Testing pressure head and testing device

Abstract

The utility model relates to the technical field of chip testing, and provides a testing pressure head and a testing device. The test pressure head comprises a cold source structure with a refrigeration side and a pressure head structure, the pressure head structure comprises a main pressure head and an auxiliary pressure head, the main pressure head and the auxiliary pressure head are arranged at an interval and are attached to the refrigeration side, the ends, attached to the refrigeration side, of the main pressure head and the auxiliary pressure head are provided with temperature control parts, and the ends, away from the refrigeration side, of the main pressure head and the auxiliary pressure head are provided with crimping parts. Along the pressing direction of the pressing head structure, the projection of the temperature control part of the main pressing head partially coincides with the projection of the crimping part of the auxiliary pressing head. According to the test pressure head provided by the invention, the heat exchange effect of the main crystal grain is improved on the basis of meeting the chip test.

Description

Technical Field

[0001] This application relates to the field of chip testing technology, and in particular to a test pressure head and a test device. Background Technology

[0002] With the gradual development of chip technology, the approach has evolved from one die per chip to multiple dies per chip. Among these multiple dies, one master die provides the core computing power, while the other dies provide computing power for data preprocessing and other tasks, thereby reducing the computational burden on the master die. Therefore, in actual operating conditions, the operating temperature of the master die is higher than that of the other dies.

[0003] In related technologies, different temperature control zones are typically set on the pressure head during chip testing to target different temperature regions on the chip. However, since the size of each die is basically the same, the heat exchange area of ​​each die is also basically the same. This results in the heat exchange effect of the main die under high computing pressure being significantly lower than that of the other dies. Utility Model Content

[0004] Therefore, it is necessary to provide a test head that can improve the heat exchange effect of the main die while meeting the chip testing requirements.

[0005] A test head, comprising:

[0006] The cold source structure has a refrigeration side;

[0007] The pressure head structure includes a main pressure head and a secondary pressure head, which are arranged at intervals and are both attached to the cooling side. The end of the main pressure head and the secondary pressure head attached to the cooling side has a temperature control part, and the end of both of them away from the cooling side has a pressing part.

[0008] In particular, along the pressing direction of the pressing head structure, the projection of the temperature control part of the main pressing head coincides with the projection of the pressing part of the auxiliary pressing head.

[0009] Understandably, a cold source structure can provide cooling to both the main and secondary pressure heads, facilitating cooling and heat dissipation for the main die and other dies during chip testing. In this process, since the projection of the main pressure head outside its corresponding pressure contact area coincides with the projection of the corresponding pressure contact area of ​​the secondary pressure head, it's equivalent to increasing the size of the portion of the main pressure head away from its corresponding pressure contact area while maintaining sufficient pressure contact area size, and correspondingly reducing the size of the portion of the secondary pressure head away from its corresponding pressure contact area. This setup reduces the contact area between the secondary pressure head and the cold source structure, and significantly increases the contact area between the main pressure head and the cold source structure, ensuring that the cold source structure can provide more heat to the main pressure head, thereby meeting the cooling requirements of the main die.

[0010] In some embodiments, the secondary pressure head includes a clearance section and a pressing section connected to the clearance section. The pressing section protrudes from the clearance section on the side near the main pressure head, and a clearance space is formed between the clearance section and the pressing section. The temperature control part of the main pressure head is partially accommodated in the clearance space.

[0011] This setup increases the heat transfer area between the main pressure head and the cold source structure while reducing assembly interference between the main and auxiliary pressure heads. Furthermore, this setup ensures that the pressing area between the second pressing part and the auxiliary grain meets the requirements, while maintaining the overall size of the test pressure head.

[0012] In some embodiments, the main pressure head includes a temperature control section and a tapered section connected to the temperature control section. The temperature control part of the main pressure head is disposed in the temperature control section. The portion of the temperature control section protruding from the tapered section is accommodated in the clearance space. The tapered section is tapered from top to bottom along the pressing direction. The pressing part is provided on the side of the tapered section opposite to the temperature control section.

[0013] This design not only bridges the dimensional differences between the temperature control section and the pressing section of the main pressure head, but also reserves an extension space at the main pressure head for the protruding pressing section of the auxiliary pressure head. This maintains the corresponding pressing areas of the main and auxiliary pressure heads while meeting the requirement for a larger cold energy transfer area of ​​the main pressure head.

