Reduction Mask Housing and Reduction Mask Housing System

Abstract

A photomask housing and a photomask housing system are disclosed. The photomask housing includes a first cover having a first outer surface and a first inner surface, and a second cover having a second outer surface and a second inner surface. The first cover and the second cover are connected together. The first cover and the second cover form an internal space therebetween, configured to include a photomask. A catalytic layer is disposed on the first inner surface of the first cover, and a dehumidifying layer is disposed on the second inner surface of the second cover. The photomask housing and micro-cleaning chamber are designed to provide reduced carbon deposition on the photomask during transport.

Description

Technical Field

[0001] One embodiment disclosed herein relates to a magnification mask housing and a magnification mask housing system. Background Technology

[0002] Photomask instruments project a pattern from a patterning device (e.g., a photomask) onto a radiation-sensitive material (photoresist) provided on a semiconductor substrate. During transport between manufacturing facilities, as the photomask is placed in a cassette, rising humidity levels in the transport vehicle cause volatile organic compounds (VOCs) to be released from the cassette, resulting in unwanted carbon deposition on the photomask surface. Utility Model Content

[0003] According to some embodiments disclosed herein, a photomask housing includes a first cover having a first outer surface and a first inner surface on the opposite side, and a second cover having a second outer surface and a second inner surface on the opposite side. The first cover and the second cover are in contact with each other, such that an internal space is formed between the first cover and the second cover to include the photomask. A catalytic layer is disposed on the first inner surface of the first cover and a dehumidifying layer is disposed on the second inner surface of the second cover.

[0004] According to some embodiments disclosed herein, a photomask housing system includes a first cover, a second cover, a container, a first instrument, a second instrument, an inert gas source, and a controller. The first cover includes a first outer surface and a first inner surface, and the second cover includes a second outer surface and a second inner surface. The first and second covers are in contact with each other, forming an internal space between them to include the photomask. A catalytic layer and a dehumidifying layer are respectively disposed on the first inner surface of the first cover and the second inner surface of the second cover. The container is configured to house at least one photomask housing within its internal space; the first instrument is configured to measure humidity levels within the internal space of the container; the second instrument is configured to measure impact levels or multiple vibration levels applied to the container; the inert gas source is configured to circulate inert gas into the internal space of the container; and the controller is configured to control the inert gas source to circulate inert gas based on at least one of the humidity level, impact level, or multiple vibration levels.

[0005] According to some embodiments disclosed herein, a photomask housing system includes a first cover, a second cover, a container, a first instrument, a second instrument, and a controller. The first cover includes a first outer surface and a first inner surface, and the second cover includes a second outer surface and a second inner surface. The first and second covers are in contact with each other to form an internal space between them to include the photomask. A catalytic layer and a dehumidifying layer are respectively disposed on the first inner surface of the first cover and the second inner surface of the second cover. The catalytic layer comprises metal. The container is configured to house at least one photomask housing within its internal space. A first instrument is configured within the internal space of the container to measure humidity levels. A second instrument is configured to measure impact levels or multiple vibration levels applied to the container. The controller is configured to circulate an inert gas into the internal space of the container based on at least one of the humidity level, impact level, or multiple vibration levels. Attached Figure Description

[0006] The features of one embodiment disclosed herein will be readily understood from the following detailed description in conjunction with the accompanying drawings. It is worth noting that in standard industrial implementations, the various features are not drawn to scale. In fact, for clarity of discussion, the dimensions of the various features can be arbitrarily increased or decreased.

[0007] Figure 1A This is a schematic diagram of an extreme ultraviolet (EUV) photomask system constructed according to some embodiments disclosed herein, which is equipped with a laser-excited plasma (LPP) extreme ultraviolet radiation source.

[0008] Figure 1B This is a schematic diagram of an extreme ultraviolet photomask system exposure tool according to some embodiments of this disclosure;

[0009] Figure 1C The diagram shows the installation placed in Figure 1A A schematic diagram of the thin film assembly on a scaled-down photomask in an extreme ultraviolet photomask system;

[0010] Figure 2 An example illustrating volatile organic compounds vented from the hood and carbon deposits formed on the photomask;

[0011] According to the embodiments disclosed herein, Figure 3A It is a top view of the inner surface of the upper cover of the enclosure; and Figure 3B It is a top view of the inner surface of the lower cover of the enclosure;

[0012] According to the embodiments disclosed herein, Figure 3C yes Figure 3A The upper surface of the inner surface of the enclosure is fitted with a dehumidifying layer; and Figure 3D yes Figure 3B The upper surface of the lower cover of the enclosure is fitted with a catalytic layer.

[0013] Figure 4 This is a cross-sectional view of a closed housing including a photomask according to an embodiment of the present disclosure;

[0014] Figure 5 This is a cross-sectional view of an open housing of a photomask according to an embodiment of the present disclosure;

[0015] Figure 6 This is an isometric view of the container holding the cover box according to the embodiments disclosed herein;

[0016] Figure 7 It is used for transportation according to the embodiments disclosed herein. Figure 6 A schematic diagram of a container transport vehicle;

[0017] Figure 8 This is a schematic diagram of a small cleaning chamber system according to an embodiment of the present disclosure;

[0018] Figure 9 This is a schematic diagram of a container for accommodating a cover box according to an embodiment of this disclosure;

[0019] Figure 10 The embodiments shown in this disclosure are illustrated for the purposes of this disclosure. Figure 6 and Figure 9 Block diagram of a computing device for controlling the container in the diagram;

[0020] Figure 11 The present disclosure illustrates a method for encapsulating a reduction mask within a reduction mask housing.

[0021] [Symbol Explanation]

[0022] 100: Extreme ultraviolet radiation source, extreme ultraviolet radiation source instrument

[0023] 101: Extreme Ultraviolet Photomask System

[0024] 105: Chamber

[0025] 110: Collector

[0026] 115: Target Droplet Generator

[0027] 120: Droplet trap

[0028] 130: First buffer gas supply

[0029] 135: Second Buffer Gas Supply

[0030] 140: Export

[0031] 150: Debris collection mechanism or device

[0032] 160: Output terminal

[0033] 200: Exposure Tools

[0034] 205a, 205b: Optical elements

[0035] 205c: Reduction mask, mask

[0036] 205d, 205e: Reduced projection optics

[0037] 211:Substrate

[0038] 250: Thin Film Assembly

[0039] 252:Thin film

[0040] 254: Membrane frame

[0041] 256: Patterned Surface

[0042] 258: Pollutant particles

[0043] 300: Excitation source instrument, laser source instrument, laser generator, laser source, laser source

[0044] 302: Monitoring Module

[0045] 310: Laser Production Equipment

[0046] 320: Laser-guided optical element

[0047] 330: Focusing Instrument

[0048] 340: Upper cover

[0049] 341: Lower base

[0050] 342: Humidity

[0051] 342 humidity level

[0052] 343: Volatile Organic Compounds

[0053] 344: Carbon deposition

[0054] 345: Dehumidifier layer

[0055] 346: Catalytic layer, base of inner casing

[0056] 347a: Restriction mechanism, support component

[0057] 348: Clear valve

[0058] 349: Patterned Surface

[0059] 350: Back surface

[0060] 360: Cover Box

[0061] 351: Interior Space

[0062] 352: Top

[0063] 353: Side

[0064] 354: Surface

[0065] 355: Surface

[0066] 400: Container

[0067] 401: Door

[0068] 402: Handle

[0069] 403: Hygrometer / Thermometer

[0070] 404: Instruments for shock or vibration environments, instruments for vibration environments, instruments for shock environments.

