Heating disc assembly and cooking utensil

By using a layered structure of heat-conducting and heat-insulating components, the problem of scorching caused by uneven heating is solved, achieving the effect of uniform heating of the heating plate assembly surface and shortening cooking time.

CN224269095UActive Publication Date: 2026-05-26ZHEJIANG SHAOXING SUPOR DOMESTIC ELECTRICAL APPLIANCE CO LTD
0 Cites 0 Cited by

Patent Information

Application Number
CN202520751166.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Priority Date
2025-02-21
Filing Date
2025-04-18
Publication Date
2026-05-26
Estimated Expiration
2035-04-18

AI Technical Summary

Technical Problem

The existing heating plate assembly heats unevenly, resulting in a cold zone near the wiring terminal and a hot zone further away from the wiring terminal, causing the bottom to burn. Furthermore, existing technologies cannot effectively avoid the burning phenomenon by reducing power.

Method used

The device employs a layered structure of heat-conducting and heat-insulating components. The heat-conducting component has a groove at its hot end, and the heat-insulating component is located within the groove and between the hot end and the disk. The heat conductivity of the heat-insulating component is lower than that of the heat-conducting component. Through the cooperation of the heat-conducting and heat-insulating components, heat is evenly transferred, avoiding heat concentration.

Benefits of technology

It achieves uniform heating of the heating plate component surface, reducing or avoiding scorching, while not requiring a reduction in heating power and shortening cooking time.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The utility model discloses a heating disc assembly and a cooking utensil. The heating disc assembly comprises a disc body, a heat conduction piece, a heating piece and a heat insulation piece. The heating piece comprises a cold end and a hot end. The heating piece, the heat conduction piece and the plate body are stacked. The heat conduction piece is provided with a heat conduction piece groove corresponding to the hot end area. The heat insulation piece is located in the heat conduction piece groove and located between the hot end and the disc body in the thickness direction of the heating disc assembly. The thermal conductivity of the heat insulation piece is smaller than that of the heat conduction piece. Heat of the hot end is transmitted to the disc body through the heat insulation piece. Heat of the cold end is transmitted to the disc body through the heat conduction piece. In the heat transfer process, although the heating value of the hot end is larger than that of the cold end, the heat conductivity of the heat insulation piece is smaller than that of the heat conduction piece, and therefore the surface, making contact with food, of the heating disc assembly (such as the surface of the disc body) is heated evenly, and the bottom pasting phenomenon can be reduced or avoided.
Need to check novelty before this filing date? Find Prior Art