A motherboard layout structure for smartwatches and a smartwatch

Abstract

This application discloses a motherboard layout structure for a smartwatch and the smartwatch itself. The motherboard is a flat motherboard, including a first surface and a second surface opposite to the first surface. The first surface includes a core processor area, a power management area, a wireless communication area, and an auxiliary function module area. The second surface includes a multimedia and power interface area and a physiological detection and user interaction interface area. The core processor area is located in the center of the motherboard to shorten the wiring distance to other areas. The power management area is located near the battery connection to reduce the length of the power transmission line. The wireless communication area is located at the edge of the motherboard and away from high-frequency interference sources to reduce electromagnetic interference. The auxiliary function module area is suitable for installing spring contacts and vibration motors. This optimizes the placement of components inside the smartwatch, fully utilizes motherboard space, and results in a more rational layout.

Description

Technical Field

[0001] This application relates to the field of smartwatch technology, and more particularly to a motherboard layout structure for use in smartwatches and a smartwatch. Background Technology

[0002] As portable devices integrating various advanced technologies, smartwatches can perform multiple functions such as communication, location tracking, health monitoring, mobile payment, and information notifications, greatly enhancing users' daily convenience and digital experience. With users' increasing demands for wearing comfort and aesthetics, miniaturization has become an important development direction for smartwatches—integrating a wealth of functional modules while minimizing the watch's size. However, there is an inherent contradiction between functional diversity and device size.

[0003] Therefore, how to rationally arrange electronic components, improve integration, and optimize performance such as heat dissipation and electromagnetic compatibility within a limited space has become a key technical problem that urgently needs to be solved in the design of smartwatches. Utility Model Content

[0004] In view of this, this application discloses a motherboard layout structure for use in smartwatches and a smartwatch.

[0005] In a first aspect, this application discloses a motherboard layout structure for use in a smartwatch. The motherboard is a flat motherboard, comprising a first surface and a second surface opposite to the first surface, with the first and second surfaces having the larger surface area on the main board. The first surface includes a core processor area, a power management area, a wireless communication area, and an auxiliary function module area. The second surface includes a multimedia and power interface area and a physiological detection and user interaction interface area. The core processor area is located in the center of the motherboard to shorten the wiring distance to other areas. The power management area is located near the battery connection to reduce the length of the power transmission line. The wireless communication area is located at the edge of the motherboard and away from high-frequency interference sources to reduce electromagnetic interference. The auxiliary function module area is suitable for installing spring clips and vibration motors. The multimedia and power interface area and the physiological detection and user interaction interface area are respectively located on opposite sides of the second surface to connect to corresponding devices.

[0006] Optionally, a closed-loop frame is provided around the outer periphery of the motherboard, the shape of which matches the shape of the motherboard.

[0007] Optionally, the motherboard is an irregularly shaped motherboard, with the auxiliary function module area located at the edge of the motherboard.

[0008] Optionally, the core processor region includes a central processing unit (CPU) and memory chips disposed adjacent to the CPU, with the outer surfaces of the CPU and the memory chips connected to heat dissipation elements.

[0009] Optionally, the heat dissipation element is a heat sink, and the outer surfaces of the central processing unit and the memory chips are connected to the same heat sink through thermally conductive silicone.

[0010] Optionally, the wireless communication area includes a Bluetooth chip, a WiFi / GPS chip, a multi-mode power amplifier chip, and multiple antenna springs. The Bluetooth chip and Bluetooth antenna springs are located on the same side edge of the motherboard and away from the core processor area.

[0011] Optionally, the WiFi / GPS chip is located in one corner of the motherboard, close to its corresponding antenna spring, to improve signal reception sensitivity.

[0012] Optionally, the auxiliary function module area includes an accelerometer chip, an NFC chip, and a crystal chip. The accelerometer chip is located in a stable area on the motherboard to reduce errors caused by vibrations of other components on the motherboard; the NFC chip is located close to the surface of the smartwatch; and the crystal chip is located in an area away from high-frequency circuits and is equipped with a shielding structure to reduce electromagnetic interference.