[0071] 405: Impact Absorption Device

[0072] 406: Nitrogen source, inert gas source

[0073] 407: Internal

[0074] 408, 409: Straight arrows

[0075] 501: Truck

[0076] 501a: Storage or cargo area

[0077] 502: Operator or driver

[0078] 503: Air Conditioning System

[0079] 510, 511: Manufacturing facilities

[0080] 600: Cleanroom System

[0081] 601: Control Module

[0082] 602: Monitoring module; 603, 604, 605, 606, 719: Data

[0083] 710: Computing device

[0084] 711: Monitor

[0085] 712: Processor

[0086] 713: Memory

[0087] 714: Input / Output Interface

[0088] 715: Network Interface

[0089] 716: Storage

[0090] 717: Operating System

[0091] 718: Application

[0092] 740: Network

[0093] A1: Optical axis

[0094] EUV: Extreme Ultraviolet Radiation

[0095] LR1: Laser

[0096] LR2: Excitation laser, laser, laser pulse PP1, PP2: Disk base DP1, DP2: Buffer

[0097] DP: Target droplet

[0098] MF: Main Floor

[0099] BF: Grassroots

[0100] ZE: Excitation region S101, S103, S105, S107: Operation Detailed Implementation

[0101] To understand the different features of this application, many different implementations or examples are provided below. Specific implementations or examples of elements and arrangements are described below to simplify one embodiment of this disclosure. This is, of course, merely illustrative and not intended to be limiting. For example, the dimensions of elements are not limited to the scope or numerical values ​​disclosed, but may vary depending on the process conditions and / or desired properties of the apparatus. Furthermore, the formation of a first feature on or over a second feature described below may include implementations in which the first and second features are in direct contact, and may also include implementations in which additional features intervene in the first and second features, such that the first and second features are not in direct contact. For simplicity and clarity, various features may be drawn at arbitrary scales. In the accompanying drawings, some features may be omitted for simplicity.

[0102] Furthermore, spatially relative terms, such as “below,” “below,” “lower,” “above,” “above,” etc., may be used herein to simplify the description in order to describe the relationship between an element or feature and another element or feature illustrated in the figure. Spatially relative terms are intended to include the orientation of different devices in use or operation, further described in the figures. Devices may have other orientations (rotated 90 degrees or other orientations), and the spatially related descriptions used herein may be interpreted accordingly. Additionally, the phrase “made of” may mean “comprising” or “consisting of.” Furthermore, in subsequent manufacturing processes, one or more additional operations may be performed between the described operations and the order of operations may be changed. In one embodiment of this disclosure, the phrase “at least one of A, B, and C” means one of A, B, and C, A+B, A+C, B+C, or A+B+C, and does not mean one from A, one from B, and one from C, unless otherwise interpreted.

[0103] One embodiment of this disclosure generally relates to an extreme ultraviolet (EUV) photomask system and method. The embodiment disclosure describes an improved design of a reduction photomask (mask) box for storing photomasks or blank substrates during transport. In a particular embodiment, the reduction photomask box provides and includes a double coating designed to dehumidify the air surrounding the reduction photomask or photomask and to decompose volatile organic compounds (VOCs) generated from exhaust, thereby reducing carbon deposition on the photomask or reduction photomask during transport to the manufacturing plant.

[0104] Figure 2 A diagram illustrating the venting of the enclosure is provided. The enclosure includes an upper cover 340 and a lower base 341, with a magnifying glass 205c disposed between them. When the upper cover 340 and the lower base 341 are sealed, the magnifying glass 205c is fixed within the internal space 351. When the plastic material of the enclosure is exposed to high humidity 342, volatile organic compounds 343 are produced through the venting of the plastic material of the enclosure, resulting in the formation of carbon deposits 344 on the surface of the magnifying glass 205c.

[0105] Other embodiments disclosed herein include a small cleaning chamber (microchamber) configuration for storing the reduction mask box and maintaining and monitoring ideal environmental conditions during transport. Therefore, damage to the reduction mask due to carbon deposition can be reduced during transport. Thus, damage to the mask (reduction mask) due to carbon deposition is reduced when included in the reduction mask box within the microchamber. Because of the reduced carbon deposition, reduction mask repair thus leads to increased reduction mask production efficiency.

[0106] Semiconductor wafers are patterned using photomasks (e.g., for patterning, extreme ultraviolet (EUV) photomasks or UV masks using a 13.5 nm wavelength). Masks or photomasks (also called reduction masks) are used, and these masks are placed on a standard carrier for transfer to different locations or cleanrooms for different processes. For example, blank substrates are transferred from a standard carrier to different locations or cleanrooms for cleansing and mask fabrication using manual or mechanical methods. Fabrication masks are transferred within a standard carrier to different locations or cleanrooms for photomask processes or stored before or after use. Mask carriers (also referring to mask containers, mask boxes, or mask cassettes) include a double-casing design with an inner and outer casing. The inner casing contacts the blank substrate or mask and includes an inner casing lid and an inner casing base. The inner casing lid and inner casing base are designed to fit or connect to each other with high precision. The double-casing design is used during exposure to manufacturing facilities. This allows the photomask (reduction mask) to be transported between manufacturing facilities within the casing.

[0107] The transport of photomasks (reduced photomasks) is carried out between manufacturing plants via vehicles such as trucks. The photomasks (reduced photomasks) are transported in temperature-controlled vehicles. Air conditioning systems are provided on the vehicles to provide an environment that increases relative humidity during transport of the photomasks within the photomask housing. In certain embodiments, the photomask housing is used for transport between facilities made of plastic materials. Higher humidity levels in the air-conditioned storage area (carrier) of the vehicle cause volatile organic compounds (VOCs) to be emitted from the plastic photomask housing. The presence of unacceptable levels of VOCs during transport, including the photomask housing, between manufacturing plants results in additional carbon deposition on the photomask or reduced photomask.

[0108] Total volatile organic compounds (TVOC) are a measurement of the total amount of volatile organic compounds within a given space. In a particular embodiment, an acceptable TVOC measurement for the interior of the enclosure during transport is a concentration of less than 0.5 mg / m³. 3 The temperature is 22℃ and the relative humidity is between 20% and 40%.

[0109] Carbon deposition can occur on photomasks or blank substrates fixed in a housing. Carbon deposition contaminates photomasks and can damage patterns on photomasks or blank substrates, or impede extreme ultraviolet radiation, leading to manufacturing errors. Carbon deposition on photomasks or blank substrates can also severely damage photomasks or blank substrates, and damaged photomasks increase production costs, increase process time, and necessitate expensive systems for identifying and removing carbon deposition from photomasks.

