Wafer cleaning placement structure and cleaning tank

Abstract

The utility model discloses a wafer cleaning and placing structure and cleaning tank relates to semiconductor technical field. The wafer cleaning and placing structure disclosed by the utility model includes: multiple groups of placing components, and the interval arrangement along the circumferential direction of wafer, and each group of placing components includes at least two support rods, and the support rod located at both sides of wafer is used for with both sides edge of wafer is in close conformity, and the support rod located at both sides of wafer along the circumferential direction of wafer is arranged in the interval staggered. When wafer is placed in the wafer cleaning and placing structure provided by the utility model, the support rod at both sides of wafer is staggered arrangement, and the cleaning fluid of wafer edge will continue to flow down along the both sides of support rod, and will not be like the cleaning fluid in the prior art gathers in the guide groove, condenses between the edge of wafer and the inner wall of guide groove, and then in the drying process, the edge of wafer placed in the wafer cleaning and placing structure provided by the utility model can also carry out good drying, and the particle gathering process problem is solved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a wafer cleaning placement structure and cleaning tank. Background Technology

[0002] In the wafer cleaning process, during the cleaning process using batch cleaning equipment, a robotic arm places the wafers vertically into the cleaning tank. To maintain the upright position of the wafers in the cleaning tank, guide grooves are installed. When the wafers are inserted into the guide grooves, the edges of the wafers are in close contact with the inner wall of the guide grooves. As a result, cleaning fluid condenses between the edge of the wafer and the inner wall of the guide groove, leading to poor drying and particle aggregation defects at the wafer edges. Utility Model Content

[0003] The purpose of this invention is to provide a wafer cleaning placement structure and cleaning tank. The wafer cleaning placement structure provided by this invention is used to improve the quality of wafer drying and reduce particle aggregation.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] In a first aspect, this utility model provides a wafer cleaning and placement structure, comprising:

[0006] Multiple placement components are arranged at intervals along the circumference of the wafer. Each placement component includes at least two support rods located on both sides of the wafer. The support rods located on both sides of the wafer are used to fit against the edges of the wafer, and the support rods located on both sides of the wafer are arranged at intervals and staggered in the circumferential direction of the wafer.

[0007] Optionally, in the above-described wafer cleaning and placement structure, the support rod has an inclined surface on the side that is in contact with the wafer, the edge of the wafer abuts against the inclined surface, and the distance between the inclined surface and the wafer gradually increases along the direction extending towards the center of the wafer.

[0008] Optionally, in the above-described wafer cleaning and placement structure, the placement components are provided in three groups, with one group of placement components located between two groups at the bottom of the wafer.

[0009] Optionally, in the above-described wafer cleaning and placement structure, the placement assembly includes two of the support rods; or the placement assembly includes three of the support rods, wherein two of the support rods are located on the same side of the wafer, and the other is located on the other side of the wafer.

[0010] In use, the wafer cleaning and placement structure provided by this invention places the wafer on multiple placement components. These components are spaced apart along the circumference of the wafer, and each set of components includes at least two support rods. The support rods on both sides of the wafer are in contact with the wafer's edge, providing support and fixation. The support rods on both sides of the wafer are staggered along the circumference, forming a staggered arrangement, meaning there is no overlap. Therefore, when the wafer is placed in the wafer cleaning and placement structure provided by this invention, the staggered arrangement of the support rods on both sides allows the cleaning fluid at the wafer edge to continue flowing downwards along the sides of the support rods, unlike in existing technologies where the cleaning fluid accumulates in the guide groove and condenses between the wafer edge and the inner wall of the guide groove. Consequently, during the drying process, the edges of the wafer placed in the wafer cleaning and placement structure provided by this invention can also be effectively dried, solving the problem of particle aggregation.

[0011] Secondly, this utility model also provides a cleaning tank, including a wafer cleaning placement structure as described in any of the preceding claims, disposed within the cleaning tank. The cleaning tank provided by this utility model, having the aforementioned wafer cleaning placement structure, possesses all the technical effects of the aforementioned wafer cleaning placement structure, which will not be elaborated upon further herein. Attached Figure Description

[0012] The accompanying drawings, which are included to provide a further understanding of the present invention and constitute a part of this invention, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0013] Figure 1 This is a schematic diagram of the wafer cleaning and placement structure disclosed in an embodiment of the present utility model;

[0014] Figure 2 This is a schematic diagram of the inclined surface in the support rod disclosed in an embodiment of the present utility model.

[0015] Figure label:

[0016] 10 is the placement component, 11 is the support rod, and 20 is the wafer. Detailed Implementation

[0017] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0018] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0019] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified. "Several" means one or more, unless otherwise explicitly specified.