[0013] Optionally, the multimedia and power interface area includes a microphone, a battery connector, a front camera connector, and a rear camera connector, while the physiological detection and user interaction interface area includes a heart rate connector, a screen connector, and a charging connector.

[0014] Secondly, this application discloses a smartwatch that adopts the motherboard layout structure disclosed in the first aspect above.

[0015] In summary, the motherboard layout structure and smartwatch disclosed in this application have at least the following beneficial effects: By optimizing the placement of various components inside the smartwatch, each component can fully exert its optimal performance while saving internal space to the greatest extent, thereby improving the overall performance and battery life of the smartwatch and making the watch structure more compact and thinner; In addition, by rationally planning the placement of components, the signal transmission path is shortened, electromagnetic interference is reduced, and the performance of each component is improved; Through measures such as stacking structure, modular design, and irregular motherboard design, internal space is effectively saved, making the smartwatch structure more compact and thinner, and improving overall performance and battery life. Attached Figure Description

[0016] The following is a brief introduction to the accompanying drawings used in the description of the embodiments of this application:

[0017] Figure 1 An example diagram of the first surface of a motherboard layout structure for a smartwatch, provided in an embodiment of this application, is shown.

[0018] Figure 2 An example diagram of the second surface of a motherboard layout structure for a smartwatch, provided in an embodiment of this application, is shown.

[0019] The labels in the diagram are as follows: 1: WiFi / GPS antenna spring - first ground pin; 2: WiFi / GPS antenna spring - signal pin; 3: WiFi / GPS antenna spring - second ground pin; 4: button spring - ground pin; 5: button spring - signal pin; 6: cellular antenna spring - ground pin; 7: cellular antenna spring - signal pin; 8: cellular antenna spring - ground pin; 9: horn spring - signal pin; 10: horn spring - ground pin; 11: vibration motor - signal pin; 12: vibration motor - ground pin; 13: BT antenna spring - signal pin; 14: BT antenna spring - ground pin; 15: board frame; 16: acceleration 17: Barometer chip; 18: Analog switch chip; 19: BT chip; 20: Motor chip; 21: GPS chip; 22: LNA+SAW chip; 23: Diplexer; 24: WiFi chip; 25: SAW chip; 26: PMU chip; 27: CPU chip; 28: MMPA chip; 29: Memory chip; 30: Duplexer; 31: Transceiver chip; 32: Test socket; 33: TXM chip; 34: NFC chip; 35: Crystal chip; 36: Charging switch; 37: Power IC; 38: Audio PA; 39: Shielding cover; 40: Microphone; 41: Battery connector; 42: Front camera connector; 43: Rear camera connector; 44: Heart rate connector; 45: Screen connector; 46: Charging connector. Detailed Implementation

[0020] To more clearly illustrate the technical solutions of the embodiments of this application, the specific implementation methods of this application will be described below with reference to the accompanying drawings. The accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without creative effort. Adjustments and improvements made without departing from the concept of this application are all within the protection scope of this application.

[0021] To keep the drawings simple, only the parts related to the corresponding embodiments are shown schematically in each figure, and they do not represent the actual structure of the product. In addition, to make the drawings simple and easy to understand, some parts with the same structure or function are only shown schematically in some figures, and there may actually be more or fewer parts with the same structure or function.

[0022] In this application, unless otherwise expressly specified and limited, ordinal numbers, such as "first," "second," etc., are used only to distinguish and describe related objects, and should not be construed as indicating or implying the relative importance or order between related objects; furthermore, they do not represent the quantity of related objects. "Multiple" includes two or more, and other quantifiers are similar. " / " is used to describe the relationship between related objects, indicating an "or" relationship between them. "And / or" is used to describe the relationship between related objects, including any combination relationship between them, such as "a and / or b" including: "a alone," "b alone," or "a and b." "One or more" or "at least one" of multiple objects refers to any object or any combination of multiple objects, such as "one or more of a1, a2, a3" or "at least one of a1, a2, a3" including: "a1 alone," "a2 alone," "a3 alone," "a1 and a2," "a1 and a3," "a2 and a3," or "a1, a2 and a3."