[0110] Protective photomasks to prevent carbon deposition can be used in semiconductor processes such as extreme ultraviolet (EUV) photomasks. In an EUV photomask, a photomask instrument projects a pattern onto a layer of radiating material (photoresist) provided on a semiconductor substrate from a patterning device (e.g., a photomask). The minimum size of the feature that can be formed on the substrate is determined by the wavelength of radiation used to project the pattern onto the substrate by the photomask instrument. Using a photomask instrument with extreme ultraviolet radiation having a wavelength between 1 and 100 nanometers, it is possible to form smaller features on the substrate than with conventional photomask instruments (e.g., using electromagnetic radiation with a wavelength of 193 nanometers).

[0111] Carbon deposition on the photomask causes pattern projection into defects on the semiconductor substrate. This is intended to limit the formation of carbon deposits on the photomask. It should be noted that although the embodiments discussed herein refer to extreme ultraviolet (EUV) systems, the embodiments are not limited to this view. According to the embodiments discussed herein, the mask can be used in other types of photomask systems (e.g., deep ultraviolet photomask systems) without departing from the scope of disclosure.

[0112] Figure 1A This is a schematic diagram and accompanying drawing of an extreme ultraviolet (EUV) photomask system 101. The EUV photomask system 101 includes an EUV radiation source instrument 100 for generating and exposing ultraviolet light, an exposure tool 200 such as a scanner, and an excitation laser source instrument 300. Figure 1A As shown, in some embodiments, the extreme ultraviolet radiation source instrument 100 and the exposure tool 200 are installed on the main floor MF of the cleaning chamber, while the excitation source instrument 300 is installed on the base layer BF located below the main floor. Each of the extreme ultraviolet radiation source instrument 100 and the exposure tool 200 is placed on trays PP1 and PP2, respectively, passing through buffers DP1 and DP2. The extreme ultraviolet radiation source instrument 100 and the exposure tool 200 are coupled to each other via a coupling mechanism that may include a centralized unit.

[0113] The extreme ultraviolet (EUV) photomask system is designed to expose a photoresist layer using UV light (or UV radiation). The photoresist layer is a material sensitive to UV light. The UV photomask system uses an UV radiation source instrument 100 to generate UV light, such as UV light with a wavelength range between approximately 1 nanometer and 100 nanometers. In this example, the UV radiation source 100 generates UV light with a wavelength centered at 13.5 nanometers. In this embodiment, the UV radiation source 100 uses a laser-generated plasma (LPP) mechanism to generate UV radiation.

[0114] The exposure tool 200 includes various reflective optical elements, such as convex / concave / plane mirrors, and the mask holding mechanism includes a mask stage and a wafer holding system. Extreme ultraviolet (EUV) radiation is generated by an EUV radiation source 100, and the EUV radiation is guided by reflective optical elements on the mask and fixed to the mask stage. In some embodiments, the mask stage includes an electrostatic chuck to hold the mask in place. Because gas molecules absorb EUV light, the mask system patterned for EUV masks is kept in a vacuum or low-pressure environment to avoid a lack of EUV intensity.

[0115] Figure 1B The intended simplification of the exposure tool 200 is to demonstrate the exposure of a photoresist-coated substrate 211 using a patterned beam of extreme ultraviolet (EUV) light according to the disclosed embodiment. The exposure tool 200 is an integrated circuit photomask tool such as an exposure machine, scanner, stepper and scanning system, direct write system, or device using contact and / or proximity masks, providing one or more optical elements 205a, 205b, for example, illuminating patterned optical elements, such as an EUV beam magnification mask 205c to generate a patterned beam, and one or more reduced projection optical elements 205d, 205e for projecting the patterned beam onto the substrate 211. The one or more optical elements 205a, 205b provide an EUV beam with a desired cross-sectional shape and desired angle distribution. The magnification mask 205c is protected by a thin film held in place by a thin film frame. The magnification mask 205c reflects and patternes the EUV beam.

[0116] Brief reference Figure 1C The illustration shows the thin film assembly 250 mounted on the magnifying glass 205c, as detailed in the relevant section. The thin film assembly 250 includes a thin film 252 and a thin film frame 254. The magnifying glass 205c has a patterned surface 256. The thin film frame 254 supports the portion of the thin film 252 surrounding the thin film 252 and is detachably attachable to the magnifying glass 205c. The thin film 252 retains contaminants, such as contaminant particles 258, at a distance from the patterned surface 256 of the magnifying glass 205c, ensuring that the contaminant particles 258 are not located at the focal plane of the extreme ultraviolet radiation beam and therefore are not imaged on the substrate 211. Figure 1B ).

[0117] Back Figure 1B Following reflection from the magnifying mask, a patterned beam of extreme ultraviolet light is provided by one or more optical elements 205a, 205b and alternately projected onto a substrate 211 (e.g., a base) fixed by a mechanical assembly. In some embodiments, the one or more optical elements 205a, 205b apply a reduction factor to the radiated beam, forming features smaller than the corresponding features on the magnifying mask. The mechanical assembly provides relative movement between the substrate 211 and the magnifying mask 205c for production control.

[0118] Extreme ultraviolet (EUV) photomask systems can, for example, be used in a scanning mode, where a chuck and mechanical assembly (e.g., a base) synchronously scan as a pattern delivered to the radiation beam is projected onto the substrate 211 (in other words, dynamic exposure). The speed and direction of the base relative to the chuck are determined by the reduction and image reversal characteristics of the exposure tool 200. The patterned beam of EUV radiation incident on the substrate 211 forms a radiation band. The radiation band represents the exposure slit. During scanning exposure, movement of the base, and movement of the base and chuck, causes the exposure slit to travel across the exposure field of the substrate 211. Furthermore... Figure 1B As shown, the extreme ultraviolet photomask tool includes an extreme ultraviolet radiation source 100, which includes plasma in the excitation region ZE that emits extreme ultraviolet light in the chamber 105. The plasma is collected along the path by the collector 110 and reflected into the exposure tool 200 to irradiate the substrate 211.

[0119] As used herein, the term "optical element" is broadly defined to include, and not necessarily limited to, one or more elements that reflect and / or transmit and / or manipulate incident light, and includes, but is not limited to, one or more lenses, windows, filters, wedges, prisms, gratings, transmission fibers, etalons, diffusers, homogenizers, detectors and other instrument components, apertures, axial prisms and mirrors, including multilayer mirrors, near-normal incident mirrors, grazing incident mirrors, specular reflectors, diffusers and combinations thereof. Furthermore, unless otherwise stated, the term "optical element" as used herein is not intended to be limited to components that operate only within one or more specific wavelength ranges, such as extreme ultraviolet output wavelengths, irradiating laser wavelengths, wavelengths suitable for metrology, or any other specific wavelength.