[0014] In some embodiments, at least two auxiliary pressure heads are provided and arranged circumferentially around the main pressure head. Each auxiliary pressure head has a clearance space for accommodating the temperature control portion of the main pressure head. The pressing portion of each auxiliary pressure head is spaced apart from the pressing portion of the main pressure head. In the main pressure head, the cross-section of the pressing portion is smaller than the cross-section of the temperature control portion.

[0015] This setup, while satisfying multiple other grain pressing tests, further increases the heat transfer area between the main pressure head and the cold source structure, thereby improving the heat dissipation effect on the main grain.

[0016] In some embodiments, the main pressure head is provided with the auxiliary pressure head on both sides along the first direction, and the cross-section of the main pressure head along the pressing direction is trapezoidal; the first direction is the width direction of the grain and is set at an angle to the pressing direction.

[0017] In some embodiments, the main pressure head includes a temperature control section and a tapered section connected to the temperature control section, and the tapered section has the pressing part on the side opposite to the temperature control section; the test pressure head also includes a graphite sheet, which is pressed between the temperature control section and the cold source structure; along the pressing direction, the projection of the temperature control section is larger than the projection of the graphite sheet.

[0018] In other words, by using graphite sheets, the heat at the main pressure head is transferred to the cold source structure as much as possible, thereby improving the heat dissipation effect of the main grains.

[0019] In some embodiments, the test head further includes a heating element; both the main head and the auxiliary head are provided with the heating element, and the heating element corresponding to the main head is located on the side close to the corresponding pressing part.

[0020] It is understandable that heating elements are used to meet the testing requirements of chips at different temperatures; and, since the heating element corresponding to the main pressure head is set far away from the cold source structure, the heat dissipation effect of the heating element on the main die is reduced.

[0021] In some embodiments, the heating element corresponding to the secondary pressure head is located on the side close to the cold source structure.

[0022] In some embodiments, a heat insulation portion is provided between the secondary pressure head and the main pressure head, wherein the heat insulation portion is a heat insulation gap and / or a heat insulation material layer.

[0023] Understandably, by using the heat insulation section, the heat influence between the main pressure head and the auxiliary pressure head can be reduced, ensuring that the heat from both can be transferred to the cold source structure for heat dissipation as fully and independently as possible.

[0024] This application also provides a testing device, including a test base and the aforementioned test head, wherein the test head is arranged opposite to and spaced apart from the test base, and the test head is capable of moving closer to or away from the test base. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 A schematic diagram of a test pressure head provided in an embodiment of this application;

[0027] Figure 2 This is a front view of a test indenter provided in an embodiment of this application;

[0028] Figure 3 A cross-sectional view of a test pressure head provided in an embodiment of this application;

[0029] Figure 4 This is a partial schematic diagram of the testing apparatus provided in an embodiment of this application during testing.

[0030] Reference numerals: 10, cold source structure; 20, pressure head structure; 21, main pressure head; 22, auxiliary pressure head; 30, graphite sheet; 40, integrated substrate; 60, heating element; 61, first heating element; 62, second heating element; 100, test pressure head; 101, cooling side; 200, test seat; 201, pressing part; 202, temperature control part; 203, heat insulation part; 211, temperature control section; 212, tapering section; 221, clearance section; 222, pressing section; 223, transition section; 310, main grain; 320, auxiliary grain; 2011, first pressing part; 2012, second pressing part; 2021, first temperature control part; 2022, second temperature control part; 2201, clearance space. Detailed Implementation

[0031] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0032] It should be noted that when a component is referred to as being "fixed to" or "attached to" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0034] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0035] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0036] Please see Figures 1 to 4 One embodiment of this application provides a test pressure head 100, mainly used for pressing tests on chips. The test pressure head 100 includes a cold source structure 10 and a pressure head structure 20. The cold source structure 10 has a cooling side 101, and the pressure head structure 20 includes a main pressure head 21 and a secondary pressure head 22, which are arranged at intervals and both attached to the cooling side 101. Both the main pressure head 21 and the secondary pressure head 22 have a temperature control portion 202 at one end attached to the cooling side 101, and both have a pressing portion 201 at the end opposite to the cooling side 101. Specifically, along the pressing direction of the pressure head structure 20, the projection of the temperature control portion 202 of the main pressure head 21 coincides with the projection of the pressing portion 201 of the secondary pressure head 22.

