A testing device

Abstract

A testing device includes: a fixture frame, a first electrical connector, a first water-cooling connector, a test frame, a mounting structure, a water-cooling structure, a fan, and a power supply component. The fixture frame has a linearly extending groove. The first electrical connector and the first water-cooling connector are both mounted on the fixture frame and located at corresponding positions at one end of the groove. The test frame is slidably connected to the groove, with the other end of the groove inserted into it. The test frame has a mounting structure and a water-cooling structure for mounting a test board. The water-cooling structure is located at a corresponding position on the test board and has a second water-cooling connector located at a position corresponding to the first water-cooling connector, and is pluggable to the first water-cooling connector along the extension direction of the groove. After the test board is mounted on the mounting structure, the second electrical connector on the test board is located at a corresponding position to the first electrical connector and is pluggable to the first electrical connector along the extension direction of the groove. The fan and the power supply component are mounted on the fixture frame.

Description

Technical Field

[0001] This utility model relates to the field of electrical equipment technology, and in particular to a testing device. Background Technology

[0002] When testing single-board test fixtures, different single boards have varying sizes and specifications, requiring the design of a dedicated fixture for each board's dimensions and specifications. Furthermore, different single boards have different heat dissipation requirements, necessitating the inclusion of air-cooling, water-cooling, or both, within the test fixture to improve heat dissipation performance. This prevents the use of interchangeable fixtures for different single boards, increasing the cost of the testing equipment. Moreover, the lack of fixture interoperability leads to idle fixtures after each test, further increasing costs and wasting resources. Therefore, there is an urgent need for a testing device that can accommodate test boards of different sizes and specifications, supporting both air-cooling and water-cooling methods to meet diverse heat dissipation needs, thereby improving equipment versatility and reducing costs. Utility Model Content

[0003] In view of the above-mentioned problems of the prior art, this application provides a testing device that can be adapted to test boards of different sizes and specifications, meet the different heat dissipation requirements of the test boards, thereby improving the versatility of the device and reducing costs.

[0004] To achieve the above objectives, a first aspect of this application provides a testing device, comprising: a tooling frame having a sliding groove extending in a straight line; a first electrical connector mounted on the tooling frame at a position corresponding to one end of the sliding groove; a first water-cooling connector mounted on the tooling frame at a position corresponding to one end of the sliding groove; and a testing frame slidably connected to the sliding groove, with the other end of the testing frame inserted into the sliding groove; the testing frame having an installation structure and a water-cooling structure, the installation structure being used to install the testing device. The test board has a water-cooling structure located at a corresponding position on the test board. The water-cooling structure has a second water-cooling connector, which is positioned corresponding to the first water-cooling connector and is plugged into and disconnected from the first water-cooling connector along the extension direction of the slide groove. After the test board is mounted on the mounting structure, a second electrical connector on the test board is positioned corresponding to the first electrical connector and is plugged into and disconnected from the first electrical connector along the extension direction of the slide groove. A fan is mounted on the tooling frame. A power supply assembly is mounted on the tooling frame and is electrically connected to the fan and the test board.

[0005] Therefore, this application, by setting up a test frame and mounting the test board on the test frame, allows for adaptation to test boards of different sizes and specifications simply by replacing the test frame or modifying the mounting structure. This reduces the design complexity of the test equipment, improves its versatility, and lowers its cost.

[0006] Furthermore, this application incorporates a water-cooling structure on the test frame. After the test frame is inserted into the slide groove, the second water-cooling connector of the water-cooling structure connects to the first water-cooling connector, allowing cooling water to enter the water-cooling structure through the first and second water-cooling connectors to cool the test board on the test frame. This application also includes a fan on the mounting frame for air cooling of the test board. Therefore, the testing equipment in this application can cool the test board individually using a fan and the water-cooling structure, or simultaneously using both, depending on the board's heat dissipation requirements. This allows for the integration of both air and water cooling methods to meet the diverse heat dissipation needs of different test boards. This improves the equipment's versatility and reduces costs.

[0007] As one possible implementation of the first aspect, the water-cooling structure is detachably connected to the test frame.

[0008] As described above, by making the water-cooling structure detachably connected to the test frame, the water-cooling structure can be installed on the test frame when water cooling of the test board is required, and can be removed from the test frame when water cooling of the test board is not required. This improves the flexibility of the testing equipment.

[0009] As one possible implementation of the first aspect, the test equipment further includes a PIB board and a backplate, the PIB board and the backplate being detachably mounted on the tooling frame, the power supply component being electrically connected to the backplate, and a plurality of first electrical connectors being provided, with a portion of the first electrical connectors mounted on the PIB board and another portion of the first electrical connectors mounted on the backplate.

[0010] As one possible implementation of the first aspect, the first water-cooling connector and / or the second water-cooling connector are provided with a self-sealing structure. When the first water-cooling connector is connected to the second water-cooling connector, the self-sealing structure opens to allow the first water-cooling connector to communicate with the second water-cooling connector. When the first water-cooling connector is disconnected from the second water-cooling connector, the self-sealing structure closes the first water-cooling connector and / or the second water-cooling connector.

[0011] Therefore, by setting a self-sealing structure in the first water-cooling connector and the second water-cooling connector, the first water-cooling connector and the second water-cooling connector can be sealed by the self-sealing structure after the first water-cooling connector and the second water-cooling connector are disconnected, so as to prevent the cooling water from flowing out of the first water-cooling connector and the second water-cooling connector and causing damage to other components in the test equipment.

[0012] As one possible implementation of the first aspect, it also includes an air guide plate, which is mounted on the tooling frame and located at the position corresponding to the fan.

[0013] As shown above, by setting an air guide plate at the corresponding position of the fan, the cooling air blown out by the fan can be guided, thereby improving the air cooling effect on the test board.

[0014] As one possible implementation of the first aspect, the air guide plate is hinged to the tooling frame.

[0015] As described above, by hinged to the tooling frame, the angle of the air guide plate can be adjusted, thereby regulating the direction of the cooling airflow. This allows for adjustment of the cooling airflow when the heat-generating location or heat dissipation requirements on the test board change after replacement, enabling the testing equipment to adapt to test boards of different specifications and heat dissipation needs. This improves the compatibility and versatility of the testing equipment.

[0016] As one possible implementation of the first aspect, the air guide plate is provided with an adjustment port, the adjustment port is arc-shaped, and the center of the adjustment port coincides with the axis of the air guide plate hinged on the tooling frame; the tooling frame is provided with a limit hole, the limit hole is located at the corresponding position of the adjustment port, and a bolt passes through the limit hole and the adjustment port to make the limit hole and the adjustment port securely connected.

[0017] As described above, the tilt angle of the air guide plate can be limited by adjusting the fit between the port and the bolt, ensuring that the tilt angle is within a suitable range for heat dissipation of the test plate on the test frame. Furthermore, the adjustment port and the limiting port can be securely connected using bolts, thereby improving the stability and robustness of the air guide plate.