[0120] In one embodiment of this disclosure, the terms mask, photomask, and zoom photomask are used interchangeably. In this embodiment, the mask is a reflective mask. An exemplary structure of the mask includes a substrate having a suitable material, such as a low thermal expansion material or fused silica. In various examples, the material includes titanium dioxide (TiO2) doped silicon dioxide (SiO2), or other suitable low thermal expansion materials. The mask includes multiple reflective multilayers deposited on the substrate. The multilayers include multiple pairs of thin films, such as molybdenum-silicon (Mo / Si) thin film pairs (e.g., a molybdenum layer above or below a silicon layer in each thin film pair). Alternatively, the multilayers may include pairs of molybdenum-beryllium (Mo / Be) thin films or other suitable materials that can be configured to highly reflect extreme ultraviolet light. The mask may also include a capping layer, such as ruthenium (Ru), disposed on the main layer MF for protection. The mask may also include an absorption layer, such as a boron tantalum nitride (TaBN) layer deposited on the multilayers. The absorption layer is patterned to define integrated circuit layers. Alternatively, another reflective layer can be deposited on top of multiple layers and patterned to define the integrated circuit layer, thus forming an extreme ultraviolet phase-shift mask.

[0121] In this embodiment, the semiconductor substrate is a patterned semiconductor wafer, such as a silicon wafer or other type of wafer. The semiconductor substrate uses a photoresist layer coating that is sensitive to extreme ultraviolet light in this embodiment. Various components include those described on which are integrated and operable to perform photomask exposure processes.

[0122] The photomask system may also include other modules or be integrated (coupled) using other modules. For example... Figure 1A As shown, the extreme ultraviolet radiation source 100 includes a target droplet generator 115 and a laser-excited plasma collector 110, which are enclosed by a chamber 105. The target droplet generator 115 generates a plurality of target droplets (DPs). In some embodiments, the target droplets (DPs) are tin (Sn) droplets. In some embodiments, each tin droplet has a diameter of approximately 30 micrometers (μm). In some embodiments, the tin droplets (DPs) are generated at a rate of approximately 50 droplets per second and the excitation zone (ZE) is introduced at a rate of approximately 70 meters per second (m / s). Other materials may also be used for the target droplets; for example, tin includes liquid materials such as tin- or lithium (Li) eutectic alloys.

[0123] The excitation laser LR2 generated by the excitation laser source instrument 300 is a pulsed laser. In some embodiments, the excitation laser includes a preheating laser and a main laser. The preheating laser pulse heats (or preheats) the target droplet to create a low-density target heat-conducting column, which is then sequentially heated (or preheated) by the main laser pulse, resulting in an increase in extreme ultraviolet light emission. In various embodiments, the preheating laser pulse has a dot size of approximately 100 micrometers or less, and the main laser pulse has a dot size of approximately 200-300 micrometers.

[0124] Laser pulse LR2 is generated by exciting laser source 300. Laser source 300 may include laser generator 310, laser guiding optics 320, and focusing instrument 330. In some embodiments, laser generator 310 includes a carbon dioxide (CO2) or neodymium-doped yttrium aluminum garnet (Nd:YAG) laser source. Laser LR1 generated by laser generator 300 is guided by laser guiding optics 320 and focused by focusing instrument 330 into exciting laser LR2, and then introduced into extreme ultraviolet radiation source 100.

[0125] The laser beam LR2 passes directly through a window (or lens) into the excitation region ZE. The window is made of a suitable material that is substantially transparent to the laser beam. Pulsed laser generation is synchronized with the generation of the target droplet. As the target droplet moves through the excitation region, the pre-pulse heats the target droplet and transforms it into a low-density target heat-conducting column. The delay is controlled between the pre-pulse and the main pulse to allow the target heat-conducting column to form and expand to an optimal size and geometry. When the main pulse heats the target heat-conducting column, a high-temperature plasma is generated. The plasma emits extreme ultraviolet radiation (EUV), which is collected by a collector (mirror) 110. The collector 110 has a reflective surface for reflecting and focusing the EUV radiation during the photomask exposure process. In some embodiments, a droplet trap 120 is used to capture additional target droplets. For example, some target droplets may be intentionally missed by the laser pulse.

[0126] Collector 110 includes a specific coating material and shape to function as a mirror for collecting, reflecting, and focusing ultraviolet light. In some embodiments, collector 110 is designed with an ellipsoidal geometry. In some embodiments, the coating material of collector 110 is similar to a reflective multilayer of an extreme ultraviolet (EUV) shield. In some embodiments, the coating material of collector 110 includes multiple layers (such as multiple molybdenum / silicon film pairs) and may also include a capping layer (such as ruthenium) coating that has substantially reflected EUV light over the multiple layers. In some embodiments, collector 110 may also include a grating structure designed to effectively scatter laser beams directly onto collector 110. For example, the silicon nitride layer coating on collector 110 is also patterned to have a grating pattern in some embodiments.

[0127] In such extreme ultraviolet radiation source instruments, plasma is used to create substantial debris, such as atoms of ions, gases, and liquid droplets, through laser application, and is desired to be emitted by ultraviolet radiation. It is essential to prevent the accumulation of material in the collector 110 and from the excitation chamber 105 into the exposure tool 200, as well as to prevent substantial debris from forming.

[0128] like Figure 1A As shown, in some embodiments, a buffer gas is supplied from a first buffer gas supply 130 through an aperture in the collector 110 through which the pulsed laser is delivered to the molten tin droplet. In some embodiments, the buffer gas is hydrogen, helium, argon, nitrogen, and another inert gas. In a particular embodiment, hydrogen is used as hydrogen radicals generated by ionization of the buffer gas, which can be used for cleaning purposes. The buffer gas may also be supplied through one or more second buffer gas supplies 135 toward and / or around the collector 110. Furthermore, the chamber 105 includes one or more gas outlets 140 so that the buffer gas is discharged from the chamber 105.

[0129] Hydrogen gas has low absorption of extreme ultraviolet radiation. Upon reaching the coated surface of collector 110, the hydrogen gas reacts chemically with the metal of the droplets to form hydrogen compounds, such as metallic hydrides. When tin (Sn) is used as the droplets, stanane (SnH4) is formed as a gaseous byproduct of the extreme ultraviolet generation process. Gaseous stanane (SnH4) is discharged through outlet 140. However, it is difficult to completely remove all gaseous stanane from the chamber and to prevent stanane from entering the exposure tool 200.

[0130] To trap stanane or other debris, one or more debris collection mechanisms or devices 150 are used in chamber 105. For example... Figure 1A As shown, one or more debris collection mechanisms or devices 150 are arranged along the optical axis A1 between the excitation region ZE and the output end 160 of the extreme ultraviolet radiation source 100.

[0131] During the manufacturing of integrated circuits using photomask equipment, different reduction magnification photomasks are used to create different circuit patterns to form on different layers of the integrated circuit. Therefore, different reduction magnification photomasks are changed during the manufacturing of different layers of the integrated circuit. A rapid changeover device (RED) is also intended to be a reduction magnification photomask changeover device, which is used to effectively change the reduction magnification photomask during the photomask process.

[0132] Figure 3A and Figure 3B The display reduction light cover box includes an upper cover 340 and a lower base 341. Figure 3A Showing the inner surface of the upper cover 340 and Figure 3B The inner surface of the lower base 341 is shown, which is constrained by a limiting mechanism or support member 347a provided on the upper cover 340 and the lower base 341. Figure 3C and 3D The reduction mask 205c is held directly in place. In a particular embodiment, the purge valve 348 is positioned on the lower base 341. Figure 3D ).

