Wafer direction adjusting device for plasma photoresist removing equipment

Abstract

The utility model discloses a wafer direction adjusting device for plasma photoresist removing equipment. The wafer direction adjusting device comprises a bearing platform, a photoelectric sensor A, a photoelectric sensor B, a wafer limiting column, a rotary lifting platform, a vacuum adsorption hole, a hollow supporting column, a rotary ventilation connector, a servo motor and a telescopic air cylinder. The photoelectric sensor is used for detecting the flat edge or notch of the wafer to judge the type of the wafer, and the rotary lifting platform is matched with the servo motor to adjust the direction of the wafer. The device can improve the stability of equipment for plasma photoresist removal and the like, is convenient for troubleshooting, and improves the utilization rate of the equipment.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor wafer equipment technology, and in particular to a wafer orientation adjustment device for plasma resist removal equipment. Background Technology

[0002] In wafer fabrication, plasma resist stripping equipment is an indispensable component in certain processes. As manufacturing processes become increasingly sophisticated, the demands on both equipment and processes also rise. Existing plasma resist stripping equipment faces higher requirements for stability. In the resist stripping process, the consistency of wafer orientation significantly impacts the uniformity of resist removal. If the wafer orientation is inconsistent, it becomes difficult to immediately determine whether the issue stems from the product itself or a specific point on the equipment when resist uniformity is abnormal, leading to increased maintenance time. Therefore, developing a device capable of accurately identifying and adjusting wafer orientation is crucial for improving equipment stability, reducing damage to structural components, and increasing equipment utilization. Utility Model Content

[0003] This invention aims to provide a wafer orientation adjustment device for plasma resist removal equipment. By accurately identifying and adjusting the wafer orientation, it improves the stability of plasma resist removal equipment and related process equipment, reduces equipment maintenance time, and increases equipment utilization.

[0004] The above-mentioned objective of this utility model is achieved through the following technical solution: A wafer orientation adjustment device for a plasma resist removal equipment includes a base and a support platform. The base is provided with a guide post, and a crossbeam is fixed at the upper end of the guide post. The support platform is provided with a guide hole and is mounted on the guide post through the guide hole. The support platform is provided with a wafer limiting post. The center of the support platform is provided with a central hole, through which a movable hollow support post passes. The upper end of the hollow support post is connected to a rotating lifting platform. The rotating lifting platform is provided with a vacuum adsorption hole communicating with the hollow support post. The lower end of the hollow support post is connected to a rotatable vent connector. The bottom of the rotatable vent connector is connected to a servo motor. The bottom of the servo motor is connected to a telescopic cylinder. The bottom of the telescopic cylinder is fixed on the base. The support platform is provided with two photoelectric sensors, and the crossbeam is provided with a photoelectric reflector facing the photoelectric sensors.

[0005] The photoelectric sensor includes photoelectric sensor A and photoelectric sensor B. A circular working area for placing the wafer is divided on the support platform with the hollow support column as the center. Photoelectric sensor A and photoelectric sensor B are located at the edge of the circular working area. When the wafer type is a notched wafer, photoelectric sensor A and photoelectric sensor B can sequentially sense reflected light or an increase in light intensity during one rotation of the wafer. When the wafer type is a flat-edge wafer, photoelectric sensor A and photoelectric sensor B can simultaneously sense reflected light or an increase in light intensity during one rotation of the wafer. When photoelectric sensor A and photoelectric sensor B are not located at the wafer notch or wafer flat-edge position, photoelectric sensor A and photoelectric sensor B cannot sense reflected light or can only sense reflected light with an intensity below a certain threshold.

[0006] In this utility model:

[0007] Support platform: As a basic component, it is used to support the laser sensor and wafer positioning components, providing a stable support structure for the entire device.

[0008] Photoelectric sensors: Two sensors, A and B, work by detecting objects that block the light beam. The wafer's orientation is detected using its flat edges or notches, providing a basis for subsequent orientation adjustments.

[0009] Wafer positioning posts: These have the function of placing the wafer and adjusting the wafer offset, ensuring that the initial position of the wafer on the device is accurate, which facilitates subsequent orientation adjustment operations.

[0010] Rotary lifting platform: This platform is capable of rising and then rotating to adjust the wafer orientation. It is a key component for achieving wafer orientation adjustment.

[0011] Vacuum adsorption holes: Their function is to prevent the wafer from shifting or falling during the rising and rotating process after it has been mounted, thus ensuring the stability of the wafer during operation.

[0012] Hollow support column: The interior has a hollow structure, through which VAC (vacuum adsorption gas) is introduced to adsorb the wafer, further enhancing the wafer's fixation effect on the device.