[0023] As a portable smart terminal integrating multiple advanced technologies, smartwatches have demonstrated tremendous development potential in recent years in areas such as communication, positioning, health monitoring, mobile payment, and information notifications. They are not only an effective supplement to smartphones but also an important component of personal wearable devices in the Internet of Things era, greatly enhancing users' digital experience and convenience in daily life.

[0024] As the popularity of smartwatches continues to increase, users are demanding higher standards for their comfort, aesthetics, and personalized appearance. This trend is driving smartwatches to become thinner and smaller while improving their functionality. This is especially true for children, whose wrists are smaller; oversized watches not only affect aesthetics and wearing experience but can also cause inconvenience during vigorous exercise or daily activities. Prolonged wear of heavy devices may even negatively impact the development of children's wrists. Therefore, reducing the size and weight of smartwatches has become a key design objective.

[0025] From an aesthetic perspective, the compact design blends more easily into various clothing styles, and is especially popular among adult women and teenagers. Furthermore, miniaturization helps improve the product's integration and manufacturing integrity, giving the device a more modern and technological look. From a manufacturing cost perspective, reducing size effectively reduces material usage and the number of structural components, potentially lowering manufacturing costs in mass production and enhancing the product's market competitiveness.

[0026] However, achieving miniaturization doesn't simply mean "shrinking the size." It presents the technical challenge of integrating as many functional modules as possible within a limited space. Some existing smartwatches sacrifice some functionality to reduce size, such as eliminating cameras, reducing the number of sensors, or limiting communication module capabilities; while others have to increase the motherboard size and overall thickness to achieve a complete functional system. Both designs have their trade-offs, but both have significant drawbacks: the former struggles to meet users' diverse functional needs, while the latter contradicts the original intentions of miniaturization and comfortable wear.

[0027] Therefore, how to further reduce the size of the device while ensuring full functionality is a crucial problem that current smartwatch technology urgently needs to solve. The following description, in conjunction with the accompanying diagram, illustrates this point.

[0028] Please refer to Figure 1 and Figure 2 These figures illustrate an example of a motherboard layout structure for a smartwatch, as provided in an embodiment of this application. Figure 1 and Figure 2 As shown, this application discloses a motherboard layout structure for use in smartwatches. The motherboard is a flat motherboard, which includes a first surface and a second surface opposite to the first surface. The first surface and the second surface are the two surfaces with the larger surface area on the motherboard. Figure 1 The first surface of the motherboard, Figure 2 This is the second surface of the motherboard. For ease of distinction, the first surface of the motherboard can be called the front surface, and the second surface can be called the back surface.

[0029] The first surface includes the core processor area, power management area, wireless communication area, and auxiliary function module area. The second surface includes the multimedia and power interface area, as well as the physiological detection and user interaction interface area. It should be noted that this area division is not a strict physical isolation or structural limitation, but rather a logical functional division based on the purpose of various functional components on the motherboard, intended to facilitate the description of the system structure and functional distribution. In actual layout, there may be some overlap and intersection between the areas, and the specific distribution of components can be flexibly adjusted according to factors such as electrical performance, heat dissipation requirements, and space utilization efficiency.

[0030] The core processor area is located in the center of the motherboard to shorten the wiring distance to other areas. The power management area is located near the battery connection to reduce the length of the power transmission line. The wireless communication area is located at the edge of the motherboard and away from high-frequency interference sources to reduce electromagnetic interference. The auxiliary function module area is suitable for installing spring clips and vibration motors. The multimedia and power interface area and the physiological detection and user interaction interface area are respectively located on opposite sides of the second surface to connect to the corresponding devices.

