Micro-hemisphere electrode and micro-hemisphere gyroscope

CN224285954UActive Publication Date: 2026-05-26HUNAN 208 ADVANCED TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HUNAN 208 ADVANCED TECH CO LTD
Filing Date
2025-08-08
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

Existing micro-hemispherical resonant gyroscopes suffer from problems such as inability to clean particulate contaminants after assembly, performance degradation due to uneven electrode gaps, and easy breakdown of high-voltage channels, which affect detection accuracy and stability.

Method used

The perforated micro-hemispherical electrode is used. By setting through holes and functional film layers on the electrode surface, the gap is controlled by the sacrificial layer to achieve efficient cleaning and mass production. The high-voltage electrode is isolated by the insulating film layer to avoid uneven electric field and dielectric breakdown.

Benefits of technology

This technology enables efficient cleaning and mass production of micro-hemispherical resonant gyroscopes, improves angular velocity detection accuracy and long-term stability, reduces the risk of dielectric breakdown, and ensures system safety.

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Abstract

This utility model discloses a micro-hemispherical electrode and a micro-hemispherical gyroscope, comprising a micro-hemispherical electrode substrate and a functional film layer disposed on the surface of the substrate. The substrate has multiple through holes. The functional film layer consists of a bottom high-voltage film layer and a first GND film layer, a middle insulating film layer, and a top electrode film layer and a second GND film layer. This solves the problem of parasitic capacitance coupling noise caused by the coplanarity of the high-voltage electrode and the electrode film layer. The insulating layer isolates the high voltage from sensitive signals. The micro-hemispherical electrode has an array-type leaky structure. By setting a sacrificial layer on its surface with a thickness consistent with the distance from the lip of the hemispherical resonant gyroscope to the electrode film layer, the gap can be effectively controlled. The leaky electrode can break the capillary force constraint and achieve efficient cleaning under submicron gap conditions, thereby solving the problems of bonding assembly gap control and post-assembly cleaning of micro-hemispherical resonant gyroscopes, making it suitable for mass production of micro-hemispherical resonant gyroscopes.
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