[0018] As one possible implementation of the first aspect, when the bolt abuts against one end of the adjustment port, the air guide plate is tilted toward the test frame, and the angle between the air guide plate and the plane where the test plate is located is within 23°-27°; when the bolt abuts against the other end of the adjustment port, the air guide plate is tilted away from the test frame, and the angle between the air guide plate and the plane where the test plate is located is within 8°-12°.

[0019] The above provides the range of tilt angles for the air guide plate, which allows the tilt angle of the air guide plate to be within a suitable range for heat dissipation of the test board on the test frame, thereby improving the heat dissipation effect on the test board.

[0020] As one possible implementation of the first aspect, the straight line between the center of the adjustment port and the center of the limiting hole is parallel to the plane on which the test plate is located.

[0021] As described above, by aligning the straight line between the center of the adjustment port and the center of the limiting hole with the plane of the test plate, the positions of the adjustment port and the limiting hole can be easily set. This reduces the design complexity of the testing equipment.

[0022] As one possible implementation of the first aspect, the testing equipment further includes a locking handle, which is mounted on the testing frame. After the testing frame is inserted into the slide groove, the locking handle engages with the tooling frame to prevent the testing frame from sliding out of the slide groove.

[0023] As described above, after the test frame is inserted into the slide, it can be secured by locking the handle. This improves the stability of both the test frame and the test board.

[0024] A second aspect of this application provides a load device, comprising: a mounting plate; a positive copper busbar fixed on the mounting plate; a negative copper busbar fixed on the mounting plate and arranged parallel to the positive copper busbar; and multiple resistors, the two ends of which are detachably connected to the positive copper busbar and the negative copper busbar, respectively.

[0025] As described above, by setting multiple resistors, with their two ends detachably connected to the positive and negative copper busbars respectively, the number of resistors installed between the positive and negative copper busbars can be adjusted according to load requirements. This allows the load device to meet different load demands, thereby improving its adaptability.

[0026] As a possible implementation of the second aspect, the load device further includes: a fixing member, which is fixedly disposed on the mounting plate, and the fixing member has a first fixing port and a second fixing port on a surface away from the mounting plate, wherein the positive copper busbar is plugged into the first fixing port and the negative copper busbar is plugged into the second fixing port.

[0027] As described above, by plugging and unplugging the positive and negative copper busbars to the first and second fixing ports on the fixing components, it is convenient to assemble and disassemble the positive and negative copper busbars, and to replace and adjust them as needed.

[0028] As a possible implementation of the second aspect, the positive copper busbar is provided with a first mounting port on the side away from the mounting plate, and the negative copper busbar is provided with a second mounting port on the side away from the mounting plate; the resistor is provided with connecting posts at both ends, and the connecting posts at both ends of the resistor extend into the first mounting port and the second mounting port, respectively.

[0029] As described above, by connecting the two ends of the resistor to the first mounting port of the positive copper busbar and the second mounting port of the negative copper busbar, the installation structure between the resistor and the positive and negative copper busbars is simplified, thereby reducing equipment costs.

[0030] As a possible implementation of the second aspect, the first mounting port and the second mounting port are U-shaped notches, and the connecting posts at both ends of the resistor pass through the first mounting port and the second mounting port and are threadedly connected to the fixing nut.

[0031] As described above, by making the first and second mounting ports U-shaped notches, the connecting posts at both ends of the resistor can be easily inserted into the first and second mounting ports through the notches, and then secured with the fixing nuts. This facilitates the installation and removal of the resistor, thereby simplifying the adjustment of the load on the load device and reducing the difficulty of adjustment.

[0032] As one possible implementation of the second aspect, the resistor is fixed to the mounting plate by bolts.

[0033] As described above, by using bolts to fix the resistor to the mounting plate, the resistor's stability can be improved. Simultaneously, the fixed connection between the resistor and the mounting plate indirectly fixes the positive and negative copper busbars to the mounting plate, preventing them from detaching from the first and second fixing ports on the fastener.

[0034] As a possible implementation of the second aspect, the fixing member includes an end fixing member and an intermediate fixing member. The end fixing member is disposed at both ends of the positive copper busbar and the negative copper busbar. The first fixing port and the second fixing port are disposed on the end fixing member. The intermediate fixing member is disposed on both sides of the positive copper busbar and the negative copper busbar that are far apart from each other, and abuts against the positive copper busbar and the negative copper busbar.

[0035] As described above, the positive and negative copper busbars are fixed at both ends and in the middle by end fixing parts and middle fixing parts, thereby improving the firmness and stability of the positive and negative copper busbars.

[0036] As one possible implementation of the second aspect, the positive copper busbar and the negative copper busbar are arranged in pairs, and there are multiple pairs of positive copper busbars and negative copper busbars.

[0037] As mentioned above, by setting multiple pairs of positive and negative copper busbars, the load adjustment range of the load device can be increased, thereby improving the adaptability of the load device.

[0038] As one possible implementation of the second aspect, each pair of positive copper busbars and the negative copper busbars are arranged in parallel, and in two adjacent pairs of positive copper busbars and the negative copper busbars, the two positive copper busbars or the two negative copper busbars are located on adjacent sides.

[0039] As described above, by placing two pairs of adjacent positive copper busbars and two positive or negative copper busbars on the adjacent side, it is convenient for adjacent positive and negative copper busbars to be close together, thus facilitating connection between the same poles.

[0040] As a possible implementation of the second aspect, it also includes a positive terminal and a negative terminal, wherein the positive terminal is connected to the positive copper busbar and the negative terminal is connected to the negative copper busbar.

[0041] As one possible implementation of the second aspect, the mounting plate is provided with a heat dissipation structure.

[0042] As described above, by incorporating a heat dissipation structure on the mounting plate, heat dissipation for the load device can be facilitated. Alternatively, by incorporating a heat dissipation structure on the mounting plate, the mounting plate can function as a heat sink, allowing other components of the load device to be directly mounted on the heat sink. This reduces the number of components in the load device, thereby lowering equipment costs.

[0043] A third aspect of this application provides a testing device, which may be any of the testing devices described in the first aspect of this application, including the load device described in any possible implementation of the second aspect of this application.

[0044] As a possible implementation of the third aspect, the test equipment further includes: a tooling frame for mounting a test board, and the load device is electrically connected to the test board.