[0031] Thus, by mounting components on both sides of the motherboard, the limited volume can be fully utilized, maximizing space utilization. Furthermore, placing the antenna close to the RF chip reduces losses and interference, improving RF performance. On the first surface, since the core processor area can include core components such as the CPU, placing it in the center of the motherboard effectively shortens wiring distances to other areas, reduces signal transmission delay, and improves data processing speed. Furthermore, placing the core processor area in the center of the motherboard keeps it relatively away from antenna springs located at the motherboard edge, thereby reducing the impact of electromagnetic interference on core components such as the CPU. Placing the power management area near the battery connection reduces the length of power transmission lines, thereby reducing line losses and improving the smartwatch's battery life. Placing the wireless communication area at the motherboard edge and away from high-frequency interference sources reduces electromagnetic interference and improves the stability and transmission distance of wireless communication (e.g., Bluetooth communication). The auxiliary function module area is suitable for mounting various springs (signal pins and ground pins) and vibration motors. For example, in some embodiments of this application, such as... Figure 1 and Figure 2As shown, the auxiliary function module area includes WiFi / GPS antenna spring-loaded contact - first ground pin 1, WiFi / GPS antenna spring-loaded contact - signal pin 2, WiFi / GPS antenna spring-loaded contact - second ground pin 3, button spring-loaded contact - ground pin 4, button spring-loaded contact - signal pin 5, cellular antenna spring-loaded contact - ground pin 6, cellular antenna spring-loaded contact - signal pin 7, cellular antenna spring-loaded contact - ground pin 8, speaker spring-loaded contact - signal pin 9, speaker spring-loaded contact - ground pin 10, vibration motor - signal pin 11, vibration motor - ground pin 12, BT antenna spring-loaded contact - signal pin 13, and BT antenna spring-loaded contact - ground pin 14. In the second surface, the multimedia and power interface area centrally arranges key interfaces related to sound, image acquisition, and main power supply, facilitating modular connection and system debugging. For example, it includes MIC 40, battery connector 41, front camera connector 42, and rear camera connector 43. The physiological detection and user interaction interface area mainly focuses on user interaction and physiological parameter detection, as well as the charging interface, and is usually located near the housing opening for easy external connection. For example, in some embodiments of this application, it includes a heart rate connector 44, a screen connector 45, and a charging connector 46. In this way, each area undertakes a specific type of function (such as multimedia, power supply, physiological sensing, interactive display), facilitating design, debugging, later maintenance, and module replacement. Furthermore, similar functional components are grouped together, and signal lines and power lines can be closed-loop within the area, reducing cross-area wiring, improving wiring efficiency, and reducing interference. In addition, multimedia devices (such as microphones and cameras) have high requirements for signal integrity; their centralized isolation helps avoid interference from power devices or high-speed display signals. In summary, through the above-mentioned area division, while ensuring functional independence, optimal wiring, electromagnetic interference isolation, thermal management balance, and overall structural integration can be achieved.

[0032] In some embodiments of this application, the core processor region includes a central processing unit (CPU) and a memory chip disposed adjacent to the CPU, i.e. Figure 1 The CPU chip 27 and memory chip 29 are located within the CPU. The outer surfaces of the central processing unit and the memory chips are connected to heat dissipation components (not shown in the figure).

[0033] The CPU chip 27 is positioned adjacent to the memory chip 29 to facilitate high-speed data exchange between the two. To address the heat dissipation requirements of the CPU chip 27 and the memory chip 29, heat dissipation components can be placed above them to quickly dissipate heat.

