Baking device applied to wafer

Abstract

The utility model discloses a baking device applied to wafers, which relates to the technical field of wafer baking devices and comprises a hot plate with a heating part, a vacuum monitoring assembly and a driving part. The vacuum monitoring assembly comprises at least one suction cup, at least one vacuum tube and at least one pressure gauge, one end of the vacuum tube is arranged above the heating part and connected with the suction cup, the other end of the vacuum tube is arranged below the heating part and connected with the driving part, the vacuum tube is used for providing negative pressure for the suction cup, and the pressure gauge is used for monitoring pressure data in the vacuum tube; through the arrangement, when impurities appear on the surface of the wafer or the wafer has dark crack fragments, negative pressure in the vacuum tube fluctuates, pressure data of the vacuum tube can be detected through the pressure gauge, and when the pressure value fluctuates, the vacuum tube is driven by the driving part to move up and down. The surface of the wafer has impurities or dark crack fragments, so that the problem of abnormal baking can be avoided.

Description

Technical Field

[0001] This utility model relates to the technical field of wafer baking equipment, specifically a baking device applied to wafers. Background Technology

[0002] The photolithography process for LEDs includes a baking process, which involves baking the coated wafer to form a uniform thin film on its surface. Baking improves the adhesion between the photoresist and the wafer, reducing the risk of peeling or detachment. Baking also helps stabilize the pattern after exposure, reducing deformation or distortion during development. Furthermore, it relieves internal stress in the photoresist, preventing cracking or peeling, and improves the resolution of the photoresist, resulting in clearer image edges and enhanced pattern accuracy.

[0003] Current wafer baking methods involve placing the wafer on a hot plate in a baking apparatus and using the hot plate to apply high temperatures to the wafer surface to achieve the baking function. However, during the early processing stages, impurities may adhere to the wafer surface or the wafer itself may have inherent problems, such as particles adhering to the wafer surface or dark cracks or fragments. These particles and dark cracks can lead to insufficient contact area between the wafer and the hot plate, resulting in baking defects.

[0004] Therefore, existing wafer baking equipment may cause baking abnormalities due to impurities and problems with the wafer itself. Utility Model Content

[0005] Based on this, the purpose of this utility model is to provide a baking device for wafers to solve the technical problem in the prior art that existing wafer baking devices may cause baking abnormalities due to impurities and problems with the wafers themselves.

[0006] The present invention provides a baking apparatus for wafers, including a hot plate with a heating section, a vacuum monitoring component, and a driving component;

[0007] The vacuum monitoring component includes at least one suction cup, at least one vacuum tube, and at least one pressure gauge. One end of the vacuum tube is located above the heating part and connected to the suction cup, and the other end of the vacuum tube is located below the heating part and connected to the driving component. The vacuum tube is used to provide negative pressure to the suction cup to vacuum adsorb the wafer onto the suction cup. The pressure gauge is used to monitor the pressure data inside the vacuum tube.

[0008] The driving component is used to drive the vacuum tube and the heating plate to move up and down, so as to bring the wafer into contact with the heating part / away from the heating part.

[0009] Furthermore, the vacuum monitoring component is located in the central region of the heating section.

[0010] Furthermore, the vacuum monitoring assembly includes multiple suction cups, multiple vacuum tubes, and multiple pressure gauges;

[0011] Each of the suction cups and each of the pressure gauges are respectively disposed on each of the vacuum tubes.

[0012] Furthermore, the plurality of vacuum tubes are arranged circumferentially with the center of the heating section as the origin.

[0013] Furthermore, the hot plate is provided with a plurality of through holes, each of which is arranged opposite to each of the vacuum tubes.

[0014] Furthermore, the vacuum monitoring component also includes multiple on / off switches, each of which is connected to each of the vacuum tubes to control the vacuum state within the vacuum tubes.

[0015] Furthermore, the driving component includes a lifting driver and a support plate, one end of which supports the vacuum monitoring component, and the other end of which is connected to the output end of the lifting driver.

[0016] Furthermore, the support plate is fixedly connected to the output end of the lifting driver.

[0017] Furthermore, the hot plate also includes a heating element, a heat insulation layer, and a temperature sensor.

[0018] Furthermore, the heating element and the heat insulation layer are sequentially disposed below the heating part, wherein the temperature sensor is used to monitor the temperature of the heating element.

[0019] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0020] In the wafer baking apparatus of this invention, the configuration of the driving component and vacuum monitoring assembly, including a suction cup, a vacuum tube, and a pressure gauge, allows the wafer to be vacuum-adsorbed onto the suction cup when it is placed on the suction cup. The driving component then drives the vacuum tube and the heating plate to descend, allowing the lower surface of the wafer to adhere to the heating surface of the heating plate. The heating surface then bakes the wafer. However, if impurities appear on the wafer surface or if the wafer itself has dark cracks or fragments, the lower surface of the wafer may not adhere tightly to the heating surface. In this case, the negative pressure inside the vacuum tube will fluctuate. The pressure gauge can detect the pressure data inside the vacuum tube. When the pressure value fluctuates, it indicates that the wafer surface has impurities or dark cracks or fragments, and the wafer can be excluded from baking, thus avoiding baking abnormalities. Attached Figure Description

[0021] Figure 1This is a perspective view of a baking apparatus applied to wafers in one embodiment of the present invention;

[0022] Figure 2 This is a side view of a wafer baking apparatus applied in one embodiment of the present invention;

[0023] Figure 3 for Figure 1 Enlarged schematic diagram of part A;

[0024] Figure 4 This is an exploded view of a wafer baking apparatus according to one embodiment of the present invention.