[0133] In some specific embodiments, the materials used for the shielding enclosure include one or more plastic materials. In some embodiments, low-emission resin materials include thermoplastic polymers such as polyetheretherketone (PEEK) and polyamide-imide. Other plastic materials such as one or more polyvinyl chloride, polycarbonate, polypropylene, polytetrafluoroethylene, and polyethylene can be used as materials for the shielding enclosure.

[0134] Figure 3A and Figure 3B Shown Figure 3C and Figure 3D The reduced-size photomask box before the application of the double coating. In a particular embodiment, the dehumidification layer 345 is applied with the first coating as in the double coating, such as... Figure 3C As shown. In some embodiments, the dehumidification layer 345 is applied to the inner surface of the upper cover 340, such as... Figure 3C As shown. In some embodiments, the dehumidification layer 345 extends laterally along the upper cover ( Figure 4 The dehumidification layer 345 extends and is located on the vertical inner surface of side 353 (not shown). In a particular embodiment, the dehumidification layer 345 has a thickness ranging from 5 mm to 25 mm and a lead height of 40 mm. In other embodiments, the catalyst layer 346 is applied to the inner surface of the lower base 341, such as... Figure 3D As shown. The combination of the dehumidifying layer 345 and the catalyst layer 346 is intended to serve as a double coating. In a particular embodiment, the positions of the double coatings may be reversed, with the catalyst layer 346 located on the upper cover 340 and the dehumidifying layer 345 located on the lower base 341.

[0135] In certain embodiments, the material for the dehumidification layer 345 includes a desiccant, such as silica (SiO2) or silica. A desiccant is a substance or material that absorbs and / or absorbs moisture from the surrounding environment. In certain embodiments, the dehumidification layer 345 includes a material with absorption properties that attracts water molecules and traps moisture on its surface, thereby reducing relative humidity (in other words, the amount of moisture / vapor in the air). In some embodiments, silica gel is used as the desiccant material, but other desiccant chemicals can be used for the dehumidification layer 345. In certain embodiments, silica gel is dispersed in a polymer, and the film absorbs and / or absorbs water vapor. In certain embodiments, a desiccant film composed of low-density polyethylene and dispersed silica gel is used as the dehumidification layer 345. In some embodiments, the silica gel is applied to the inner surface of the enclosure and fixed to the surface of the enclosure by adhesive bonding. In other embodiments, the silica gel contains a humidity indicator that indicates the water saturation level of the desiccant through color changes. In certain embodiments, the indicator may be cobalt chloride (CoCl2). Anhydrous cobalt chloride is blue in color; however, when cobalt chloride combines with water molecules (e.g., CoCl2·2H2O), it turns purple. Further hydration results in a pink cobalt(II) chloride complex [Co(H2O)6]Cl2. This visual cue allows operators or engineers to measure the saturation level of the desiccant material.

[0136] In certain embodiments, the catalyst layer 346 includes a catalytic material for the oxidation of volatile organic compounds (VOCs) and comprises noble metals and non-noble metals. Noble metal-based catalysts and metal oxide-based catalysts are known for their effectiveness and high oxidation efficiency in the oxidation of VOCs at low temperatures. In some embodiments, the catalysts used for the oxidation of VOCs are divided into two groups: those based on supported metals and those based on metal oxides. In certain embodiments, the former includes platinum, palladium, and gold-based catalysts. Noble metal-based catalysts include platinum (Pt), palladium (Pd), silver (Ag), and gold (Au). Non-noble metal-based catalysts include manganese (Mn), cobalt (Co), cerium (Ce), and copper (Cu). In certain embodiments, the metal catalyst adsorbs gaseous VOCs onto the catalyst surface, decomposing the VOCs into carbon dioxide (CO2) and water (H2O) through a catalytic oxidation reaction. In some embodiments, the catalytic oxidation reaction decomposes VOCs and converts carbon-containing VOCs into carbon dioxide and water without producing other toxic substances. In a particular embodiment, the catalyst layer 346 has a thickness ranging from about 5 mm to 25 mm at a pin height of 40 mm.

[0137] like Figure 4 As illustrated, the photomask 205c is stored in a housing 360. The housing 360 includes an upper cover 340 and a lower base 341. In a particular embodiment, the photomask 205c is stored facing downwards in the housing 360. More specifically, the printed or patterned surface 349 (also meaning as previously shown) of the photomask 205c faces the catalyst layer 346, and the back surface 350 of the photomask 205c faces the dehumidification layer 345. In some embodiments, the film is shown on the patterned surface 349 for clarity. In some embodiments, the film (not shown) is mounted on the photomask 205c in one or more restraining mechanisms 347a. The housing 360 includes one or more restraining mechanisms 347a to reduce sliding or movement of the photomask 205c and thus secure the photomask 205c in the housing 360. By way of example, the limiting mechanism 347a includes a clamp, a groove, a pin, a retaining block, and a spring. The upper cover 340 is coupled to the lower base 341 to define the internal environment of the interior space 351 or the enclosure 360. The zoom lens 205c is located in the interior space 351, between the upper cover 340 and the lower base 341. In a particular embodiment, such as... Figure 4 As shown, the upper cover 340 includes a generally transverse top 352 and a generally vertically extending side 353 extending from the top 352, and forming a sidewall or outer edge of the top 352.

[0138] like Figure 5As illustrated, side portion 353 has a lateral (or radial) width, and surface 354 forms the lower surface (or at least in this portion) of side portion 353 of upper cover 340. Upper cover 340 and lower base 341 are shown as... Figure 5 They are separated from each other. Surface 355 forms the upper surface of the lower base 341 (or at least in this portion). When the inner upper cover 340 is positioned above the inner box base 346, surfaces 354 and 355 face each other. Figure 5 When the upper cover 340 is placed on the lower base 341, surface 354 contacts surface 355. Figure 4 ).

[0139] In some embodiments, one or more double coatings are removably attached to the surface of the upper cover 340 and the lower base 341. Therefore, the desiccant layer 345 and / or catalyst layer 346 can be easily replaced in some embodiments, for example, in case of damage or when replacement of the desiccant layer 345 and / or catalyst layer 346 is planned. In some embodiments, the desiccant and / or catalyst material is mixed with a solvent, such as a liquid mixture, and then the solvent is removed during a drying operation, leaving the solid desiccant layer 345 and / or catalyst layer on the upper cover 340 and / or lower base 341. In some embodiments, the desiccant layer 345 and / or catalyst layer 346 has an adhesive layer that allows for easy movement of the layers. In some embodiments, layers 345, 346 are applied, such as by spin coating. In other embodiments, the dehumidifying layer 345 and the catalyst layer 346 are bonded to the inner surfaces of the upper cover 340 and the lower base 341 wall using a low-volatile organic compound adhesive selected from epoxy resin, acrylic resin, polyurethane, phenolic resin, rubber, polyvinyl chloride (PVC), silicone, and hot melt adhesive. In some embodiments, the thickness of the dehumidifying layer 345 may be the same as or different from the thickness of the catalyst layer 346. In other embodiments, the dehumidifying layer 345 comprises a single layer or multiple layers. In some embodiments, the catalyst layer 346 comprises a single layer or multiple layers.

