A solder paste brushing device for composite electrode grid processing

Abstract

This utility model discloses a solder paste brushing device for composite electrode grid processing, including a support and a mounting frame mounted on the support. A stencil with several through holes is mounted on the mounting frame. A gantry frame is positioned above the stencil. A translation drive mechanism is mounted on the mounting frame to drive the gantry frame to move back and forth along its length. A mounting plate is mounted on the gantry frame, and two sets of lifting cylinders are symmetrically arranged on the mounting plate. The two sets of lifting cylinders can operate independently, and each set of lifting cylinders has a scraper at its working end. A top plate is positioned below the stencil. A crossbeam is mounted on a support below the top plate, and a lifting cylinder is mounted on the crossbeam. The working end of the lifting cylinder is connected to the top plate. In summary, this utility model has the advantages of high working efficiency, good coating quality, and precise control of the coating amount.

Description

Technical Field

[0001] This utility model relates to the field of solder paste application technology, specifically to a solder paste application device for composite electrode grid processing. Background Technology

[0002] The electrode grid is a major component of a lead-acid battery, serving as the current-collecting framework of the electrodes. It conducts and collects current, ensuring uniform current distribution, and also supports the active material, acting as its carrier. The active material, coated onto the grid and cured and dried, becomes the electrode plate. The charging and discharging of a lead-acid battery is primarily accomplished by the grid. A mesh-type electrode grid includes tabs, a frame, and ribs within the frame forming a crisscrossing mesh structure. During charging, electricity is transferred from the outside to the tabs of the grid, then sequentially to the frame and ribs. The discharging sequence is exactly the reverse. The frame and ribs are typically made of composite wires braided from a core material coated with metal or a metal alloy. The core material provides support; zinc is commonly used as the metal, and zinc alloys are typically used. The metal or metal alloy provides conductivity.

[0003] During the fabrication process of the aforementioned composite electrode grid, shaping and assembly are carried out. After assembly, the corresponding connecting joints need to be fixed. During fixing, solder paste is first applied to the areas requiring soldering, using the adhesive properties of the solder paste for temporary fixation and preparation for subsequent soldering. Then, a reflow soldering machine is used for final soldering, heating the solder paste to its melting point to form an intermetallic compound. After cooling, the connection and fixation are achieved. However, the process of applying solder paste to the soldering areas has the following problems: First, it is mostly done manually, resulting in low efficiency, high labor intensity, and high costs; second, the application position is inaccurate, leading to poor application results; third, the amount of solder paste applied cannot be precisely controlled, and the application is uneven, affecting the subsequent soldering quality and causing solder paste waste. Therefore, the development of a high-efficiency, high-quality solder paste application device for composite electrode grid processing with precise control over the application amount is objectively necessary. Utility Model Content

[0004] The purpose of this invention is to provide a solder paste brushing device for composite electrode grid processing that has high working efficiency, good coating quality, and precise control over the coating amount.

[0005] The purpose of this utility model is achieved as follows: it includes a bracket and a mounting frame mounted on the bracket. A mesh plate is mounted on the mounting frame, and several through holes are machined on the mesh plate. A gantry frame is set above the mesh plate. A translation drive mechanism that drives the gantry frame to move back and forth along its length is mounted on the mounting frame. A mounting plate is set on the gantry frame, and two sets of lifting cylinders are symmetrically arranged on the mounting plate. The two sets of lifting cylinders can operate independently. A scraper is set at the working end of each set of lifting cylinders. A top plate is set below the mesh plate. A crossbeam is set on the bracket below the top plate. A lifting cylinder is mounted on the crossbeam, and the working end of the lifting cylinder is connected to the top plate.

[0006] Furthermore, the working end of the lifting cylinder is equipped with an installation strip, and the scraper is connected and fixed to the installation strip by bolts.

[0007] Furthermore, the mounting frame has a rectangular structure with grooves machined on both sides. The mesh plates are inserted into the grooves and then connected by bolts.

[0008] Furthermore, edge guards are provided around the edges of the mesh panel.

[0009] Furthermore, the top plate is rectangular, with limit grooves provided on three of its sides, and limit posts slidingly installed within the limit grooves.

[0010] Furthermore, the translation drive mechanism includes two drive components symmetrically arranged on the mounting frame. Each drive component includes two mounting blocks, and a screw is rotatably mounted between the two mounting blocks. One end of the screw is connected to a motor, and a translation block is provided on the screw. The two bottoms of the gantry frame are respectively connected to the two translation blocks.

[0011] Furthermore, a flexible anti-slip layer is provided on the upper surface of the top plate.