[0025] In the diagram: 100, heating plate; 110, heating element; 120, heating element; 130, insulation layer; 140, temperature sensor; 200, vacuum monitoring component; 210, suction cup; 220, vacuum tube; 230, pressure gauge; 240, switch; 300, driving component; 310, lifting driver; 320, support plate; 400, through hole. Detailed Implementation

[0026] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.

[0027] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0029] Please see Figures 1 to 4The image shows a wafer baking apparatus according to one embodiment of the present invention, including a hot plate 100 with a heating section 110, a vacuum monitoring component 200, and a driving component 300. It should be noted that the hot plate 100 is a component placed in a spin coater in the art. The spin coater has a cavity for baking wafers. Since the spin coater is an existing device for processing wafers, it will not be described in detail here.

[0030] Specifically, the vacuum monitoring component 200 includes at least one suction cup 210, at least one vacuum tube 220, and at least one pressure gauge 230. One end of the vacuum tube 220 is located above the heating part 110 and connected to the suction cup 210, and the other end of the vacuum tube 220 is located below the heating part 110 and connected to the driving component 300. The vacuum tube 220 is used to provide negative pressure to the suction cup 210 to vacuum adsorb the wafer onto the suction cup 210. The pressure gauge 230 is used to monitor the pressure data inside the vacuum tube 220.

[0031] The driving component 300 is used to drive the vacuum tube 220 and the heating plate 100 to move up and down, so that the wafer is attached to the heating part 110 / moved away from the heating part 110.

[0032] In practical implementation, when the wafer is placed on the suction cup 210, the vacuum tube 220 and the suction cup 210 generate negative pressure, allowing the wafer to be vacuum-adsorbed onto the suction cup 210. Then, the driving component 300 drives the vacuum tube 220 and the heating plate 100 to descend, so that the lower surface of the wafer can be in contact with the surface of the heating part 110 of the heating plate 100. The heating part 110 can be used to bake the wafer. When impurities appear on the surface of the wafer, or the wafer itself has dark cracks or fragments, the lower surface of the wafer will not be able to be tightly in contact with the surface of the heating part 110. At this time, the negative pressure in the vacuum tube 220 will fluctuate. The pressure data in the vacuum tube 220 can be detected by the pressure gauge 230. When the pressure value fluctuates, the surface of the wafer has impurities or dark cracks or fragments, and the wafer can be left unbaked, thereby avoiding the problem of abnormal baking.

[0033] In some preferred embodiments, since the particles attached to the wafer or the dark cracks and fragments of the wafer itself are irregular, in this example, the vacuum monitoring component 200 is located in the central region of the heating section 110, and the vacuum monitoring component 200 may include multiple suction cups 210, multiple vacuum tubes 220 and multiple pressure gauges 230, wherein each suction cup 210 and each pressure gauge 230 are respectively disposed on each vacuum tube 220. Through the multiple suction cups 210 and multiple vacuum tubes 220, the suction cups 210 can be attached to multiple parts of the lower surface of the wafer. Through the multiple suction cups 210, multiple vacuum tubes 220 and multiple pressure gauges 230, multiple parts of the wafer can be monitored, which can effectively avoid the problem of abnormal baking of the wafer during baking, thereby improving the practicality of the device.

[0034] Specifically, multiple vacuum tubes 220 are arranged circumferentially with the center of the heating section 110 as the origin, and multiple through holes 400 are provided on the heating plate 100. Each through hole 400 is arranged opposite to each vacuum tube 220. The arrangement of the through holes 400 allows the vacuum tubes 220 to pass through the heating section 110 and move up and down.

[0035] After heating is complete, the vacuum tube 220 and the hot plate 100 can be driven to rise using the drive component 300, and the baked wafer can be removed. To avoid the situation where the wafer cannot be removed due to vacuum negative pressure, in this embodiment, the vacuum monitoring component 200 also includes multiple on switches 240. Each on switch 240 is connected to each vacuum tube 220 and is used to control the vacuum state in the vacuum tube 220. That is, the negative pressure state in the vacuum tube 220 can be released by the on switch 240 to avoid the situation where the wafer cannot be removed. It should be noted that the on switch 240 can be a solenoid valve in the prior art.

[0036] It should be noted that the bottom of the vacuum tube 220 can be connected to a vacuum pump. The vacuum pump can generate negative pressure inside the vacuum tube 220, allowing the chuck 210 to vacuum-adsorb the wafer. The vacuum pump can also be used to release the negative pressure inside the vacuum tube 220.

