Heat dissipation assembly, power module assembly, electronic equipment and vehicle

Abstract

The utility model relates to a heat dissipation assembly, a power module assembly, electronic equipment and a vehicle. The heat dissipation assembly comprises a substrate, and the bottom surface of the substrate is provided with a heat dissipation part; the substrate comprises a connecting part and two pre-bending parts, the connecting part is of a straight structure, the two pre-bending parts are arranged on the two opposite side edges of the connecting part and are obliquely arranged upwards in the direction away from the heat dissipation part, and the connecting part and the pre-bending parts are used for installing a power module assembly. Thus, the connecting part is of a non-pre-bent straight structure, and when the two pre-bent parts are pre-bent, the pre-bending force between the adjacent connecting part and pre-bent part can be reduced, so that the pre-bending of the whole substrate is more balanced, the warping amount of the assembled power module assembly is reduced, and the assembly yield of the power module assembly is improved.

Description

Technical Field

[0001] This disclosure relates to the field of heat dissipation technology for power module components, specifically to a heat dissipation component, a power module component, electronic equipment, and a vehicle. Background Technology

[0002] In related technologies, large-size plastic-encapsulated power modules (chips) are sintered or soldered to a finned heat sink substrate. In order to reduce the warpage of the assembled power module assembly, the heat sink substrate needs to be pre-bent with a larger arc. However, this will lead to poor fit between the power module and the heat sink substrate, resulting in a lower production yield of the power module assembly. Utility Model Content

[0003] The purpose of this disclosure is to provide a heat dissipation component, a power module component, an electronic device, and a vehicle, which can reduce the warpage of the power module component and improve the assembly yield, thereby at least partially solving the problems in the related art.

[0004] To overcome the problems existing in related technologies, a first aspect of this disclosure provides a heat dissipation assembly, comprising: a substrate, wherein a heat dissipation portion is disposed on the bottom surface of the substrate; the substrate includes a connecting portion and two pre-bent portions, the connecting portion having a straight structure, and the two pre-bent portions being respectively disposed on two opposite sides of the connecting portion and inclined upward in a direction away from the heat dissipation portion; the connecting portion and the pre-bent portions are used to mount a power module. Thus, by setting the connecting portion as a straight structure without pre-bending, the pre-bending force between adjacent connecting portions and pre-bent portions can be reduced during pre-bending of the two pre-bent portions, resulting in a more balanced pre-bending of the substrate as a whole, reducing the warpage of the power module assembly after assembly of the power module and the substrate, and improving the assembly yield of the power module assembly.

[0005] In some possible implementations, the pre-bent portion is a straight structure or an arc-shaped structure. This allows the shape of the upper surface of the pre-bent portion to be selected according to different installation requirements.

[0006] In some possible implementations, both pre-bent portions are arc-shaped structures; or both pre-bent portions are straight structures. This allows the shape of the upper surface of the pre-bent portions to be selected according to different installation requirements.

[0007] In some possible implementations, the two pre-bent portions are arranged symmetrically with respect to the central axis of the connecting portion. This symmetrical arrangement of the two pre-bent portions further balances the stress on the substrate and improves the stability of the heat dissipation assembly.

[0008] In some possible implementations, the pre-bent portion at the end furthest from the connecting portion has a pre-bending height H of 0.5h to 0.8h relative to the connecting portion, where h is a preset warpage height. This allows the pre-bending height of the pre-bent portion to be set within a reasonable range, avoiding excessive warpage in the assembled power module assembly and improving assembly yield.

[0009] In some possible implementations, the pre-bent portion is constructed as a straight structure; the included angle A between the pre-bent portion and the connecting portion is 1.25arcsin(0.4h / L) to 2arcsin(0.4h / L), where L is the length of the pre-bent portion and h is the preset warpage height. This allows the included angle of the pre-bent portion to be set within a reasonable range, avoiding excessive warpage in the assembled power module assembly and improving the assembly yield.