[0012] In operation, this invention first pours a certain amount of solder paste onto the stencil. The shaped and assembled composite electrode grid is then transported to the top plate below the stencil. After positioning, a lifting cylinder is activated, causing the top plate to move upwards. The top plate then moves the grid upwards, bringing the upper surface of the grid into contact with the lower surface of the stencil. This positions the gantry frame to the right of the mounting bracket, which serves as the starting point for coating. A lifting cylinder, located near the right side of the mounting bracket, is then activated. This cylinder moves the scraper at its working end downwards, bringing its lower end face into contact with the upper surface of the stencil. This drives a translation mechanism, which in turn moves the gantry frame and scraper to the left. During this movement, the scraper moves the solder paste along with the stencil, allowing the solder paste to pass through the through-holes. The solder paste is applied to the solder points on the composite electrode grid. When the scraper moves to the left side of the mounting bracket, it stops moving left and is moved upward by a lifting cylinder. Then, the lifting cylinder near the left side of the mounting bracket is activated, which moves the scraper at its working end downward so that the lower end of the scraper contacts the upper surface of the stencil. This drives the translation drive mechanism, which in turn moves the gantry frame and scraper to the right. Similarly, during the movement, the scraper moves the solder paste on the stencil along with it, allowing the solder paste to penetrate through the through-holes into the solder points on the composite electrode grid. When the gantry frame and scraper reach the starting position, the translation stops, and the scraper rises away from the stencil, completing the solder paste application to the solder points on the composite electrode grid. In this invention, the application of solder paste to the soldering points on the composite electrode grid is a fully automated assembly line operation, with a high degree of mechanization. This not only saves labor costs and achieves a high degree of standardization, but also completes the application of solder paste to all soldering points on the grid in one go, resulting in high work efficiency. Secondly, this invention precisely drills holes in the stencil to ensure accurate solder paste application and thus ensures the quality of subsequent soldering. Furthermore, the solder paste in this invention seeps into the soldering points of the grid through the through-holes in the stencil. The amount of solder paste applied is limited by the through-holes, allowing for precise control of the amount used and ensuring even application of the solder paste to the soldering points, thereby ensuring the quality of subsequent soldering and avoiding solder paste waste. In summary, this invention has the advantages of high work efficiency, good coating quality, and precise control of the coating amount. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0014] Figure 2 This is a top view of the structure of this utility model;

[0015] Figure 3 This is a top view of the top plate 9 in this utility model;

[0016] In the diagram: 1-Bracket, 2-Mounting frame, 3-Mesh plate, 4-Through hole, 5-Gantry frame, 6-Mounting plate, 7-Lifting cylinder, 8-Scraper, 9-Top plate, 10-Crossbeam, 11-Lifting cylinder, 12-Mounting strip, 13-Groove, 14-Side guard, 15-Limiting groove, 16-Limiting post, 17-Mounting block, 18-Screw, 19-Motor, 20-Transfer block, 21-Flexible anti-slip layer. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings, but this description is not intended to limit the present invention in any way. Any changes or improvements made based on the present invention shall fall within the protection scope of the present invention.

[0018] like Figures 1-3 As shown, this utility model includes a bracket 1 and a mounting frame 2 mounted on the bracket 1. A mesh plate 3 is mounted on the mounting frame 2, and several through holes 4 are machined on the mesh plate 3. A gantry frame 5 is mounted above the mesh plate 3. A translation drive mechanism that drives the gantry frame 5 to move back and forth along its length is mounted on the mounting frame 2. A mounting plate 6 is mounted on the gantry frame 5, and two sets of lifting cylinders 7 are symmetrically arranged on the mounting plate 6. The two sets of lifting cylinders 7 can operate independently. Each set of lifting cylinders 7 has a scraper 8 at its working end. A top plate 9 is mounted below the mesh plate 3. A crossbeam 10 is mounted on the bracket 1 below the top plate 9. A lifting cylinder 11 is mounted on the crossbeam 10, and the working end of the lifting cylinder 11 is connected to the top plate 9. Both the lifting cylinder 7 and the lifting cylinder 1 are existing technologies, and parameters such as stroke are selected as needed.

