Radial phase change heat dissipation cold head

Abstract

The utility model relates to a radiation type phase change heat dissipation cold head, which comprises a heat dissipation bottom plate and a heat dissipation cover which are encircled to form a heat dissipation cavity, a liquid inlet and a liquid outlet which are respectively communicated with the heat dissipation cavity are formed in the heat dissipation cover; a heat dissipation enhancing structure is arranged on the side, located in the heat dissipation cavity, of the heat dissipation bottom plate and comprises a plurality of tiny structures extending from inside to outside in the radial direction, and a tiny channel is formed by the interval between any two adjacent tiny structures in the tiny structures. An inner core is further arranged in the heat dissipation cavity, a through hole penetrating through the inner core is formed in the middle of the inner core, one end of the through hole abuts against the liquid inlet, and the other end of the through hole abuts against the heat dissipation enhancing structure. Compared with the prior art, through the structural design of the heat dissipation bottom plate, the heat dissipation cover and the inner core and the design and assembly of the micro channel on the inner side of the heat dissipation bottom plate, the contact area of the heat dissipation cold head and the chip and the contact area of a working medium and the bottom plate are improved; and the heat exchange rate and the heat dissipation efficiency of the heat dissipation device and the working efficiency and the service life of the chip are improved.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, specifically to a radial phase change heat dissipation cold head. Background Technology

[0002] With the rapid development of microelectronics technology, chip integration is constantly increasing and chip size is shrinking. This has led to a significant increase in core heat generation and heat accumulation due to stacking, resulting in a sharp increase in heat flux density. Chip performance is highly sensitive to operating temperature, making thermal design increasingly important. To ensure the stable operation and lifespan of chips in various devices, heat dissipation technology plays a crucial role in chip development.

[0003] While existing technologies attempt to improve performance through fixed bifurcated flow channels or surface coatings, unidirectional flow channels lack adaptive adjustment capabilities. Complex bifurcated designs, due to insufficient manufacturing precision, result in flow dead zones at the fork tips. Furthermore, traditional surface treatment processes such as anodizing and chemical plating struggle to achieve uniform coverage within micron-level flow channels, and coating peeling and particle agglomeration further exacerbate the conflict between flow resistance and thermal resistance. In addition, the traditional stacked packaging design of microchannels increases device thickness by 30%, contradicting the trends of miniaturization and lightweight design. Utility Model Content

[0004] The purpose of this invention is to overcome at least one of the defects in the existing technology mentioned above and provide a radial phase change cooling head. The forked microchannels in this cooling head reconstruct the fluid path through a multi-level radial branching network. The secondary flow effect generated at the branching points can disrupt the thermal boundary layer, significantly improving heat transfer efficiency. Simultaneously, surface modification technology precisely controls the wettability and bubble dynamics of the phase change working fluid through gradient hydrophilic-hydrophobic treatment (combining a superhydrophilic substrate with a superhydrophobic top surface). Combined with laser-etched microgrooves or nanocomposite coatings (such as silicon nitride / silicon carbide), the effective heat dissipation area is increased and the interfacial thermal resistance is reduced. The integrated molding process of the porous medium and the flow channels compensates for the manufacturing defects of the complex structure. This two-tiered design of "macro-flow channel optimization - micro-interface enhancement" not only achieves adaptive fluid distribution and dynamic thermal resistance matching, but also provides a systematic solution for high heat flux density scenarios that combines efficient heat dissipation, rapid response, and process compatibility by suppressing local overheating and long-term performance degradation.

[0005] The objective of this utility model can be achieved through the following technical solutions:

[0006] A radial phase change heat dissipation cold head includes a heat dissipation base plate and a heat dissipation cover, which together form a heat dissipation chamber;

[0007] The heat dissipation cover is provided with an inlet and an outlet that are respectively connected to the heat dissipation chamber;

[0008] The heat dissipation base plate is provided with a heat dissipation enhancement structure on one side of the heat dissipation cavity, which includes multiple microstructures extending radially from the inside to the outside, and the interval between any two adjacent microstructures among the multiple microstructures constitutes a microchannel.

[0009] The heat dissipation chamber is also provided with an inner core, and the inner core has a through hole in the middle, one end of which abuts against the liquid inlet and the other end of which abuts against the heat dissipation enhancement structure.

[0010] Furthermore, the plurality of said microstructures are divided into multiple concentric ring arrays arranged from the inside out, and the outlet end of the microchannel in the inner layer is connected to the inlet end of at least two microchannels in the next layer.