[0010] In some possible implementations, the substrate material includes copper, copper alloy, aluminum, aluminum alloy, aluminum-based silicon carbide, diamond copper, diamond aluminum, graphite copper, or graphite aluminum. Thus, the appropriate substrate material can be selected according to specific operating requirements. For example, to meet high power density requirements, the substrate can be a copper alloy, diamond copper, or aluminum-based silicon carbide; to balance performance and economy, the substrate can also be aluminum or an aluminum alloy.

[0011] In some possible implementations, the heat dissipation section includes a plurality of pins arranged on the bottom surface of the substrate. To improve the stability of the heat dissipation mechanism and increase heat dissipation efficiency, the heat dissipation section includes a plurality of pins, the arrangement of which enables rapid heat exchange between the substrate and the coolant, thereby improving heat dissipation efficiency.

[0012] In some possible implementations, the cross-sectional shape of the needle fin includes a circle, an ellipse, a teardrop shape, or a polygon. To adapt to different operating conditions, the cross-sectional shape of the needle fin can be selectively chosen; for example, the cross-section can be a circle, an ellipse, a teardrop shape, or a polygon.

[0013] In some possible implementations, the bottom surface of the substrate is provided with a protective coating. Thus, the protective coating reduces the corrosion of the substrate's bottom surface by the coolant, improving the service life and stability of the heat dissipation mechanism.

[0014] A second aspect of this disclosure provides a power module assembly, including the aforementioned heat dissipation assembly and a power module disposed on the heat dissipation assembly.

[0015] A third aspect of this disclosure provides an electronic device including the power module assembly described above.

[0016] This disclosure provides a fourth aspect of a vehicle that includes the aforementioned electronic equipment.

[0017] Through the above technical solution, the substrate includes a connecting part and two pre-bent parts disposed on both sides of the connecting part. The connecting part has a straight structure, and the two pre-bent parts are disposed on both sides of the connecting part and are inclined upward in the direction away from the heat dissipation part. Thus, by setting the connecting part as a straight structure without pre-bending, the pre-bending force between adjacent connecting parts and pre-bent parts can be reduced when the two pre-bent parts are pre-bent, so that the pre-bending of the substrate as a whole is more balanced, reducing the warpage of the power module assembly after the module assembly and the substrate are assembled, and improving the assembly yield of the power module assembly.

[0018] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0019] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings:

[0020] Figure 1 This is a schematic diagram of a heat dissipation component provided in an exemplary embodiment of this disclosure.

[0021] Figure 2 This is a schematic diagram showing the shape of a heat dissipation component before and after welding without pre-bending in related technologies.

[0022] Figure 3 This is a schematic diagram of a heat dissipation component in related technologies.

[0023] Explanation of reference numerals in the attached figures

[0024] 1-Substrate; 11-Heat dissipation part; 12-Connecting part; 13-Pre-bent part; 14-Pin fin. Detailed Implementation

[0025] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0026] In this disclosure, unless otherwise stated, directional terms such as "upper," "lower," "left," and "right" generally refer to the upper, lower, left, and right of the corresponding figures. When the following description refers to the figures, unless otherwise indicated, the same numbers in different figures denote the same or similar elements.

[0027] The inventors discovered that power module components for motor controllers typically use liquid cooling, transferring heat generated by the chip to the coolant via a finned heat sink to maintain the chip at a suitable operating temperature. For applications where large-size molded power modules are sintered or soldered to a finned heat sink, multiple power modules (chips) are usually mounted on the upper surface of the heat sink, for example... Figure 3 In a three-phase inverter full-bridge structure, corresponding chips are set in the U-phase, V-phase, and W-phase. Due to the difference in thermal expansion coefficients between the power module and the heat sink, the power module assembly (the assembly composed of the power module and the heat sink) will warp after cooling. In order to reduce the warping of the assembled power module assembly, the heat sink usually needs to be pre-bent. After the pre-bending treatment, the actual pre-bending amount of the V-phase of the heat sink is greater than that of the U-phase and W-phase. This makes the V-phase of the heat sink prone to defects such as welding voids. This will lead to poor fit between the power module and the heat sink, resulting in a decrease in the production yield of the power module assembly.

