Wire controller
By setting infrared transmitters and receivers on the bottom layer of the wired controller's PCB board, and by setting openings and using structural and insulating components on the top layer, the light leakage problem was solved, and the wake-up accuracy and sensitivity of the wired controller were improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- QINGDAO HAIER AIR CONDITIONING ELECTRONICS CO LTD
- Filing Date
- 2025-04-29
- Publication Date
- 2026-05-22
AI Technical Summary
Existing wired controllers based on through-beam sensing solutions are prone to light leakage, leading to false triggering and wake-up.
Both the infrared emitter and the infrared receiver are placed on the bottom layer of the PCB board, and an opening is made on the top layer to block them. Light transmission paths are set on the top layer corresponding to the positions of the infrared emitter and the receiver, and structural components and isolation components are used to prevent light leakage.
This effectively avoids the situation where infrared light is received by the infrared receiver before it is emitted into the external space, thus improving the accuracy and sensitivity of the wired controller's wake-up function.
Smart Images
Figure CN224267160U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of wired controller technology, and specifically provides a wired controller. Background Technology
[0002] With the increasing demands for interactive experiences in smart devices, wired controllers, as important human-machine interfaces, can often be equipped with contactless wake-up functions to enhance the user experience. Existing technologies for contactless wake-up include distance detection schemes based on Time of Flight (TOF) sensors or through-beam sensing schemes based on infrared emitters and receivers. However, the former suffers from drawbacks such as high component costs and complex circuit design. In contrast, through-beam sensing schemes based on infrared emitters and receivers offer advantages such as low cost, simple circuit structure, and convenient installation, and are therefore widely used.
[0003] However, wired controllers based on through-beam sensing schemes are prone to light leakage problems in practical applications, causing the infrared light generated by the infrared emitter to be directly captured by the infrared receiver without being reflected by external objects, thus causing the wired controller to be falsely triggered and woken up. Utility Model Content
[0004] This application aims to solve the above-mentioned technical problems, namely, to solve the problem that existing wired controllers based on through-beam sensing schemes have light leakage and are prone to accidental wake-up.
[0005] In a first aspect, this application provides a wired controller, which includes a PCB board, an infrared emitter, and an infrared receiver. The PCB board includes a bottom layer and a top layer stacked together. The infrared emitter and the infrared receiver are both disposed on the surface of the bottom layer near the top layer. The top layer has openings corresponding to the positions of the infrared emitter and the infrared receiver.
[0006] In some embodiments, the infrared emitting tube and the infrared receiving head are spaced apart.
[0007] In some embodiments, the infrared emitting diode and the infrared receiving head are spaced apart along the same side of the bottom layer.
[0008] In some embodiments, the wired controller further includes a structural component for wrapping the side of the PCB board, the structural component having a first opening corresponding to the position of the infrared receiver head, and the structural component having a second opening corresponding to the position of the infrared emitter.
[0009] In some embodiments, the wired controller further includes a first isolator disposed on the surface of the structural member near the PCB board, the first isolator being disposed around the periphery of the second opening.
[0010] In some embodiments, the wired controller further includes at least one second isolator disposed on the surface of the structural member near the PCB board, the at least one second isolator being disposed between the first isolator and the first opening.
[0011] In some embodiments, the first isolation member and the at least one second isolation member are integrally disposed with the structural member.
[0012] In some embodiments, a third opening is provided in the middle region of the structural member, and the third opening communicates with the first opening.
[0013] In some embodiments, at least one of the top layer and the bottom layer is a black solder resist ink layer.
[0014] In some embodiments, the wired controller further includes a main chip disposed on the surface of the bottom layer near the top layer, and the main chip is electrically connected to the infrared emitting diode and the infrared receiving head, respectively.
[0015] By adopting the above technical solution, this application provides a wired controller, which includes a PCB board (Printed Circuit Board), an infrared emitter, and an infrared receiver. The PCB board includes a bottom layer and a top layer stacked together. The infrared emitter and the infrared receiver are both disposed on the surface of the bottom layer near the top layer. Openings are respectively provided on the top layer corresponding to the positions of the infrared emitter and the infrared receiver. This solution, by placing the infrared emitter and the infrared receiver on the bottom layer, allows the top layer to act as a barrier between the infrared emitter and the infrared receiver, effectively preventing light leakage and ensuring that the infrared light is received by the infrared receiver before it is emitted into the external space. This avoids the wired controller being falsely triggered and wakes up, improving the accuracy and sensitivity of the wired controller's wake-up process. Attached Figure Description
[0016] The preferred embodiments of this application are described below with reference to the accompanying drawings, in which:
[0017] Figure 1 This is a top view schematic diagram of a wired controller stacking structure provided in an embodiment of this application;
[0018] Figure 2 This is a schematic diagram of the underlying structure of the PCB board provided in the embodiments of this application;
[0019] Figure 3 This is a front view of the structural component provided in the embodiments of this application;
[0020] Figure 4This is a schematic diagram of the back of the structural component provided in the embodiments of this application;
[0021] Figure 5 This is a schematic diagram of the rear side of a structural component provided in another embodiment of this application;
[0022] Figure 6 This is a schematic diagram of the underlying structure of a PCB board provided in another embodiment of this application. Detailed Implementation
[0023] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.