[0011] Furthermore, the microchannels between each layer are connected sequentially, forming a multi-level radial network structure extending outward from the radial center. That is, the microchannels are a multi-level radial network structure extending from the central circular groove to the surrounding area. This multi-level radial network structure includes multiple layers of short microchannels connected sequentially. Specifically, the microchannels are a multi-level radial network structure, comprising multiple layers of short-range microchannels connected sequentially. The first layer of short-range microchannels surrounds the central circular groove 11. Each layer of short-range microchannels includes an upstream microchannel and a downstream microchannel. The downstream microchannel of the previous layer is interconnected with the upstream microchannel of the next layer. Preferably, the cross-sectional shape of the microchannel is a parallelogram.

[0012] Furthermore, the microstructure is a solid prism, a solid prism with a surface partially covered by a first porous medium layer, a solid prism with a surface completely covered by a first porous medium layer, a partially solid prism with a partially porous structure, or a prism with a completely porous structure.

[0013] The first porous medium has a pore size range of 0.1 μm to 800 μm and a porosity of 5% to 99%; the porous structure has a pore size range of 0.1 μm to 800 μm and a porosity of 5% to 99%.

[0014] Furthermore, the width of the microchannel is between 5 micrometers and 10 millimeters, and the height is between 5 micrometers and 10 millimeters.

[0015] Furthermore, the aforementioned microstructures are divided into multiple concentric ring arrays from the inside out, and the outlet end of the microchannel in the inner layer is connected to the inlet end of at least two microchannels in the next layer.

[0016] Furthermore, the heat dissipation base plate is located on one side of the heat dissipation cavity, and the surface of the microchannel is provided with a hydrophilic modification layer or a hydrophobic modification layer.

[0017] Furthermore, the heat dissipation base plate is covered with a second porous medium layer on the side near the heat dissipation cover. The thickness of the second porous medium layer is 0.01 to 10 mm, the porosity of the second porous medium is 5% to 99%, the pore size ranges from 0.1 μm to 800 μm, and the thickness at different positions or regions is adjusted differently according to design requirements.

[0018] Furthermore, the heat dissipation base plate and the heat dissipation cover are connected by threads or by welding;

[0019] When the heat dissipation base plate and the heat dissipation cover are connected by welding, the mating surfaces of the two are filled with solder, and a sealed connection is formed by brazing.

[0020] When the heat dissipation base plate and the heat dissipation cover are connected by threads, threaded holes and sealing grooves for placing sealing rings are evenly opened around the heat dissipation base plate and the heat dissipation cover. A sealing ring is provided between the heat dissipation base plate and the heat dissipation cover and placed in the sealing groove. The sealing ring is located inside the threaded hole. The sealing ring is pressed between the heat dissipation base plate and the heat dissipation cover by screwing a screw into the threaded hole to form a sealing structure.

[0021] Furthermore, the phase change cooling head also includes a first elbow joint and a second elbow joint, wherein the first elbow joint is threaded or welded to the liquid inlet, and the second elbow joint is threaded or welded to the liquid outlet.

[0022] Furthermore, the connection between the inner core and the heat sink cover is either welded or statically sealed.

[0023] Furthermore, the ends of the first elbow joint and the second elbow joint are one or more of the following: threaded structure, pagoda structure, or quick-release joint structure.

[0024] Furthermore, the inner core has an outwardly extending through-hole at one end near the heat dissipation cover, and the outer wall of the through-hole has a circumferentially provided protrusion. The through-hole extends into the liquid inlet, and the protrusion abuts against the inner wall of the heat dissipation cover.

[0025] This invention improves the contact area between the heat sink and the chip, as well as the contact area between the working fluid and the base plate, through structural design of the heat sink base plate, heat sink cover, and inner core, and the design and assembly of microchannels on the inner side of the heat sink base plate. This enhances the heat exchange rate and heat dissipation efficiency of the heat dissipation device, as well as the operating efficiency and lifespan of the chip. Compared with existing technologies, this invention has the following advantages:

[0026] (1) By combining the microchannels that expand from the central circular groove on the heat dissipation base plate to the edge of the chassis, the equivalent cross-sectional area of ​​the gas-liquid two-phase flow along the path is gradually increased, thereby adapting to the violent expansion of fluid volume caused by phase change under high heat flux density. This can effectively reduce the pressure drop loss caused by fluid phase change, reduce the power consumption of the heat dissipation head, and improve the stability of the heat dissipation head.

