Ceramic copper clad substrate plating dam structure

Abstract

This utility model provides an electroplated dam structure for a ceramic copper-clad substrate, including a ceramic substrate. A first dam is provided at the top of the ceramic substrate, a connecting plate is provided on one side of the first dam, and a second dam is provided on one side of the connecting plate. Compared with the prior art, this utility model has the following advantages: By placing the first dam on both sides of the connecting plate and then placing the second dam at the corner of the first dam, and using the insert plate and the insert hole, several first dams, connecting plates and second dams can form a sealed dam. By applying glue between the dam and the ceramic substrate to form an adhesive layer, the dam and the ceramic substrate can be connected together. Since the dam is spliced, its size can be flexibly adjusted according to actual needs, thereby effectively expanding the application range of the dam. The connecting plate, which is made of a material with good elasticity and temperature resistance, can absorb stress when the dam expands and contracts with heat, thereby preventing the dam from cracking.

Description

Technical Field

[0001] This utility model relates to an electroplating dam structure for a ceramic copper-clad substrate, belonging to the field of ceramic substrate production. Background Technology

[0002] AMB (Active Metal Brazing Ceramic Substrate) is developed based on DBC technology. It achieves bonding at high temperatures through a chemical reaction between the ceramic and active metal solder paste, resulting in higher bonding strength and better reliability. It is highly suitable for connectors or applications requiring high current carrying capacity and heat dissipation. A dam is a ring-shaped protective structure in precision electroplating processes. It is mainly used to isolate specific areas during electroplating to limit the flow of the plating solution, ensuring that metals (such as nickel and gold) are deposited only in the target area, preventing short circuits or plating overflow.

[0003] In the existing technology, since the common dam is a frame of fixed size, it is difficult to adjust its size according to actual needs, thus reducing the applicability of the dam. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a ceramic copper-clad substrate electroplated dam structure to solve the problem mentioned in the background technology that the common dam is a frame of fixed size, which makes it difficult to adjust its size according to actual needs, thereby reducing the applicability of the dam.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution: a ceramic copper-clad substrate electroplated dam structure, comprising a ceramic substrate, a first dam being provided at the top of the ceramic substrate, a connecting plate being provided on one side of the first dam, a second dam being provided on one side of the connecting plate, insertion holes being provided on both sides of the first dam and the second dam, insertion plates matching the insertion holes being fixedly connected to both sides of the connecting plate, and adhesive layers being provided between the first dam and the ceramic substrate, between the connecting plate and the ceramic substrate, and between the second dam and the ceramic substrate.

[0006] Furthermore, the height of the first dam is the same as the height of the second dam, the height of the insertion hole is less than the height of the first dam, and both the insertion hole and the insertion plate are "L" shaped.

[0007] Furthermore, the height of the connecting plate is the same as the height of the first dam, and the connecting plate is made of a material with good elasticity and temperature resistance.

[0008] Furthermore, a plurality of first positioning holes are formed on the surface of the ceramic substrate, a first positioning plate is fixedly connected to one side of the second dam, a second positioning plate is sleeved on the surface of the first positioning plate, a second positioning hole is formed on the surface of the second positioning plate, a locking bolt is inserted into both the first positioning hole and the second positioning hole, and a locking nut is sleeved on the surface of the locking bolt.

[0009] Furthermore, the first positioning plate is L-shaped, and the second positioning hole is T-shaped.

[0010] Furthermore, the first positioning hole is elongated, and the width of the first positioning hole is the same as the minimum width of the second positioning hole. The maximum diameter of the locking bolt and the diameter of the locking nut are both greater than the width of the first positioning hole.

[0011] The beneficial effects of this utility model are as follows: The first dam is placed on both sides of the connecting plate, and the second dam is placed at the corner of the first dam. With the help of the insert plate and the insert hole, several first dams, connecting plates and second dams can form a sealed dam. By applying glue between the dam and the ceramic substrate to form an adhesive layer, the dam and the ceramic substrate can be connected together. Since the dam is spliced, its size can be flexibly adjusted according to actual needs, thereby effectively expanding the application range of the dam. With the help of the connecting plate made of materials with good elasticity and temperature resistance, stress can be absorbed when the dam expands and contracts with heat, thereby preventing the dam from cracking.

[0012] The second positioning plate is fitted onto the surface of the first positioning plate, and with the locking bolt, the first positioning hole, the second positioning hole, and the locking nut, the dam can be pre-fixed to the top of the ceramic substrate, thereby preventing the dam from shifting during the bonding process with the ceramic substrate. Attached Figure Description

[0013] Other features, objects, and advantages of this invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0014] Figure 1 This is a schematic diagram of the overall structure of an electroplated dam structure for a ceramic copper-clad substrate according to this utility model.