[0024] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that an element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects.
[0025] In a wired controller based on a through-beam sensing scheme, the main chip controls an infrared emitter to emit infrared light. This light is reflected when it encounters an obstacle and is received by the infrared receiver on the controller. The main chip then triggers a control action based on the signal received by the receiver. This type of wired controller can be used in scenarios such as automatically waking up the screen without contact when a user approaches, improving the user experience. However, as described in the background section, existing through-beam sensing wired controllers are prone to light leakage in practical applications. This causes the infrared light emitted by the emitter to be directly captured by the receiver before it reaches the external space and is reflected by an external object, resulting in the controller being falsely triggered and woken up.
[0026] In view of this, this application provides a wired remote control, see [link to relevant documentation]. Figure 1 , Figure 1This is a top view of a wired controller stacked structure provided in an embodiment of this application. The wired controller may include a PCB board 1, an infrared transmitter 2, and an infrared receiver 3. The PCB board 1 includes a bottom layer 11 and a top layer 12 stacked together. The infrared transmitter 2 and the infrared receiver 3 are both disposed on the surface of the bottom layer 11 near the top layer 12. The top layer 12 has openings corresponding to the positions of the infrared transmitter 2 and the infrared receiver 3.
[0027] The above is an embodiment of the wired controller provided in this application. By setting both the infrared emitting tube 2 and the infrared receiver 3 on the bottom layer 11 of the PCB board 1, the top layer 12 of the PCB board 1 can act as a barrier between the infrared emitting tube 2 and the infrared receiver 3, effectively preventing light leakage and ensuring that the infrared light is received by the infrared receiver 3 before it is emitted into the external space. This can prevent the wired controller from being accidentally triggered and wake up, and improve the accuracy and sensitivity of the wired controller's wake-up.
[0028] In some embodiments, the infrared emitter 2 and the infrared receiver 3 can be soldered onto the surface of the bottom layer 11 of the PCB near the top layer 12 using surface mount technology (SMT).
[0029] The opening on the top layer 12 corresponding to the position of the infrared emitting tube 2 provides a light transmission path for the infrared light emitted by the infrared emitting tube 2, so that the infrared light can pass through the top layer 12 of the PCB board 1 and further reach the external space environment where the wired controller is located. The opening on the top layer 12 corresponding to the position of the infrared receiver 3 provides a transmission path for the infrared light reflected back from the external space environment, so that the infrared receiver 3 can receive the reflected infrared light.
[0030] In some embodiments, the size of the opening on the top layer 12 corresponding to the position of the infrared emitting tube 2 can be set based on the radiation angle range of the emitted light from the infrared emitting tube 2, so as to reduce the obstruction of light emitted into the external space while avoiding light leakage.
[0031] In some embodiments, to further improve the isolation effect, see [reference needed]. Figure 2 As shown, Figure 2 This is a schematic diagram of the bottom layer 11 of the PCB board 1 provided in this application embodiment. The infrared emitting tube 2 and the infrared receiving head 3 can be set at intervals. The interval distance can be flexibly set based on the size of the bottom layer 11 of the PCB board 1 and the actual application requirements.
[0032] In some embodiments, the infrared emitting diode 2 and the infrared receiving head 3 can be spaced apart along the same side of the bottom layer 11. This improves the isolation effect, and the subsequent design of the top layer 12, etc., only requires matching and placement on the same side, which simplifies the process. Figure 2 As shown,Figure 2 The example shows that the infrared emitting tube 2 and the infrared receiving head 3 can be spaced apart along one side of the bottom layer 11 in the vertical direction.
[0033] In other embodiments, the infrared emitting tube 2 and the infrared receiving head 3 may also be spaced apart along one side of the bottom layer 11 in the horizontal direction.