[0028] To solve the above technical problems, such as Figure 1 As shown, this disclosure provides a heat dissipation assembly, a substrate 1, and a heat dissipation part 11 disposed on the bottom surface of the substrate 1; the substrate 1 includes a connecting part 12 and two pre-bent parts 13, the connecting part 12 has a straight structure, and the two pre-bent parts 13 are respectively disposed on two opposite sides of the connecting part 12 and are inclined upward in the direction away from the heat dissipation part 11. The connecting part 12 and the pre-bent parts 13 are used to install a power module assembly.

[0029] Through the above technical solution, the substrate 1 includes a connecting portion 12 and two pre-bent portions 13 disposed on both sides of the connecting portion 12. The connecting portion 12 has a straight structure, and the two pre-bent portions 13 are disposed on both sides of the connecting portion 12 and are inclined upward in the direction away from the heat dissipation portion 11. The connecting portion 12 corresponds to the V phase, and the two pre-bent portions 13 correspond to the U phase and W phase located on both sides of the V phase. Thus, by setting the connecting portion 12 as a straight structure without pre-bending, when the two pre-bent portions 13 are pre-bent and inclined, the pre-bending of the three phases can be avoided because the pre-bending amount of the V phase is greater than that of the U phase and W phase. This achieves the overall pre-bending of the U phase, V phase, and W phase, so that when the U / V / W three phases are assembled with the corresponding power modules, the force on the three phases in the substrate 1 is more balanced, reducing the warpage of the assembled power module assembly and improving the assembly yield of the power module assembly.

[0030] Furthermore, a smaller warpage of substrate 1 improves the fit between substrate 1 and the sealing ring. Specifically, the heat dissipation portion 11 of substrate 1 needs to contact the coolant for heat exchange. A sealing groove and sealing ring are typically provided between the end face of the coolant tank and the bottom surface of substrate 1. The substrate 1 is pressed down to achieve a seal between it and the coolant tank. A smaller warpage of substrate 1 allows it to be pressed tightly against the sealing groove, achieving a water channel seal and preventing coolant leakage. It is understood that the coolant can be selected according to different cooling conditions. For example, the coolant can be a water-based coolant (ethylene glycol aqueous solution), a fluorinated coolant (3M fluorinated coolant, perfluoropolyether), or a mineral oil / silicone oil coolant.

[0031] In some possible implementations, the pre-bent portion 13 can be a straight structure or an arc-shaped structure. For example, to adapt to certain installation requirements, such as the need for high sealing between the substrate and the coolant tank, the pre-bent portion 13 can be specifically designed as an arc-shaped structure according to the installation environment requirements in both the U-phase and W-phase. The arc-shaped structure results in less warping after installation, allowing for a sealed connection between the substrate 1 and the sealing groove, preventing coolant leakage. Of course, for some applications with lower installation requirements, both pre-bent portions 13 can also be straight structures. The straight structure also facilitates processing and reduces the manufacturing difficulty of the substrate 1.

[0032] In some possible implementations, both pre-bent portions are arc-shaped structures; or both pre-bent portions are straight structures.

[0033] To ensure more uniform stress on the substrate 1, in some possible embodiments, the two pre-bent portions 13 are arranged symmetrically with respect to the central axis N of the connecting portion 12. For example... Figure 1 As shown, the central axis N is located at the center of the connecting part 12 and extends in the vertical direction. The pre-bending part 13 on the left and the pre-bending part 13 on the right are symmetrically arranged about the central axis N. Therefore, when the power module power required by the two pre-bending parts 13 is the same, the symmetrical arrangement of the two pre-bending parts 13 can make the overall stress of the substrate 1 more uniform after the substrate 1 is assembled with the power module, thereby reducing the warpage of the assembled power module assembly and improving the assembly yield of the power module assembly.

[0034] In some possible implementations, in order to ensure that the pre-bending height H of the pre-bent portion 13 is within a preset range and to avoid poor assembly due to excessive pre-bending, the pre-bending height H of the end of the pre-bent portion 13 away from the connecting portion 12 relative to the connecting portion 12 is 0.5h~0.8h, where h is a preset warping height. Figure 2 As shown, the preset warpage height h refers to the warpage height of the finished power module assembly after sintering or welding with a flat heat dissipation substrate and power module without pre-bending. Thus, by setting the pre-bending height H of the pre-bent portion 13 to 0.5h to 0.8h, the pre-bending height H of the pre-bent portion 13 can be controlled within a suitable range to improve the assembly yield of the power module assembly. It is understood that this disclosure does not impose a specific length limitation on the pre-bending height H of the pre-bent portion 13; it can be selected according to different operating conditions, as long as it meets the above-mentioned pre-bending height H = 0.5h to 0.8h, where h is the preset warpage height.