[0037] In addition, to facilitate the lifting and lowering movement of the vacuum tube 220, in this example, the driving component 300 includes a lifting driver 310 and a support plate 320. One end of the support plate 320 supports the vacuum monitoring component 200, and the other end of the support plate 320 is connected to the output end of the lifting driver 310. Specifically, the support plate 320 is fixedly connected to the output end of the lifting driver 310. The fixed connection ensures the stability of the support plate 320 during lifting and lowering movements. The lifting driver 310 can be a cylinder from the prior art.

[0038] It should be noted that, in order to facilitate wafer baking, the hot plate 100 in this example also includes a heating element 120, a heat insulation layer 130, and a temperature sensor 140. Specifically, the heating element 120 and the heat insulation layer 130 are sequentially disposed below the heating section 110. The temperature sensor 140 is used to monitor the temperature of the heating element 120. The heating element 120 can be a mica heating sheet as used in the prior art, and the heat insulation layer 130 can be a ceramic material as used in the prior art. Using ceramic materials can reduce heat loss and improve heating efficiency. The temperature sensor 140 can monitor the temperature of the surface of the heating section 110 in real time to maintain temperature stability. It should be noted that the above-mentioned material limitations for the heating element 120 and the heat insulation layer 130 are conventional prior art in the field, and therefore will not be specifically described here.

[0039] In summary, the wafer baking apparatus of this invention, as described in one embodiment, has at least the following advantages compared to existing baking apparatuses:

[0040] In the wafer baking apparatus of this invention, the driving component 300 and the vacuum monitoring component 200, including the suction cup 210, vacuum tube 220, and pressure gauge 230, ensure that when the wafer is placed on the suction cup 210, a negative pressure is generated by the vacuum tube 220 and the suction cup 210, allowing the wafer to be vacuum-adsorbed onto the suction cup 210. Then, the driving component 300 drives the vacuum tube 220 and the heating plate 100 to descend, allowing the lower surface of the wafer to contact the heating part 110 surface of the heating plate 100. The wafer can be baked using the heating element 110. When impurities appear on the surface of the wafer, or when the wafer itself has dark cracks or fragments, the lower surface of the wafer cannot be tightly attached to the surface of the heating element 110. At this time, the negative pressure in the vacuum tube 220 will fluctuate. The pressure data in the vacuum tube 220 can be detected by the pressure gauge 230. When the pressure value fluctuates, the surface of the wafer has impurities or dark cracks or fragments, and the wafer can be left unbaked, thereby avoiding baking abnormalities.

[0041] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0042] The above embodiments only illustrate several implementation methods of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A baking apparatus for wafers, characterized in that, Includes a heating plate with a heating element, a vacuum monitoring assembly, and a drive component; The vacuum monitoring component includes at least one suction cup, at least one vacuum tube, and at least one pressure gauge. One end of the vacuum tube is located above the heating part and connected to the suction cup, and the other end of the vacuum tube is located below the heating part and connected to the driving component. The vacuum tube is used to provide negative pressure to the suction cup to vacuum adsorb the wafer onto the suction cup. The pressure gauge is used to monitor the pressure data inside the vacuum tube. The driving component is used to drive the vacuum tube and the heating plate to move up and down, so as to bring the wafer into contact with the heating part / away from the heating part.

2. The baking apparatus for wafers according to claim 1, characterized in that: The vacuum monitoring component is located in the central region of the heating section.

3. The baking apparatus for wafers according to claim 1, characterized in that: The vacuum monitoring component includes multiple suction cups, multiple vacuum tubes, and multiple pressure gauges; Each of the suction cups and each of the pressure gauges are respectively disposed on each of the vacuum tubes.

4. The baking apparatus for wafers according to claim 3, characterized in that: The multiple vacuum tubes are arranged circumferentially with the center of the heating section as the origin.

5. The baking apparatus for wafers according to claim 3, characterized in that: The hot plate is provided with multiple through holes, and each through hole is arranged opposite to each vacuum tube.

6. The baking apparatus for wafers according to claim 3, characterized in that: The vacuum monitoring component also includes multiple on / off switches, each of which is connected to each of the vacuum tubes to control the vacuum state inside the vacuum tubes.

7. The baking apparatus for wafers according to claim 1, characterized in that: The driving component includes a lifting driver and a support plate. One end of the support plate supports the vacuum monitoring component, and the other end of the support plate is connected to the output end of the lifting driver.

8. The baking apparatus for wafers according to claim 7, characterized in that: The support plate is fixedly connected to the output end of the lifting driver.

9. The baking apparatus for wafers according to claim 1, characterized in that: The hot plate also includes a heating element, a heat insulation layer, and a temperature sensor.

10. The baking apparatus for wafers according to claim 9, characterized in that: The heating element and the heat insulation layer are sequentially disposed below the heating part, wherein the temperature sensor is used to monitor the temperature of the heating element.

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