[0037] For ease of explanation, the main pressure head 21 corresponds to the first pressing part 2011 and the first temperature control part 2021, while the auxiliary pressure head 22 corresponds to the second pressing part 2012 and the second temperature control part 2022. Taking the pressing direction of the pressure head structure 20 as vertical (i.e., the Z-axis direction) as an example, the chip is positioned below the test pressure head 100. When a pressing test is required, the test pressure head 100 moves downwards along the Z-axis direction. After the test is completed, the test pressure head 100 moves upwards along the Z-axis direction away from the chip, facilitating the transfer of the chip to the next process step.

[0038] The cold source structure 10 provides cooling to the main pressure head 21 and the secondary pressure head 22, facilitating cooling and heat dissipation for the main die 310 and other dies during chip testing. The cooling capacity of the cold source structure 10 can be transferred to the first pressing part 2011 and the second pressing part 2012 via the first temperature control unit 2021 and the second temperature control unit 2022, respectively, thereby achieving die heat dissipation.

[0039] In this process, because the vertical projection of the first temperature control part 2021 and the vertical projection of the second pressing part 2012 partially overlap, it is equivalent to a portion of the first temperature control part 2021 being located on the side of the second pressing part 2012 facing the cold source structure 10, and the cross-section of the second temperature control part 2022 being smaller than the cross-section of the second pressing part 2012. Therefore, this arrangement, while ensuring that the dimensions of the first pressing part 2011 and the second pressing part 2012 meet the pressing requirements, not only increases the size of the first temperature control part 2021 of the main pressing head 21, but also correspondingly reduces the size of the second temperature control part 2022 of the auxiliary pressing head 22. Since both the first temperature control part 2021 and the second temperature control part 2022 are located on the side where the cold source structure 10 is attached, the contact area between the main pressing head 21 and the cold source structure 10 is increased, ensuring that the cold source structure 10 can provide more heat to the main pressing head 21, meeting the cooling requirements of the main grain 310.

[0040] The main pressure head 21 is used for pressing test with the main grain 310, and the auxiliary pressure head 22 is used for pressing test with the remaining grains (referred to as auxiliary grains 320).

[0041] It should be added that the cold source structure 10 can be a liquid-cooled structure, with channels inside for the flow and circulation of coolant. Of course, the cold source structure 10 can also be an air-cooled structure, or a combination of liquid and air cooling. The key is to meet the cooling requirements of the chip; this is merely an example.

[0042] Please see Figures 1 to 4 In some embodiments, the secondary pressure head 22 includes a clearance section 221 and a pressing section 222 connected to the clearance section 221. The pressing section 222 protrudes from the clearance section 221 on the side near the main pressure head 21. A clearance space 2201 is formed between the clearance section 221 and the pressing section 222. The first temperature control part 2021 of the main pressure head 21 is partially accommodated in the clearance space 2201.

[0043] The second temperature control unit 2022 is located on the clearance section 221, or the clearance section 221 can form the second temperature control unit 2022. The side wall of the clearance section 221 opposite to the pressing section 222 is attached to the refrigeration side 101 of the cold source structure 10 to transfer cold energy. The second pressing part 2012 is located on the side wall of the pressing section 222 opposite to the clearance section 221, or the side wall of the pressing section 222 opposite to the clearance section 221 can form the second pressing part 2012, or the pressing section 222 as a whole can form the second pressing part 2012.

[0044] The protrusion of the pressing section 222 relative to the clearance section 221 creates a clearance space 2201 between them to accommodate the first temperature control unit 2021. This allows for an increase in the size of the first temperature control unit 2021 facing the auxiliary pressure head 22, thereby increasing the cold energy transfer area between the main pressure head 21 and the cold source structure 10. Simultaneously, this arrangement reduces assembly interference between the main pressure head 21 and the auxiliary pressure head 22, ensuring smooth pressing and testing of each with its corresponding main die 310 and auxiliary die 320. Furthermore, the protrusion of the pressing section 222 relative to the clearance section 221 not only ensures that the pressing area of ​​the second pressing part 2012 and the auxiliary die 320 meets requirements but also maintains the overall size of the test pressure head 100 without change.

