Semiconductor test sorting machine

Abstract

The utility model discloses a semiconductor test sorting machine, which belongs to the field of semiconductor detection, and comprises a workbench, a support frame fixed on the top of the workbench, a detection mechanism arranged on the top of the support frame, and a clamping mechanism arranged on the workbench and comprising a mechanical arm fixed on the top of the workbench, a mounting shell is fixed to the output end of the mechanical arm, a suction cup is arranged in the mounting shell, an air pump is mounted at the top of the workbench, and the air suction end of the air pump communicates with the suction cup through a hose. Through the arrangement of the clamping mechanism, the air pump provides suction force for the suction cup through the hose, compared with a traditional mechanical arm for clamping, the suction cup can evenly adsorb the surface of a semiconductor material, damage to the semiconductor material due to uneven clamping force is avoided, semiconductors of various shapes can be stably clamped, and materials with smooth or irregular surfaces can be stably clamped. And the slipping risk in the clamping process is reduced, and the clamping stability is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing technology, and in particular to a semiconductor testing and sorting machine. Background Technology

[0002] In the field of semiconductor testing technology, semiconductor testing and sorting machines are key equipment to ensure the quality of semiconductor products. Their performance directly affects the efficiency and quality of semiconductor production. In the semiconductor manufacturing process, semiconductor materials need to go through many complex processes to finally be made into various chips and devices. In this process, the accurate handling and testing of semiconductor materials is crucial.

[0003] Traditional semiconductor testing and sorting machines often use robotic arms to grip semiconductor materials. While these arms rely on mechanical structures to perform the gripping action, semiconductor materials are often fragile, and some chips are tiny and have delicate structures. Due to the precision limitations of the mechanical components, it is difficult for the robotic arm to ensure that the gripping force is evenly distributed on the surface of the semiconductor material. If the gripping force is too large, it is easy to leave marks or pits on the surface of the semiconductor material, or even damage the internal structure of the material, which will change the electrical properties of the semiconductor and affect the product pass rate. In addition, when dealing with irregularly shaped and smooth semiconductor materials, the robotic arm is prone to unstable gripping and slippage, which may not only damage the material, but also interfere with subsequent testing processes, reducing testing efficiency and accuracy. Utility Model Content

[0004] The purpose of this invention is to solve the problem that in the existing technology, most of the gripping methods are robotic arms. The robotic arms rely on mechanical structures to perform gripping actions, which makes it difficult to ensure that the gripping force is evenly distributed on the surface of semiconductor materials. Once the gripping force is too large, it is easy to leave gripping marks, pits or even damage to the internal structure of the semiconductor material. Therefore, a semiconductor testing and sorting machine is proposed.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A semiconductor testing and sorting machine includes a worktable, a support frame fixed to the top of the worktable, a detection mechanism on the top of the support frame, a clamping mechanism on the worktable, a robotic arm fixed to the top of the worktable, a mounting shell fixed to the output end of the robotic arm, a suction cup inside the mounting shell, and an air pump mounted on the top of the worktable, the suction end of the air pump being connected to the suction cup via a hose.

[0007] Preferably, the clamping mechanism further includes an electric push rod two fixed to the top of the mounting housing, the bottom end of the extension rod of the electric push rod two is fixed with a rectangular plate, and the suction cup is fixed to the bottom of the rectangular plate.

[0008] Preferably, the testing mechanism includes a chip testing instrument fixed to the top of the workbench, an electric push rod is fixed to the top of the support frame, a fixed plate is fixed to the bottom of the extension rod of the electric push rod, a probe is fixed to the bottom of the fixed plate, and the chip testing instrument is electrically connected to the probe.

[0009] Preferably, the testing mechanism further includes a motor fixed to the workbench, with a turntable fixed to the output shaft end of the motor, and a rectangular shell fixed to the top of the turntable.

[0010] Preferably, the mounting shell is provided with a protective mechanism, which includes racks symmetrically fixed on a rectangular plate, gears meshing with the outer surface of the racks, a support block fixed on the mounting shell, a rotating rod fixed at the axis of the gears, the rotating rod being rotatably connected to the support block through a bearing, and a protective plate fixed on the outer surface of the rotating rod.