[0035] In other feasible embodiments, the pre-bent portion 13 is constructed as a straight structure. To ensure that the angle between the pre-bent portion 13 and the connecting portion 12 is within a preset range, the angle A between the pre-bent portion 13 and the connecting portion 12 is 1.25arcsin(0.4h / L) ~ 2arcsin(0.4h / L), where L is the length of the pre-bent portion and h is the preset warping height. For example... Figure 1 As shown, L is the length of one of the pre-bent sections 13. Figure 1 In this context, L represents the length of the pre-bent portion 13 on the left, and angle A is the acute angle between the connecting portion 12 and the pre-bent portion 13 on the left. This disclosure does not impose any restrictions on the specific angle A; it can be selected according to different working conditions, as long as it conforms to the above-mentioned A = 1.25arcsin(0.4h / L) ~ 2arcsin(0.4h / L).

[0036] In some possible implementations, to facilitate heat dissipation of substrate 1, the material of substrate 1 may include copper, copper alloy, aluminum, aluminum alloy, aluminum-based silicon carbide, diamond copper, diamond aluminum, graphite copper, or graphite aluminum. For example, to meet high power density operating conditions, the substrate may be a copper alloy, diamond copper, or aluminum-based silicon carbide; to balance performance and economy, substrate 1 may also be aluminum or aluminum alloy. Of course, in some possible implementations, the material combination of substrate 1 can be selected according to the specific operating conditions. For example, substrate 1 may also be a combination of two or more of the following: copper, aluminum, aluminum alloy, aluminum-based silicon carbide, diamond copper, diamond aluminum, graphite copper, and graphite aluminum.

[0037] The heat dissipation section 11 may include a plurality of pin fins 14 on the bottom surface of the substrate 1. The arrangement of the plurality of pin fins 14 enables the substrate 1 to quickly exchange heat with the coolant, thereby absorbing the heat generated by the power module. Of course, in order to further improve the heat dissipation capacity of the substrate 1, in some possible embodiments, the pin fins 14 of the heat dissipation section 11 may be arranged in an array.

[0038] Of course, in other feasible methods, multiple needle wings 14 can be integrally formed with the substrate 1. For example, the needle wings 14 can be integrally formed by die casting, precision casting, extrusion molding, forging, machining, or 3D printing. This integral forming design makes the needle wings 14 and the substrate 1 a single unit, reducing the number of welding layers, brazing layers, or bonding surfaces in a separate structure, eliminating thermal resistance between interfaces, and allowing heat to be transferred uninterruptedly from the substrate 1 to the needle wings 14, thus improving heat dissipation efficiency. To avoid differences in thermal expansion systems between different materials, the needle wings 14 need to be made of the same material as the substrate 1.

[0039] Of course, the integral molding of the pin 14 with the substrate 1 can also improve the overall strength of the heat dissipation component and avoid the risk of failure such as solder joint cracking and pin 14 falling off due to mechanical stress or thermal stress in the split structure.

[0040] The cross-sectional shape of the needle fin 14 can be circular, elliptical, teardrop-shaped, or polygonal. For example, the needle fin 14 can be circular. The flow field distribution of a circular cross-section is symmetrical, and local eddies or stagnant zones are less likely to be generated when the coolant flows around it. Especially in a densely arranged array of needle fins 14, the circular cross-section can avoid uneven flow distribution caused by asymmetry in shape, thereby improving heat transfer efficiency. Of course, the cross-section of the needle fin 14 can also be teardrop-shaped. Compared with a circular needle fin 14, a teardrop-shaped needle fin 14 can significantly reduce flow resistance. At the same time, the rounded blunt end of the teardrop shape generates a periodic Karman vortex street, which enhances fluid mixing, disrupts the thermal boundary layer, and improves heat transfer efficiency. Of course, in some possible embodiments, the cross-sectional shape of the needle fin 14 can also be two or more combinations of circular, elliptical, rhomboid, pentagonal, hexagonal, octagonal, teardrop-shaped, and triangular shapes.