[0140] As discussed above, the disclosed specific embodiments lead to the use of a housing for transporting the photomask during reduction magnification between manufacturing plants for semiconductor device fabrication. The housing 360 includes a double coating on the inner surface of the upper cover 340 and the lower base 341. For the decomposition of volatile organic compounds, the double coating includes a desiccant layer 345 and a catalyst layer 346.

[0141] Other implementations, as discussed below, include a micro-cleaning chamber (micro-chamber) design to accommodate the mask box 360 during transport and maintain ideal environmental conditions during transport. Reduced mask repairs result in increased production efficiency for scaled-down masks.

[0142] In a particular embodiment, a housing 360, including the photomask 205c, is moved from a manufacturing plant to another. In a particular example, transportation, such as truck transport, uses the housing 360 along with the photomask 205c included therein. Transport time varies depending on the distance from the manufacturing plant but typically takes several hours. The photomask 205c must be properly protected during transport. The storage area of ​​the vehicle is temperature-controlled to maintain a temperature of approximately 20°C to 22°C. An air conditioning system on the vehicle maintains the controlled temperature environment during transport. However, higher relative humidity levels exacerbate exhaust from the housing 360 during transport and can lead to carbon deposition on the surface of the scaled-down photomask 205c, as discussed above.

[0143] like Figure 6 In some embodiments, the cover 360 is placed inside the container 400. One or more containers 400 are loaded onto a transport vehicle, such as a truck 501. Figure 7 In some embodiments, each container 400 includes a door 401 with a handle 402 for opening and closing. In some embodiments, the door 401 includes a seal around its edge to maintain a precise airtight seal when the door 401 is closed. In a particular embodiment, the container 400 includes a hygrometer / thermometer 403 disposed within the container 400 to measure temperature and humidity. The hygrometer / thermometer 403 is a combination of a hygrometer and a thermometer, but in other embodiments, the two separate instruments can be used separately to display temperature and humidity levels on a screen within the container 400.

[0144] In some embodiments, one or more shock or vibration environment instruments 404 are provided to measure and / or record the occurrence of shocks, effects, and / or vibrations exceeding selected thresholds during the transport of each container 360. This helps identify instances where the container 360 and the zoom lens 205c included herein may have been mishandled during transport. In certain embodiments, the shock or vibration environment instrument 404 is a mechanical or electromechanical device designed to indicate that an effect or shock has occurred above a specific threshold. Trucks traveling on highways can experience poor road conditions, resulting in shocks or vibrations during transport. In certain embodiments, if the shock or vibration environment instrument 404 has not yet been triggered or turned off, then the inspection time for a particular container 400 can be substantially reduced, as only those containers 400 that have been turned off or triggered need to be inspected to ensure that the zoom lens 205c included in the container 360 has not been damaged.

[0145] In a particular implementation, each container 400 is a matching impact absorption device 405, such as Figure 6 As shown. In a particular embodiment, the shock-absorbing device 405 includes a spring, coil, foam, or other shock-absorbing material sufficient to absorb shocks and vibrations generated during transportation. Figure 6As shown, the shock-absorbing device 405 is placed on the bottom surface of the container 400. However, the number and position of the shock-absorbing device 405 can vary. For example, as... Figure 9 As shown, in some embodiments, the impact absorption device 405 is placed on multiple outer sides of the container 400.

[0146] In certain embodiments, container 400 includes an inert gas source 406 for circulating inert gas within the interior 407 of container 400. In some embodiments, as indicated by straight arrow 408, air is drawn from the interior 407 of container 407 and a fresh inert gas, such as nitrogen, is introduced into the interior 407, as indicated by straight arrow 409. In certain embodiments, nitrogen source 406 includes a moisture trap for capturing moisture in the air discharged from the interior 407 of container 400, as indicated by straight arrow 408. In other embodiments, a filter is provided to remove other impurities from the air before it is discharged from container 400. In some embodiments, other inert gases such as helium, argon, neon, xenon, and krypton may be used as a gas source instead of nitrogen. In certain embodiments, a plurality of purge valves 348 associated with a plurality of enclosures 360 are connected to nitrogen source 406. In some embodiments, air from the interior space 351 of each enclosure 360 ​​is discharged from enclosure 360 ​​to nitrogen source 406 via purge valve 348. In some embodiments, container 400 includes a valve (not shown) attached to a container sidewall that allows gas to pass through the walls of container 400. A purge valve 348 is connected to the valve via a gas conduit (not shown) to allow inert gas to flow into and out of the hood 360. In some embodiments, the purge valve is placed or mounted on a vent of container 400. In other embodiments, a nitrogen purging process replaces the gas present inside container 407 and / or the nitrogen-containing internal space 351 of hood 360 to remove unwanted substances and prevent damage to the cyclops lens 205c during transport.

[0147] like Figure 7 As shown, container 400 can be placed in the storage or cargo area of ​​a vehicle, such as truck 501. In some embodiments, storage or cargo area 501a accommodates one or more containers 400. In a particular embodiment, a nitrogen gas source is connected to each container via mountings, multiple valves, and multiple hoses to connect a nitrogen gas source 406 to each container 400. In a particular embodiment, when an electronic sensor is present in container 400, the electronic sensor provides a means to measure the humidity level of the exhaust gas. In some embodiments, each container is fitted with its own inert gas supply canister, which is attached to the corresponding container 400.

[0148] In some embodiments, the storage or cargo area 501a is a temperature-controlled area, including an air conditioning system 503 to maintain a predetermined temperature in the storage or cargo area 501a during transport of the shroud 360 housed in the respective container 400. In certain embodiments, the operator or driver 502 is warned of adverse environmental conditions in the storage area and / or potential damage to one or more containers 400 in the storage or cargo area 501a. In certain embodiments, alarms and / or current readings may be sent to one or more manufacturing facilities for inspection by an operator or engineer, who may contact the operator or driver 502 of the truck 501 regarding one or more alarms or equipment readings. Additional instructions may be provided to the operator or driver 502 to address the cause of the alarm.

[0149] In a particular embodiment, truck 501 is equipped with a computing device 710 to record and monitor readings from containers 400 and other equipment in storage or cargo area 501a. In another embodiment, the collected information or data is transmitted via the computing device 710 to a network 740 at one or more manufacturing facilities 510, 511, such as... Figure 7 As shown. Information or data transmitted to one or more manufacturing facilities 510, 511 can monitor real-time alarms. In some embodiments, operators or engineers at one or more manufacturing facilities can contact truck operators or drivers 502 with instructions to remedy alarms and prevent damage to the photomask 205c. In a particular embodiment, truck 501 is a self-driving vehicle and the operator or engineer can remotely control the equipment on the truck to handle and clear any alarms.

