A stamping device for semiconductor component manufacturing
By designing a convenient limit block and spring structure, the lower mold can be easily disassembled and replaced, solving the problems of low mold changing efficiency and weak continuous production capacity of existing stamping devices used in semiconductor component production, thereby improving production efficiency and mold life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN JIZHAN HARDWARE ELECTRONIC TECH CO LTD
- Filing Date
- 2025-05-29
- Publication Date
- 2026-05-26
AI Technical Summary
The low die-changing efficiency and weak continuous production capacity of existing stamping equipment used in semiconductor component manufacturing result in high production costs and affect large-scale production.
A stamping device for semiconductor component manufacturing was designed. It adopts a limit block and spring structure to facilitate the disassembly and replacement of the lower die, and uses internal guide pillars and springs to buffer the impact force and improve the die life.
It simplifies the disassembly and replacement process of molds, improves production efficiency, reduces operation time, and extends the service life of molds.
Smart Images
Figure CN224272889U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor component processing technology, and in particular to a stamping device for semiconductor component production. Background Technology
[0002] Semiconductors are materials whose conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. In order to make semiconductor parts present the required shape, stamping is required to process semiconductor parts.
[0003] Traditional stamping equipment used in semiconductor component manufacturing has shortcomings in terms of continuous production and mold change speed. The slow mold change speed and cumbersome process often lead to long downtime, resulting in high production costs and affecting the demand for large-scale production. Utility Model Content
[0004] The technical problem to be solved by this utility model is that the existing technology has the disadvantages of low mold changing efficiency and weak continuous production capacity of stamping devices for semiconductor parts production. To this end, we propose a stamping device for semiconductor parts production.
[0005] To achieve the above objectives, this application adopts the following technical solution: a stamping device for semiconductor component production, comprising a base plate, with external guide pillars fixed at both ends of the top of the base plate, a top plate mounted on the surface of the external guide pillars, an mounting plate fixed at the bottom of the top plate, a hydraulic cylinder mounted on the top of the mounting plate, an upper die fixed at the output end of the hydraulic cylinder, a lower die base fixed at the top of the base plate, a buffer plate disposed inside the lower die base, a lower die mounted on the inner side of the buffer plate, connecting blocks fixed on both sides of the lower die, connecting shells fixed at both ends of the inner side of the buffer plate, a knob threadedly connected to the side wall of the connecting shell, a limit block fixed at one end of the knob located inside the connecting shell, two movable plates slidably connected inside the connecting shell, the two movable plates being located on both sides of the limit block, a locking block fixed at one end of the movable plate, and locking grooves matching the locking blocks being opened on both sides of the connecting block.
[0006] Preferably, a first spring is fixed on both sides inside the connecting shell, and the other end of the first spring is fixed to the moving plate.
[0007] Preferably, crossbars are fixed on both sides inside the connecting shell, and the surface of the movable plate is provided with through grooves that match the crossbars.
[0008] Preferably, the limiting block is elliptical in shape.
[0009] Preferably, an anti-slip pad is provided on the surface of one end of the knob, and the anti-slip pad is made of rubber.
[0010] Preferably, two inner guide pillars are fixed to the top of the base plate, and the two inner guide pillars are respectively located on both sides of the lower mold base. The two ends of the buffer plate are sleeved on the surface of the inner guide pillars, and a second spring is sleeved on the surface of the inner guide pillars. One end of the second spring is fixed to the base plate, and the other end of the second spring is fixed to the buffer plate.
[0011] Preferably, a limiting plate is fixed to the top of the inner guide post.
[0012] The technical effects and advantages of this utility model are as follows:
[0013] In this invention, by turning the knob, the limiting block is rotated, causing both ends of the limiting block to press against the moving plate. This causes the moving plate to disengage the locking block from the slot, thus releasing the connection between the connecting block and the connecting shell. This allows the user to easily disassemble and replace the lower mold. When reinstallation is required after replacement, the knob is turned in the opposite direction to move the limiting block away from the side of the moving plate. The rebound force of the first spring pushes the moving plate to insert the locking block into the slot, thereby re-fixing the mold. The operation is simple and convenient, reducing operation time and improving production efficiency.
[0014] In this invention, the structure of the inner guide post and the second spring can buffer the workpiece during the stamping process, absorb the stamping impact force, reduce mold deformation, and thus improve the service life of the mold. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the main structure of this utility model;
[0016] Figure 2 This is a partial structural schematic diagram of the present invention;
[0017] Figure 3 This is a schematic diagram of the lower mold structure of this utility model;
[0018] Figure 4 This is a schematic diagram of the internal structure of the connecting shell of this utility model.
