Drying assembly and drying machine table
By driving the spray bar to rotate using a drive motor and utilizing surface tension gradient gas and cleaning liquid, the problem of uneven drying on the wafer surface in the dryer was solved, resulting in higher wafer yield and cleaning efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG ICSPROUT SEMICONDUCTOR CO LTD
- Filing Date
- 2025-06-09
- Publication Date
- 2026-05-22
AI Technical Summary
Existing drying equipment suffers from uneven drying and impurity residue on the wafer surface, leading to wafer defects and reduced yield.
A drive motor is used to drive the spray bar to rotate axially, removing blockages in the spray nozzle. Combined with the use of drying gas and cleaning liquid with surface tension gradient, uniform drying and cleaning are achieved.
It improves the drying uniformity of the wafer surface, reduces the defect rate, increases the wafer yield, and shortens the cleaning time.
Smart Images
Figure CN224266765U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor manufacturing, and in particular to a drying component and a drying machine. Background Technology
[0002] Chemical mechanical polishing (CMP) is a step in semiconductor manufacturing. It combines chemical etching with mechanical removal. The chemical components in the polishing slurry first react slightly with the material to be removed from the wafer surface, softening it. Then, the polishing head applies pressure and moves relative to the polishing pad, physically removing the reactants to achieve the leveling purpose.
[0003] Chemical mechanical polishing (CMP) combines surface chemical action with mechanical polishing to planarize the wafer surface. This process can leave impurities such as polishing slurry and moisture on the wafer surface. After polishing in a washing machine, the wafer is transferred to a drying machine for drying, thus completing the process. The drying machine removes these impurities, preventing them from forming stains, particle residues, or corroding the wafer surface after drying. This ensures the cleanliness and smoothness of the wafer surface, meeting the requirements of subsequent high-precision processes such as photolithography, and improving the yield and reliability of chip manufacturing.
[0004] However, the current drying equipment is still inadequate. Utility Model Content
[0005] The problem addressed by this invention is how to improve the drying equipment to reduce the possibility of defects on the wafer surface and improve product yield.
[0006] To address the aforementioned problems, this utility model provides a drying assembly suitable for drying a rinsed wafer. The drying assembly includes: a spray bar with multiple nozzles on its surface, the nozzles being adapted to spray drying gas onto the wafer for drying; and a drive motor adapted to drive the spray bar to rotate axially to remove blockages located within the nozzles.
[0007] Optionally, the drive motor is located at at least one end of the spray bar along its axial direction.
[0008] Optionally, the spray bar has an axially extending delivery conduit adapted to deliver the drying gas.
[0009] Optionally, the delivery conduit is also adapted to deliver cleaning liquid, and the nozzle is also adapted to spray cleaning liquid to flush out the blockage within the nozzle.
[0010] Optionally, while the drive motor drives the spray bar to rotate axially, the spray nozzle sprays cleaning liquid for rinsing.
[0011] Optionally, the drying gas includes: a first gas.
[0012] Optionally, the drying gas further includes a second gas, wherein the surface tension of the liquid after liquefaction of the second gas is less than the surface tension of the rinsing liquid used to rinse the wafer.
[0013] Optionally, when the dryer is in the IDLE state, the drive motor is adapted to drive the spray bar to rotate axially.
[0014] Optionally, when the dryer is in operation, the drive motor does not drive the spray bar to rotate axially.
[0015] Accordingly, the present invention also provides a drying machine, comprising: a drying component as described in any of the above claims, the drying component being adapted to dry a rinsed wafer; and a control module, the control module being adapted to control the drive motor to cause the spray bar to rotate axially in the IDLE state of the drying machine to remove blockages located in the spray nozzle.
[0016] Optionally, the control module is adapted to control the drive motor to cause the spray bar to rotate axially at preset time intervals to remove blockages located in the spray hole.
[0017] Compared with the prior art, the technical solution of this utility model has the following advantages:
[0018] In the drying assembly of this invention, the drive motor is adapted to drive the spray bar to rotate axially to remove blockages located within the spray orifice. The blockages are thrown out of the spray orifice under centrifugal force, reducing the amount of blockage within the orifice. This results in more uniform drying of all parts of the wafer when the spray orifice sprays drying gas onto it, preventing uneven drying that could lead to wafer defects and improving wafer yield.