[0150] According to some embodiments disclosed herein Figure 8 This describes the layout of the miniature purge chamber system 600. In a particular embodiment, a housing 360 is inserted into a container 400, with the container door 401 closed and an initial supply of nitrogen provided from a nitrogen source 406 into the container. A gas control module 601 regulates the flow and recovery of nitrogen (or other inert gas) from the nitrogen source 406 into the container 400. In some embodiments, the gas control module 601 is coupled to a computing device 710, and the computing device 710 is configured to control the gas control module 601 and regulate the flow and recovery of nitrogen from the nitrogen source 406 into the container 400.

[0151] In certain embodiments, the computing device 710 includes storage for storing flow rate data 606 collected from the gas control module 601. In some embodiments, the monitoring module 602 is provided to monitor data 603 received from the shock or vibration environment instrument 404. In some embodiments, the monitoring module 602 is configured to monitor humidity / temperature data 604 received from the hygrometer / thermometer 403. In some embodiments, the monitoring module 602 is configured to monitor the lifecycle of the catalyst layer 346 included in each enclosure 360. The catalyst layer is replaced after a preset time period to maintain a sufficient level of decomposition of volatile organic compounds 343. In some embodiments, the catalyst layer 346 is replaced after one to two years of use. In some embodiments, the monitoring module 302 monitors the lifecycle of the catalyst layer 346 and the computing device 710 generates an alarm when the catalyst layer 346 reaches the replacement deadline. In other embodiments, the dehumidifying layer 345 is replaced after a preset time period, and an alarm is generated because the computing device 710 recommends that the dehumidifying layer 345 be ready for replacement.

[0152] Figure 10 The block diagram illustrates an example of a computing device 710 for receiving and recording data received from gas control module 601 and / or monitoring module 602. According to some embodiments, it also includes information and data from devices (e.g., air conditioning system 503) in a storage area. In some embodiments, the computing device 710 performs operations using hardware or a combination of hardware and software, in a dedicated server, integrated into another entity, or distributed across multiple entities. In some embodiments, the computing device 710 is communicatively connectable to one or more remote manufacturing facilities using wireless network 740 to agree on data exchange.

[0153] In some embodiments, the computing device 710 is configured to calculate the risk level for carbon deposition 344 forming on the surface of photomask 205c during transport based on data collection. In a particular embodiment, the computing device 710 is configured to determine the risk level associated with the formation of carbon deposition 344 based on one or more of the following: data 603 collected from one or more vibration environmental instruments 404, data 604 collected by a hygrometer / thermometer 403, data 605 related to the catalytic cycle, and / or data 606 related to nitrogen flow rate. In a particular embodiment, when the computing device determines that the risk of carbon deposition 344 formation is too high, the computing device instructs the gas control module 601 to circulate clean nitrogen into container 400. In a particular embodiment, the computing device 710 tracks flow rate data 606 to determine the risk level during transport.

[0154] In a particular embodiment of this disclosure, when the shock environment instrument 404 is turned on or triggered during transport of container 400 and when the shock or vibration level exceeds a threshold, the computing device can instruct the gas control module 601 to circulate clean nitrogen air into container 400. In other embodiments, if the catalyst layer 346 is nearing the end of its cycle and needs replacement, the computing device 710 instructs the gas control module 601 to circulate clean nitrogen air into container 400. In a particular embodiment, clean nitrogen air circulation occurs more frequently when the catalyst layer 346 is nearing the end of its cycle.

[0155] In other embodiments disclosed herein, when the humidity level is below 20%, the computing device 710 determines that the risk level for carbon deposition 344 formation is low and determines that the container 360 is at a low risk level for carbon deposition 344 formation during an estimated transport period of at least 8 hours. In other embodiments, a medium risk level is determined when the humidity level is below 50% and the estimated transport period is determined to be between six and eight hours. In other embodiments, when the humidity level is below 70% and the estimated transport period is determined to be between 4 and 6 hours, the computing device 710 determines that a high risk exists. In other embodiments, when the humidity level is high, reducing the risk of carbon deposition formation and extending the transport time, the computing device 710 will instruct the gas control module 601 to circulate clean nitrogen air into the container 400 more frequently.

[0156] In a particular embodiment, computing device 710 includes a display 711, a processor 712, memory 713, an input / output interface 714, a network interface 715, and storage 716 and container 400 for storing an operating system 717, programs or application programs 718 (e.g., applications for controlling the operation of associated devices). The processor 712 can be a general-purpose microprocessor, microcontroller, digital signal processor (DSP), application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), programmable logic device (PLD), controller, state machine, gated logic, distributed hardware component, or any other suitable entity capable of performing computational or other information operations. Storage 716 can be random access memory (RAM), flash memory, read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), temporary register, hard disk, removable disk, read-only optical disc (CD-ROM), digital versatile optical disc (DVD), or any other suitable storage device for storing information and instructions executed by processor 712. The processor 712 and storage 716 can be supplemented or incorporated into special purpose logic circuits.

[0157] Network interface 715 includes network interface cards, such as Ethernet cards and modems. In some embodiments, input / output interface 714 is configured to connect multiple devices, such as input devices and / or output devices. Example input devices include keyboards and pointing devices, such as mice or trackballs, through which a user can provide input to computing device 710. Other types of input devices are used to provide, for example, haptic input devices, visual input devices, auditory input devices, or human-machine interface devices for user interaction. For example, feedback provided to the user can be any form of sensory feedback, such as visual feedback, auditory feedback, or haptic feedback; and input from the user can be received in any form, including sound, speech, tactile, or brainwave input. To display information to the user, example output devices include display devices, such as light-emitting diode (LED), cathode ray tube (CRT), or liquid crystal display (LCD) screens.

[0158] When executed by computing device 710 (or processor 712 therein), application program 718 may include instructions that cause computing device 710 (or processor 712 therein) to control modules that control devices associated with container 400 and perform other operations, methods and / or processors, as expressly or implicitly described in one embodiment of this disclosure.

[0159] Data 719 may include data with preset parameters used in control operations, which is received, for example, via input / output interface 714 or via network interface 715, for data displayed on display 711, data transmitted to or from one or more manufacturing facilities 510, 511, or data generated during operation of computing device 710.

[0160] Figure 11 A flowchart illustrating the method for forming an embodiment of this disclosure is provided. The method includes operation S101: providing a first cover, wherein the first cover includes a catalytic layer applied to a first inner surface of the first cover; operation S103: providing a second cover, wherein the second cover includes a dehumidifying layer applied to a second inner surface of the second cover; operation S105: disposing a photomask between the first cover and the second cover; and operation S107: connecting the first cover and the second cover, such that the photomask covers the internal space between the first cover and the second cover. In a particular embodiment, the catalytic layer is applied to the second cover and the dehumidifying layer is applied to the first cover.

[0161] The embodiments disclosed herein guide the reduction of carbon deposition on photomasks during transport. With this embodiment, the photomask housing and micro-cleaning chamber are designed to provide reduced carbon deposition on the photomask during transport. This results in reduced photomask maintenance costs and increased photomask production efficiency and semiconductor device processes.

[0162] It will be understood that not all advantages need to be discussed here; non-specific advantages are required for certain implementations or examples, and other implementations or examples may offer different advantages.