[0019] Legend: 1. Base plate; 2. Outer guide post; 3. Top plate; 4. Mounting plate; 5. Hydraulic cylinder; 6. Upper mold; 7. Lower mold base; 8. Buffer plate; 9. Lower mold; 10. Connecting block; 11. Connecting shell; 12. Knob; 13. Limiting block; 14. Moving plate; 15. Locking block; 16. Locking groove; 17. First spring; 18. Crossbar; 19. Through groove; 20. Anti-slip pad; 21. Inner guide post; 22. Second spring; 23. Limiting plate. Detailed Implementation
[0020] The present invention will now be described in further detail with reference to the accompanying drawings and preferred embodiments. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.
[0021] Reference Figures 1-4 As shown, this utility model provides a technical solution: a stamping device for semiconductor component production, including a base plate 1, with outer guide pillars 2 fixed at both ends of the top of the base plate 1, a top plate 3 mounted on the surface of the outer guide pillars 2, a mounting plate 4 fixed at the bottom of the top plate 3, a hydraulic cylinder 5 mounted on the top of the mounting plate 4, an upper mold 6 fixed at the output end of the hydraulic cylinder 5, a lower mold base 7 fixed at the top of the base plate 1, a buffer plate 8 disposed inside the lower mold base 7, a lower mold 9 mounted on the inner side of the buffer plate 8, connecting blocks 10 fixed on both sides of the lower mold 9, connecting shells 11 fixed at both ends of the inner side of the buffer plate 8, a knob 12 threadedly connected to the side wall of the connecting shell 11, a limit block 13 fixed at one end of the knob 12 inside the connecting shell 11, and two movable plates 14 slidably connected inside the connecting shell 11, the two movable plates 14 being located on both sides of the limit block 13 respectively. One end of the 4 is fixed with a locking block 15. Both sides of the connecting block 10 are provided with locking slots 16 that match the locking block 15. Both sides of the inside of the connecting shell 11 are fixed with first springs 17. The other end of the first spring 17 is fixed to the moving plate 14. By turning the knob 12, the limiting block 13 is rotated, so that the two ends of the limiting block 13 are pressed against the moving plate 14, so that the moving plate 14 drives the locking block 15 to disengage from the inside of the locking slot 16. This releases the connection between the connecting block 10 and the connecting shell 11, making it convenient for the user to disassemble and replace the lower mold 9. When it needs to be reinstalled after replacement, the knob 12 is turned in the opposite direction to move the limiting block 13 away from the side of the moving plate 14. The rebound force of the first spring 17 pushes the moving plate 14 to drive the locking block 15 into the inside of the locking slot 16, thereby achieving re-fixation. The operation process is simple and convenient, reducing operation time and improving production efficiency.
[0022] Reference Figure 4 As shown in this embodiment: crossbars 18 are fixed on both sides inside the connecting shell 11, and through grooves 19 matching the crossbars 18 are opened on the surface of the moving plate 14. Through the structure of the crossbars 18 and through grooves 19, the movement trajectory of the moving plate 14 can be restricted to avoid the moving plate 14 from deviating and affecting the insertion effect of the card block 15 and the card slot 16.
[0023] Reference Figure 4 As shown in this embodiment, the limiting block 13 is elliptical in shape. The elliptical design reduces the contact area between the limiting block 13 and the moving plate 14, making the movement between the limiting block 13 and the moving plate 14 smoother and less strenuous.
[0024] Reference Figure 4 As shown in this embodiment: an anti-slip pad 20 is provided on the surface of one end of the knob 12. The anti-slip pad 20 is made of rubber material. The rubber material of the anti-slip pad 20 can further increase the firmness between the knob 12 and the connecting shell 11 and improve the fixing effect.
[0025] Reference Figure 3 As shown in this embodiment: two inner guide pillars 21 are fixed on the top of the base plate 1. The two inner guide pillars 21 are located on both sides of the lower die base 7. The two ends of the buffer plate 8 are sleeved on the surface of the inner guide pillars 21. A second spring 22 is sleeved on the surface of the inner guide pillars 21. One end of the second spring 22 is fixed to the base plate 1, and the other end of the second spring 22 is fixed to the buffer plate 8. Through the structure of the inner guide pillars 21 and the second spring 22, the workpiece can be buffered during the stamping process, absorbing the stamping impact force, reducing the deformation of the die, and thus improving the service life of the die.