[0045] These and other aspects of this invention will become more readily apparent in the following description of several embodiments. Attached Figure Description

[0046] The various features of this utility model and the relationships between them are further explained below with reference to the accompanying drawings. The drawings are exemplary; some features are not shown to scale, and some drawings may omit conventional features in the field of this application that are not essential to this application, or additional features that are not essential to this application may be shown. The combination of features shown in the drawings is not intended to limit this application. Furthermore, throughout this specification, the same reference numerals refer to the same things. Specific descriptions of the drawings are as follows:

[0047] Figure 1 This is a three-dimensional structural diagram of the testing equipment in this application;

[0048] Figure 2 for Figure 1 A schematic diagram of the three-dimensional structure extracted from the test framework section;

[0049] Figure 3 for Figure 1 A schematic diagram of the top orthographic projection structure of the testing equipment;

[0050] Figure 4 for Figure 3 A schematic diagram of the side orthographic projection structure of the testing equipment;

[0051] Figure 5A for Figure 3 A schematic diagram of the front orthographic projection structure of the testing equipment;

[0052] Figure 5B for Figure 5A Enlarged view of part A in the image;

[0053] Figure 6 for Figure 5B A schematic diagram of the side orthographic projection structure of the central air guide plate;

[0054] Figure 7A This is a schematic diagram of the top orthographic projection of the load device of the test equipment;

[0055] Figure 7B for Figure 7A Enlarged view of part B in the image;

[0056] Figure 8A for Figure 7A A schematic diagram of the front orthographic projection structure of the medium-load device;

[0057] Figure 8B for Figure 8A Enlarged view of section C in the image;

[0058] Figure 9 for Figure 7A A schematic diagram of the right-side orthographic projection structure of the medium-load device.

[0059] Explanation of reference numerals in the attached figures

[0060] 10 Test equipment; 100 Tooling frame; 110 Partition plate; 111 Mounting bracket; 112 First water-cooling connector; 113 Through hole; 114 Hose; 120 Slide rail; 140 Air guide plate; 141 Adjustment port; 150 First bolt; 200 Test frame; 210 Mounting structure; 220 Second water-cooling connector; 230 Locking handle; 300 PIB board; 310 First electrical connector B; 320 Connecting terminal; 400 Back plate; 410 First electrical connector A; 500 Fan; 600 Load device; 610 Heat sink; 611 Mounting plate; 612 Heat dissipation structure; 620 Positive copper busbar; 621 First mounting port; 630 Negative copper busbar; 631 Second mounting port; 640 Fixture; 641 End fixture; 642 Intermediate fixture; 643 First fixing port; 644 Second fixing port; 650 Resistor; 651 Connecting post; 652 Retaining nut; 653 Retaining hole; 660 Positive connection terminal; 670 Negative connection terminal; 680 Handle; 700 Power supply assembly; 20 Test board; 21 Second electrical connector A; 22 Second electrical connector B. Detailed Implementation

[0061] The terms "first, second, third, etc." or similar terms such as module A, module B, module C, etc., used in the specification and claims are only used to distinguish similar objects and do not represent a specific ordering of objects. It is understood that a specific order or sequence may be interchanged where permitted so that the embodiments of this application described herein can be implemented in an order other than that illustrated or described herein.

[0062] The term "comprising" as used in the specification and claims should not be construed as limiting itself to what follows; it does not exclude other elements. Therefore, it should be interpreted as specifying the presence of the mentioned feature, integral, or component, but does not exclude the presence or addition of one or more other features, integrals, or components, or groups thereof. Thus, the statement "equipment comprising means A and B" should not be limited to an equipment consisting solely of components A and B.

[0063] The terms "an embodiment" or "an embodiment" as used in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in at least one embodiment of the present invention. Therefore, the terms "in one embodiment" or "in an embodiment" appearing throughout this specification do not necessarily refer to the same embodiment, but may refer to the same embodiment. Furthermore, in one or more embodiments, the particular features, structures, or characteristics can be combined in any suitable manner, as will be apparent to those skilled in the art from this disclosure.

[0064] Below, with reference to the accompanying drawings, possible embodiments of the test device 10 in this application will be described by way of example.

[0065] The test equipment 10 in this application includes a fixture frame 100, first electrical connectors (specifically, first electrical connector A410 and first electrical connector B310, where first electrical connector A410 is the electrical connector on the backplate 400 and first electrical connector B310 is the electrical connector on the PIB board 300), a first water-cooling connector 112, a test frame 200, a fan 500, and a power supply assembly 700. The fixture frame 100 has a sliding groove 120 extending in a straight line. The first electrical connector is mounted on the fixture frame 100, located at one end of the sliding groove 120. The first water-cooling connector 112 is also mounted on the fixture frame 100, located at one end of the sliding groove 120. The test frame 200 is slidably connected to the sliding groove 120, with the other end of the sliding groove 120 inserted into it. The test frame 200 is provided with a mounting structure 210 and a water-cooling structure. The mounting structure 210 is used to mount the test board 20, and the water-cooling structure is located at the corresponding position on the test board 20. The water-cooling structure has a second water-cooling connector 220, which is located at the position corresponding to the first water-cooling connector 112 and is plugged into and plugged into the first water-cooling connector 112 along the extension direction of the slide groove 120. After the test board 20 is mounted on the mounting structure 210, the second electrical connector on the test board 20 (i.e., the second electrical connector A21 and the second electrical connector B22, wherein the second electrical connector A21 is used to plug into and plug into the first electrical connector A410, and the second electrical connector B22 is used to plug into and plug into the first electrical connector B310, so that the test board 20 is simultaneously electrically connected to the backplate 400 and the PIB board 300) is located at the position corresponding to the first electrical connector and is plugged into and plugged into the first electrical connector (i.e., the first electrical connector A410 and the first electrical connector B310) along the extension direction of the slide groove 120. The fan 500 and the power supply component 700 are mounted on the tooling frame 100, and the power supply component 700 is electrically connected to the fan 500 and the test board 20.

[0066] Therefore, by setting up a test frame 200 and mounting the test board 20 on the test frame 200 using the mounting structure 210, this application allows for the adaptation of test boards 20 of different sizes and specifications simply by replacing the test frame 200 or modifying the mounting structure 210. This reduces the design complexity of the test equipment 10, improves its versatility, and lowers its cost.

[0067] Furthermore, this application incorporates a water-cooling structure on the test frame 200. After the test frame 200 is inserted into the slide groove 120, the second water-cooling connector 220 of the water-cooling structure is connected to the first water-cooling connector 112. This allows cooling water to enter the water-cooling structure through the first water-cooling connector 112 and the second water-cooling connector 220 to cool the test board 20 on the test frame 200. This application also incorporates a fan 500 on the mounting frame to provide air cooling for the test board 20 on the test frame 200. Therefore, the test equipment 10 in this application can cool the test board 20 individually using the fan 500 and the water-cooling structure, or simultaneously using both, according to the heat dissipation requirements of the test board 20. This allows for the integration of both air and water cooling methods to meet the different heat dissipation needs of different test boards 20. This improves the versatility of the equipment and reduces costs.