[0019] In an optional embodiment of this invention, the drive motor drives the spray bar to rotate axially while the nozzle sprays cleaning liquid for rinsing. The rotation of the spray bar allows the cleaning liquid sprayed from the nozzle to cover a wider area, avoiding cleaning dead zones and improving the cleaning effect of the nozzle. Furthermore, during the rotation, due to centrifugal force, the cleaning liquid gains additional speed and force when exiting the nozzle, thereby enhancing the impact force on blockages within the nozzle. This impact force helps to remove the blockages more effectively. In addition, the rotation of the spray bar can significantly shorten the cleaning time of the nozzle, improving cleaning efficiency.
[0020] In an optional embodiment of this invention, the drying gas further includes a second gas, wherein the surface tension of the liquefied second gas is less than the surface tension of the rinsing liquid used to rinse the wafer. A tension gradient exists between the second gas and the residual rinsing liquid on the wafer surface. This tension gradient accelerates the removal of the residual rinsing liquid from the wafer surface, thereby achieving wafer surface drying.
[0021] In an optional embodiment of this invention, when the dryer is in the IDLE state, the drive motor drives the spray bar to rotate axially. That is, when the dryer is idle and not drying the wafer, the drive motor drives the spray bar to rotate axially. The axial rotation of the spray bar in the IDLE state removes blockages within the spray nozzles, improving the wafer drying effect without affecting the dryer's operation.
[0022] In an optional embodiment of this invention, the drive motor does not drive the spray bar to rotate axially while the dryer is in operation. That is, when the dryer is drying the wafer, the drive motor does not drive the spray bar to rotate axially, thus preventing insufficient drying of the wafer surface by the drying gas. Attached Figure Description
[0023] Figure 1 This is a schematic diagram of the structure of a drying component;
[0024] Figure 2 For the Figure 1 A schematic diagram of the wafer after drying using the drying components;
[0025] Figure 3 This is a schematic diagram of the structure of the drying component according to an embodiment of the present invention. Detailed Implementation
[0026] As can be seen from the background technology, current drying components still have shortcomings. The reasons for these problems are analyzed below:
[0027] Please refer to Figure 1 A drying assembly adapted to dry a rinsed wafer, the drying assembly comprising:
[0028] The spray bar 101 has a plurality of spray holes (not shown) on its surface, which are adapted to spray drying gas onto the wafer for drying.
[0029] The spray bar 101 has an axially extending delivery pipe adapted to deliver the drying gas.
[0030] Axial direction refers to the direction along the central axis of an object or system, and is parallel to the object's axis of rotation or central axis. Radial direction refers to the direction perpendicular to the central axis. For example, in some embodiments of this invention, the axial direction is the X-direction.
[0031] The drying gas includes a first gas. The first gas is a carrier gas, and the first gas includes nitrogen and an inert gas.
[0032] The drying gas further includes a second gas, wherein the surface tension of the liquefied liquid is less than the surface tension of the rinsing solution used to rinse the wafer. Specifically, the second gas includes isopropanol.
[0033] Isopropyl alcohol crystallization can easily clog nozzles. Please refer to [reference needed]. Figure 2 When isopropanol blocks the nozzle, the nozzle sprays dry gas onto the wafer for drying, which can lead to uneven drying at different locations on the wafer and cause defects in the wafer.
[0034] To solve the aforementioned technical problem, this utility model provides a drying assembly suitable for drying a rinsed wafer. The drying assembly comprises: a spray bar with multiple spray holes on its surface, the spray holes being adapted to spray drying gas onto the wafer for drying; and a drive motor adapted to drive the spray bar to rotate axially to remove blockages located within the spray holes.
[0035] In the drying machine of this utility model, the drive motor is adapted to drive the spray bar to rotate axially to remove the blockage located in the spray hole. The blockage is thrown out of the spray hole under the action of centrifugal force, effectively clearing the blockage in the spray hole, reducing the risk of the spray hole blockage, and making the wafer more uniformly dried when the spray hole sprays drying gas to dry the wafer. This avoids the wafer from being defective due to uneven drying and improves the wafer yield.