[0015] Figure 2 This is a schematic diagram of the assembly structure of the first dam, the second dam, and the connecting block of the electroplated dam structure on a ceramic copper-clad substrate according to the present invention.

[0016] Figure 3 This is a schematic diagram of the second dam fixing structure of the electroplated dam structure on a ceramic copper-clad substrate according to the present invention.

[0017] In the figure: 1. Ceramic substrate; 2. First dam; 3. Connecting plate; 4. Second dam; 5. Insertion hole; 6. Insertion plate; 7. Adhesive layer; 8. First positioning hole; 9. First positioning plate; 10. Second positioning plate; 11. Second positioning hole; 12. Locking bolt; 13. Locking nut. Detailed Implementation

[0018] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0019] Please see Figures 1 to 2 This utility model provides a technical solution: a ceramic copper-clad substrate electroplated dam structure, including a ceramic substrate 1, a first dam 2 is provided at the top of the ceramic substrate 1, a connecting plate 3 is provided on one side of the first dam 2, a second dam 4 is provided on one side of the connecting plate 3, and insertion holes 5 are provided on both sides of the first dam 2 and the second dam 4. Insertion plates 6 matching the insertion holes 5 are fixedly connected to both sides of the connecting plate 3. Adhesive layers 7 are provided between the first dam 2 and the ceramic substrate 1, between the connecting plate 3 and the ceramic substrate 1, and between the second dam 4 and the ceramic substrate 1.

[0020] Place the first dam 2 on both sides of the connecting plate 3, and then place the second dam 4 at the corner of the first dam 2. With the help of the insert plate 6 and the insertion hole 5, several first dams 2, connecting plates 3 and second dams 4 can form a sealed dam. By applying glue between the dam and the ceramic substrate 1 to form an adhesive layer 7, the dam and the ceramic substrate 1 can be connected together. Since the dam is spliced, its size can be flexibly adjusted according to actual needs, thereby effectively expanding the application range of the dam. With the help of the connecting plate 3, which is made of a material with good elasticity and temperature resistance, it can absorb stress when the dam expands and contracts with heat, thereby preventing the dam from cracking.

[0021] Please see Figures 1 to 3 This utility model provides a technical solution: the height of the first cofferdam 2 is the same as the height of the second cofferdam 4, the height of the insertion hole 5 is less than the height of the first cofferdam 2, and both the insertion hole 5 and the insertion plate 6 are "L" shaped. After the cofferdam is assembled, the "L" shaped insertion plate 6 will be inserted into the insertion hole 5, thereby improving the firmness of the connection between the first cofferdam 2 and the connecting plate 3, and between the connecting plate 3 and the second cofferdam 4.

[0022] The height of the connecting plate 3 is the same as the height of the first cofferdam 2. The connecting plate 3 is made of a material with good elasticity and temperature resistance. The use of a material with good elasticity and temperature resistance in the connecting plate 3 allows it to absorb stress when the cofferdam expands and contracts with temperature changes, thereby preventing the cofferdam from cracking.

[0023] A plurality of first positioning holes 8 are formed on the surface of the ceramic substrate 1. A first positioning plate 9 is fixedly connected to one side of the second dam 4. A second positioning plate 10 is fitted onto the surface of the first positioning plate 9. A second positioning hole 11 is formed on the surface of the second positioning plate 10. Locking bolts 12 are inserted into both the first positioning holes 8 and the second positioning holes 11. Locking nuts 13 are fitted onto the surface of the locking bolts 12. By fitting the second positioning plate 10 onto the surface of the first positioning plate 9, and cooperating with the locking bolts 12, the first positioning holes 8, the second positioning holes 11, and the locking nuts 13, the dam can be pre-fixed to the top of the ceramic substrate 1, thereby preventing the dam from shifting during the bonding process with the ceramic substrate 1.

[0024] The first positioning plate 9 is L-shaped, and the second positioning hole 11 is T-shaped. After the second positioning plate 10 is placed on the surface of the first positioning plate 9, the second dam 4 can be fixed to the top of the ceramic substrate 1 by matching the L-shaped first positioning plate 9 and the T-shaped second positioning hole 11. Thus, the dam is fixed to the top of the ceramic substrate 1 before applying glue.

[0025] The first positioning hole 8 is elongated, and its width is the same as the minimum width of the second positioning hole 11. The maximum diameter of the locking bolt 12 and the diameter of the locking nut 13 are both greater than the width of the first positioning hole 8. This configuration allows for the limiting of the second dam 4 at different positions.