[0068] In some embodiments, the water-cooling structure is detachably connected to the test frame 200. Therefore, by making the water-cooling structure detachably connected to the test frame 200, the water-cooling structure can be installed on the test frame 200 when water cooling of the test board 20 is required, and can be removed from the test frame 200 when water cooling of the test board 20 is not required. This improves the flexibility of the test equipment 10.

[0069] In some embodiments, the mounting structure 210 is detachably connected to the test frame 200. Therefore, the mounting structure 210 can be replaced according to the size and specifications of the test board 20, allowing the test frame 200 to be adapted to test boards 20 of different sizes and specifications. This improves the versatility of the test equipment 10 and reduces its cost.

[0070] In some embodiments, the test equipment 10 further includes a PIB board 300 and a backplate 400, which are detachably mounted on the tooling frame 100. The power supply assembly 700 is electrically connected to the backplate 400. Multiple first electrical connectors (i.e., first electrical connector A410 and first electrical connector B310) are provided, with some first electrical connectors (i.e., first electrical connector B310) mounted on the PIB board 300 and other first electrical connectors (i.e., first electrical connector A410) mounted on the backplate 400.

[0071] In some embodiments, the first water-cooling connector 112 and / or the second water-cooling connector 220 are provided with a self-sealing structure. When the first water-cooling connector 112 is connected to the second water-cooling connector 220, the self-sealing structure opens, allowing communication between the two connectors. When the first water-cooling connector 112 is disconnected from the second water-cooling connector 220, the self-sealing structure closes the connection. Therefore, by providing a self-sealing structure in the first water-cooling connector 112 and the second water-cooling connector 220, the self-sealing structure can seal the first water-cooling connector 112 and the second water-cooling connector 220 after they are disconnected, preventing cooling water from flowing out and damaging other components in the testing equipment 10.

[0072] In some embodiments, an air guide plate 140 is also included, which is mounted on the tooling frame 100 and located at the position corresponding to the fan 500. Thus, by setting the air guide plate 140 at the position corresponding to the fan 500, the cooling air blown out by the fan 500 can be guided, thereby improving the air cooling effect on the test board 20.

[0073] In some embodiments, the air guide plate 140 is hinged to the tooling frame 100. Therefore, by hinged to the tooling frame 100, the angle of the air guide plate 140 can be adjusted, thereby adjusting the flow direction of the cooling air. This allows for adjustment of the cooling airflow when the heat-generating location or heat dissipation requirements on the test plate 20 change after replacement, enabling the testing equipment 10 to adapt to test plates 20 of different specifications and heat dissipation requirements, thus improving the adaptability and versatility of the testing equipment 10.

[0074] In some embodiments, the air guide plate 140 is provided with an adjustment port 141, which is arc-shaped, and the center of the adjustment port 141 coincides with the axis of hinge of the air guide plate 140 on the tooling frame 100. The tooling frame 100 is provided with a limiting hole, which is located at the corresponding position of the adjustment port 141. A first bolt 150 passes through the limiting hole and the adjustment port 141, thus fastening the limiting hole and the adjustment port 141 together. Therefore, the tilt angle of the air guide plate 140 can be limited by the cooperation between the adjustment port 141 and the first bolt 150, ensuring that the tilt angle of the air guide plate 140 is within a suitable range for heat dissipation of the test plate 20 on the test frame 200. Furthermore, the first bolt 150 can also be used to fasten the adjustment port 141 and the limiting port together, thereby improving the stability and robustness of the air guide plate 140.

[0075] In some embodiments, when the first bolt 150 abuts against one end of the adjustment port 141, the air guide plate 140 is tilted towards the test frame 200, and the angle between the air guide plate 140 and the plane where the test plate 20 is located is 25±2° (i.e., within 23°-27°, with 25° being the preferred angle). When the first bolt 150 abuts against the other end of the adjustment port 141, the air guide plate 140 is tilted away from the test frame 200, and the angle between the air guide plate 140 and the plane where the test plate 20 is located is 10±2° (i.e., within 8°-12°, with 10° being the preferred angle). This provides a range of tilt angles for the air guide plate 140, ensuring that the tilt angle of the air guide plate 140 is within a suitable range for heat dissipation of the test plate 20 on the test frame 200, thereby improving the heat dissipation effect on the test plate 20.

[0076] In some embodiments, the straight line between the center of the adjustment port 141 and the center of the limiting hole is parallel to the plane of the test plate 20. Therefore, by making the straight line between the center of the adjustment port 141 and the center of the limiting hole parallel to the plane of the test plate 20, the positions of the adjustment port 141 and the limiting hole can be easily set. This reduces the design complexity of the testing device 10.

[0077] In some embodiments, the testing device 10 further includes a locking handle 230, which is mounted on the testing frame 200. After the testing frame 200 is inserted into the slide groove 120, the locking handle 230 engages with the tooling frame 100, preventing the testing frame 200 from sliding out of the slide groove 120. Thus, the testing frame 200 can be secured by the locking handle 230 after it is inserted into the slide groove 120. This improves the stability of the testing frame 200 and the testing plate 20.

[0078] The above description provides an exemplary description of possible embodiments of the test device 10 in this application. This application also provides a load device 600; below, with reference to the accompanying drawings, possible embodiments of the load device 600 in this application will be described exemplary.

[0079] The load device 600 of this application includes a mounting plate 611, a positive copper busbar 620, a negative copper busbar 630, and resistors 650. The positive copper busbar 620 and the negative copper busbar 630 are fixed to the mounting plate 611 and arranged parallel to the positive copper busbar 620. Multiple resistors 650 are provided, and the two ends of each resistor 650 are detachably connected to the positive copper busbar 620 and the negative copper busbar 630, respectively. Therefore, by providing multiple resistors 650, and allowing the two ends of each resistor to be detachably connected to the positive copper busbar 620 and the negative copper busbar 630, the number of resistors 650 installed between the positive and negative copper busbars 620 and 630 can be adjusted according to load requirements. This allows the load device 600 to meet different load demands, thereby expanding the adaptability of the load device 600.

[0080] In some embodiments, the load device 600 further includes a fixing member 640, which is fixedly mounted on the mounting plate 611. The fixing member 640 has a first fixing port 643 and a second fixing port 644 on its surface away from the mounting plate 611. The positive copper busbar 620 is plugged into the first fixing port 643, and the negative copper busbar 630 is plugged into the second fixing port 644. Therefore, by plugging and unplugging the positive and negative copper busbars 620 and 630 into the first and second fixing ports 643 and 644 on the fixing member 640, it is convenient to assemble and disassemble the positive and negative copper busbars 620 and to replace and adjust them as needed.

