A stationary carrier unit for selective wave soldering and a stationary carrier assembled therefrom.

Abstract

A fixing carrier unit for selective wave soldering and a fixing carrier assembled therefrom are disclosed, belonging to the technical field of soldering carriers in the electronics manufacturing industry. The unit includes a wave soldering substrate, an FPCA device mounted on the substrate, a connector inserted into the FPCA device, and a pressure block covering the FPCA device and connector. The pressure block includes a working surface in contact with the FPCA device and connector, and an upper surface opposite to the working surface. A cavity is formed on the working surface, the cavity having a through portion and a sealing portion. The through portion accommodates the protrusion of the connector, and a resilient pin is disposed on the pressure block of the sealing portion. This provides a novel selective wave soldering fixing carrier solution that uses the pressure block to limit the misalignment of the pins and FPC pads.

Description

Technical Field

[0001] This application belongs to the field of welding carrier technology in the electronics manufacturing industry, and specifically relates to a fixed carrier unit for selective wave soldering and a fixed carrier synthesized therefrom. Background Technology

[0002] After FPC is assembled using SMT technology, it forms FPCA components. The plug-in connectors in the components require selective wave soldering. Before soldering, the FPCA positioning connectors need to be fixed on the carrier board. Due to transmission vibration, equipment positioning vibration, and the external force of the selective solder wave, positioning abnormalities can easily occur, causing misalignment between the connector pins and the FPC pads.

[0003] Existing selective wave soldering mounting systems use an anodized aluminum plate with magnets to position the FPCA and set the connector. Then, a stainless steel sheet covers the FPCA around the connector. The steel sheet is held in place by the magnetic attraction of the magnets on the aluminum alloy carrier. However, because the connector body is only 6-12mm high, the steel sheet cannot cover the top of the connector to apply force for fixation; the connector must rely on its own weight for secure fixation.

[0004] In a laser welding carrier for a connecting wire published in CN207651781U, which belongs to the laser welding of electronic wires and connectors in the wire harness industry, the mother plate and pressure plate are movably connected by a hinge, and the connector fixing plate and wire harness fixing plate are detachably mounted on the mother plate. This carrier is relatively universal, but it cannot solve the problem of misalignment of PIN pins and FPC pads caused by external force during the welding process of large-size connectors. Utility Model Content

[0005] The purpose of this invention is to address the aforementioned problems by providing a novel selective wave soldering fixture solution that uses pressure blocks to limit the misalignment of PIN pins and FPC pads.

[0006] To achieve the above-mentioned technical objectives, the following technical solution is provided: Firstly, a fixed carrier unit for selective wave soldering is provided, including a wave soldering substrate, an FPCA device mounted on the wave soldering substrate, a connector inserted into the FPCA device, and a pressure block covering the FPCA device and the connector; the pressure block includes a working surface that contacts the FPCA device and the connector, and an upper surface located opposite the working surface; a cavity is formed on the working surface, the cavity having a through portion and a sealing portion, the through portion accommodating the protrusion of the connector, and a resilient pin provided on the pressure block of the sealing portion.

[0007] In feasible methods, the thickness of the briquette is 17.5mm-20mm.

[0008] In feasible implementations, the depth of the seal is 10mm-15mm.

[0009] In feasible implementations, the diameter of the flexible pin is 5mm-8mm; its pressure head spring force is between 100g-140g, and the downward pressure range is between 3mm-5mm.

[0010] In a second aspect, a fixture for selective wave soldering is provided, which is composed of at least three fixture units for selective wave soldering as described in the first aspect, wherein a magnetic connector is provided near one of the fixture units for precise engagement with the wave soldering substrate.

[0011] In one feasible approach, the magnetic connector is a high-temperature resistant strong magnetic block with a thickness of 10mm-17mm.

[0012] Compared with the prior art, the present invention has the following advantages:

[0013] The novel carrier unit of this application effectively avoids the problem of connector pin misalignment and improves welding quality. Its elastic pin is retractable, and the connector is evenly stressed during positioning, avoiding defects such as connector lifting. The entire carrier uses magnets to fix the pressure plate, simplifying the assembly and disassembly steps and increasing the production efficiency per panel by 10 seconds. Moreover, the pressure plate of this application is mainly designed for large-sized connector components that protrude more than 2mm above the FPCA plane. The connector is fixed to the FPCA by pressing down with the existing spring pin (GP5.0*19.0-G5.0, with a pressure of 100 N when pressed down 2mm) on the pressure block, ensuring the stability and accuracy of the welding process. Attached Figure Description

[0014] 1. Wave soldering substrate; 2. FPCA device; 3. Connector; 4. Clamping block; 5. Cavity; 6. Flexible pin; 41. Working surface; 42. Top surface; 43. Magnetic connector; 51. Through-hole; 52. Sealing part.

