitrogen inlet holes are provided on the first air inlet plate, and nitrogen is introduced at the first nitrogen inlet holes.
4. The pre-heating and cooling structure of the eutaxy pasting machine according to claim 3, wherein, The first substrate pressing sheet has multiple portions arranged along the longitudinal direction, and the first substrate side baffle has two portions, with the two first substrate side baffles respectively corresponding to the longitudinal sides of the first substrate support plate.
5. The pre-heating and cooling structure of the eutaxy pasting machine according to claim 4, wherein, The preheating and cooling structure further includes a precooling component, which includes a precooling mounting base. The precooling mounting base is provided with a precooling rod, a second substrate support plate, a second substrate top air isolation plate, and a second vertical moving component. The second substrate support plate is used to place the substrate, and the precooling rod is used to precool the substrate on the second substrate support plate. The second vertical moving component includes a second vertical power member, a second substrate pressing plate, and a second substrate side baffle. The power output end of the second vertical power member is connected to the second substrate pressing plate and the second substrate side baffle respectively through a second connecting plate. The second vertical power member is used to drive the second substrate pressing plate and the second substrate side baffle to move vertically to a second upper set position and a second lower set position. The second upper set position is the position where the second substrate pressing plate is separated from the substrate on the second substrate support plate, and the second lower set position is the position where the second substrate pressing plate is pressed against the substrate on the second substrate support plate. At the second lower set position, the second substrate support plate, the second substrate side baffle, and the second substrate top air isolation plate form a relatively closed space for substrate precooling.
6. The pre-heating and cooling structure of the eutaxy pasting machine according to claim 5, wherein, The second vertical power component is a second cylinder. The pre-cooling mounting base is provided with a second guide rail. The second connecting plate is provided with a second slider. The second slider is slidably connected to the second guide rail. The second connecting plate is connected to the power output end of the second cylinder so that when the power output end of the second cylinder moves vertically, the first slider slides along the first guide rail to guide the vertical movement of the first substrate pressing sheet and the first substrate side baffle.
7. The pre-heating and cooling structure of the eutaxy pasting machine according to claim 6, wherein, A second air inlet plate is provided on both sides of the second substrate support plate along the axial direction. A plurality of second nitrogen inlet holes are provided on the second air inlet plate, and nitrogen is introduced at the second nitrogen inlet holes.
8. The pre-heating and cooling structure of the eutaxy pasting machine according to claim 7, wherein, The second substrate has multiple plates arranged in the longitudinal direction, and two side baffles are provided on the second substrate, with the two side baffles corresponding to the longitudinal sides of the second substrate support plate.
9. The pre-heating and cooling structure of the eutaxy pasting machine according to claim 5, wherein, The preheating and cooling structure further includes a first axial moving component arranged along the axial direction. The fixing part of the first axial moving component is used to connect with the external body. The preheating mounting base and the precooling mounting base are both connected to the moving part of the first axial moving component, so that the moving part of the first axial moving component can bring the preheating mounting base and the precooling mounting base to move axially.
10. The pre-heating and cooling structure of the eutaxy pasting machine according to claim 1, wherein, The preheating and cooling structure also includes a kicking assembly, which includes a mounting frame, a kicking arm, and a first longitudinal moving assembly. The mounting frame is used to connect to an external body. The fixing part of the first longitudinal moving assembly is connected to the mounting frame in the longitudinal direction. The moving part of the first longitudinal moving assembly is connected to the kicking arm so that the first longitudinal moving assembly can lead the kicking arm to move longitudinally.