[0081] In some embodiments, the positive copper busbar 620 has a first mounting port 621 on the side away from the mounting plate 611, and the negative copper busbar 630 has a second mounting port 631 on the side away from the mounting plate 611. Connecting posts 651 are provided at both ends of the resistor 650, extending into the first mounting port 621 and the second mounting port 631 respectively. Thus, by connecting the resistor 650 to the first mounting port 621 of the positive copper busbar 620 and the second mounting port 631 of the negative copper busbar 630 through the connecting posts 651 at both ends of the resistor 650, the installation structure between the resistor 650 and the positive and negative copper busbars 620 and 630 is simplified, thereby reducing equipment costs.

[0082] In some embodiments, the first mounting port 621 and the second mounting port 631 are U-shaped notches, and the connecting posts 651 at both ends of the resistor 650 pass through the first mounting port 621 and the second mounting port 631 and are threadedly connected to the fixing nut 652. Thus, by making the first mounting port 621 and the second mounting port 631 U-shaped notches, the connecting posts 651 at both ends of the resistor 650 can be easily inserted into the first mounting port 621 and the second mounting port 631 through the notches, and then fixed by the fixing nut 652. This facilitates the installation and removal of the resistor 650, thereby facilitating the adjustment of the load of the load device 600 and reducing the difficulty of adjustment.

[0083] In some embodiments, the resistor 650 is fixed to the mounting plate 611 by a second bolt. Therefore, by using the second bolt to fix the resistor 650 to the mounting plate 611, the robustness of the resistor 650 can be improved. Simultaneously, the fixed connection between the resistor 650 and the mounting plate 611 can indirectly fix the positive copper busbar 620 and the negative copper busbar 630 to the mounting plate 611, preventing the positive copper busbar 620 and the negative copper busbar 630 from detaching from the first fixing port 643 and the second fixing port 644 on the fixing member 640.

[0084] In some embodiments, the fixing member 640 includes an end fixing member 640 and a middle fixing member 640. The end fixing members 640 are disposed at both ends of the positive copper busbar 620 and the negative copper busbar 630, and a first fixing port 643 and a second fixing port 644 are disposed on the end fixing members 640. The middle fixing member 640 is disposed on both sides of the positive copper busbar 620 and the negative copper busbar 630 that are far apart from each other, and abuts against the positive copper busbar 620 and the negative copper busbar 630. Thus, by fixing the two ends and the middle position of the positive copper busbar 620 and the negative copper busbar 630 with the end fixing members 640 and the middle fixing member 640, the firmness and stability of the positive copper busbar 620 and the negative copper busbar 630 can be improved.

[0085] In some embodiments, the positive copper busbar 620 and the negative copper busbar 630 are arranged in pairs, and multiple pairs of positive copper busbar 620 and negative copper busbar 630 are arranged. Therefore, by arranging multiple pairs of positive copper busbar 620 and negative copper busbar 630, the adjustment range of the load device 600 for the load can be increased, thereby increasing the adaptability range of the load device 600.

[0086] In some embodiments, each pair of positive copper busbars 620 and negative copper busbars 630 are arranged in parallel, and in two adjacent pairs of positive copper busbars 620 and negative copper busbars 630, two positive copper busbars 620 or two negative copper busbars 630 are located on an adjacent side. Therefore, by placing two positive copper busbars 620 or two negative copper busbars 630 in two adjacent pairs of positive copper busbars 620 and two negative copper busbars 630 on an adjacent side, it is convenient for adjacent positive copper busbars 620 and negative copper busbars 630 to approach each other, thereby facilitating connection between the same poles.

[0087] In some embodiments, the system further includes a positive terminal 660 and a negative terminal 670. The positive terminal 660 is connected to the positive copper busbar 620, and the negative terminal 670 is connected to the negative copper busbar 630. The positive terminal 660 and the negative terminal 670 are used for electrical connection with the test board 20.

[0088] In some embodiments, a heat dissipation structure 612 is provided on the mounting plate 611. Therefore, by providing the heat dissipation structure 612 on the mounting plate 611, heat dissipation of the load device 600 can be conveniently achieved. Alternatively, by providing the heat dissipation structure 612 on the mounting plate 611, the mounting plate 611 can form a heat sink 610, meaning other components of the load device 600 can be directly mounted on the heat sink 610. This reduces the number of components in the load device 600, thereby lowering equipment costs.

[0089] The above description provides an exemplary description of possible embodiments of the test device 10 and the load device 600. The specific structure of the test device 10 in this application will now be described in detail with reference to the accompanying drawings, in a particular embodiment.

[0090] Figure 1 This is a three-dimensional structural diagram of the test equipment 10 in this application; Figure 2 for Figure 1 A schematic diagram of the three-dimensional structure extracted from part 200 of the test framework; Figure 3 for Figure 1 A schematic diagram of the top orthographic projection structure of the testing equipment 10; Figure 4 for Figure 3 A schematic diagram of the side orthographic projection structure of the testing equipment 10; Figure 5A for Figure 3 A schematic diagram of the front orthographic projection structure of the testing equipment 10 in the middle; Figure 5B for Figure 5A Enlarged view of part A in the image. (See image for example.) Figures 1-4 , Figure 5A , Figure 5BAs shown, the test equipment 10 includes a fixture frame 100, a test frame 200, a PIB board 300 (Prober Interface Board), a backplane 400, a fan 500, and a power supply component 700. The test frame 200, PIB board 300, backplane 400, fan 500, and power supply component 700 are mounted on the fixture frame 100. The test frame 200 is used to mount the test board 20, and is slidably connected to the fixture frame 100. The power supply component 700 is directly electrically connected to the backplane 400 and the test board 20, and the backplane 400 is electrically connected to the fan 500, thereby providing power to the test board 20, backplane 400, and fan 500. After the test frame 200 is slidably connected to the fixture frame 100 and moved to a predetermined position, the test board 20 can be electrically connected to the backplane 400 and PIB board 300 to perform testing on the test board 200 mounted on the test frame 200. The test frame 200 can also be connected to an external temperature controller via piping to water cool the test board 20 on the test frame 200. Simultaneously, a fan 500 can also provide air cooling for the test board 20 on the test frame 200, thereby meeting the different heat dissipation requirements of different test boards 20 and improving the versatility of the equipment.

[0091] like Figures 1-4 , Figure 5A , Figure 5B As shown, the tooling frame 100 is a rectangular frame structure. A partition plate 110 is provided on the rear side of the tooling frame 100, and a mounting bracket 111 is provided on the partition plate 110. The PIB plate 300 and the back plate 400 are mounted on the mounting bracket 111. The PIB plate 300 and the back plate 400 are arranged parallel to the partition plate 110. The back plate 400 is smaller in size and is located close to the partition plate 110, corresponding to the middle position of the partition plate 110. The PIB plate 300 is located away from the partition plate 110. The PIB plate 300 is larger than the back plate 400 and protrudes from the left and right sides of the back plate 400. The backplate 400 has a first electrical connector A410 on the side facing the partition plate 110. The PIB board 300 has a first electrical connector B310 on each side of the backplate 400 on the side facing the partition plate 110. The partition plate 110 has through holes 113 at the corresponding positions of the first electrical connectors A410 and B310. The second electrical connectors A21 and B22 of the test board 20 can be plugged and plugged into the first electrical connectors A410 and B310 through the through holes 113.