[0034] At least one of the top layer 12 and the bottom layer 11 of the PCB board 1 may be a green or blue solder resist layer. In some embodiments, to absorb light and avoid interference from ambient light, at least one of the top layer 12 and the bottom layer 11 of the PCB board 1 may be a black solder resist layer. Figure 1 As shown, Figure 1 The example shows that the top layer 12 of the PCB board 1 is made of black solder resist ink.
[0035] The black solder resist ink layer can be obtained using conventional materials and spraying processes that can achieve the same effect in this field.
[0036] In some embodiments, to further improve the light leakage isolation effect, the wired controller may also include structural component 4, see [link to documentation]. Figure 3 and Figure 4 As shown, Figure 3 This is a front view of structural component 4 provided in an embodiment of this application. Figure 4 This is a schematic diagram of the back of the structural component 4 provided in the embodiment of this application. The structural component 4 is used to wrap the side of the PCB board 1. A first opening 41 is provided on the structural component 4 at the position corresponding to the infrared receiver head 3, and a second opening 42 is provided on the structural component 4 at the position corresponding to the infrared emitting tube 2.
[0037] In some embodiments, the first opening 41 may be the same size as the opening on the top layer 12 corresponding to the position of the infrared receiver 3, so that infrared light reflected from the external space environment can reach the infrared receiver 3 through the first opening 41 and the opening on the top layer 12 corresponding to the position of the infrared receiver 3.
[0038] In other embodiments, to ensure that the reflected infrared light is not blocked, such as Figure 3 and Figure 4 As shown, the middle area of structural component 4 may be provided with a third opening 43, which is connected to the first opening 41.
[0039] In some embodiments, the second opening 42 may be the same size as the opening on the top layer 12 corresponding to the position of the infrared emitting tube 2. The infrared light emitted by the infrared emitting tube 2 can further reach the external space environment where the wire controller is located through the opening at the corresponding position on the top layer 12 and the second opening 42 of the structural member 4.
[0040] The front side of structural component 4 refers to the side of structural component 4 facing away from the top layer 12 of PCB board 1. The front side of structural component 4 can be configured to face the display screen of the wired controller. The back side of structural component 4 can be the side of structural component 4 close to the top layer 12 of PCB board 1.
[0041] Structural component 4 not only further isolates the infrared emitting tube 2 and the infrared receiving head 3, but also serves as a limiting or supporting element. See also the following in some embodiments: Figure 4 As shown, the back of structural component 4 has a concave structure to facilitate embedding into PCB board 1. The relatively protruding outer frame on the back of structural component 4 can be used to wrap around the side of PCB board 1, thereby limiting or supporting PCB board 1.
[0042] In some embodiments, in order to further prevent infrared light from being received directly by the infrared receiver 3 before it is emitted, which could lead to false triggering, the wired controller may also include a first isolator 44 disposed on the surface of the structural member 4 near the PCB board 1, with the first isolator 44 disposed around the periphery of the second opening 42.
[0043] In some embodiments, the first spacer 44 may be made of sealant. In other embodiments, the first spacer 44 may also be integrally formed with the structural member 4, see [link to relevant documentation]. Figure 5 As shown, Figure 5 This is a schematic diagram of the back side of structural component 4 provided in another embodiment of this application.
[0044] The first isolation member 44 has a raised structure, which can be used to form a shield around the opening of the top layer 12 corresponding to the position of the infrared emitting tube 2, so as to avoid light leakage between the top layer 12 and the structural member 4.
[0045] In some embodiments, to further improve the barrier effect, the wired controller may further include: at least one second barrier 45 disposed on the surface of the structural member 4 near the PCB board 1, wherein the at least one second barrier 45 is disposed between the first barrier 44 and the first opening 41.
[0046] In some embodiments, the second spacer 45 may be made of sealant. In other embodiments, the second spacer 45 may be integrally formed with the structural member 4.
[0047] like Figure 5 As shown, Figure 5 The example shows two second isolation members 45 disposed on the surface of the structural member 4 near the PCB board 1, and both second isolation members 45 are integrally disposed with the structural member 4.
[0048] The second spacer 45 has a protruding structure and can extend in a direction perpendicular to the line connecting the first opening 41 and the first spacer 44. Its dimension in this direction can be greater than or equal to the dimension in the corresponding direction of the second opening 42. The dimensions of the multiple second spacers 45 in the direction perpendicular to the line connecting the first opening 41 and the first spacer 44 can be the same or different.
[0049] In some embodiments, a plurality of second spacers 45 may be spaced apart between the first opening 41 and the first spacer 44.