[0013] Rotary vent connector: Equipped with a VAC interface, it can rotate 360° to ensure a stable supply of vacuum adsorption gas when the wafer orientation is adjusted by rotating the lifting platform, which facilitates wafer orientation adjustment.

[0014] Servo motors: They eliminate step loss and, when used in conjunction with photoelectric sensors, enable more precise control of wafer orientation, ensuring the accuracy and stability of adjustment actions.

[0015] Telescopic cylinder: Used to raise and lower the rotating platform. By precisely controlling the raising and lowering action of the rotating platform, it provides the necessary spatial position changes for wafer orientation adjustment.

[0016] The working process of this utility model is as follows: After placing the wafer on the wafer limiting post, the rotating lifting platform is vacuumed and raised to a predetermined height, then rotates 360° once. Since the wafer type and notch or flat edge direction are uncertain when placing the wafer, the first rotation allows the sensors to fully detect the wafer type. When photoelectric sensor A or photoelectric sensor B detects the wafer alone, it is determined to be a notched wafer. At this time, the platform begins a second rotation and stops at the position of photoelectric sensor A. When photoelectric sensors A and B detect the wafer simultaneously, it is determined to be a flat edge wafer. At this time, the platform begins a second rotation and stops at the position of photoelectric sensor B, thereby completing the wafer orientation adjustment.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] 1. Improve equipment stability: By accurately adjusting the wafer orientation, the placement and handling of wafers are more standardized during processes such as plasma resist removal, reducing process fluctuations caused by inconsistent wafer orientation and thus improving equipment stability.

[0019] 2. Facilitates troubleshooting: When process parameters such as uniformity of adhesive removal are abnormal, the wafer orientation is already unified, making it easier to quickly and accurately analyze whether the problem lies with the product itself or a specific point on the equipment, effectively reducing maintenance time.

[0020] 3. Improve equipment utilization: Reduce equipment failures and maintenance time caused by wafer orientation issues, indirectly improving equipment utilization, reducing production costs, and increasing production efficiency. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of this utility model.

[0022] Figure 2 This is a schematic diagram of the structure of the support platform in this utility model.

[0023] Figure 3 This is a diagram demonstrating the process of a notched wafer rotating on a device.

[0024] Figure 4 This is a diagram demonstrating the process of a flat-edge wafer rotating on a device.

[0025] Figure 5 This is a schematic diagram illustrating the working principle of this utility model, showing the state of the wafer placed on the equipment.

[0026] Figure 6This is a schematic diagram illustrating the rising state of the adsorption vacuum platform in the working principle of this utility model.

[0027] Figure 7 This is a schematic diagram illustrating the working principle of the platform rotation for detecting wafer types.

[0028] Figure 8 This is a schematic diagram illustrating the state of the platform's secondary rotation to determine the wafer orientation, which is the working principle of this utility model.

[0029] Figure 9 This is a schematic diagram illustrating the working principle of this utility model: the vacuum platform is closed and descending.

[0030] Figure 10 This is a schematic diagram of the notched wafer completing orientation adjustment.

[0031] Figure 11 This is a schematic diagram of the orientation adjustment completed on a flat-edge wafer.

[0032] Figure 12 This is a flowchart of the process of this utility model. Detailed Implementation

[0033] The present invention will now be described in further detail with reference to the accompanying drawings.

[0034] like Figure 1 , Figure 2As shown, a wafer orientation adjustment device for a plasma resist removal equipment includes a base 1 and a support platform 2. The base 1 is provided with a guide post 3, and a crossbeam 4 is fixed to the upper end of the guide post 3. The support platform 2 is provided with a guide hole and is mounted on the guide post 3 through the guide hole. The support platform 2 is provided with a wafer limiting post 5. The support platform 2 has a central hole and a movable hollow support post 6 passes through it. The upper end of the hollow support post 6 is connected to a rotating lifting platform 7. The rotating lifting platform 7 is provided with a vacuum adsorption hole 13 communicating with the hollow support post 6. The lower end of the hollow support post 6 is connected to a rotatable vent connector 8. The bottom of the rotatable vent connector 8 is connected to a servo motor 9. The bottom of the servo motor 9 is connected to a telescopic cylinder 10. The bottom of the telescopic cylinder 10 is fixed to the base 1. The support platform 2 is provided with two photoelectric sensors. The crossbeam 4 is provided with a photoelectric reflector 11 facing the photoelectric sensors A and B. Two photoelectric sensors, photoelectric sensor A and photoelectric sensor B, are used. A circular working area for placing the wafer is divided on the support platform 2, centered on the hollow support column 6. Photoelectric sensors A and B are located at the edge of this circular working area. When the wafer 12 is a notched wafer, photoelectric sensors A and B can sequentially sense reflected light or an increase in light intensity during one rotation of the wafer. When the wafer 12 is a flat-edge wafer, photoelectric sensors A and B can simultaneously sense reflected light or an increase in light intensity during one rotation of the wafer. When photoelectric sensors A and B are not located at the wafer notch or flat edge position, they cannot sense reflected light or can only sense reflected light with an intensity below a certain threshold.