[0092] like Figures 1-4 , Figure 5A , Figure 5BAs shown, a horizontally extending slide groove 120 is provided on each of the left and right sides near the bottom inside the tooling frame 100. The test frame 200 is generally rectangular, and the size of the slide groove 120 is adapted to the test frame 200. The left and right edges of the test frame 200 can be inserted into the slide groove 120 by the front end of the two sides, extending into the tooling frame 100 along the slide groove 120. After the test frame 200 slides to the predetermined position along the slide groove 120, the front end of the test frame 200 is approximately flush with the front end of the slide groove 120.

[0093] A locking handle 230 is provided at each of the two front ends of the test frame 200. The locking handle 230 is hinged to the test frame 200. After the test frame 200 slides along the slide groove 120 to the predetermined position, it can be locked as follows: Figure 1 As shown, by rotating the locking handle 230, one end of the locking handle 230 is rotated towards the center of the test frame 200 to a position parallel to the front edge of the test frame 200, thereby engaging the other end of the locking handle 230 with the fixture frame 100 and preventing the test frame 200 from moving out of the slide groove 120. When disassembling the test frame 200, the locking handle 230 can be rotated to rotate one end of the locking handle 230 away from the center of the test frame 200 by a certain angle, so that the locking handle 230 is at, for example, a 90° angle with the front edge of the test frame 200, thereby disengaging the other end of the locking handle 230 from the fixture frame 100. After disassembling the test frame 200, it can also be... Figure 2 As shown, one end of the locking handle 230 is rotated toward the middle of the test frame 200 to a position parallel to the front edge of the test frame 200, so as to prevent the locking handle 230 from protruding from the test frame 200 and scratching the operator.

[0094] like Figures 1-3 As shown, the test frame 200 is provided with a mounting structure 210, which is used to mount the test board 20, so that one second electrical connector A21 on the test board 20 is aligned with the first electrical connector A410 in the front-back direction, and two second electrical connectors B22 on the test board 20 are respectively aligned with two first electrical connectors B310 in the front-back direction, so that after the test frame 200 slides backward along the slide groove 120 to a predetermined position, the second electrical connectors A21 and B22 pass through the through hole 113 and are respectively plugged and unplugged into the first electrical connectors A410 and B310.

[0095] like Figure 3As shown, the partition plate 110 has a first water-cooling connector 112 near both its left and right ends. The first water-cooling connector 112 is mounted on the tooling frame 100 via a floating structure. One end of the first water-cooling connector 112 passes through the partition plate 110 and protrudes from the front surface of the partition plate 110, while the other end is connected to an external temperature controller via a flexible hose 114. To facilitate smoother sliding of the test frame 200 in the slide groove 120, a certain gap is typically provided at the sliding connection point between the slide groove 120 and the test frame 200. This gap causes misalignment between the first water-cooling connector 112 and the second water-cooling connector 220 described below. By allowing the first water-cooling connector 112 to be floated and connected to the thermostat via the hose 114, the positional constraints on the first water-cooling connector 112 can be reduced. This allows the first water-cooling connector 112 to float during insertion and removal from the second water-cooling connector 220, thus mitigating the impact of misalignment between the two connectors on the insertion and removal process. Consequently, the success rate of inserting the second water-cooling connector 220 into the first water-cooling connector 112 along with the test frame can be improved, resulting in smoother insertion and removal.

[0096] The test frame 200 is also equipped with a water-cooling structure located at a corresponding position on the test plate 20. Specifically, it could be located on the lower surface of the test frame 200, used to cool the test plate 20 installed in the mounting structure 210. The water-cooling structure has two second water-cooling connectors 220, which are positioned corresponding to the first water-cooling connector 112 and are plugged into and unplugged from the first water-cooling connector 112 along the extension direction of the slide groove 120. That is, after the test frame 200 slides along the slide groove 120 to a predetermined position, the second water-cooling connector 220 can be driven to plug into and unplug from the first water-cooling connector 112. This allows the temperature controller to be connected to the water-cooling structure via a pipe. The temperature controller can control the cooling water to enter the water-cooling structure through one second water-cooling connector 220 to cool the test plate 20, and then flow back to the temperature controller through the other second water-cooling connector 220, thereby achieving water cooling of the test plate 20.

[0097] The first water-cooling connector 112 and the second water-cooling connector 220 are also equipped with a self-sealing structure. When the first water-cooling connector 112 and the second water-cooling connector 220 are connected, the self-sealing structure opens, allowing the first water-cooling connector 112 and the second water-cooling connector 220 to communicate and circulate the cooling water. When the first water-cooling connector 112 and the second water-cooling connector 220 are disconnected, the self-sealing structure closes the first water-cooling connector 112 and the second water-cooling connector 220, preventing cooling water from flowing out of the first water-cooling connector 112 and the second water-cooling connector 220 and causing damage to other components in the test equipment 10.

[0098] The water-cooling structure also has a water distributor with multiple flow channels. One end of the water distributor is connected to the second water-cooling connector 220, and the other end is connected to multiple flow channels. The flow channels allow cooling water to flow through the area corresponding to the test plate 20 to water-cool the test plate 20.

[0099] like Figures 1-3 As shown, fan 500 is mounted on the right surface of fixture frame 100, blowing cooling air to the left. This frees up space above test frame 200 and test board 20, providing more operating space for the user. Figure 5A , Figure 5B As shown, in the vertical direction, the test frame 200 is located near the lower edge of the fan. A guide vane 140 is mounted on the inner right side surface of the fixture frame 100. The guide vane 140 is positioned in the middle of the fan 500, guiding the direction of the cooling air blown by the fan 500 to achieve air cooling of the upper surface of the test plate 20. Thus, the upper surface of the test plate 20 can be cooled by the fan and the guide vane 140, while the lower surface of the test plate 20 can be cooled by the water cooling structure. This arrangement allows the structures related to both air cooling and water cooling to be located near the right and bottom of the test frame 200, making the structure of the test equipment 10 more compact and rational, enabling both air cooling and water cooling to be achieved simultaneously within a smaller size.