[0045] Please see Figures 1 to 4 In some embodiments, the main pressure head 21 includes a temperature control section 211 and a tapered section 212 connected to the temperature control section 211. The first temperature control part 2021 of the main pressure head 21 is disposed in the temperature control section 211. The portion of the temperature control section 211 that protrudes from the tapered section 212 is accommodated in the clearance space 2201. The tapered section 212 is tapered from top to bottom along the pressing direction. A first pressing part 2011 is provided on the side of the tapered section 212 away from the temperature control section 211.

[0046] The temperature control section 211 forms the first temperature control unit 2021, or a portion of the temperature control section 211 forms the first temperature control unit 2021.

[0047] Understandably, for the main pressure head 21, the cross-section of the first pressing portion 2011 remains unchanged, as it only needs to be adapted to the main grain 310. However, in order to increase the cold energy transfer area between the main pressure head 21 and the cold source structure 10, the cross-section of the first temperature control portion 2021 is correspondingly increased. Therefore, by using the tapered section 212, the size difference between the first pressing portion 2011 and the first temperature control portion 2021 can be bridged, ensuring that while the cold energy transfer area of ​​the main pressure head 21 is increased, the pressing area adapted to the main grain 310 can also be maintained. Furthermore, due to the tapered section 212, the cross-section of the lower part of the main pressure head 21 gradually decreases from top to bottom, and the space on both sides of the tapered section 212 gradually increases from top to bottom. This provides more space for the pressing section 222 of the auxiliary pressure head 22, which is conducive to the pressing section 222 protruding towards the main pressure head 21, so as to ensure that the second pressing portion 2012 has a sufficient pressing area.

[0048] like Figure 1As shown, in actual use, the auxiliary pressure head 22 also includes a transition section 223 connecting the pressing section 222 and the clearance section 221. The transition section 223 is gradually widened downwards in the vertical direction. The transition section 223 is provided to compensate for the size difference between the pressing section 222 and the clearance section 221, and can also be adapted to the tapering section 212 of the main pressure head 21.

[0049] Please see Figures 1 to 4 In some embodiments, at least two auxiliary pressure heads 22 are provided and arranged circumferentially around the main pressure head 21. Each auxiliary pressure head 22 has a temperature control section 202 with a clearance space 2201 for accommodating a portion of the temperature control section 202 of the main pressure head 21. The pressing portion 201 of each auxiliary pressure head 22 is spaced apart from the pressing portion 201 of the main pressure head 21. In the main pressure head 21, the cross-section of the pressing portion 201 is smaller than the cross-section of the temperature control section 202.

[0050] Understandably, the use of multiple sub-pressure heads 22 is intended to meet the crimping tests of multiple auxiliary grains 320, thereby improving testing efficiency. Because each sub-pressure head 22 has a clearance space 2201 at its second temperature control section 2022, a wider space is provided for the first temperature control section 2021 of the main pressure head 21, increasing the size of the first temperature control section 2021 and further enhancing the cold energy transfer area between the main pressure head 21 and the cold source structure 10.

[0051] like Figures 1 to 3 As shown, taking an example where two auxiliary pressure heads 22 are provided. Specifically, auxiliary pressure heads 22 are provided on both sides of the main pressure head 21 along the first direction, and the cross-section of the main pressure head 21 along the pressing direction is trapezoidal. The first direction is the width direction of the grain and is set at an angle to the pressing direction. Figure 1 Taking the placement of the test pressure head 100 as an example, if the first direction is the X-axis direction, then the length direction of the grain is the Y-axis direction. At this time, the projection of the main pressure head 21 along the Y-axis direction is trapezoidal. This setting allows the first temperature control unit 2021 to extend on both sides along the X-axis direction, thereby increasing the cold energy transfer area between the first temperature control unit 2021 and the cold source structure 10 along the X-axis direction.