[0035] Taking a certain plasma resist removal equipment as an example, this wafer orientation adjustment device is used in conjunction with it:

[0036] like Figures 1 to 12 As shown, in actual production, the wafer is first placed on the wafer positioning post 5 (e.g., Figure 5 At this point, the wafer positioning post 5 initially positions the wafer and can adjust the wafer offset as needed to ensure the wafer is in the appropriate initial position. Next, the telescopic cylinder 10 actuates, driving the rotary lifting platform 7 to rise (e.g., ...). Figure 6 At the same time, the vacuum adsorption hole activates the vacuum adsorption function, and VAC is introduced through the hollow support column 6 to firmly adsorb the wafer onto the rotating lifting platform 7, preventing the wafer from shifting or falling during subsequent operations.

[0037] Once the rotating lifting platform 7 reaches the predetermined height, the servo motor 9 drives the rotating lifting platform 7 to rotate one revolution (e.g., Figure 7During rotation, photoelectric sensors A and B detect the flat edge or notch of the wafer in real time. If photoelectric sensor A or B alone detects the flat edge or notch of the wafer, it is determined that the wafer is a notched wafer, and servo motor 9 controls the rotary lifting platform 7 to begin the second rotation (e.g., Figure 8 ), and precisely stop at the position of photoelectric sensor A (e.g. Figure 10 If photoelectric sensors A and B simultaneously detect a flat edge or notch on the wafer, the wafer is determined to be a flat-edge wafer, and servo motor 9 controls the rotary lifting platform 7 to rotate a second time (e.g., Figure 8 ), and remain at the position of photoelectric sensor B (e.g. Figure 11 ).

[0038] After the wafer orientation is adjusted, the rotary lifting platform 7 can perform corresponding actions according to subsequent process requirements, such as descending to a designated position (e.g., Figure 9 The oriented wafers are then transported to the plasma resist removal equipment for further processing. Throughout the process, the rotary vent joint ensures a stable supply of vacuum adsorption gas as the rotary lifting platform 7 rotates, guaranteeing that the wafers are always firmly adsorbed.

[0039] In summary, the wafer orientation adjustment device of this invention, through the coordinated work of its components, can accurately and efficiently adjust the wafer orientation, meeting the requirements for equipment stability and process precision in wafer manufacturing, and has good application prospects.

[0040] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer orientation adjustment device for a plasma resist stripping equipment, characterized in that: The device includes a base and a support platform. The base has guide columns with a crossbeam fixed to their upper ends. The support platform has guide holes through which it is mounted on the guide columns. The support platform also has wafer positioning columns and a central hole through which a movable hollow support column passes. The upper end of the hollow support column is connected to a rotating lifting platform with a vacuum adsorption hole communicating with the hollow support column. The lower end of the hollow support column is connected to a rotatable vent connector, the bottom of which is connected to a servo motor. The bottom of the servo motor is connected to a telescopic cylinder, the bottom of which is fixed to the base. The support platform has two photoelectric sensors, and the crossbeam has a photoelectric reflector facing the photoelectric sensors.

2. The wafer orientation adjustment device for a plasma resist stripping equipment according to claim 1, characterized in that: The photoelectric sensor includes photoelectric sensor A and photoelectric sensor B. A circular working area for placing the wafer is divided on the support platform with the hollow support column as the center. Photoelectric sensor A and photoelectric sensor B are located at the edge of the circular working area. When the wafer type is a notched wafer, photoelectric sensor A and photoelectric sensor B can sequentially sense reflected light or an increase in light intensity during one rotation of the wafer. When the wafer type is a flat-edge wafer, photoelectric sensor A and photoelectric sensor B can simultaneously sense reflected light or an increase in light intensity during one rotation of the wafer. When photoelectric sensor A and photoelectric sensor B are not located at the wafer notch or wafer flat-edge position, photoelectric sensor A and photoelectric sensor B cannot sense reflected light or can only sense reflected light with an intensity below a certain threshold.

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