[0011] Preferably, the mounting housing has a sliding groove on its side, and the rack is slidably connected to the sliding groove.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] 1. Through the clamping mechanism, the air pump provides suction to the suction cup through the hose. Compared with traditional robotic grippers, the suction cup can evenly adsorb the surface of semiconductor materials, avoiding damage to semiconductor materials caused by uneven clamping force. It can firmly clamp semiconductors of various shapes, including materials with smooth or irregular surfaces, reducing the risk of slippage during the clamping process, improving clamping stability, and providing reliable material transfer guarantee for subsequent testing processes.

[0014] 2. Through the setting of the protective mechanism, the protective plate can protect the semiconductor during the clamping and handling process, preventing the semiconductor from falling during the movement and ensuring the integrity of the semiconductor material. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of a semiconductor testing and sorting machine proposed in this utility model;

[0016] Figure 2 This is a side view of the overall structure of a semiconductor testing and sorting machine proposed in this utility model;

[0017] Figure 3 This is a front view of the overall structure of a semiconductor testing and sorting machine proposed in this utility model;

[0018] Figure 4 This is a schematic diagram of the mounting shell structure of a semiconductor testing and sorting machine proposed in this utility model;

[0019] Figure 5 This utility model proposes a semiconductor testing and sorting machine. Figure 4 Enlarged view of the structure at point A in the middle;

[0020] Figure 6 This is a schematic diagram of the mounting shell structure of a semiconductor testing and sorting machine proposed in this utility model.

[0021] In the diagram: 1. Workbench; 2. Support frame; 31. Chip testing instrument; 32. Electric push rod one; 33. Fixed plate; 34. Probe; 35. Motor; 36. Turntable; 37. Rectangular shell; 41. Robotic arm; 42. Mounting shell; 43. Electric push rod two; 44. Rectangular plate; 45. Suction cup; 46. Air pump; 47. Hose; 51. Rack; 52. Gear; 53. Support block; 54. Rotating rod; 55. Protective plate; 56. Slide. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0023] Example 1

[0024] Reference Figures 1-6 A semiconductor testing and sorting machine includes a worktable 1, a support frame 2 fixed on the top of the worktable 1, a detection mechanism on the top of the support frame 2, and a clamping mechanism on the worktable 1. The clamping mechanism includes a robotic arm 41 fixed on the top of the worktable 1, a mounting shell 42 fixed to the output end of the robotic arm 41, a suction cup 45 inside the mounting shell 42, and an air pump 46 installed on the top of the worktable 1. The suction end of the air pump 46 is connected to the suction cup 45 through a hose 47.

[0025] Furthermore, the clamping mechanism also includes an electric push rod 43 fixed to the top of the mounting housing 42, and a rectangular plate 44 is fixed to the bottom end of the extension rod of the electric push rod 43, with a suction cup 45 fixed to the bottom of the rectangular plate 44.

[0026] Furthermore, the testing mechanism includes a chip testing instrument 31 fixed on the top of the workbench 1, an electric push rod 32 fixed on the top of the support frame 2, a fixed plate 33 fixed at the bottom of the extension rod of the electric push rod 32, a probe 34 fixed at the bottom of the fixed plate 33, and an electrical connection between the chip testing instrument 31 and the probe 34.

[0027] Furthermore, the testing mechanism also includes a motor 35 fixed on the workbench 1, a turntable 36 fixed to the output shaft end of the motor 35, and a rectangular shell 37 fixed to the top of the turntable 36.

[0028] The semiconductor to be tested is placed inside the rectangular shell 37. Simultaneously, the motor 35 on the top of the worktable 1 is started, and its output shaft drives the turntable 36 and the rectangular shell 37 to rotate, moving the semiconductor below the probe 34. The electric push rod 32 drives the fixed plate 33 to move down, detecting the position of the semiconductor to be tested. The chip testing instrument 31, through electrical connection with the probe 34, tests various performance parameters of the semiconductor, such as electrical and optical properties. The test data is transmitted to the chip testing instrument 31 in real time for analysis and processing to determine whether the semiconductor is qualified. Then, the motor 35 is restarted to rotate the semiconductor to the mechanical... At the gripping position of arm 41, under the command of the control system, the robotic arm 41 moves to the top of the semiconductor according to the preset path. At this time, the electric push rod 43 on the top of the mounting shell 42 is activated, and its extension rod drives the rectangular plate 44 and the suction cup 45 fixed at the bottom to move downward until the suction cup 45 is in close contact with the semiconductor surface. Then, the air pump 46 on the top of the worktable 1 is activated, and the air in the suction cup 45 is extracted through the hose 47 to form a negative pressure, thereby firmly adsorbing the semiconductor onto the suction cup 45. Then, the electric push rod 43 retracts, driving the rectangular plate 44 and the adsorbed semiconductor to move upward. The robotic arm 41 then transports the semiconductor to the sorting section.