[0050] In some embodiments, the wired controller may further include a main chip 46, which is disposed on the surface of the bottom layer 11 near the top layer 12. The main chip 46 is electrically connected to the infrared emitter 2 and the infrared receiver 3, respectively. See also Figure 6 As shown, Figure 6 This is a schematic diagram of the bottom layer 11 of the PCB board 1 provided in another embodiment of this application. The main chip 46 can be disposed in the middle area of the bottom layer 11.
[0051] The main chip 46 can be used to control the infrared emitting tube 2 to emit pulsed infrared light. When the infrared light is reflected by an obstacle in the external space where the wire controller is located, and the infrared receiver 3 receives the reflected infrared light, the infrared receiver 3 generates an interrupt signal and provides it to the main chip 46. The main chip 46 is used to trigger control actions based on the interrupt signal, such as waking up the display screen, so as to realize the accurate and effective human wake-up function in the absence of contact.
[0052] In some embodiments, the bottom layer 11 may also be provided with a ground wire or other auxiliary signal lines (not shown in the figure).
[0053] In some embodiments, the top layer 12 may also be provided with traces and vias, for the main chip 46 to be electrically connected to the infrared emitter 2 and the infrared receiver 3 disposed on the same layer through the traces and vias of the top layer 12. Thus, by placing both the infrared emitter 2 and the infrared receiver 3 on the bottom layer 11, and having the top layer 12 act as a barrier between the infrared emitter 2 and the infrared receiver 3, changes to the trace layout of the top layer 12 can be avoided, simplifying the process.
[0054] In other embodiments, electronic components, such as resistors, may also be provided on the top layer 12 as needed.
[0055] In some embodiments, the wired controller may further include a liquid crystal display screen, which may be disposed on the front side of the structure 4, and the orthographic projection of the liquid crystal display screen on the structure 4 may overlap with the third opening 43.
[0056] In some embodiments, the wired controller may also include a liquid crystal bracket for supporting the liquid crystal display screen.
[0057] In other embodiments, the wired controller may also be provided with a front shell and a rear shell, which are assembled to form a receiving cavity. The PCB board 1, structural component 4, LCD display screen, LCD bracket, etc. can all be disposed in the receiving cavity formed by the front shell and the rear shell.
[0058] In addition, the LCD bracket can support the LCD screen by wrapping around its sides, and the LCD bracket can have an opening at the corresponding position of the LCD screen.
[0059] The front cover may also have openings or transparent materials at the positions corresponding to the LCD screen, the infrared emitter 2, and the infrared receiver 3, in order to avoid blocking the light.
[0060] In some embodiments, the wired controller provided in this application can be applied to smart air conditioners, smart speakers, etc., which is beneficial for achieving accurate and flexible wake-up and improving the user experience.
[0061] The technical solutions of this application have been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of this application is obviously not limited to these specific embodiments. Without departing from the principles of this application, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the scope of protection of this application.
Claims
1. A wired controller, characterized in that, The device includes a PCB board, an infrared emitter, and an infrared receiver. The PCB board includes a bottom layer and a top layer stacked together. The infrared emitter and the infrared receiver are both disposed on the surface of the bottom layer near the top layer. The top layer has openings corresponding to the positions of the infrared emitter and the infrared receiver.
2. The wired controller according to claim 1, characterized in that, The infrared emitting tube and the infrared receiving head are spaced apart.
3. The wired controller according to claim 2, characterized in that, The infrared emitting tube and the infrared receiving head are spaced apart along the same side of the bottom layer.
4. The wired controller according to claim 1, characterized in that, The wired controller also includes a structural component for wrapping the side of the PCB board. The structural component has a first opening corresponding to the position of the infrared receiver head and a second opening corresponding to the position of the infrared emitter.
5. The wired controller according to claim 4, characterized in that, The wired controller further includes a first isolator disposed on the surface of the structural component near the PCB board, the first isolator being disposed around the periphery of the second opening.
6. The wired controller according to claim 5, characterized in that, The wired controller further includes at least one second isolator disposed on the surface of the structural member near the PCB board, the at least one second isolator being disposed between the first isolator and the first opening.
7. The wired controller according to claim 6, characterized in that, The first isolation member and the at least one second isolation member are both integrally formed with the structural member.
8. The wired controller according to claim 4, characterized in that, The structural component has a third opening in the middle region, and the third opening communicates with the first opening.
9. The wired controller according to any one of claims 1 to 8, characterized in that, At least one of the top layer and the bottom layer is made of black solder resist ink.
10. The wired controller according to any one of claims 1 to 8, characterized in that, The wired controller also includes a main chip, which is disposed on the surface of the bottom layer near the top layer. The main chip is electrically connected to the infrared emitting tube and the infrared receiving head, respectively.