[0019] In operation, a certain amount of solder paste is first poured onto the stencil 3. The composite electrode grid, after being shaped and assembled, is then transported to the top plate 9 below the stencil 3. After positioning, the lifting cylinder 11 is activated, which moves the top plate 9 upward. The top plate 9 then moves the grid upward, causing the upper surface of the grid to adhere to the lower surface of the stencil 3. This positions the gantry frame 5 to the right side of the mounting frame 2, and this position is used as the starting point for coating. The lifting cylinder 7, located near the right side of the mounting frame 2, is then activated. The lifting cylinder 7 drives the scraper 8 at its working end to move downwards, so that the lower end face of the scraper 8 contacts the upper surface of the stencil 3. This drives the translation drive mechanism, which in turn drives the gantry frame 5 and the scraper 8 to move to the left. During the movement, the scraper 8 moves the solder paste on the stencil 3, allowing it to penetrate through the through-holes 4 into the soldering points of the composite electrode grid. When the scraper 8 reaches the left side of the mounting bracket 2, it stops moving to the left and then lifts the cylinder. The lowering cylinder 7 drives the scraper 8 upward, and then another lifting cylinder 7 near the left side of the mounting bracket 2 is activated. This lifting cylinder 7 drives the scraper 8 at its working end to move downward, so that the lower end face of the scraper 8 contacts the upper surface of the stencil 3, driving the translation drive mechanism. The translation drive mechanism drives the gantry frame 5 and the scraper 8 to translate in the opposite direction to the right. Similarly, during the movement, the scraper 8 moves the solder paste on the stencil 3 together with it, allowing the solder paste to seep into the soldering points of the composite electrode grid through the through hole 4. When the gantry frame 5 and the scraper 8 reach the starting position, the translation stops, and the scraper 8 rises away from the stencil 3. The two scrapers 8 are used alternately to scrape the solder paste twice to complete the solder paste application work on the soldering points of the composite electrode grid. The starting position can also be set on the left side of the mounting bracket 2, and the two scrapers 8 are used alternately to complete the two application processes. In actual use, the number of applications can be determined as needed.

[0020] In this invention, the application of solder paste to the soldering points on the composite electrode grid is carried out in a fully automated assembly line operation, with a high degree of mechanization. This not only saves labor costs and has a high degree of standardization, but also completes the application of solder paste to all soldering points on the grid in one go, resulting in high work efficiency. Secondly, this invention first precisely drills holes in the stencil 3 to ensure the accuracy of the solder paste application position, thereby ensuring the subsequent soldering quality. In addition, the solder paste in this invention seeps into the soldering points of the grid through the through holes 4 on the stencil 3. The amount of solder paste applied is limited by the through holes 4, which allows for precise control of the amount of solder paste used, while also ensuring that the solder paste is evenly applied to the soldering points, thereby ensuring the subsequent soldering quality and avoiding solder paste waste. The working end of the lifting cylinder 7 is equipped with a mounting strip 12. The scraper 8 is connected and fixed to the mounting strip 12 by bolts. The lifting cylinder 7 is an existing cylinder, and the end of its piston rod is the working end. The mounting strip 12 is set on its working end, and the scraper 8 is installed on the mounting strip 12 by bolts. The reason is as follows: The scraper 8 is long and narrow. The scraper 8 is used to scrape away the solder paste on the stencil 3. During long-term use, the contact area between the scraper 8 and the lifting cylinder 7 is small, and the scraper 8 may be deformed or even damaged. After the mounting strip 12 is set, the mounting strip 12 can support the scraper 8, prevent the scraper 8 from being deformed and damaged, and extend the service life of the scraper 8.

[0021] The mounting bracket 2 has a rectangular structure with grooves 13 machined on both sides. The mesh plate 3 is inserted into the grooves 13 and connected by bolts. The mounting bracket 2 and the mesh plate 3 are designed as a plug-in structure, and the bolts are used for tightening and loosening, which facilitates installation and removal, and also makes it easy to adjust the position of the mesh plate 3 on the mounting bracket 2. At the same time, when the structure of the composite electrode grid is changed, the mesh plate 3 can also be replaced accordingly.

[0022] The stencil 3 has a retaining edge 14 around its perimeter. In this invention, solder paste is first placed on the stencil 3, and then the solder paste is pushed on the stencil 3 by the scraper 8. When the solder paste reaches the through hole 4, it will enter the through hole 4 and then be applied to the soldering point of the composite electrode grid. In order to prevent the solder paste from flowing from the edge of the stencil 3, causing environmental pollution and waste of solder paste, a retaining edge 14 is provided on the edge of the stencil 3 to block it.