[0100] Figure 6 for Figure 5B A schematic diagram of the side orthographic projection structure of the central air guide plate 140. (See attached diagram.) Figure 5B , Figure 6 As shown, the air guide plate 140 extends in the front-to-back direction and is installed and connected to the tooling frame 100 at both its front and rear ends. Specifically, the air guide plate 140 is hinged to the tooling frame 100 near its right edge at both ends, allowing the air guide plate 140 to rotate on the tooling frame 100, thereby adjusting the direction of the cooling air. The air guide plate 140 is provided with an adjustment port 141, which is arc-shaped, and the center of the adjustment port 141 coincides with the axis of hinge of the air guide plate 140 on the tooling frame 100. The tooling frame 100 is provided with limit holes (…). Figure 3The first bolt 150 covers the position of the limiting hole, which is located at the corresponding position of the adjusting port 141. The first bolt 150 passes through the limiting hole and the adjusting port 141, making the limiting hole and the adjusting port 141 securely connected. Thus, the tilt angle of the air guide plate 140 can be limited by the cooperation between the adjusting port 141 and the first bolt 150, ensuring that the tilt angle of the air guide plate 140 is within a suitable range for heat dissipation of the test plate 20 on the test frame 200. The first bolt 150 can also be used to securely connect the adjusting port 141 and the limiting port, thereby improving the stability and robustness of the air guide plate 140. Alternatively, when the angle of the air guide plate 140 needs to be adjusted, the first bolt 150 can be loosened, making the adjusting port 141 contact and securely connect with the limiting port, allowing the air guide plate 140 to be rotated to adjust its angle. After adjustment, the first bolt 150 is tightened again, making the adjusting port 141 contact and securely connect with the limiting port.

[0101] like Figure 6 As shown, when the air guide plate 140 is in a horizontal state, one end of the adjustment port 141 is above the horizontal plane, and the other end is below the horizontal plane. Specifically, the angle between the line connecting the hinge position of the air guide plate 140 and one end of the adjustment port 141 and the air guide plate 140 is 25°, and the angle between the line connecting the hinge position of the air guide plate 140 and the other end of the adjustment port 141 and the air guide plate 140 is 10°. This allows the air guide plate 140 to have an adjustment range of 35°. After installation, when the first bolt 150 abuts against one end of the adjustment port 141, the air guide plate 140 tilts towards the test frame 200, and the angle between the air guide plate 140 and the plane where the test plate 20 is located is 25°. When the first bolt 150 abuts against the other end of the adjustment port 141, the air guide plate 140 tilts away from the test frame 200, and the angle between the air guide plate 140 and the plane where the test plate 20 is located is 10°. Therefore, the tilt angle range of the air guide plate 140 is given, so that the tilt angle of the air guide plate 140 can be within the angle range suitable for heat dissipation of the test plate 20 on the test frame 200, thereby improving the heat dissipation effect of the test plate 20.

[0102] Figure 7A A schematic diagram of the top orthographic projection structure of the load device 600 of the test equipment 10; Figure 7B for Figure 7A Enlarged view of part B in Figure 8; Figure 8 is Figure 7A A schematic diagram of the front orthographic projection structure of the medium-load device 600; Figure 8B for Figure 8A Enlarged view of section C in the image; Figure 9 for Figure 7A A schematic diagram of the right-side orthographic projection structure of the medium-load device 600. (See attached diagram.) Figure 7A , Figure 7B , Figure 8A , Figure 8B , Figure 9 As shown, the test device 10 in this application also includes a load device 600. The power supply component 700 is electrically connected to the PIB board 300 through the load device 600 to provide electrical energy with a predetermined voltage and current, so that the PIB board 300 is in a predetermined load environment. The load device 600 includes a heat sink 610, a positive copper busbar 620, a negative copper busbar 630, a fixing member 640, and resistors 650. The fixing member 640 is used to mount the positive copper busbar 620 and the negative copper busbar 630 onto the heat sink 610. Multiple resistors 650 are provided and are detachably connected to the positive copper busbar 620 and the negative copper busbar 630. By adjusting the number of resistors 650, the load of the load device 600 can be adjusted, thereby adjusting the voltage and current of the electrical energy supplied to the PIB board 300.

[0103] like Figure 7A , Figure 7B , Figure 9 As shown, the heat sink 610 includes a mounting plate 611 and a heat dissipation structure 612. The mounting plate 611 is a rectangular plate-shaped component, and the heat dissipation structure 612 consists of fins arranged in an array on one side surface of the mounting plate 611. A positive copper busbar 620, a negative copper busbar 630, a fixing member 640, and a resistor 650 are mounted on the other side surface of the mounting plate 611.

[0104] like Figure 7A , Figure 7B As shown, the fixing member 640 includes an end fixing member 641 and a middle fixing member 642. The end fixing member 641 is a block-shaped component, located at both ends near the mounting plate 611. The end fixing member 641 has a rectangular notch-shaped first fixing port 643 and a second fixing port 644 on its surface away from the mounting plate 611. The positive copper busbar 620 and the negative copper busbar 630 are elongated plate-shaped copper busbars. The positive copper busbar 620 is plugged into the first fixing port 643, and the negative copper busbar 630 is plugged into the second fixing port 644.

[0105] like Figure 7A , Figure 7B As shown, two positive copper busbars 620 and two negative copper busbars 630 are arranged in parallel. The two positive copper busbars 620 are respectively positioned near the front and rear edges of the mounting plate 611. After the two positive copper busbars 620 are inserted into the first fixing port 643, their left ends are bent inward at a 90° angle and connected to the positive connection terminal 660. The two negative copper busbars 630 are positioned in the middle of the mounting plate 611. After the two negative copper busbars 630 are inserted into the second fixing port 644, their left ends are bent outward at a 90° angle and connected to the negative connection terminal 670. The positive connection terminal 660 and the negative connection terminal 670 are used for electrical connection with the connection terminal 320 on the PIB board 300.

[0106] like Figure 7A , Figure 7B As shown, a positive copper busbar 620 and an adjacent negative copper busbar 630 form a pair. Each pair of positive and negative copper busbars 620 and 630 forms an area for mounting a resistor 650. An intermediate fixing member 642 is positioned in the middle of the mounting plate 611, located on the outer side of the two positive copper busbars 620 and the inner side of the two negative copper busbars 630. It abuts against the positive and negative copper busbars 620 and 630 respectively, fixing them while preventing obstruction of the resistance 650 between the pairs of positive and negative copper busbars 620 and 630.