[0027] (2) Adding hydrophilic or hydrophobic treatment to the surface of the microchannel can greatly improve the heat exchange performance of the heat dissipation head;

[0028] (3) A multi-level radial network structure is used to construct a microchannel system. In this structure, a continuous multi-layer short-range forked microchannel structure is adopted, so that the dynamic behavior of bubbles merging and bursting near the nodes can interfere with the thermal boundary layer of the nearby microchannels and reduce the thickness of the thin liquid film, thereby increasing the wall heat transfer efficiency of the microchannel network. In addition, two kinds of node structure basic units are introduced in the multi-layer short-range forked microchannels, making the distribution of the microchannel network more dense and uniform than the existing fractal tree network, significantly increasing the specific surface area for heat transfer, effectively improving the cooling effect and helping to maintain the uniformity of chip temperature; the interconnection of short-range forked microchannels in the microchannel network can realize efficient heat and mass exchange between different microchannels, which helps to delay the occurrence of boiling flow instability.

[0029] (4) The components of this heat dissipation device are easy to process and assemble, making it easy to promote and apply. Attached Figure Description

[0030] Figure 1 A schematic diagram of the structure of the heat dissipation head provided by this utility model;

[0031] Figure 2 A cross-sectional view of the heat dissipation head provided by this utility model;

[0032] Figure 3 A schematic diagram of the structure of the heat dissipation base plate provided by this utility model;

[0033] Figure 4 One of the structural schematic diagrams of the heat dissipation cover provided by this utility model;

[0034] Figure 5 The second schematic diagram of the structure of the heat dissipation cover provided by this utility model;

[0035] Figure 6 One of the structural schematic diagrams of the inner core provided by this utility model;

[0036] Figure 7 The second schematic diagram of the inner core provided by this utility model;

[0037] Figure 8A schematic diagram of the microchannel network structure provided by this utility model;

[0038] Figure 9 One of the schematic diagrams of the first bend structure and the second bend structure of the heat dissipation cold head provided by this utility model;

[0039] Figure 10 Schematic diagram of the first bend structure and the second bend structure of the heat dissipation head provided by this utility model (Part 2);

[0040] Figure 11 Schematic diagram of the working fluid flow direction of the heat dissipation cold head in this utility model;

[0041] In the diagram: 1-Heat dissipation base plate; 2-Heat dissipation cover; 3-First bend joint; 4-Second bend joint; 5-Inner core; 11-Central circular groove; 12-Microstructure; 13-Microchannel; 21-Welding surface; 22-Flow chamber; 23-First through hole; 24-Second through hole; 25-Upper surface of heat dissipation cover; 51-Through hole; 52-Connecting surface; 53-Boss surface. Detailed Implementation

[0042] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. These embodiments are implemented based on the technical solution of the present invention, providing detailed implementation methods and specific operating procedures. However, the scope of protection of the present invention is not limited to the following embodiments.

[0043] This utility model provides a radial phase change heat dissipation cold head, including a heat dissipation base plate 1 and a heat dissipation cover 2, which together form a heat dissipation chamber;

[0044] The heat dissipation cover 2 is provided with an inlet and an outlet that are respectively connected to the heat dissipation chamber;

[0045] The heat dissipation base plate 1 has a heat dissipation enhancement structure on one side of the heat dissipation chamber, which includes a plurality of microstructures 12 extending radially from the inside to the outside. The interval between any two adjacent microstructures 12 constitutes a microchannel 13.

[0046] The heat dissipation chamber is also provided with an inner core 5. The inner core 5 has a through hole 51 in the middle, one end of which abuts against the liquid inlet and the other end of which abuts against the heat dissipation enhancement structure.

[0047] In some embodiments of this utility model, the plurality of microstructures 12 are divided into multiple concentric ring arrays from the inside out, and the outlet end of the microchannel 13 in the inner layer is connected to the inlet end of at least two microchannels 13 in the next layer.

[0048] In some embodiments of this utility model, the microchannels 13 between each layer are connected sequentially to form a multi-level radial network structure extending outward from the radiation center.

[0049] In some embodiments of this utility model, the microstructure 12 is a solid prism, a solid prism with a surface partially covered by a first porous medium layer, a solid prism with a surface completely covered by a first porous medium layer, a partially solid prism with a partially porous structure, or a prism with a completely porous structure.