[0015] Figure 1 This is a schematic diagram of Embodiment 1;

[0016] Figure 2 This is a schematic diagram of Embodiment 2; Detailed Implementation

[0017] like Figure 1The first embodiment shown describes a fixed carrier unit for selective wave soldering, comprising a wave soldering substrate 1, an FPCA device 2 mounted on the wave soldering substrate 1, a connector 3 inserted into the FPCA device 2, and a pressure block 4 covering the FPCA device 2 and the connector 3. In this embodiment, the pressure block 4 includes a working surface 41 that contacts the FPCA device 2 and the connector 3, and an upper surface 42 located opposite to the working surface 41. A cavity 5 is formed on the working surface 41, the cavity 5 having a through portion 51 and a sealing portion 52. The through portion 51 accommodates the protrusion of the connector 3, and the pressure block 4 of the sealing portion 52 is provided with an elastic pin 6.

[0018] The parameters of each component are as follows: the thickness of the pressure block 4 is 17.5mm-20mm; preferably, the pressure block 4 is made of aluminum alloy with a thickness of 18.5mm. The depth of the sealing part 52 is 10mm-15mm; that is, the depth of the part of the cavity 5 that is not penetrated is preferably 12.7mm. The diameter of the elastic PIN 6 is 5mm-8mm; its pressure head elasticity is between 100g-140g, and the downward pressure amplitude is between 3mm-5mm; preferably, the diameter of the elastic PIN 6 is 5mm, the pressure head elasticity is 140g, and the downward pressure amplitude is 4mm.

[0019] like Figure 2 The illustrated embodiment two provides a fixed carrier for selective wave soldering, which is integrally synthesized from at least three fixed carrier units for selective wave soldering as described in embodiment one. Preferably, three fixed carrier units are integrally synthesized in this embodiment. A magnetic connector 43 is disposed near one of the fixed carrier units, and the magnetic connector 43 is used for precise mating with the wave soldering substrate 1. In this embodiment, the magnetic connector 43 is a high-temperature resistant strong magnetic block with a thickness of 17 mm; alternatively, it can be formed by stacking multiple 1 mm thick high-temperature resistant strong magnetic particles.

[0020] The entire mounting device is used by placing the FPCA device 2 onto the wave soldering substrate 1, and then placing the connector 3 at a specific position. The entire clamping block 4 is then attached to the wave soldering substrate 1 via the magnetic connector 43. The operator then uses the elastic pin 6 on the clamping block 4 to press down on the connector 3, thus securing it firmly to the FPCA device 2.

[0021] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing the technical solution of this patent and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this patent application.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this patent application, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0023] In this specification, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this specification according to the specific circumstances.

[0024] In this specification, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0025] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0026] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A fixed carrier unit for selective wave soldering, comprising a wave soldering substrate (1) on which an FPCA device (2) is mounted, Its features are, The FPCA device (2) is fitted with a connector (3), and the FPCA device (2) and the connector (3) are covered with pressure blocks (4); The pressure block (4) includes a working surface (41) that contacts the FPCA device (2) and the connector (3), and an upper surface (42) located opposite the working surface (41); A cavity (5) is provided on the working surface (41). The cavity (5) has a through part (51) and a sealing part (52). The through part (51) accommodates the protrusion of the connector (3). An elastic pin (6) is provided on the pressure block (4) of the sealing part (52).

2. The fixed carrier unit for selective wave soldering according to claim 1, characterized in that, The thickness of the pressure block (4) is 17.5mm-20mm.

3. The fixed carrier unit for selective wave soldering according to claim 1, characterized in that, The depth of the sealing part (52) is 10mm-15mm.

4. The fixed carrier unit for selective wave soldering according to claim 1, characterized in that, The diameter of the elastic PIN (6) is 5mm-8mm; its pressure head elasticity is between 100g-140g, and the downward pressure amplitude is between 3mm-5mm.

5. A fixed carrier for selective wave soldering, characterized in that, It is composed of at least three fixed carrier units for selective wave soldering according to any one of claims 1 to 4, wherein a magnetic connector (43) is provided near one of the fixed carrier units, the magnetic connector (43) being used to precisely mate with the wave soldering substrate (1).

6. The fixture for selective wave soldering according to claim 5, characterized in that, The magnetic connector (43) is a high-temperature resistant strong magnetic block with a thickness of 10mm-17mm.

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