[0036] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.
[0037] Please refer to Figure 3 A drying assembly adapted to dry a rinsed wafer, the drying assembly comprising: a spray bar 201 having a plurality of spray holes (not shown) on its surface, the spray holes being adapted to spray drying gas onto the wafer for drying.
[0038] Specifically, in some embodiments of this invention, the rinsing solution used to rinse the wafer is deionized water.
[0039] Specifically, in some embodiments of this invention, the diameter of the nozzle ranges from 4mm to 10mm. The moderate diameter of the nozzle is beneficial for improving the drying effect of the drying gas on the wafer.
[0040] The spray bar 201 has an axially extending delivery pipe adapted to deliver the drying gas.
[0041] Axial direction refers to the direction along the central axis of an object or system, and is parallel to the object's axis of rotation or central axis. Radial direction refers to the direction perpendicular to the central axis. For example, in some embodiments of this invention, please refer to... Figure 3 The axial direction of the spray bar 201 is the X direction.
[0042] Specifically, the delivery pipe is adapted to deliver the drying gas to the nozzle so that the nozzle ejects the drying gas to dry the wafer.
[0043] The drying gas includes: a first gas.
[0044] Specifically, the first gas serves as a carrier gas. The first gas includes nitrogen and an inert gas. Specifically, in some embodiments of this invention, the first gas is nitrogen. Nitrogen, as a carrier gas, is inexpensive and readily available, reducing process costs; furthermore, nitrogen is inert, providing a protective atmosphere during wafer drying to prevent chemical reactions or impurity adsorption between the wafer surface and oxygen, moisture, etc., in the air, thus ensuring the electrical performance and surface quality of the wafer; additionally, blowing nitrogen onto the wafer surface can accelerate the evaporation of residual moisture on the wafer surface.
[0045] Specifically, the drying gas further includes a second gas, wherein the surface tension of the liquid after liquefaction of the second gas is less than the surface tension of the rinsing liquid used to rinse the wafer.
[0046] Surface tension is the tension along any boundary of a liquid surface caused by the imbalance of molecular attraction. When the surface tension of a region on a liquid surface changes, a surface tension gradient is formed. Liquid molecules move from regions of lower surface tension to regions of higher surface tension, resulting in liquid flow, a phenomenon known as the Marangoni effect. In chemical mechanical polishing (CMP) processes, the Marangoni effect can be used to achieve rapid drying of wafer surfaces, improving production efficiency and product quality.
[0047] Specifically, in some embodiments of this utility model, the liquid after the second gas is liquefied is isopropanol.
[0048] Isopropanol has a much lower surface tension than water. When isopropanol vapor comes into contact with water on the wafer surface, a surface tension gradient is formed on the liquid film surface. According to the Marangoni effect, this gradient causes the fluid with higher surface tension (water remaining on the wafer surface after rinsing) to flow towards the fluid with lower surface tension (isopropanol), thereby achieving wafer surface drying. Furthermore, isopropanol has volatile properties, which can prevent the formation of drying defects such as watermarks.
[0049] Nitrogen is used as a carrier gas to transport isopropanol gas to the delivery pipeline, so that the isopropanol can be evenly distributed in the delivery pipeline. When the nozzle sprays a dry gas mixture of nitrogen and isopropanol onto the wafer, the dry gas and the deionized water rinsing liquid remaining on the wafer surface form the Marangoni effect, creating conditions for drying the wafer surface.
[0050] Specifically, the conveying pipe is also adapted to convey cleaning liquid, and the nozzle is also adapted to spray cleaning liquid to flush the blockage in the nozzle, the blockage being crystals of the liquid.
[0051] The blockage is a crystallization of the liquid after the second gas is liquefied. Specifically, in this embodiment of the invention, the blockage is isopropanol crystals. The nozzle sprays cleaning liquid to rinse the isopropanol crystals, effectively removing them from the nozzle and preventing uneven or insufficient drying of the wafer caused by the isopropanol crystals blocking the nozzle. This improves the drying effect on the wafer, ensuring more uniform drying of all areas of the wafer surface during the drying process. This avoids defects on the wafer surface caused by uneven drying, thus improving wafer yield.