[0050] In some embodiments of this invention, the width of the microchannel 13 is between 5 micrometers and 10 millimeters, and the height is between 5 micrometers and 10 millimeters.

[0051] In some embodiments of this utility model, the heat dissipation base plate 1 is located on one side of the heat dissipation cavity, and the surface of the microchannel 13 is provided with a hydrophilic modification layer or a hydrophobic modification layer.

[0052] In some embodiments of this utility model, the heat dissipation base plate 1 is covered with a second porous medium layer on the side near the heat dissipation cover 2, and the thickness of the second porous medium layer is 0.01 to 10 mm.

[0053] In some embodiments of this utility model, the heat dissipation base plate 1 and the heat dissipation cover 2 are connected by threads or by welding;

[0054] The phase change cooling head also includes a first bend connector 3 and a second bend connector 4. The first bend connector 3 is threaded or welded to the liquid inlet, and the second bend connector 4 is threaded or welded to the liquid outlet.

[0055] The connection between the inner core 5 and the heat sink 2 is either welded or statically sealed.

[0056] In some embodiments of this utility model, the ends of the first bend joint 3 and the second bend joint 4 are one or more of a threaded structure, a pagoda structure, or a quick-release joint structure.

[0057] In some embodiments of this utility model, the inner core 5 has an outwardly extending through-hole at one end near the heat dissipation cover 2, and the outer wall of the through-hole is provided with a protrusion 53. The through-hole extends into the liquid inlet, and the protrusion 53 abuts against the inner wall of the heat dissipation cover 2.

[0058] Example

[0059] This embodiment provides a radial phase-change cooling head, such as Figure 1-10As shown, a radial phase change heat dissipation cold head includes a heat dissipation base plate 1, a heat dissipation cover 2, a first bend joint 3, a second bend joint 4, and an inner core 5. The heat dissipation base plate 1 is installed on the lower part of the heat dissipation cover 2.

[0060] The inner core 5 is installed inside the heat sink cover 2;

[0061] The first bend connector 3 and the second bend connector 4 are installed on the upper part of the heat sink cover 2;

[0062] The inner core 5 is installed inside the heat sink 2, and during installation, the connecting surface 51 is ensured to overlap with the microstructure 12.

[0063] The heat dissipation cover includes a welding surface 21, a flow chamber 22, a first through hole 23, a second through hole 24, and an upper surface of the heat dissipation cover 2. The second through hole 24 is formed on a frustum.

[0064] The heat dissipation base plate includes a central circular groove 11, a microstructure 12, and a microchannel 13;

[0065] The inner core includes a through hole 51, a connecting surface 52, and a boss surface 53.

[0066] The first bend joint 3 is installed and connected to the first through hole 23. The inner core 5 is installed in the first through hole 32 and coincides with the welding surface 21 by its upper frustum boss surface 53 overlapping with the upper surface of the flow chamber 22.

[0067] The second bend joint 4 is installed in the second through hole 24 and is connected to the flow chamber 22 and overlaps with the welding surface 21; the microchannel 13 is a multi-level radial network structure from the central circular groove 11 to the surrounding area, and the multi-level radial network structure includes multiple layers of short microchannels connected in sequence.

[0068] like Figure 8 As shown, the microchannel 13 is specifically a multi-level radial network structure, which includes multiple layers of short-range microchannels 13 connected in sequence. The first layer of short-range microchannels 13 surrounds the central circular groove 11. Each layer of short-range microchannels 13 includes an upstream microchannel 13 and a downstream microchannel 13. The structures of each layer of short-range microchannels 13 are interconnected. The downstream microchannel 13 of the previous layer is the upstream microchannel 13 of the next layer.

[0069] In the multi-level radial network structure, the first layer of short-range microchannels 13 is constructed by connecting the first basic unit, the second layer of short-range microchannels 13 is constructed by connecting the second basic unit, and the remaining layers of short-range microchannels 13 are constructed by alternating connections of the first and second basic units.

[0070] The cross-sectional shape of the microchannel 13 is rectangular;

[0071] The microstructures formed between the microchannels 13 are solid structures, solid and porous media combined structures, or porous media structures.

[0072] The solid and porous media combined structure is in which the porous media is coated on the surface of the solid structure, and its surface coverage rate is 0 to 100%. The position and thickness of different coverage areas can be adjusted according to design needs.

[0073] The porous medium has a pore size range of 0.1 μm to 800 μm and a porosity of 5% to 99%.