[0052] The projection of the main pressure head 21 along the Y-axis can be an isosceles trapezoid, maintaining the consistent protrusion length of the pressing section 222 along the X-axis in both secondary pressure heads 22, meaning the pressing area between the two secondary pressure heads 22 and the auxiliary grain 320 is consistent. Of course, the projection of the main pressure head 21 along the Y-axis can also be non-isosceles trapezoidal. In this case, the dimensions of the two secondary pressure heads 22 can be adjusted according to the size of the auxiliary grains 320 on both sides to accommodate pressing of auxiliary grains 320 of different sizes. This is merely an example.

[0053] In other embodiments, when four auxiliary pressure heads 22 are provided, two auxiliary pressure heads 22 are respectively arranged on both sides of the main pressure head 21 along the X-axis direction, and the other two auxiliary pressure heads 22 are respectively arranged on both sides of the main pressure head 21 along the Y-axis direction. In this case, the projection of the main pressure head 21 along the Y-axis direction and the projection along the X-axis direction are both trapezoidal.

[0054] Alternatively, there can be three auxiliary pressure heads 22, with two located on either side of the main pressure head 21 along the X-axis and the other located on one side of the main pressure head 21 along the Y-axis. This is just an example.

[0055] Please see Figure 1 , Figure 3 and Figure 4 In some embodiments, the main pressure head 21 includes a temperature control section 211 and a tapered section 212 connected to the temperature control section 211. A first pressing portion 2011 is provided on the side of the tapered section 212 facing away from the temperature control section 211. The test pressure head 100 also includes a graphite sheet 30, which is pressed between the temperature control section 211 and the cold source structure 10. Along the pressing direction (i.e., the vertical direction), the projection of the first temperature control section 211 is larger than the projection of the graphite sheet 30. That is, the dimension D1 of the projection of the first temperature control section 211 along the X-axis is larger than the dimension D2 of the projection of the graphite sheet 30 along the X-axis.

[0056] Understandably, because the graphite sheet 30 has high thermal conductivity, when it is pressed between the temperature control section 211 and the cold source structure 10, it can transfer the heat generated by the main grain 310 during the test to the cold source structure 10 as fully as possible, which is beneficial to improving the heat dissipation effect of the main grain 310. Moreover, precisely because the projection of the graphite sheet 30 is smaller than the projection of the first temperature control section 211, the projection of the graphite sheet 30 is located within the projection of the first temperature control section 211, that is, the graphite sheet 30 will not protrude from the first temperature control section 211, thus minimizing heat interference at the secondary pressure head 22 and ensuring that more heat from the main grain 310 is transferred to the cold source structure 10 for heat dissipation.

[0057] Please continue reading. Figures 1 to 4 In some embodiments, the pressure head structure 20 further includes an integrated substrate 40, on which the main pressure head 21 and the auxiliary pressure head 22 are integrated and assembled. The integrated substrate 40 is attached to the cold source structure 10. The integrated substrate 40 and / or the cold source structure 10 are provided with mounting grooves, and the graphite sheet 30 is pressed into the mounting grooves. That is, the mounting grooves are used to accommodate the graphite sheet 30, ensuring that the integrated substrate 40 and the cold source structure 10 can have direct surface contact, reducing the gap and thus improving the heat dissipation effect. Specifically, the mounting groove may be recessed on the upper surface of the integrated substrate 40 along the Z-axis direction, or on the lower surface of the cold source structure 10 along the Z-axis direction, or both the integrated substrate 40 and the cold source structure 10 may be recessed with mounting grooves.

[0058] The thickness of the graphite sheet 30 is basically the same as the depth of the assembly groove. This ensures sufficient surface contact between the graphite sheet 30, the cold source structure 10, and the integrated substrate 40, facilitating heat transfer. Furthermore, it ensures sufficient surface contact between the portion of the cold source structure 10 and the portion of the integrated substrate 40 located on the outer periphery of the graphite sheet 30, facilitating heat exchange. Specifically, for the auxiliary pressure head 22, which primarily utilizes the direct surface contact between the integrated substrate 40 and the cold source structure 10 for heat dissipation, this arrangement ensures the heat dissipation requirements of the auxiliary die 320.

[0059] Please continue reading. Figures 1 to 4 In some embodiments, a heat insulation portion 203 is provided between the secondary pressure head 22 and the main pressure head 21. It can be understood that by using the heat insulation portion 203, the heat influence between the main pressure head 21 and the secondary pressure head 22 can be reduced, thereby reducing the heat interference between the main grain 310 and the auxiliary grain 320, ensuring that the heat of both can be transferred to the cold source structure 10 for heat dissipation as fully and independently as possible.