[0052] Please refer to Figure 3 The drying assembly includes a drive motor 202, which is adapted to drive the spray bar 201 to rotate axially X to remove blockages located in the spray orifice.
[0053] The drive motor 202 drives the spray bar 201 to rotate along the X-axis. The blockage inside the spray hole is thrown out of the spray hole under the action of centrifugal force, effectively removing the blockage inside the spray hole and reducing the probability of the spray hole being blocked.
[0054] Specifically, in some embodiments of this utility model, the angular velocity of the spray bar 201 is in the range of 200 rad / s to 1000 rad / s.
[0055] The rotation speed of the spray bar 201 will not be too high, which reduces the possibility of blockage breaking in the spray hole and avoids the small blockage particles remaining in the gap of the spray hole, thereby avoiding uneven drying of the wafer surface; the rotation speed of the spray bar 201 will not be too low, so as to avoid insufficient centrifugal force that prevents crystals from being thrown out of the spray hole.
[0056] The drive motor 202 is disposed at at least one end of the spray bar 201 along the axial direction X. Specifically, in some embodiments of this utility model, the drive motor 202 is disposed at both ends of the spray bar 201 along the axial direction X.
[0057] For example, such as Figure 3 As shown, in some embodiments of this utility model, the drive motor 202 drives the spray bar 201 to rotate counterclockwise.
[0058] Specifically, in some embodiments of this invention, when the dryer is in the idle state, the drive motor 202 is adapted to drive the spray bar 201 to rotate along the X-axis. That is, when the dryer is idle and not drying the wafer, the drive motor 202 drives the spray bar 201 to rotate along the X-axis. The spray bar 201 rotates along the X-axis in the idle state of the dryer to remove blockages located in the spray nozzles, improving the drying effect on the wafer without affecting the drying process.
[0059] Specifically, after the spray bar 201 rotates along the axial direction X to remove the blockage located in the spray hole, the spray bar 201 resets, that is, the spray bar 201 returns to a stationary state, and the spray hole returns to the position of the dryer in operation.
[0060] Specifically, in some embodiments of this invention, when the dryer is in operation, the drive motor 202 does not drive the spray bar 201 to rotate along the axial direction X. That is, when the dryer is drying the wafer, the drive motor 202 does not drive the spray bar 201 to rotate along the axial direction X, avoiding the effect of centrifugal force causing uneven mixing of the first gas nitrogen and the second gas isopropanol, thereby avoiding uneven drying of various positions on the wafer surface by the drying gas.
[0061] Specifically, in some embodiments of this utility model, while the drive motor 202 drives the spray bar 201 to rotate along the axial direction X, the spray nozzle sprays cleaning liquid for rinsing.
[0062] The rotation of the spray bar 201 allows the cleaning liquid sprayed from the nozzle to cover a wider area, avoiding cleaning dead spots and improving the cleaning effect of the nozzle. Furthermore, when the spray bar 201 rotates, due to centrifugal force, the cleaning liquid gains additional speed and force when it exits the nozzle, thereby enhancing the impact force on the blockages inside the nozzle. This impact force helps to remove the blockages more effectively. In addition, the rotation of the spray bar 201 can greatly shorten the cleaning time of the nozzle and improve the cleaning efficiency.
[0063] Specifically, after the spray bar 201 rotates axially to remove blockages located in the spray orifice, the spray bar 201 returns to its original position. During the operation of the dryer, the drive motor 202 does not drive the spray bar 201 to rotate axially (X).
[0064] Accordingly, the present invention also provides a drying machine, comprising: a drying assembly as described in any of the above claims, the drying assembly being adapted to dry a rinsed wafer; and a control module, the control module being adapted to control the drive motor 202 to cause the spray bar 201 to rotate along the X-axis in the IDLE state of the drying machine to remove blockages located in the spray hole.
[0065] The control module controls the drive motor 202 to make the spray bar 201 rotate along the X-axis in the IDLE state of the dryer to remove the blockage located in the spray hole.