[0023] The top plate 9 is rectangular, and three of its sides are provided with limiting grooves 15. Limiting posts 16 are slidably arranged in the limiting grooves 15. When the composite electrode grid moves onto the top plate 9, the limiting posts 16 can be used to limit and position it. The positioning process is as follows: the limiting posts 16 are located on three sides of the top plate 9, with one side open, and the composite electrode grid can move into the top plate 9 from the open side, so that the three limiting posts 16 abut against the three sides of the composite electrode grid, thereby realizing the limitation and positioning of the composite electrode grid. This ensures that the position of the through hole 4 on the stencil 3 corresponds one-to-one with the solder point on the composite electrode grid, so that the solder paste can be accurately applied to the solder point on the composite electrode grid. The limiting structure in this utility model is an adjustable structure. The limiting post 16 can move within the limiting groove 15. The specific position is determined according to the size of the composite electrode grid. During actual installation, positioning structures such as bolts can be set on the limiting post 16. When the limiting post 16 moves to the required position, the positioning structure is used to position it to ensure the accuracy of the positioning of the composite electrode grid.

[0024] The translation drive mechanism includes two drive components symmetrically arranged on the mounting frame 2. Each drive component includes two mounting blocks 17, with a screw 18 rotatably mounted between the two mounting blocks 17. One end of the screw 18 is connected to a motor 19, and a translation block 20 is mounted on the screw 18. The bottoms of the two columns of the gantry frame 5 are respectively connected to the two translation blocks 20. During operation, the motors 19 of the two drive components operate synchronously to ensure that the gantry frame 5 can be translated stably. When the motor 19 drives the screw 18 to rotate, it drives the two translation blocks 20 to move synchronously, thereby driving the gantry frame 5 to translate, and finally driving the scraper 8 to translate, realizing the application of solder paste on the stencil 3.

[0025] The upper surface of the top plate 9 is provided with a flexible anti-slip layer 21. The top plate 9 is used to place the composite electrode grid and lift it up so that it is in close contact with the stencil 3. In order to prevent the composite electrode grid from shifting during the solder paste application process and affecting the solder paste application effect, a flexible anti-slip layer 21 is provided on the top plate 9. The flexible anti-slip layer 21 is existing technology and has a certain degree of flexibility and anti-slip ability. The composite electrode grid is placed on it to prevent the composite electrode grid from slipping. At the same time, due to its certain flexibility, when the composite electrode grid is lifted and attached to the stencil 3, it can play a certain buffering role to prevent the composite electrode grid from being deformed or even damaged by pressure.

Claims

1. A brush tin paste device for composite electrode plate grid processing, comprising a support (1) and a mounting frame (2) arranged on the support (1), characterized in that: The mounting frame (2) is equipped with a mesh plate (3), and the mesh plate (3) is machined with several through holes (4). A gantry frame (5) is set above the mesh plate (3). The mounting frame (2) is equipped with a translation drive mechanism that drives the gantry frame (5) to move back and forth along its length. The gantry frame (5) is equipped with a mounting plate (6). Two sets of lifting cylinders (7) are symmetrically arranged on the mounting plate (6). The two sets of lifting cylinders (7) can operate independently. Each set of lifting cylinders (7) is equipped with a scraper (8) at its working end. A top plate (9) is set below the mesh plate (3). A crossbeam (10) is set on the support (1) below the top plate (9). A lifting cylinder (11) is installed on the crossbeam (10). The working end of the lifting cylinder (11) is connected to the top plate (9).

2. The brush tin paste device for processing a composite electrode plate grid according to claim 1, characterized in that: The working end of the lifting cylinder (7) is provided with an installation strip (12), and the scraper (8) is connected and fixed to the installation strip (12) by bolts.

3. The brush tin paste device for processing a composite electrode plate grid according to claim 1, characterized in that: The mounting bracket (2) is a rectangular structure with grooves (13) machined on both sides. The mesh plate (3) is inserted into the grooves (13) and then connected by bolts.

4. The solder paste brushing device for composite electrode grid processing according to claim 1, characterized in that: The mesh plate (3) is provided with a retaining edge (14) around its perimeter.

5. The solder paste brushing device for composite electrode grid processing according to claim 1, characterized in that: The top plate (9) is rectangular, and three of its sides are provided with limiting grooves (15), and limiting posts (16) are slidably provided in the limiting grooves (15).

6. The solder paste brushing device for composite electrode grid processing according to claim 1, characterized in that: The translation drive mechanism includes two drive components symmetrically arranged on the mounting frame (2). Each drive component includes two mounting blocks (17). A screw (18) is rotatably mounted between the two mounting blocks (17). One end of the screw (18) is connected to a motor (19). A translation block (20) is provided on the screw (18). The bottom of the two columns of the portal frame (5) is connected to the two translation blocks (20) respectively.

7. The solder paste brushing device for composite electrode grid processing according to claim 1, characterized in that: The upper surface of the top plate (9) is provided with a flexible anti-slip layer (21).

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