[0034] In some embodiments of this application, the heat dissipation element is a heat sink, and the outer surfaces of the central processing unit and the memory chips are connected to the same heat sink via thermally conductive silicone. Heat dissipation of the CPU chip 27 relies on the thermally conductive silicone working in conjunction with the heat sink. The thermally conductive silicone fills the tiny gaps between the central processing unit and the heat sink, improving heat conduction efficiency and efficiently transferring heat from the CPU chip 27 to the heat sink. The heat sink is typically made of a highly thermally conductive metal, rapidly dissipating heat through its large-area fin structure, and carrying away heat with the help of natural convection or a fan to accelerate airflow, thus achieving efficient heat dissipation. The heat conduction principle of the memory chip 29 is similar. Sharing the same heat sink offers several advantages. First, this design saves motherboard space, making it suitable for compact device designs (such as the smartwatch in this application); second, it reduces the use of heat sinks and thermally conductive materials, lowering overall manufacturing and assembly costs; third, sharing the heat sink simplifies the thermal management structure and facilitates system integration; finally, by increasing the heat dissipation area, it helps with overall heat diffusion, improving heat dissipation efficiency, and with a reasonable layout, it can simultaneously ensure the temperature control of both the CPU chip 27 and the memory.

[0035] In some embodiments of this application, graphite material can be attached to the surface of the CPU chip 27, connecting it to the internal structure or casing, utilizing graphite's excellent planar thermal conductivity to rapidly dissipate heat. Furthermore, a phase change material can be attached to the top of the CPU chip 27, absorbing heat and melting to store energy at high temperatures and releasing heat at low temperatures, thus aiding in temperature peak control. Alternatively, heat from the CPU chip 27 can be directly conducted to another structural layer (such as the casing or back cover) through built-in copper pillars or other highly thermally conductive materials. Another example is the creation of thermal conduction paths near the CPU chip 27, guiding heat to ventilation areas and enabling natural air convection through casing gaps. All of these methods can achieve heat dissipation, reducing the impact of high-temperature environments on the core processor area.

[0036] In some embodiments of this application, a closed-loop board frame 15 is provided around the outer periphery of the motherboard, and the shape of the board frame 15 matches the shape of the motherboard. The closed-loop board frame can form a closed support structure around the outer periphery of the motherboard, thereby effectively enhancing the mechanical strength and bending rigidity of the entire motherboard and preventing the motherboard from bending, being damaged, or components from desoldering due to external forces during assembly, transportation, or use. Furthermore, the board frame is usually grounded, forming a complete grounding closed-loop path, enhancing the shielding effect around the motherboard, and effectively suppressing electromagnetic interference, which is particularly critical in wireless communication devices (such as smartwatches). The closed-loop structure can also work in conjunction with the shielding cover to form a "metal cavity," providing good shielding and isolation for high-frequency signals. The board frame can contact the outer shell or the middle frame, serving as a heat conduction path to conduct heat from high-heat-generating components such as the main chip through the edges of the motherboard, improving overall heat dissipation efficiency.

[0037] In some embodiments of this application, the motherboard is an irregularly shaped motherboard, and the auxiliary function module area is located in the edge area of ​​the motherboard.

[0038] Because different smartwatches have different internal structures, some smartwatches cannot accommodate a regularly shaped motherboard, such as a rectangular motherboard. Therefore, this application designs an irregularly shaped motherboard based on the smartwatch's external outline, making full use of the irregular space inside the watch and further improving space utilization. For example, as... Figure 1 and Figure 2 As shown, the motherboard can be designed into a corresponding shape at the corners of the smartwatch, and small sensors or connectors can be placed in these areas. That is, at least some of the components in the auxiliary function module area can be placed in these edge areas.

[0039] In some embodiments of this application, the power management area includes a PMU chip 26, which is positioned near the battery connection to reduce the length of the power transmission line and lower line losses. Furthermore, as mentioned above, the charging connector 46 is located on the back of the motherboard and employs a single-sided mounting structure, which can reduce the thickness of the smartwatch.