[0026] Reference Figure 3 As shown in this embodiment: a limiting plate 23 is fixed to the top of the inner guide post 21. Through the structure of the limiting plate 23, the position of the buffer plate 8 can be limited to prevent the buffer plate 8 from falling off.
[0027] Working principle: By turning knob 12, the user rotates the limiting block 13, causing both ends of the limiting block 13 to press against the moving plate 14. This causes the moving plate 14 to disengage the locking block 15 from the slot 16, thus releasing the connection block 10 from the connecting shell 11. This facilitates the user's disassembly and replacement of the lower mold 9. When reinstallation is required after replacement, turning knob 12 in the opposite direction moves the limiting block 13 away from the side of the moving plate 14. The rebound force of the first spring 17 pushes the moving plate 14, causing the locking block 15 to insert into the slot 16, thereby re-fixing the mold. The operation is simple and convenient, reducing operation time and improving production efficiency. The structure of the crossbar 18 and the through slot 19 allows for better control of the moving plate 14. The movement trajectory is restricted to prevent the moving plate 14 from shifting and affecting the insertion effect of the card block 15 and the card slot 16. The elliptical design reduces the contact area between the limiting block 13 and the moving plate 14, making the movement between the limiting block 13 and the moving plate 14 smoother and less strenuous. The rubber material of the anti-slip pad 20 further increases the firmness between the knob 12 and the connecting shell 11, improving the fixing effect. The structure of the inner guide post 21 and the second spring 22 can buffer the workpiece during the stamping process, absorb the stamping impact force, reduce mold deformation, and thus improve the service life of the mold. The structure of the limiting plate 23 can limit the position of the buffer plate 8, preventing the buffer plate 8 from falling off.
[0028] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0029] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A stamping apparatus for manufacturing semiconductor parts, comprising a base plate (1), characterized in that: Both ends of the top of the base plate (1) are fixed with outer guide posts (2). A top plate (3) is installed on the surface of the outer guide posts (2). A mounting plate (4) is fixed at the bottom of the top plate (3). A hydraulic cylinder (5) is installed on the top of the mounting plate (4). An upper mold (6) is fixed at the output end of the hydraulic cylinder (5). A lower mold base (7) is fixed at the top of the base plate (1). A buffer plate (8) is provided inside the lower mold base (7). A lower mold (9) is installed on the inner side of the buffer plate (8). Connecting blocks (10) are fixed on both sides of the lower mold (9). Both ends of the inner side of the buffer plate (8) are fixed with connecting shells (11). The side wall of the connecting shell (11) is threaded with a knob (12). One end of the knob (12) inside the connecting shell (11) is fixed with a limit block (13). Two moving plates (14) are slidably connected inside the connecting shell (11). The two moving plates (14) are located on both sides of the limit block (13). One end of the moving plate (14) is fixed with a locking block (15). Both sides of the connecting block (10) are provided with locking grooves (16) that match the locking block (15).
2. The press device for producing a semiconductor part according to claim 1, characterized by: Both sides of the inside of the connecting shell (11) are fixed with a first spring (17), and the other end of the first spring (17) is fixed to the moving plate (14).
3. The press apparatus for producing a semiconductor part according to claim 1, characterized by: Both sides of the inside of the connecting shell (11) are fixed with crossbars (18), and the surface of the moving plate (14) is provided with through grooves (19) that match the crossbars (18).
4. The press apparatus for producing a semiconductor part according to Claim 1, wherein: The limiting block (13) is elliptical in shape.
5. The press apparatus for producing a semiconductor part according to claim 1, characterized by: The surface of one end of the knob (12) is covered with an anti-slip pad (20), which is made of rubber.
6. The press apparatus for producing a semiconductor part according to Claim 1, characterized by: Two inner guide pillars (21) are fixed on the top of the base plate (1). The two inner guide pillars (21) are located on both sides of the lower mold base (7). The two ends of the buffer plate (8) are sleeved on the surface of the inner guide pillars (21). A second spring (22) is sleeved on the surface of the inner guide pillars (21). One end of the second spring (22) is fixed to the base plate (1), and the other end of the second spring (22) is fixed to the buffer plate (8).
7. The press apparatus for producing a semiconductor part according to claim 6, wherein: A limit plate (23) is fixed to the top of the inner guide post (21).