[0074] The upper surface of the heat dissipation plate 1 can be covered with a porous medium layer. The thickness of the porous medium layer is 0.01 to 10 mm, the porosity of the porous medium is 5% to 99%, the pore size ranges from 0.1 μm to 800 μm, and the thickness at different locations or in different areas can be adjusted according to design requirements.

[0075] The width of the microchannel 13 is between 5 micrometers and 10 millimeters, and the height is between 5 micrometers and 10 millimeters;

[0076] The connection between the heat dissipation base plate 1 and the heat dissipation cover 2 is either threaded or welded.

[0077] Preferably, when the heat dissipation base plate 1 and the heat dissipation cover 2 are connected by welding, the mating surfaces of the two are filled with solder, and a sealed connection is formed by brazing.

[0078] Preferably, when the heat dissipation base plate 1 and the heat dissipation cover 2 are connected by threads, threaded holes and sealing grooves for placing sealing rings are evenly opened around the heat dissipation base plate 1 and the heat dissipation cover 2. A sealing ring is provided between the heat dissipation base plate 1 and the heat dissipation cover 2 and placed in the sealing groove. The sealing ring is located inside the threaded hole. The sealing ring is pressed between the heat dissipation base plate 1 and the heat dissipation cover 2 by screwing a screw into the threaded hole to form a sealing structure.

[0079] The connection between the first bend joint 3 and the heat sink 2, and between the inner core 5 and the heat sink 2, is either welding or threaded connection.

[0080] The connection between the second bend joint 4 and the heat sink 2 is either welded or threaded.

[0081] The connection between the inner core 5 and the heat sink 2 is either welded or statically sealed.

[0082] Preferably, when the connection between the inner core 5 and the heat sink 2 is welding, solder is provided between the boss surface 53 and the upper surface of the flow chamber 22;

[0083] Preferably, when the inner core 5 and the heat sink 2 are statically sealed, a gasket with the same size as the boss surface 53 on the inner core 5 is placed between the inner core 5 and the heat sink 2. A through hole with the same size as the through hole 51 is opened in the center of the gasket. The gasket is installed between the boss surface 53 and the upper surface of the flow chamber 22 to form a seal.

[0084] The connection between the inner core 5 and the heat dissipation base plate 1 is either welding or static sealing connection.

[0085] Preferably, when the connection between the inner core 5 and the heat dissipation base plate 1 is welding, the connection surface 52 and the microstructure 12 are provided with solder;

[0086] Preferably, when the inner core 5 and the heat dissipation base plate 1 are statically sealed, a gasket with the same size as the connecting surface 52 on the inner core 5 is placed between the inner core 5 and the heat dissipation base plate 1. A through hole with the same size as the through hole 51 is opened in the center of the gasket. The gasket is installed on the connecting surface 52 and the microstructure 12 to form a seal.

[0087] The heat dissipation base plate 1, the heat dissipation cover 2, and the inner core 5 are made of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, or silicon; they are manufactured using materials with high thermal conductivity and certain strength to ensure that the heat dissipation head has excellent heat exchange efficiency and good service life.

[0088] The cooling medium introduced into the heat dissipation cold head during use includes water, alcohols, ammonia, hydrocarbons, refrigerants, mineral oil, transformer oil, and fluorinated liquid;

[0089] The inner wall of the heat dissipation base plate 1 and the surface of the microchannels 13 can be configured with natural surfaces, hydrophilic modified layers, or hydrophobic modified layers according to design requirements. Hydrophilic / hydrophobic modification of the inner wall of the base plate and the surface of the microchannels 13 can further increase the boiling rate of the working fluid and improve heat removal efficiency. The choice of hydrophilic / hydrophobic modification is based on the heat flux density under specific operating conditions: hydrophobic modification has a better heat transfer effect under low heat flux density, while hydrophilic modification has a better heat transfer effect under high heat flux density. This is because, generally speaking, a hydrophilic surface yields a larger heat transfer coefficient under high heat flux density, while a hydrophobic surface yields a larger heat transfer coefficient under low heat flux density. Hydrophobic or hydrophilic modification can be achieved by loading appropriate materials onto the surface, or by using laser texturing to make the inner wall of the base plate hydrophilic or hydrophobic.

[0090] Preferably, the hydrophilic / hydrophobic modification method can be spin coating or electrodeposition of hydrophilic / hydrophobic coatings.