[0040] In some embodiments of this application, the wireless communication area includes a Bluetooth chip (i.e., BT chip 19), a WiFi chip 24, a GPS chip 21, a multi-mode power amplifier chip (i.e., MMPA chip 28), and multiple antenna springs. The Bluetooth chip and Bluetooth antenna springs are located on the same edge of the motherboard, away from the core processor area. In some embodiments of this application, the WiFi chip 24 and GPS chip 21 are located in a corner of the motherboard, close to their corresponding antenna springs, to improve signal reception sensitivity.

[0041] By placing the BT chip 19 and BT antenna springs on the same edge of the motherboard, and keeping the antenna springs as far away as possible from other interference sources, such as the CPU chip 27 and high-power devices like the 4G PA PAMID (e.g., MMPA chip 28, TXM chip 33, or duplexer 30), signal interference can be reduced, improving the stability and transmission distance of Bluetooth communication. The WIFI / GPS / BT antenna springs are concentrated in one corner of the motherboard, away from the main digital circuitry, to reduce the impact of electromagnetic interference on the wireless signal. Simultaneously, placing the GPS chip and circuitry close to the WIFI / GPS / BT antenna springs shortens the signal transmission path, improving signal reception sensitivity and accuracy. The 4G PA PAMID and main RF antenna springs are positioned on opposite edges of the motherboard, allowing for better RF signal radiation while avoiding mutual interference. The transceiver chip 31 is placed near the 4G PA PAMID for convenient signal transmission and reception.

[0042] In some embodiments of this application, the auxiliary function module area includes an accelerometer chip 16, an NFC chip 34, and a crystal chip 35. For example, the accelerometer chip 16 is disposed in a stable area on the motherboard to reduce errors caused by vibrations of other components on the motherboard; the NFC chip 34 is disposed close to the surface of the smartwatch; and the crystal chip 35 is disposed in an area away from high-frequency circuits and equipped with a shielding structure to reduce electromagnetic interference. During the operation of the smartwatch, some components on the motherboard spontaneously vibrate, which may affect the accuracy of data acquisition by the accelerometer chip 16. Therefore, by placing the accelerometer chip 16 in a relatively stable position on the motherboard, the impact of vibrations generated by other components during operation can be effectively reduced. The NFC chip 34 is disposed close to the surface of the smartwatch, facilitating short-range wireless communication operations such as mobile payments and data transfers. The crystal chip 35 is sensitive to electromagnetic interference, therefore it is placed in an area away from antennas and high-power chips, and is surrounded by a shielding cover 39 to reduce the impact of external interference on the crystal frequency stability.

[0043] In some embodiments of this application, the motherboard also includes a barometer chip 17, an analog switch chip 18, a motor chip 20, an LNA+SAW chip 22, a diplexer 23, a SAW chip 25, a test socket 32, a charging switch 36, a Power IC 37, and an Audio PA 38. The motherboard also includes various functional chips and components to support the diverse functions and system stability of the smartwatch. Specifically, the barometer chip 17 is used to detect atmospheric pressure and is commonly used to implement altimeter and weather monitoring functions; the analog switch chip 18 is mainly used for switching and controlling different analog signal paths, enabling resource sharing and circuit management between multi-functional modules; and the motor chip 20 is responsible for driving the vibration motor to provide tactile feedback to the user, such as incoming call reminders and alarm clock vibrations. The LNA+SAW chip 22 combines a low-noise amplifier (LNA) and a surface acoustic wave (SAW) filter to improve wireless signal reception sensitivity and suppress interference, and is widely used in RF receiving channels. The Diplexer 23 allows transmitted and received signals to be transmitted through different frequency bands, thus sharing the same antenna channel, effectively reducing the number of antennas and saving space. The SAW chip 25 itself is an RF filter used for selective filtering of high-frequency signals, further improving communication quality. The test socket 32 ​​is used for rapid verification of the motherboard's functions during production testing, facilitating debugging and quality control. The charging switch 36 controls the on / off state and protection logic during battery charging, ensuring a safe and stable charging process. The Power IC 37 provides power management functions for the entire motherboard, including voltage conversion, distribution, and protection. The Audio PA 38 drives audio output devices such as speakers, amplifying audio signals to an audible range. These components together constitute the complex and compact hardware system of the smartwatch, supporting its rich functionality.