[0026] Detailed Implementation: Select an appropriate number of first dams 2, connecting plates 3, and second dams 4 according to the size of the area to be isolated. Place the two first dams 2 on either side of the connecting plate 3. During this process, the insert plates 6 fixed to both sides of the connecting plate 3 will be inserted into the insertion holes 5 on both sides of the first dams 2. Repeat the above steps to connect several first dams 2 together. Place the second dam 4 at the corner of the first dam 2. During this process, the insert plates 6 will be inserted into the insertion holes 5 on both sides of the second dam 4, thus connecting the first dam 2 and the second dam 4 together. Repeat the above steps until several first dams are connected. 2. The connecting plate 3 and the second dam 4 form a sealed dam. Then, the dam is placed on top of the area of ​​the ceramic substrate 1 that needs to be isolated. The dam is then connected to the ceramic substrate 1 by applying a high-temperature resistant and chemically resistant adhesive between the dam and the ceramic substrate 1 to form an adhesive layer 7. Since the first dam 2, the connecting plate 3 and the second dam 4 are spliced ​​together, the size of the dam can be flexibly adjusted according to actual needs, thereby effectively expanding the application range of the dam. The connecting plate 3, which is made of a material with good elasticity and temperature resistance (such as silicone), can absorb stress when the dam expands and contracts with heat, thereby preventing the dam from cracking.

[0027] Before applying adhesive between the dam and the ceramic substrate 1, the second positioning plate 10 is fitted onto the surface of the first positioning plate 9 fixed on one side of the second dam 4. Then, the locking bolt 12 is passed through the first positioning hole 8 on the surface of the ceramic substrate 1 and the second positioning hole 11 on the surface of the second positioning plate 10 in sequence. Finally, the locking nut 13 is fitted onto the surface of the locking bolt 12 and rotated until it and the locking bolt 12 are tightly pressed against the second positioning plate 10 and the ceramic substrate 1, respectively. This can pre-position the dam and prevent the dam from shifting during the bonding process with the ceramic substrate 1.

[0028] During production, the ceramic substrate 1 undergoes three improvement processes: grinding, copper plating, and polishing. Then, a precision circuit diagram is etched onto its surface. Finally, a silver film and a chip are attached to its surface and heated to cure them. These operations effectively eliminate the irregular and polycrystalline appearance of the copper foil surface, resulting in a smoother and denser copper foil surface. This effectively improves the bonding effect between the dam and the ceramic substrate 1.

[0029] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A ceramic copper-clad substrate electroplated dam structure, comprising a ceramic substrate (1), characterized in that: The ceramic substrate (1) has a first dam (2) at its top, a connecting plate (3) on one side of the first dam (2), and a second dam (4) on one side of the connecting plate (3). The first dam (2) and the second dam (4) have insertion holes (5) on both sides. The connecting plate (3) has a fixed plate (6) that matches the insertion hole (5) on both sides. An adhesive layer (7) is provided between the first dam (2) and the ceramic substrate (1), between the connecting plate (3) and the ceramic substrate (1), and between the second dam (4) and the ceramic substrate (1).

2. The electroplated dam structure for a ceramic copper-clad substrate according to claim 1, characterized in that: The height of the first dam (2) is the same as the height of the second dam (4), the height of the insertion hole (5) is less than the height of the first dam (2), and both the insertion hole (5) and the insertion plate (6) are "L" shaped.

3. The electroplated dam structure on a ceramic copper-clad substrate according to claim 1, characterized in that: The height of the connecting plate (3) is the same as the height of the first dam (2), and the connecting plate (3) is made of a material with good elasticity and temperature resistance.

4. The electroplating dam structure on a ceramic copper-clad substrate according to claim 1, characterized in that: The ceramic substrate (1) has several first positioning holes (8) on its surface. A first positioning plate (9) is fixedly connected to one side of the second dam (4). A second positioning plate (10) is sleeved on the surface of the first positioning plate (9). A second positioning hole (11) is opened on the surface of the second positioning plate (10). Locking bolts (12) are inserted into both the first positioning hole (8) and the second positioning hole (11). Locking nuts (13) are sleeved on the surface of the locking bolts (12).

5. The electroplating dam structure for a ceramic copper-clad substrate according to claim 4, characterized in that: The first positioning plate (9) is L-shaped, and the second positioning hole (11) is T-shaped.

6. The electroplating dam structure for a ceramic copper-clad substrate according to claim 4, characterized in that: The first positioning hole (8) is elongated, and the width of the first positioning hole (8) is the same as the minimum width of the second positioning hole (11). The maximum diameter of the locking bolt (12) and the diameter of the locking nut (13) are both greater than the width of the first positioning hole (8).

Images