[0060] The heat insulation part 203 can be a heat insulation gap. This gap can be the distance between the auxiliary pressure head 22 and the main pressure head 21. Understandably, by using the heat insulation gap, a thermal barrier can be formed between the main pressure head 21 and the auxiliary pressure head 22, preventing direct heat transfer between them.

[0061] Alternatively, the heat insulation part 203 can be a heat insulation material layer. The heat insulation material layer can be made of a material with high thermal resistance and low thermal conductivity, such as aerogel or vacuum insulation board. By setting the heat insulation material layer between the main pressure head 21 and the auxiliary pressure head 22, heat interference between the two is satisfied, and heat transfer between them is avoided. The heat insulation material layer can be attached between the main pressure head 21 and the auxiliary pressure head 22.

[0062] Alternatively, the insulation section 203 can also employ a combination of insulation gaps and insulation material layers. Based on the spaced arrangement of the main pressure head 21 and the auxiliary pressure head 22, an insulation material layer is provided at the interval between them, and a gap is provided between the insulation material layer and both the main pressure head 21 and the auxiliary pressure head 22. This is only an example; the goal is simply to reduce heat interference and mutual transfer between the main pressure head 21 and the auxiliary pressure head 22.

[0063] like Figure 1 and Figure 3As shown, in some embodiments, the test head 100 further includes a heating element 60, with both the main head 21 and the secondary head 22 equipped with heating elements 60. The main head 21 corresponds to the first heating element 61, and the secondary head 22 corresponds to the second heating element 62. That is, the arrangement of the first heating element 61 and the second heating element 62 can simulate the high-temperature operating conditions of the chip, thus meeting the temperature control requirements under different testing conditions. Moreover, this arrangement facilitates independent temperature control of the main head 21 and the secondary head 22, more accurately simulating the actual working environment and improving testing accuracy and reliability.

[0064] In this configuration, the first heating element 61 corresponding to the main pressure head 21 is located on the side closer to the corresponding pressing part 201. That is, the first heating element 61 corresponding to the main pressure head 21 is located on the side away from the cold source structure 10, thereby reducing the heat dissipation impact of the first heating element 61 on the main pressure head 21. In some specific embodiments, a mounting groove is provided in the area between the tapered section 212 and the temperature control section 211 of the main pressure head 21, facilitating the insertion of the first heating element 61 into the mounting groove.

[0065] Furthermore, the second heating element 62 corresponding to the secondary pressure head 22 is located on the side closer to the cold source structure 10. For example, the end of the clearance section 221 of the secondary pressure head 22 away from the second pressing part 2012 may be recessed with a mounting groove to insert the second heating element 62 into the mounting groove for assembly. Since the second heating element 62 corresponding to the secondary pressure head 22 is located on the side closer to the cold source structure 10, it is equivalent to forming a heat exchange barrier between the secondary pressure head 22 and the cold source structure 10, which can promote more cooling to be applied to the main pressure head 21, further improving the heat dissipation effect of the main grain 310.

[0066] It should be added that when the main die 310 and auxiliary die 320 are being cooled, the heating element 60 is in the off state to reduce the impact of the heating element 60 on the cooling of the die.

[0067] In some specific embodiments, the heating element 60 may be a ceramic heating element. Using a ceramic heating element allows for more precise control of temperature conditions during chip testing, simulating the chip's temperature state in a real-world working environment, and ensuring the accuracy and reliability of the test results.

[0068] like Figure 1 , Figure 3 and Figure 4 As shown, this application also provides a testing device, including a test base 200 and the aforementioned test head 100. The test head 100 is arranged opposite to and spaced apart from the test base 200, and the test head 100 can move closer to or further away from the test base 200.