[0044] Based on a similar technical concept, this application also discloses a smartwatch, the motherboard layout structure of which adopts the motherboard layout structure detailed in any of the above embodiments; the technical effects it can achieve are similar to those of the motherboard layout structure, and will not be described again here.

[0045] In the above embodiments, the descriptions of each embodiment have their own emphasis. Parts not described in detail or in a particular embodiment can be referred to in the relevant descriptions of other embodiments. Furthermore, the above embodiments can be freely combined as needed.

Claims

1. A motherboard layout structure for use in smartwatches, characterized in that, The motherboard is a flat motherboard, which includes a first surface and a second surface opposite to the first surface, and the surface areas of the first surface and the second surface are both greater than the surface areas of each side surface of the motherboard; The first surface includes a core processor area, a power management area, a wireless communication area, and an auxiliary function module area; the second surface includes a multimedia and power interface area and a physiological detection and user interaction interface area. The core processor area is located in the center of the motherboard to shorten the wiring distance to other areas. The power management area is located near the battery connection to reduce the length of the power transmission line. The wireless communication area is located at the edge of the motherboard and away from high-frequency interference sources to reduce electromagnetic interference. The auxiliary function module area is suitable for installing spring clips and vibration motors. The multimedia and power interface area and the physiological detection and user interaction interface area are respectively located on opposite sides of the second surface to connect to corresponding devices.

2. The motherboard layout structure for a smartwatch according to claim 1, characterized in that, A closed-loop frame is provided around the outer periphery of the motherboard, and the shape of the frame matches the shape of the motherboard.

3. The motherboard layout structure for a smartwatch according to claim 1 or 2, characterized in that, The motherboard is an irregularly shaped motherboard, and the auxiliary function module area is located in the edge area of ​​the motherboard.

4. The motherboard layout structure for a smartwatch according to claim 1, characterized in that, The core processor region includes a central processing unit (CPU) and a memory chip disposed adjacent to the CPU. The outer surfaces of the CPU and the memory chip are connected to heat dissipation elements.

5. The motherboard layout structure for a smartwatch according to claim 4, characterized in that, The heat dissipation element is a heat sink, and the outer surface of the central processing unit and the outer surface of the memory chip are connected to the same heat sink through thermally conductive silicone.

6. The motherboard layout structure for a smartwatch according to claim 1, characterized in that, The wireless communication area includes a Bluetooth chip, a WiFi / GPS chip, a multi-mode power amplifier chip, and multiple antenna springs. The Bluetooth chip and Bluetooth antenna springs are located on the same side edge of the motherboard and away from the core processor area.

7. The motherboard layout structure for a smartwatch according to claim 6, characterized in that, The WiFi / GPS chip is located in one corner of the motherboard, close to its corresponding antenna spring, to improve signal reception sensitivity.

8. The motherboard layout structure for a smartwatch according to claim 1, characterized in that, The auxiliary function module area includes an accelerometer chip, an NFC chip, and a crystal chip; The accelerometer chip is located in a stable area on the motherboard to reduce errors caused by vibrations of other components on the motherboard; the NFC chip is located close to the surface of the smartwatch; and the crystal chip is located in an area away from high-frequency circuits and is equipped with a shielding structure to reduce electromagnetic interference.

9. The motherboard layout structure for a smartwatch according to claim 1, characterized in that, The multimedia and power interface area includes a microphone, a battery connector, a front camera connector, and a rear camera connector, while the physiological detection and user interaction interface area includes a heart rate connector, a screen connector, and a charging connector.

10. A smartwatch, characterized in that, The motherboard layout structure described in any one of claims 1-9 is adopted.

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