[0091] Preferably, the hydrophobic layer is made of trimethylsilane, polytetrafluoroethylene, or polydimethylsiloxane.

[0092] The first bend joint 3 and the second bend joint 4 are oriented in any direction perpendicular to the upper surface 25 of the heat sink cover.

[0093] The radial phase change heat dissipation cold head is characterized in that the ends of the first bend joint 3 and the second bend joint 4 are threaded, pagoda-shaped, quick-release joint, etc.

[0094] like Figure 10 As shown, the first bend joint 3 and the second bend joint 4 can also be the same structure.

[0095] like Figure 11 As shown, the heat dissipation base plate 1, heat dissipation cover 2, first bend connector 3, second bend connector 4, and inner core 5 together constitute the working fluid flow channel of the radial phase change heat dissipation head. Specifically, the cold working fluid enters the central circular groove 11 through the through hole of the inner core 5 via the first bend connector 3, and exchanges heat with the heat dissipation base plate 1 and the chip through the micro channel 13. The heat is transferred to the liquid working fluid through the heat dissipation base plate 1 and the micro channel 13, causing the liquid working fluid to change from a liquid phase to a gas phase. Subsequently, the gas-liquid mixed working fluid enters the outer wall of the inner core 5 and another chamber formed by the heat dissipation cover 2 and the inner core 5 through the central circular groove 11 and the micro channel 13, and finally exits the heat dissipation head through the second bend connector 4.

[0096] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from its technical solution shall still fall within the protection scope of this utility model.

Claims

1. A radial phase-change cooling head, characterized in that, It includes a heat dissipation base plate (1) and a heat dissipation cover (2), which together form a heat dissipation chamber; The heat dissipation cover (2) is provided with an inlet and an outlet that are respectively connected to the heat dissipation chamber; The heat dissipation base plate (1) is provided with a heat dissipation enhancement structure on one side of the heat dissipation chamber, which includes a plurality of microstructures (12) extending radially from the inside to the outside. The interval between any two adjacent microstructures (12) constitutes a microchannel (13). The heat dissipation chamber is also provided with an inner core (5), and the inner core (5) has a through hole (51) in the middle, one end of the through hole (51) abuts against the liquid inlet and the other end abuts against the heat dissipation enhancement structure.

2. The radial phase-change cooling head according to claim 1, characterized in that, The multiple microstructures (12) are arranged in a concentric ring array from the inside out, and the outlet end of the microchannel (13) in the inner layer is connected to the inlet end of at least two microchannels (13) in the next layer.

3. The radial phase change cooling head according to claim 2, characterized in that, The tiny channels (13) between each layer are connected in sequence to form a multi-level radial network structure extending outward from the radiation center.

4. A radial phase-change cooling head according to claim 2, characterized in that, The microstructure (12) is a solid prism, a solid prism whose surface is partially covered with a first porous medium layer, a solid prism whose surface is completely covered with a first porous medium layer, a partially solid prism with a partially porous structure, or a prism with a completely porous structure.

5. A radial phase-change cooling head according to claim 2, characterized in that, The width of the microchannel (13) is between 5 micrometers and 10 millimeters, and the height is between 5 micrometers and 10 millimeters.

6. A radial phase-change cooling head according to claim 2, characterized in that, The heat dissipation base plate (1) is located on one side of the heat dissipation chamber, and the surface of the microchannel (13) is provided with a hydrophilic or hydrophobic modified layer.

7. A radial phase-change cooling head according to claim 1, characterized in that, The heat dissipation base plate (1) is covered with a second porous medium layer on the side near the heat dissipation cover (2), and the thickness of the second porous medium layer is 0.01 to 10 mm.

8. A radial phase-change cooling head according to claim 1, characterized in that, The heat dissipation base plate (1) and the heat dissipation cover (2) are connected by threads or by welding; The phase change cooling head also includes a first bend connector (3) and a second bend connector (4). The first bend connector (3) is threaded or welded to the liquid inlet, and the second bend connector (4) is threaded or welded to the liquid outlet. The connection between the inner core (5) and the heat sink (2) is either welded or statically sealed.

9. A radial phase-change cooling head according to claim 1, characterized in that, The inner core (5) has an outwardly extending through-hole at one end near the heat dissipation cover (2). The outer wall of the through-hole is provided with a boss (53). The through-hole extends into the liquid inlet, and the boss (53) abuts against the inner wall of the heat dissipation cover (2).

Images