[0163] According to the embodiments disclosed herein, there is a method for encapsulating a photomask within a photomask housing. The method includes providing a first cover, wherein the first cover includes a catalytic layer applied to a first inner surface of the first cover. A second cover is provided, wherein the second cover includes a dehumidifying layer applied to a second inner surface of the second cover. The photomask is disposed between the first cover and the second cover. The first cover and the second cover are connected such that the photomask encapsulates the interior space of the first cover and the second cover. In some embodiments, the dehumidifying layer comprises silicon dioxide (SiO2). In a particular embodiment, the catalytic layer comprises a metal. In some embodiments, the metal is selected from platinum (Pt), palladium (Pd), silver (Ag), gold (Au), manganese (Mn), cobalt (Co), cerium (Ce), or copper (Cu). In other embodiments, a restraining mechanism is provided on the first cover and the second cover for securing the photomask. In other embodiments, a gas purging valve is formed in the first cover. In a particular embodiment, the first cover and the second cover comprise a plastic material. In some embodiments, the limiting mechanism plastic material is selected from polydietherketone, polyamide-imide, polyvinyl chloride, polycarbonate, polypropylene, polytetrafluoroethylene, or polyethylene. In some embodiments, the photomask includes a printed or patterned surface facing the catalyst layer.

[0164] Another embodiment of this disclosure includes a photomask housing. The photomask housing includes a first cover having a first outer surface and a first inner surface on the opposite side. A second cover includes a second outer surface and a second inner surface on the opposite side. The first cover and the second cover are in contact with each other, such that an internal space is formed between the first cover and the second cover, which include the photomask. A catalyst layer is disposed on the first inner surface of the first cover. A dehumidifying layer is disposed on the second inner surface of the second cover. In some embodiments, the dehumidifying layer includes silicon dioxide (SiO2). In some embodiments, the catalyst layer includes a metal. In some embodiments, the metal is selected from platinum (Pt), palladium (Pd), silver (Ag), gold (Au), manganese (Mn), cobalt (Co), cerium (Ce), or copper (Cu). In other embodiments, a purge valve is formed in the first cover. In some embodiments, the first cover and the second cover include a plastic material. In some embodiments, the plastic material is selected from poly(dietherketone), polyamide-imide, polyvinyl chloride, polycarbonate, polypropylene, polytetrafluoroethylene, or polyethylene.

[0165] Another embodiment of this disclosure includes a photomask housing system. The system includes a photomask housing with a first cover having a first outer surface and a first inner surface; a second cover having a second outer surface and a second inner surface. The first and second covers are in contact with each other, forming an internal space between the first and second covers including the photomask. A catalytic layer is disposed on the first inner surface of the first cover. A dehumidifying layer is disposed on the second inner surface of the second cover. A container is configured to house at least one photomask housing within the internal space of the container. A first instrument is configured to measure the humidity level within the internal space of the container. A second instrument is configured to measure the level of shock or vibration applied to the container. An inert gas source is configured to circulate inert gas into the internal space of the container. A controller is configured to control the circulation of the inert gas source based on at least one of the humidity level or the shock level. In some embodiments, shock absorption devices are applied to the outer surface of one or more containers. In some embodiments, the dehumidifying layer comprises silica (SiO2). In some embodiments, the catalytic layer comprises a metal.

[0166] Another embodiment of this disclosure includes a photomask housing system. The system includes a photomask housing with a first cover having a first outer surface and a first inner surface; a second cover having a second outer surface and a second inner surface. The first and second covers are in contact with each other, forming an internal space between the first and second covers including the photomask. A catalytic layer is disposed on the first inner surface of the first cover. A dehumidifying layer is disposed on the second inner surface of the second cover. A container is configured to receive at least one photomask housing within the internal space of the container. A first instrument is configured to measure the humidity level within the internal space of the container. A second instrument is configured to measure the level of shock or vibration applied to the container. A controller is configured to circulate an inert gas into the internal space of the container based on the humidity level, the shock level, or at least one of the plurality of vibration levels.

[0167] The foregoing outlines the features of many embodiments or examples, enabling those skilled in the art to better understand the various forms of an embodiment of this disclosure. Those skilled in the art should understand that they can readily use this disclosure as the basis for designing or modifying other processes and structures to achieve the same purpose and / or attain the same advantages of the embodiments or examples described herein. Those skilled in the art should also recognize that such equivalent constructions do not depart from the spirit and scope of an embodiment of this disclosure, and that they can make various changes, substitutions, or replacements without departing from the spirit and scope of an embodiment of this disclosure.

Claims

1. A four-fold mask housing, characterized by include: A first cover body, including a first outer surface and a first inner surface on the opposite side; A second cover body, including a second outer surface and a second inner surface on the opposite side. The first cover and the second cover are in contact with each other, so that an internal space is formed between the first cover and the second cover to include a one-time reduction mask; A catalyst layer is disposed on the first inner surface of the first cover; and A dehumidifying layer is disposed on the second inner surface of the second cover.

2. The four-fold mask housing of claim 1, wherein, The dehumidifying layer includes silica.

3. The reduced projection mask housing of claim 1, wherein, The catalyst layer comprises a metal.

4. The photomask housing as described in claim 1, characterized in that, It also includes a plurality of purge valves formed in the first cover.

5. The photomask housing as described in claim 1, characterized in that, The first cover and the second cover comprise a plastic material.

6. A reduction photomask housing system, characterized in that, include: A 1x shrinkable housing includes: A first cover body, comprising a first outer surface and a first inner surface; A second cover body, including a second outer surface and a second inner surface, The first cover and the second cover are in contact with each other, so that an internal space is formed between the first cover and the second cover to include a light-shrinking mask. A catalyst layer is disposed on the first inner surface of the first cover; and A dehumidifying layer is disposed on the second inner surface of the second cover; A container configured to accommodate at least one times the size of the shimmering cover housing within an internal space of the container; A first instrument configured to measure a humidity level within the internal space of the container; A second instrument configured to measure one or more shock levels or vibration levels applied to the container; An inert gas source, configured to circulate an inert gas into the internal space of the container; and A controller configured to control the inert gas source to circulate the inert gas based on at least one of the humidity level, the shock level, or the plurality of vibration levels.

7. The reduction photomask housing system as described in claim 6, characterized in that, It also includes multiple shock-absorbing devices applied to one or more outer surfaces of the container.

8. A photomask housing system, characterized in that, include: A 1x shrinkable housing includes: A first cover body, comprising a first outer surface and a first inner surface; A second cover body, including a second outer surface and a second inner surface, The first cover and the second cover are in contact with each other, so that an internal space is formed between the first cover and the second cover to include a light-shrinking mask. A catalyst layer is disposed on the first inner surface of the first cover, the catalyst layer comprising a metal; and A dehumidifying layer is disposed on the second inner surface of the second cover; A container configured to accommodate at least one times the size of the shimmering cover housing within an internal space of the container; A first instrument configured to measure a humidity level within the internal space of the container; A second instrument configured to measure one or more shock levels or vibration levels applied to the container; and A controller configured to circulate an inert gas into the interior space of the container based on at least one of the humidity level, the shock level, or the plurality of vibration levels.

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