[0020] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0021] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0022] like Figure 1As shown in the figure, this utility model embodiment discloses a wafer cleaning placement structure including a placement component 10, wherein the placement component 10 is provided in multiple sets, and each set of placement components 10 is arranged at intervals along the circumferential direction of the wafer 20. The multiple sets of placement components 10 improve the stability of the wafer 20 after placement and prevent the wafer 20 from rolling in the placement component 10. Furthermore, the evenly distributed intervals of each set of placement components 10 make the wafer 20 receive uniform support force, improve the stability of the wafer 20, and prevent the wafer 20 from shaking during the cleaning process. Each placement assembly 10 includes at least two support rods 11. When the wafer 20 is placed into each placement assembly 10, support rods 11 on both sides of the wafer 20 are attached to the edges of the wafer 20. The support rods 11 on both sides of the wafer 20 clamp the wafer 20, thus supporting and fixing the wafer 20. The support rods 11 on both sides of the wafer 20 are staggered along the circumference of the wafer 20, so that the support rods 11 on both sides of the wafer 20 are staggered. Therefore, when the wafer 20 is placed in the wafer cleaning placement structure provided by this utility model, the cleaning liquid on the edge of the wafer 20 will continue to flow downward along both sides of the support rods, instead of accumulating in the guide groove as in the prior art, and condensing between the edge of the wafer 20 and the inner wall of the guide groove. As a result, during the drying process, the edge of the wafer 20 placed in the wafer cleaning placement structure provided by this utility model can also be dried well, solving the problem of particle agglomeration process.

[0023] like Figure 1 As shown, a slope is provided on the side of the support rod 11 that is in contact with the wafer 20. The slope extends towards the center of the placed wafer 20, and the distance between the slope and the wafer 20 gradually increases. After the wafer 20 is inserted into the placement assembly 10, the edge of the wafer 20 abuts against the support surface. The support surface not only reduces the contact area between the wafer 20 and the support rod 11, making it less likely for cleaning fluid to accumulate between the wafer 20 and the support rod 11, thus further improving the drying effect of the wafer 20, but also acts as a guide during the placement of the wafer 20. The wafer 20 slides smoothly between the two support rods 11 along the slope. At the same time, the slope increases the space between the support rod 11 and the wafer 20, which is conducive to air flow and improves drying efficiency and effect.

[0024] like Figure 1 As shown, the wafer cleaning and placement structure provided in this embodiment has three sets of placement components 10. The three sets of placement components 10 are evenly distributed along the circumferential direction of the wafer 20. One set of placement components 10 located between two sets is located at the bottom of the wafer 20, and the other two sets are symmetrically distributed on both sides. The stability of the wafer 20 placement is improved by the three sets of placement components 10, and the problem of the wafer 20 rolling after placement is avoided.

[0025] like Figure 1 As shown in the specific embodiment, each group of placement components 10 in the wafer cleaning placement structure provided in this example is provided with two support rods 11, that is, one support rod 11 is arranged on each side of the wafer 20, and the two support rods 11 in each group of placement components 10 are staggered with equal spacing, supporting the wafer 20 through the two support rods 11 in each group of placement components 10. Alternatively, each group of placement components 10 is provided with three support rods 11, of which two support rods 11 are located on the same side of the wafer 20, and the third is located on the other side of the wafer 20, and the three support rods 11 are arranged at intervals along the circumference of the wafer 20, that is, there is a gap between any two adjacent support rods 11 along the circumference of the wafer 20, and the three support rods 11 are staggered. Alternatively, those skilled in the art can increase the number of support rods 11 according to actual needs, which will not be elaborated here.

[0026] This utility model embodiment also discloses a cleaning tank, including a wafer cleaning placement structure. Since this cleaning tank has the aforementioned wafer cleaning placement structure, it possesses all the technical effects of the aforementioned wafer cleaning placement structure, which will not be elaborated upon here.

[0027] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0028] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A wafer cleaning and placement structure, characterized in that, include: Multiple placement components are arranged at intervals along the circumference of the wafer. Each placement component includes at least two support rods located on both sides of the wafer. The support rods located on both sides of the wafer are used to fit against the two side edges of the wafer, and the support rods located on both sides of the wafer are arranged at intervals and staggered in the circumferential direction of the wafer.

2. The wafer cleaning and placement structure according to claim 1, characterized in that, The support rod has an inclined surface on the side that is in contact with the wafer. The edge of the wafer abuts against the inclined surface. The distance between the inclined surface and the wafer gradually increases along the direction extending towards the center of the wafer.

3. The wafer cleaning and placement structure according to claim 1, characterized in that, The placement components are provided in three groups, with one group located between the two groups at the bottom of the wafer.

4. The wafer cleaning and placement structure according to any one of claims 1-3, characterized in that, The placement assembly includes two of the support rods; or the placement assembly includes three of the support rods, wherein two of the support rods are located on the same side of the wafer and the other is located on the other side of the wafer.

5. A cleaning tank, characterized in that, The cleaning tank is provided with a wafer cleaning placement structure as described in any one of claims 1-4.

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