[0069] In practical use, the test holder 200 is positioned below the test head 100 along the Z-axis. The test holder 200 has a test cavity where the chip can be placed, for example, by vacuum adsorption. When testing is required, the test head 100 moves downward along the Z-axis, causing the main head 21 and the auxiliary head 22 to face the main die 310 and the auxiliary die 320 respectively, to meet the crimping test requirements. During this test, the cold source structure 10 can absorb the heat generated by the chip test, and the heating element 60 and the cold source structure 10 can simulate different temperature environments for the chip, thereby testing the chip's performance under different temperature conditions. The increased size of the first temperature control section 2021 of the main head 21 facilitates the full transfer of heat from the main die 310 to the cold source structure 10, improving heat dissipation. Furthermore, the graphite sheet 30 further enhances heat transfer efficiency, thus improving the heat dissipation effect.

[0070] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0071] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. A test pressure head, characterized in that, include: The cold source structure (10) has a refrigeration side (101). The pressure head structure (20) includes a main pressure head (21) and a secondary pressure head (22), which are arranged at intervals and are both attached to the cooling side (101). The main pressure head (21) and the secondary pressure head (22) are both attached to the cooling side (101) with a temperature control part (202), and both have a crimping part (201) at the end away from the cooling side (101). Along the pressing direction of the pressing head structure (20), the projection of the temperature control part (202) of the main pressing head (21) coincides with the projection of the pressing part (201) of the auxiliary pressing head (22).

2. The test indenter according to claim 1, characterized in that, The secondary pressure head (22) includes a clearance section (221) and a pressing section (222) connected to the clearance section (221). The pressing section (222) protrudes from the clearance section (221) on the side near the main pressure head (21). A clearance space (2201) is formed between the clearance section (221) and the pressing section (222). The temperature control part (202) of the main pressure head (21) is partially accommodated in the clearance space (2201).

3. The test indenter according to claim 2, characterized in that, The main pressure head (21) includes a temperature control section (211) and a tapered section (212) connected to the temperature control section (211). The temperature control part (202) of the main pressure head (21) is located in the temperature control section (211). The portion of the temperature control section (211) protruding from the tapered section (212) is accommodated in the clearance space (2201). The tapered section (212) tapes down from top to bottom along the pressing direction. The pressing part (201) is located on the side of the tapered section (212) away from the temperature control section (211).

4. The test indenter according to claim 1, characterized in that, At least two auxiliary pressure heads (22) are provided and are arranged at intervals along the circumference of the main pressure head (21). Each auxiliary pressure head (22) has a temperature control section (202) with a clearance space (2201) for accommodating the temperature control section (202) of the main pressure head (21). The crimping section (201) of each auxiliary pressure head (22) is spaced apart from the crimping section (201) of the main pressure head (21). In the main pressure head (21), the cross-section of the pressing part (201) is smaller than the cross-section of the temperature control part (202).

5. The test indenter according to claim 4, characterized in that, The main pressure head (21) is provided with the auxiliary pressure head (22) on both sides along the first direction. The cross section of the main pressure head (21) along the pressing direction is trapezoidal. The first direction is the width direction of the grain and is set at an angle to the pressing direction.

6. The test indenter according to claim 1, characterized in that, The main pressure head (21) includes a temperature control section (211) and a tapered section (212) connected to the temperature control section (211). The tapered section (212) has the pressing part (201) on the side away from the temperature control section (211). The test head (100) also includes a graphite sheet (30), which is pressed between the temperature control section (211) and the cold source structure (10); Along the pressing direction, the projection of the temperature control section (211) is greater than the projection of the graphite sheet (30).

7. The test indenter according to claim 1, characterized in that, The test head (100) also includes a heating element (60); The main pressure head (21) and the auxiliary pressure head (22) are each provided with a heating element (60), and the heating element (60) corresponding to the main pressure head (21) is located on the side close to the corresponding pressing part (201).

8. The test indenter according to claim 7, characterized in that, The heating element (60) corresponding to the secondary pressure head (22) is located on the side close to the cold source structure (10).

9. The test indenter according to claim 1, characterized in that, A heat insulation part (203) is provided between the auxiliary pressure head (22) and the main pressure head (21), and the heat insulation part (203) is a heat insulation gap and / or a heat insulation material layer.

10. A testing apparatus, characterized in that, include: Test socket (200); The test head according to any one of claims 1 to 9, wherein the test head (100) is arranged opposite to and spaced apart from the test seat (200), and the test head (100) is capable of moving closer to or further away from the test seat (200).

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