[0029] Based on Example 1, Example 2:

[0030] Reference Figures 1-6 ,

[0031] Furthermore, a protective mechanism is provided on the mounting shell 42. The protective mechanism includes a rack 51 symmetrically fixed on a rectangular plate 44. A gear 52 is meshed with the outer surface of the rack 51. A support block 53 is also fixed on the mounting shell 42. A rotating rod 54 is fixed at the axis of the gear 52. The rotating rod 54 is rotatably connected to the support block 53 through a bearing. A protective plate 55 is fixed on the outer surface of the rotating rod 54.

[0032] Furthermore, a groove 56 is provided on the side of the mounting housing 42, and the rack 51 is slidably connected to the groove 56.

[0033] During the clamping mechanism's operation, when the electric push rod 43 lowers the rectangular plate 44, the symmetrically fixed racks 51 on the rectangular plate 44 slide downwards within the grooves 56 on the side of the mounting housing 42. Since the racks 51 are meshed with the gears 52, the downward movement of the racks 51 drives the gears 52 to rotate, causing the rotating rod 54 at the shaft of the gears 52 to rotate as well. This causes the protective plate 55 fixed to the outer surface of the rotating rod 54 to rotate and open, providing side protection for the semiconductors. When the clamping is complete, when the electric push rod 43 raises the rectangular plate 44, the racks 51 move upwards, the gears 52 rotate in the opposite direction, and the protective plate 55 rotates and closes, preventing the semiconductors from falling or being damaged by collisions during the handling process. Based on the detection results of the chip testing instrument 31, the robotic arm 41 transports qualified semiconductors to the qualified product storage area and unqualified semiconductors to the unqualified product storage area, completing the automated semiconductor sorting operation.

[0034] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A semiconductor testing and sorting machine, comprising a worktable (1), characterized in that, A support frame (2) is fixed on the top of the workbench (1). A detection mechanism is provided on the top of the support frame (2). A clamping mechanism is also provided on the workbench (1). The clamping mechanism includes a mechanical arm (41) fixed on the top of the workbench (1). A mounting shell (42) is fixed on the output end of the mechanical arm (41). A suction cup (45) is provided inside the mounting shell (42). An air pump (46) is installed on the top of the workbench (1). The suction end of the air pump (46) is connected to the suction cup (45) through a hose (47).

2. The semiconductor testing and sorting machine according to claim 1, characterized in that, The clamping mechanism also includes an electric push rod two (43) fixed to the top of the mounting shell (42), and a rectangular plate (44) is fixed to the bottom end of the extension rod of the electric push rod two (43), and the suction cup (45) is fixed to the bottom of the rectangular plate (44).

3. A semiconductor testing and sorting machine according to claim 1, characterized in that, The testing mechanism includes a chip testing instrument (31) fixed on the top of the workbench (1), an electric push rod (32) fixed on the top of the support frame (2), a fixed plate (33) fixed at the bottom of the extension rod of the electric push rod (32), a probe (34) fixed at the bottom of the fixed plate (33), and the chip testing instrument (31) and the probe (34) are electrically connected.

4. A semiconductor testing and sorting machine according to claim 1, characterized in that, The testing mechanism also includes a motor (35) fixed on the workbench (1), a turntable (36) fixed to the output shaft end of the motor (35), and a rectangular shell (37) fixed to the top of the turntable (36).

5. A semiconductor testing and sorting machine according to claim 2, characterized in that, The mounting housing (42) is provided with a protective mechanism, which includes a rack (51) symmetrically fixed on a rectangular plate (44). A gear (52) is meshed with the outer surface of the rack (51). A support block (53) is also fixed on the mounting housing (42). A rotating rod (54) is fixed at the axis of the gear (52). The rotating rod (54) is rotatably connected to the support block (53) through a bearing. A protective plate (55) is fixed on the outer surface of the rotating rod (54).

6. A semiconductor testing and sorting machine according to claim 5, characterized in that, The mounting housing (42) has a sliding groove (56) on its side, and the rack (51) is slidably connected to the sliding groove (56).

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