High-voltage-resistant insulating printed PCB (printed circuit board)

Abstract

The utility model discloses a high voltage resistant insulation printed PCB circuit board, comprising a board body, the board body comprises a surface protection layer, a middle composite layer and a bottom protection layer, the middle composite layer comprises a high voltage signal layer, an intelligent monitoring layer, a composite insulation layer, a dynamic stress buffer layer and a nanometer composite shielding layer, the surface protection layer, the middle composite layer and the bottom protection layer are bonded through low-temperature plasma interface activation treatment, a plurality of mounting holes are formed in the board body, a plurality of electronic elements are arranged on the front end face of the board body, the surface protection layer is composed of a nano aluminum oxide ceramic coating, and the surface protection layer is composed of a nano aluminum oxide ceramic coating. The bottom protection layer is composed of a plasma polymerization fluorocarbon coating. The utility model integrates the functions of high-voltage resistance, self-monitoring, interference resistance and environmental protection, is suitable for scenes such as new energy equipment and industrial high-voltage systems, and significantly improves the reliability and service life of the equipment.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a high-voltage resistant insulated printed PCB circuit board. Background Technology

[0002] With the rapid development of new energy equipment (such as electric vehicles and photovoltaic inverters), industrial high-voltage systems (such as power transmission and rail transportation), and aerospace electronics, the performance requirements for printed circuit boards (PCBs) have significantly increased.

[0003] Traditional high-voltage PCBs have the following shortcomings in terms of materials, structure, and functional integration:

[0004] 1. Inadequate insulation and thermal management performance

[0005] Material limitations: Ordinary polyimide or epoxy resin has low dielectric strength (usually <20kV / mm) and is prone to aging and breakdown under long-term high voltage.

[0006] Poor thermal conductivity: The thermal conductivity of the insulation layer is mostly below 1W / mK, which leads to the accumulation of local hot spots and accelerates insulation failure.

[0007] 2. Poor adaptability to mechanical stress

[0008] Rigid structure design: Traditional PCBs rely on rigid substrates such as FR-4, which cannot effectively absorb vibration energy and are prone to solder joint cracking or circuit breakage.

[0009] Low interlayer bonding strength: The interlayer bonding strength of conventional hot pressing process is insufficient, and it is easy to delaminate under dynamic load. Utility Model Content

[0010] The purpose of this invention is to provide a high-voltage resistant, insulated printed PCB circuit board to solve the problems mentioned in the background art.

[0011] To achieve the above objectives, this utility model provides the following technical solution: a high-voltage resistant insulating printed PCB circuit board, comprising a board body, the board body comprising a surface protective layer, a middle composite layer and a bottom protective layer, the middle composite layer comprising a high-voltage signal layer, an intelligent monitoring layer, a composite insulation layer, a dynamic stress buffer layer and a nano-composite shielding layer, wherein the surface protective layer, the middle composite layer and the bottom protective layer are bonded together by low-temperature plasma interface activation treatment.

[0012] The plate has several mounting holes.

[0013] The front end face of the plate is provided with several electronic components.

[0014] The surface protective layer is composed of a nano-alumina ceramic coating.

[0015] The bottom protective layer is composed of a plasma-polymerized fluorocarbon coating.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] This utility model integrates high voltage resistance, self-monitoring, anti-interference and environmental protection functions, and is suitable for new energy equipment, industrial high voltage systems and other scenarios, significantly improving equipment reliability and service life. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the present invention;

[0019] Figure 2 This is a cross-sectional view of the circuit board body of this utility model;

[0020] Figure 3 This is a cross-sectional view of the composite layer in this utility model.

[0021] In the diagram: 1. Board body; 2. Mounting holes; 3. Electronic components; 11. Surface protective layer; 12. Middle composite layer; 13. Bottom protective layer; 121. High voltage signal layer; 122. Intelligent monitoring layer; 123. Composite insulation layer; 124. Dynamic stress buffer layer; 125. Nanocomposite shielding layer. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-3 This utility model provides a technical solution: a high-voltage resistant insulated printed PCB circuit board, including a board body 1. The board body 1 includes a surface protective layer 11, a middle composite layer 12 and a bottom protective layer 13. The middle composite layer 12 includes a high-voltage signal layer 121, an intelligent monitoring layer 122, a composite insulation layer 123, a dynamic stress buffer layer 124 and a nano-composite shielding layer 125.

[0024] The high-voltage signal layer 121 uses gradient etched copper foil and integrates an embedded varistor array to reduce the risk of partial discharge and improve the withstand voltage level;

[0025] The intelligent monitoring layer 122 includes a ceramic-polyimide composite substrate and a distributed fiber optic sensor array. The data can be analyzed by the edge computing module to achieve early fault warning.

[0026] The composite insulating layer 123 is made of a modified polyimide material filled with boron nitride nanosheets;

[0027] The dynamic stress buffer layer 124 incorporates a shape memory alloy mesh and a 3D-printed elastomer microstructure. Under vibration or impact loads, it absorbs energy through martensitic phase transformation (energy dissipation rate > 60%) and recovers its shape with temperature.

[0028] The nanocomposite shielding layer 125 has a multilayer shielding structure of graphene / boron nitride heterojunction film. The graphene layer reflects high-frequency electromagnetic waves through a conductive network, and the boron nitride layer absorbs low-frequency interference by utilizing dielectric polarization loss.

[0029] The surface protective layer 11, the middle composite layer 12 and the bottom protective layer 13 are bonded together by low-temperature plasma interface activation treatment.

[0030] The plate 1 has several mounting holes 2.

[0031] Several electronic components 3 are provided on the front end face of the board 1.

[0032] The surface protective layer 11 is composed of a nano-alumina ceramic coating.

[0033] The bottom protective layer 13 is composed of a plasma-polymerized fluorocarbon coating.

[0034] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-voltage resistant insulated printed circuit board, comprising a board body (1), characterized in that: The plate (1) includes a surface protective layer (11), a middle composite layer (12) and a bottom protective layer (13). The middle composite layer (12) includes a high-voltage signal layer (121), an intelligent monitoring layer (122), a composite insulation layer (123), a dynamic stress buffer layer (124) and a nano-composite shielding layer (125). The surface protective layer (11), the middle composite layer (12) and the bottom protective layer (13) are bonded together by low-temperature plasma interface activation treatment.

2. The high-voltage resistant insulated printed PCB circuit board according to claim 1, characterized in that: The plate (1) has several mounting holes (2).

3. The high-voltage resistant insulated printed PCB circuit board according to claim 1, characterized in that: The front end face of the plate (1) is provided with several electronic components (3).

4. The high-voltage resistant insulated printed PCB circuit board according to claim 1, characterized in that: The surface protective layer (11) is composed of a nano-alumina ceramic coating.

5. A high-voltage resistant insulated printed PCB circuit board according to claim 1, characterized in that: The bottom protective layer (13) is composed of a plasma-polymerized fluorocarbon coating.

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