[0041] To reduce corrosion of the substrate 1 upon contact with the coolant, a protective coating is provided on the bottom surface of the substrate 1 in some possible embodiments. The protective coating primarily prevents corrosion of the substrate and pin fins by the coolant. The specific protective coating can be selected based on the type of coolant. For example, when using a water-based coolant (ethylene glycol aqueous solution), a nickel-phosphorus plating can be used as the protective coating; when using a fluorinated coolant (3M fluorinated coolant, perfluoropolyether), a polyetheretherketone coating can be used; and when using a mineral oil / silicone oil coolant, a nano-ceramic coating or an organosilicon coating can be used.

[0042] A second aspect of this disclosure provides a power module assembly, including the aforementioned heat dissipation assembly and a power module assembly disposed on the heat dissipation assembly. This power module assembly incorporates all the beneficial effects of the aforementioned heat dissipation assembly, which will not be elaborated further here.

[0043] This disclosure provides a third aspect of an electronic device that includes the aforementioned power module assembly. This electronic device can be a new energy vehicle motor controller, a photovoltaic inverter, an industrial control inverter, or a high-voltage frequency converter. All the beneficial effects of this electronic device including the aforementioned power module assembly are not elaborated here.

[0044] This disclosure provides a vehicle that includes the aforementioned electronic equipment. It is understood that the vehicle can be a new energy vehicle or a hybrid vehicle, and the vehicle encompasses all the beneficial effects of the aforementioned electronic equipment, which will not be elaborated upon here.

[0045] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.

[0046] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0047] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. A heat dissipation component, characterized in that, include: A substrate, wherein a heat dissipation portion is provided on the bottom surface of the substrate; the substrate includes a connecting portion and two pre-bent portions, the connecting portion having a straight structure, and the two pre-bent portions being respectively provided on two opposite sides of the connecting portion and inclined in a direction away from the heat dissipation portion; the connecting portion and the pre-bent portions are used to mount a power module.

2. The heat dissipation assembly according to claim 1, characterized in that, The pre-bending section is constructed as a straight structure or an arc structure.

3. The heat dissipation assembly according to claim 2, characterized in that, Both of the aforementioned pre-bent sections are arc-shaped structures; or Both of the pre-bent sections are straight structures.

4. The heat dissipation assembly according to claim 1, characterized in that, The two pre-bent portions are arranged symmetrically with respect to the central axis of the connecting portion.

5. The heat dissipation assembly according to claim 1, characterized in that, The pre-bending height H of the end of the pre-bent portion away from the connecting portion relative to the connecting portion is 0.5h~0.8h, where h is the preset warping height.

6. The heat dissipation assembly according to claim 1, characterized in that, The pre-bent section has a straight structure; The included angle A between the pre-bent portion and the connecting portion is 1.25arcsin(0.4h / L)~2arcsin(0.4h / L), where L is the length of the pre-bent portion and h is the preset warping height.

7. The heat dissipation assembly according to claim 1, characterized in that, The substrate is made of copper, copper alloy, aluminum, aluminum alloy, aluminum-based silicon carbide, diamond copper, diamond aluminum, graphite copper, or graphite aluminum.

8. The heat dissipation assembly according to claim 1, characterized in that, The heat dissipation section includes multiple pin fins arranged on the bottom surface of the substrate.

9. The heat dissipation assembly according to claim 8, characterized in that, The cross-sectional shape of the needle fin includes circular, elliptical, teardrop-shaped, or polygonal.

10. The heat dissipation assembly according to any one of claims 1-9, characterized in that, The bottom surface of the substrate is provided with a protective coating.

11. A power module assembly, characterized in that, It includes the heat dissipation component as described in any one of claims 1-10 and the power module disposed on the heat dissipation component.

12. An electronic device, characterized in that, Includes the power module assembly as described in claim 11.

13. A vehicle, characterized in that, Includes the electronic device described in claim 12.

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