[0107] like Figure 7A , Figure 7B As shown, multiple resistors 650 are installed between the positive copper busbar 620 and the negative copper busbar 630, with each end of the resistor 650 fixedly connected to the positive copper busbar 620 and the negative copper busbar 630, respectively. Specifically, as shown... Figure 7B , Figure 8B As shown, the positive copper busbar 620 has a first mounting port 621 on the side away from the mounting plate 611, and the negative copper busbar 630 has a second mounting port 631 on the side away from the mounting plate 611. A connecting post 651 is provided at both ends of the resistor 650, extending into the first mounting port 621 and the second mounting port 631 respectively. The first mounting port 621 and the second mounting port 631 form a U-shaped notch. When installing the resistor 650, the connecting post 651 at both ends of the resistor 650 can be pressed into the first mounting port 621 and the second mounting port 631 through the U-shaped notch. The connecting post 651 is threaded, and a fixing nut 652 can be provided on the connecting post 651 to securely connect the connecting post 651 to the first mounting port 621 and the second mounting port 631. Multiple mounting holes 653 are provided on both sides of the resistor 650, allowing the second bolt to be passed through the mounting holes 653 to fix the resistor 650 to the mounting plate 611. This ensures a tight fit between the resistor 650 and the mounting plate 611, improving heat conduction between the resistor 650 and the heat sink 610. Simultaneously, fixing the resistor 650 to the heat sink 610 with the second bolt indirectly fixes the positive copper busbar 620 and the negative copper busbar 630 to the heat sink 610, preventing them from detaching from the first mounting port 621 and the second mounting port 631. This improves the stability of the load device 600.

[0108] like Figure 7A , Figure 7B , Figure 8A , Figure 8B , Figure 9As shown, the mounting plate 611 is also provided with a plurality of handles 680 on the side facing away from the heat dissipation structure 612. The plurality of handles 680 are respectively located at the left and right ends of the mounting plate 611 so that the user can move the load device 600.

[0109] In summary, when testing the test board 20 using the test equipment 10 in the above embodiments, the test board 20 can be fixed to the test frame 200 via the mounting structure 210, allowing the test board 20 to slide along the test frame 200 and the tooling frame 100. This enables the second electrical connector A21 and the second electrical connector B22 on the test board 20 to be plugged into and unplugged with the corresponding first electrical connector A410 and the first electrical connector B310 when the test frame 200 slides along the slide groove 120 to a predetermined position. This allows the test equipment 10 to test the test board 20 via the PIB board 300 and the backplate 400. Simultaneously, by driving the test frame 200 to slide along the slide groove 120 to a predetermined position, the second water-cooling connector 220 of the water-cooling structure on the test frame 200 can also be plugged into and unplugged with the first water-cooling connector 112 on the tooling frame 100. This allows the cooling medium to circulate within the water-cooling structure via an external temperature controller. This allows for water cooling of the test board 20, and further allows for the selection of air cooling and / or water cooling of the test board 20 based on its heat dissipation requirements.

[0110] Meanwhile, when testing the test board 20 using the testing device 10 in the above embodiments, the testing device 10 is small in size and weight, and can be placed in various ways, such as flat or side-standing. This reduces the space occupied during testing and makes it more convenient for users.

[0111] Furthermore, when the model of the test board 20 changes, or the load requirements during the test change, in the above embodiment, the load device 600 is fixed by a fixing nut 652 after the connecting posts at both ends of the resistor 650 are pressed into the first mounting port 621 and the second mounting port 631. Therefore, the resistor 650 between the positive copper busbar 620 and the negative copper busbar 630 can be easily installed and removed from the positive and negative copper busbars 620 and 630, respectively; that is, each resistor 650 can be individually installed and removed. Thus, the load of the load device 600 can be adjusted according to the needs of the test board 20 by changing the number of resistors 650 between the positive and negative copper busbars 620 and 630.

[0112] Note that the above are merely preferred embodiments and the technical principles employed in this application. Those skilled in the art will understand that this utility model is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the protection scope of this utility model. Therefore, although this application has been described in detail through the above embodiments, this utility model is not limited to the above embodiments. Many other equivalent embodiments may be included without departing from the concept of this utility model, all of which fall within the protection scope of this utility model.

Claims

1. A testing device, characterized in that, include: A tooling frame, wherein a sliding groove is provided on the tooling frame and the sliding groove extends in a straight line; A first electrical connector is mounted on the tooling frame and located at one end of the slide groove at a corresponding position. The first water-cooled connector is installed on the tooling frame and is located at one end of the slide groove at the corresponding position. A test frame is slidably connected to a slide groove, with the other end of the test frame inserted into the slide groove. The test frame is equipped with an mounting structure and a water-cooling structure. The mounting structure is used to mount a test board, and the water-cooling structure is located at a corresponding position on the test board. The water-cooling structure has a second water-cooling connector, which is positioned corresponding to a first water-cooling connector and is plugged into and detached from the first water-cooling connector along the extension direction of the slide groove. After the test board is mounted on the mounting structure, a second electrical connector on the test board is positioned corresponding to the first electrical connector and is plugged into and detached from the first electrical connector along the extension direction of the slide groove. A fan, which is mounted on the tooling frame; A power supply component is mounted on the tooling frame and is electrically connected to the fan and the test board.

2. The testing equipment according to claim 1, characterized in that, The water-cooling structure is detachably connected to the test frame.

3. The testing equipment according to claim 1, characterized in that, The first water-cooling connector and / or the second water-cooling connector are provided with a self-sealing structure. When the first water-cooling connector and the second water-cooling connector are connected, the self-sealing structure opens, allowing the first water-cooling connector and the second water-cooling connector to communicate. When the first water-cooling connector and the second water-cooling connector are disconnected, the self-sealing structure closes the first water-cooling connector and / or the second water-cooling connector.

4. The testing equipment according to claim 1, characterized in that, It also includes a PIB board and a backplate, which are detachably mounted on the tooling frame. The power supply component is electrically connected to the backplate. Multiple first electrical connectors are provided, with some of the first electrical connectors mounted on the PIB board and others mounted on the backplate.

5. The testing equipment according to any one of claims 1-4, characterized in that, It also includes an air guide plate, which is mounted on the tooling frame and located at the position corresponding to the fan.

6. The testing equipment according to claim 5, characterized in that, The air guide plate is hinged to the tooling frame.

7. The testing equipment according to claim 6, characterized in that, An adjustment port is provided on the air guide plate. The adjustment port is arc-shaped, and the center of the adjustment port coincides with the axis of the air guide plate hinged on the tooling frame. A limit hole is provided on the tooling frame. The limit hole is located at the corresponding position of the adjustment port. A bolt passes through the limit hole and the adjustment port to securely connect the limit hole and the adjustment port.

8. The testing equipment according to claim 7, characterized in that, When the bolt abuts against one end of the adjustment port, the air guide plate is tilted toward the test frame, and the angle between the air guide plate and the plane where the test plate is located is within 23°-27°; when the bolt abuts against the other end of the adjustment port, the air guide plate is tilted away from the test frame, and the angle between the air guide plate and the plane where the test plate is located is within 8°-12°.

9. The testing equipment according to claim 8, characterized in that, The straight line between the center of the adjustment port and the center of the limiting hole is parallel to the plane on which the test plate is located.

10. The testing equipment according to any one of claims 1-4, characterized in that, Also includes: A locking handle is installed on the test frame. After the test frame is inserted into the slide groove, the locking handle engages with the tooling frame to prevent the test frame from sliding out of the slide groove.

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