[0066] The control module rotates along the X-axis in the IDLE state of the dryer to remove blockages located in the nozzles, without affecting the normal operation of the dryer and improving the drying effect on the wafer surface.
[0067] Specifically, in some embodiments of this utility model, the control module is adapted to control the drive motor 202 to make the spray bar 201 rotate along the axial direction X at preset time intervals to remove the blockage located in the spray hole.
[0068] The drying machine performs self-cleaning at preset intervals to remove blockages in the nozzles, effectively clearing the blockages and reducing the risk of nozzle blockage. This ensures more uniform drying of the wafer when the nozzles spray drying gas, preventing wafer defects caused by uneven drying and improving wafer yield. Furthermore, the self-cleaning operation at preset intervals, controlled by the control module, eliminates the need for manual cleaning, reducing the workload of staff.
[0069] Specifically, the preset duration is set according to the actual process requirements.
[0070] In summary, in the drying assembly of this utility model, when the dryer is in the IDLE state, the drive motor 202 is adapted to drive the spray bar 201 to rotate along the X-axis. Obstructions within the spray orifice are thrown out by the centrifugal force of the rotating spray bar 201, reducing obstructions and ensuring more uniform drying of all parts of the wafer when the spray orifice sprays drying gas. This avoids uneven drying leading to wafer defects and improves wafer yield. Simultaneously, while the drive motor 202 drives the spray bar 201 to rotate along the X-axis, the spray orifice sprays cleaning liquid for rinsing. The rotation of the spray bar 201 allows the cleaning liquid sprayed from the nozzle to cover a wider area, avoiding cleaning dead spots and improving the cleaning effect of the nozzle. Furthermore, when the spray bar 201 rotates, due to centrifugal force, the cleaning liquid gains additional speed and force when it exits the nozzle, thereby enhancing the impact force on the blockages inside the nozzle. This impact force helps to remove the blockages more effectively. In addition, the rotation of the spray bar 201 can greatly shorten the cleaning time of the nozzle and improve the cleaning efficiency.
[0071] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.
Claims
1. A drying assembly adapted to dry a rinsed wafer, characterized in that, The drying assembly includes: A spray bar, the surface of which has a plurality of spray holes adapted to spray drying gas onto the wafer for drying; A drive motor, the drive motor being adapted to drive the spray bar to rotate axially to remove blockages located within the spray orifice.
2. The drying assembly as described in claim 1, characterized in that, The drive motor is located at at least one end of the spray bar along its axial direction.
3. The drying assembly as described in claim 1, characterized in that, The spray bar has an axially extending delivery pipe adapted to deliver the drying gas.
4. The drying assembly as described in claim 3, characterized in that, The delivery pipe is also adapted to deliver cleaning liquid, and the nozzle is also adapted to spray cleaning liquid to flush out the blockage within the nozzle.
5. The drying assembly as described in claim 4, characterized in that, While the drive motor drives the spray bar to rotate axially, the spray nozzle sprays cleaning liquid for rinsing.
6. The drying assembly as claimed in claim 1, characterized in that, The drying gas includes: a first gas.
7. The drying assembly as described in claim 6, characterized in that, The drying gas further includes a second gas, wherein the surface tension of the liquid after liquefaction of the second gas is less than the surface tension of the rinsing liquid used to rinse the wafer.
8. The drying assembly as claimed in claim 1, characterized in that, When the dryer is in the IDLE state, the drive motor is adapted to drive the spray bar to rotate axially.
9. The drying assembly as claimed in claim 8, characterized in that, When the dryer is in operation, the drive motor does not drive the spray bar to rotate axially.
10. A drying machine, characterized in that, include: The drying assembly according to any one of claims 1 to 9, wherein the drying assembly is adapted to dry a rinsed wafer; A control module adapted to control the drive motor to cause the spray bar to rotate axially in the IDLE state of the dryer to remove blockages located in the spray orifice.
11. The drying machine as described in claim 10, characterized in that, The control module is adapted to control the drive motor to make the spray bar rotate axially at preset time intervals to remove blockages located in the spray hole.